TW201505533A - Handheld communication apparatus and thin heat-dissipating structure thereof - Google Patents
Handheld communication apparatus and thin heat-dissipating structure thereof Download PDFInfo
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Abstract
Description
本發明係有關於一種散熱結構，尤指一種手持通訊裝置及其薄型化散熱結構。The invention relates to a heat dissipation structure, in particular to a handheld communication device and a thinned heat dissipation structure thereof.
手持通訊裝置，如手機、平板電腦、PDA、GPS等，隨著科技進步，其運算功能及效率也逐漸強大，導致手持通訊裝置的內部元件，例如中央處理器及積體電路等元件，運作時皆會產生高熱，因此必須先將元件的熱量散去，才能維持元件之運作效率及使用壽命。Handheld communication devices, such as mobile phones, tablets, PDAs, GPS, etc., with the advancement of technology, their computing functions and efficiency are gradually stronger, resulting in internal components of handheld communication devices, such as central processing units and integrated circuits, etc. Both will generate high heat, so the heat of the component must be dissipated before the operating efficiency and service life of the component can be maintained.
目前用於手持通訊裝置的散熱結構，其主要包含金屬材質所構成的一導熱板，並利用導熱板直接熱貼接中央處理器及積體電路等發熱元件，使發熱元件之熱量傳導至導熱板上，以達到散熱之功效。
The heat dissipating structure currently used for the handheld communication device mainly comprises a heat conducting plate composed of a metal material, and directly heats the heat generating component such as the central processing unit and the integrated circuit by using the heat conducting plate, so that the heat of the heating element is transmitted to the heat conducting plate. On, to achieve the effect of heat dissipation.
有鑑於此，本發明人遂針對上述現有技術，特潛心研究並配合學理的運用，盡力解決上述之問題點，即成為本發明人開發之目標。
In view of the above, the inventors of the present invention have made great efforts to solve the above problems by focusing on the above-mentioned prior art, and have made great efforts to solve the above problems, which has become the object of development by the present inventors.
本發明之ㄧ目的，在於提供一種手持通訊裝置及其薄型化散熱結構，其係將發熱元件產生之熱量均勻導至熱管及導熱板上，避免熱量累積於發熱元件的周圍，以達到提升散熱效率之功效。The object of the present invention is to provide a handheld communication device and a thin heat dissipation structure thereof, which uniformly conduct heat generated by a heat generating component to a heat pipe and a heat conducting plate to prevent heat from accumulating around the heat generating component to improve heat dissipation efficiency. The effect.
為了達成上述之目的，本發明係提供一種薄型化散熱結構，包括：
In order to achieve the above object, the present invention provides a thinned heat dissipation structure including:
一導熱板，設有一穿槽及於該穿槽內周緣形成一內環壁，該內環壁延伸有至少一突出片；以及
a heat conducting plate is provided with a through groove and an inner ring wall is formed on the inner periphery of the through groove, and the inner ring wall extends at least one protruding piece;
一熱管，設置於該穿槽內並和該突出片相互卡合。
A heat pipe is disposed in the through groove and engaged with the protruding piece.
為了達成上述之目的，本發明係提供一種手持通訊裝置，包括：
In order to achieve the above object, the present invention provides a handheld communication device, including:
一殼體，內部設有一容腔；
a casing having a cavity inside;
一發熱元件，容置在該容腔內；以及
a heating element housed in the cavity;
如上述之薄型化散熱結構，容置在該容腔內，並該熱管熱貼接於該發熱元件。
The thinned heat dissipation structure as described above is housed in the cavity, and the heat pipe is thermally attached to the heat generating component.
本發明還具有以下功效：
The invention also has the following effects:
第一、熱管設置於穿槽內並和突出片相互卡合，使熱管透過突出片的支承以穩固地定位在穿槽內，進而提升薄型化散熱結構之結構穩定度。
First, the heat pipe is disposed in the through groove and is engaged with the protruding piece, so that the heat pipe passes through the support of the protruding piece to be stably positioned in the through groove, thereby improving the structural stability of the thinned heat dissipation structure.
第二、熱管係以沖壓方式成型並埋設於穿槽內，使熱管的厚度實質上等於導熱板的厚度，以使薄型化散熱結構達到薄型化之優點，讓薄型化散熱結構具有體積輕薄，不占空間、方便組裝之功效。
Secondly, the heat pipe is formed by stamping and embedded in the through groove, so that the thickness of the heat pipe is substantially equal to the thickness of the heat conducting plate, so that the thin heat dissipating structure is thinned, and the thin heat dissipating structure has a light and thin shape. Take up space and facilitate assembly.
第三、熱管係以沖壓方式成型，並令熱管和突出片共同形成共面結構，使發熱元件的表面更容易緊密貼接於共面結構，進而提升薄型化散熱結構之散熱效率。
Third, the heat pipe is formed by stamping, and the heat pipe and the protruding piece together form a coplanar structure, so that the surface of the heat generating component is more easily adhered to the coplanar structure, thereby improving the heat dissipation efficiency of the thin heat dissipation structure.
第四、熱管設有凹陷段，凹陷段對應突出片嵌合，使突出片能夠提供面積以貼覆熱管，讓發熱元件產生之熱量快速地傳導至導熱板上，達到短時間內均溫散熱之優點。
Fourth, the heat pipe is provided with a concave section, and the concave section is corresponding to the protruding piece fitting, so that the protruding piece can provide an area to cover the heat pipe, so that the heat generated by the heating element is quickly transmitted to the heat conducting plate, so as to achieve uniform heat dissipation in a short time. advantage.
第五、熱管可為L字形管體或U字形管體，使熱管能利用形狀在有限的空間裡，大面積地貼接導熱板，以提升熱管與導熱板之間的熱貼接面積，進而增加薄型化散熱結構之散熱功效。
Fifth, the heat pipe can be an L-shaped pipe body or a U-shaped pipe body, so that the heat pipe can be attached to the heat-conducting plate in a large area by using a shape in a limited space to increase the heat bonding area between the heat pipe and the heat-conducting plate, and further Increase the heat dissipation effect of the thin heat dissipation structure.
100‧‧‧手持通訊裝置
10‧‧‧薄型化散熱結構
1‧‧‧導熱板
11‧‧‧穿槽
12‧‧‧內環壁
121‧‧‧側壁
122‧‧‧底緣
121’‧‧‧側壁
122’‧‧‧底緣
13‧‧‧突出片
131‧‧‧表面
2‧‧‧熱管
21‧‧‧凹陷段
22‧‧‧表面
3‧‧‧散熱膏
20‧‧‧殼體
21‧‧‧容腔
30‧‧‧發熱元件
40‧‧‧電路板
h1、h2‧‧‧厚度
S‧‧‧共面結構100‧‧‧Handheld communication device
10‧‧‧Thin-shaped heat dissipation structure
1‧‧‧heat conducting plate
11‧‧‧through slot
12‧‧‧ Inner Ring Wall
121‧‧‧ side wall
122‧‧‧ bottom edge
121'‧‧‧ Sidewall
122'‧‧‧ bottom edge
13‧‧‧ Highlights
131‧‧‧ surface
2‧‧‧heat pipe
21‧‧‧ Depression
22‧‧‧ Surface
3‧‧‧ Thermal paste
20‧‧‧shell
21‧‧‧ cavity
30‧‧‧heating components
40‧‧‧ boards
H1, h2‧‧‧ thickness
S‧‧‧coplanar structure
第一圖係本發明手持通訊裝置之立體分解圖。The first figure is an exploded perspective view of the handheld communication device of the present invention.
第二圖係本發明薄型化散熱結構第一實施例之立體分解示意圖。
The second figure is a perspective exploded view of the first embodiment of the thinned heat dissipation structure of the present invention.
第三圖係本發明薄型化散熱結構第一實施例之組合剖視圖。
The third drawing is a combined sectional view of the first embodiment of the thinned heat dissipation structure of the present invention.
第四圖係本發明薄型化散熱結構第二實施例之組合剖視圖。
The fourth drawing is a combined sectional view of a second embodiment of the thinned heat dissipation structure of the present invention.
第五圖係本發明手持通訊裝置之立體組合圖。
The fifth figure is a three-dimensional combination diagram of the handheld communication device of the present invention.
第六圖係本發明手持通訊裝置之組合剖視圖。
Figure 6 is a cross-sectional view of the combination of the handheld communication device of the present invention.
第七圖係本發明手持通訊裝置之使用狀態示意圖。
The seventh figure is a schematic diagram of the use state of the handheld communication device of the present invention.
第八圖係本發明薄型化散熱結構第三實施例之組合示意圖。
The eighth drawing is a combination diagram of the third embodiment of the thinned heat dissipation structure of the present invention.
第九圖係本發明薄型化散熱結構第四實施例之組合示意圖。
Figure 9 is a schematic view showing the combination of the fourth embodiment of the thinned heat dissipation structure of the present invention.
有關本發明之詳細說明及技術內容，將配合圖式說明如下，然而所附圖式僅作為說明用途，並非用於侷限本發明。The detailed description and technical content of the present invention will be described with reference to the accompanying drawings.
請參考第一至七圖所示，本發明係提供一種手持通訊裝置及其薄型化散熱結構，此薄型化散熱結構10主要包括一導熱板1及一熱管（Heat Pipe）2；手持通訊裝置100包括一殼體20、一發熱元件30及薄型化散熱結構10。
Referring to the first to seventh embodiments, the present invention provides a handheld communication device and a thinned heat dissipation structure thereof. The thin heat dissipation structure 10 mainly includes a heat conduction plate 1 and a heat pipe 2; the handheld communication device 100 A housing 20, a heating element 30, and a thinned heat dissipation structure 10 are included.
導熱板1為一扁平金屬板，其最佳實施例為銅板或鋁板，導熱板1設有一穿槽11及於穿槽11內周緣形成一內環壁12，內環壁12延伸有一或複數突出片13，並導熱板1具有一厚度h1。其中，穿槽11的形狀可為一字形、一L字形或一U字形等幾何形狀，不以本實施例為限制。
The heat conducting plate 1 is a flat metal plate, and the preferred embodiment is a copper plate or an aluminum plate. The heat conducting plate 1 is provided with a through slot 11 and an inner ring wall 12 is formed on the inner periphery of the through slot 11. The inner ring wall 12 extends one or more protruding portions. The sheet 13 and the heat conducting plate 1 have a thickness h1. The shape of the through slot 11 may be a geometric shape such as a letter shape, an L shape or a U shape, which is not limited by this embodiment.
另外，如第三圖所示，係本發明薄型化散熱結構第一實施例，突出片13的數量為一，內環壁12具有一側壁121，側壁121的底部端緣具有一底緣122，突出片13沿著底緣122延伸成型。
In addition, as shown in the third figure, in the first embodiment of the thinned heat dissipation structure of the present invention, the number of the protruding pieces 13 is one, the inner ring wall 12 has a side wall 121, and the bottom end edge of the side wall 121 has a bottom edge 122. The protruding piece 13 is formed to extend along the bottom edge 122.
再者，如第四圖所示，係本發明薄型化散熱結構第二實施例，第二實施例和第一實施例不同之處在於，突出片13的數量不同，進一步說明如下。
Further, as shown in the fourth figure, the second embodiment of the thinned heat dissipating structure of the present invention is different from the first embodiment in that the number of the protruding pieces 13 is different, and further explained below.
突出片13的數量為二，內環壁12具有相對的二側壁121’，各側壁121’的底部端緣具有一底緣122’，各突出片13沿著各底緣122’延伸成型。
The number of the protruding pieces 13 is two, the inner ring wall 12 has opposite side walls 121', and the bottom end edge of each side wall 121' has a bottom edge 122', and each protruding piece 13 is extended along each bottom edge 122'.
熱管（Heat Pipe）2設置於穿槽11內並和突出片13相互卡合；詳細說明如下，熱管（Heat Pipe）2可先容置於穿槽11內再以沖壓方式成型，或者熱管（Heat Pipe）2可先以沖壓方式成型再容置於穿槽11內，而令熱管（Heat Pipe）2設有一凹陷段21，凹陷段21對應突出片13嵌合。
The heat pipe 2 is disposed in the through groove 11 and is engaged with the protruding piece 13; as described in detail below, the heat pipe 2 can be first placed in the groove 11 and then formed by stamping, or the heat pipe (Heat) The pipe 2 can be first formed by stamping and then placed in the through slot 11, and the heat pipe 2 is provided with a recessed section 21, and the recessed section 21 is fitted to the protruding piece 13.
又，熱管（Heat Pipe）2的厚度h2實質上等於導熱板1的厚度h1，即熱管（Heat Pipe）2的厚度h2等於、略大於或略小於導熱板1的厚度h1，並熱管（Heat Pipe）2的表面22和突出片13的表面131共同形成一共面結構S，即熱管（Heat Pipe）2的表面22和突出片13的表面131在同一平面上。
Further, the thickness h2 of the heat pipe 2 is substantially equal to the thickness h1 of the heat conducting plate 1, that is, the thickness h2 of the heat pipe 2 is equal to, slightly larger or slightly smaller than the thickness h1 of the heat conducting plate 1, and the heat pipe (Heat Pipe) The surface 22 of the surface 2 and the surface 131 of the protruding piece 13 together form a coplanar structure S, that is, the surface 22 of the heat pipe 2 and the surface 131 of the protruding piece 13 are on the same plane.
其中，熱管（Heat Pipe）2和突出片13係以焊接方式或以迫緊方式相互連接；詳細說明如下，熱管（Heat Pipe）2先容置於穿槽11內再以沖壓方式成型時，則熱管（Heat Pipe）2會緊迫定位為於穿槽11內，並熱管（Heat Pipe）2會和內環壁12及突出片13以迫緊方式相互貼接。Wherein, the heat pipe 2 and the protruding piece 13 are connected to each other by welding or by pressing; as described in detail below, when the heat pipe 2 is first placed in the groove 11 and then formed by punching, The Heat Pipe 2 is positioned so as to pass through the groove 11, and the Heat Pipe 2 and the inner ring wall 12 and the protruding piece 13 are pressed into each other in a pressing manner.
本發明薄型化散熱結構10更包括一散熱膏3，散熱膏3填注於熱管（Heat Pipe）2、內環壁12及突出片13之間，以提高熱管（Heat Pipe）2、內環壁12及突出片13之間的熱傳導面積，但散熱膏3並非本薄型化散熱結構10之必要元件，故散熱膏3可視情況增加或刪除。
The thin heat dissipation structure 10 of the present invention further comprises a heat dissipation paste 3, and the heat dissipation paste 3 is filled between the heat pipe 2, the inner ring wall 12 and the protruding piece 13 to improve the heat pipe 2 and the inner ring wall. 12 and the heat conduction area between the protruding sheets 13, but the heat-dissipating paste 3 is not an essential component of the thin heat-dissipating structure 10, so the heat-dissipating paste 3 may be added or deleted as appropriate.
此外，熱管（Heat Pipe）2可為一一字形管體、一L字形管體或一U字形管體，穿槽11的形狀會和熱管（Heat Pipe）2的形狀相互配合。
Further, the heat pipe 2 may be a one-shaped pipe body, an L-shaped pipe body or a U-shaped pipe body, and the shape of the through groove 11 may match the shape of the heat pipe 2 .
殼體20內部設有一容腔21；詳細說明如下，殼體20由一上殼及一下殼所組裝而成，容腔21形成在上殼及下殼的內部。
A cavity 21 is disposed inside the casing 20; as described in detail below, the casing 20 is assembled from an upper casing and a lower casing, and the cavity 21 is formed inside the upper casing and the lower casing.
發熱元件30可為中央處理器及積體電路等元件，但不以此為限，發熱元件30容置在容腔11內。
The heating element 30 can be an element such as a central processing unit and an integrated circuit, but is not limited thereto, and the heating element 30 is housed in the cavity 11.
上述薄型化散熱結構10也容置在容腔11內，並熱管（Heat Pipe）2熱貼接於發熱元件30。其中，導熱板1及突出片13可熱貼接或不熱貼接於發熱元件30，即導熱板1及突出片13可視發熱元件30的大小，以自行調整和發熱元件30之間的熱貼接面積大小。
The thin heat dissipation structure 10 is also housed in the cavity 11, and the heat pipe 2 is thermally attached to the heat generating component 30. The heat conducting plate 1 and the protruding piece 13 can be thermally or non-thermally attached to the heat generating component 30, that is, the heat conducting plate 1 and the protruding piece 13 can be sized by the heat generating component 30 to self-adjust and heat the heat generating component 30. The size of the joint area.
本發明手持通訊裝置100更包括一電路板40，發熱元件30裝固在電路板40，使發熱元件30及電路板40共同容置在容腔11內，並電路板40和導熱板1呈堆疊狀排列。
The handheld communication device 100 further includes a circuit board 40. The heat generating component 30 is mounted on the circuit board 40, so that the heat generating component 30 and the circuit board 40 are housed together in the cavity 11, and the circuit board 40 and the heat conducting board 1 are stacked. Arranged in a shape.
本發明薄型化散熱結構10之組合，如第一至四圖所示，其係利用導熱板1設有穿槽11及於穿槽11內周緣形成內環壁12，內環壁12延伸有突出片13；熱管（Heat Pipe）2設置於穿槽11內並和突出片13相互卡合。
The combination of the thin heat dissipation structure 10 of the present invention is as shown in the first to fourth figures. The heat conduction plate 1 is provided with a through groove 11 and the inner circumferential wall 12 of the groove 11 is formed. The inner ring wall 12 is extended and protruded. A sheet 13; a heat pipe 2 is disposed in the through groove 11 and engaged with the protruding piece 13 .
本發明手持通訊裝置100之組合，如第五至六圖所示，其係利用殼體20內部設有容腔21；發熱元件30容置在容腔21內；如上述之薄型化散熱結構10容置在容腔21內，並熱管（Heat Pipe）2熱貼接於發熱元件30。藉此，熱管（Heat Pipe）2將發熱元件30產生之熱量均勻導至導熱板1上，避免熱量累積於發熱元件30的周圍，以達到提升散熱器10之散熱效率。
The combination of the handheld communication device 100 of the present invention, as shown in the fifth to sixth figures, is provided with a cavity 21 inside the housing 20; the heat generating component 30 is housed in the cavity 21; the thinned heat dissipation structure 10 as described above It is accommodated in the cavity 21, and the heat pipe 2 is thermally attached to the heat generating component 30. Thereby, the heat pipe 2 uniformly guides the heat generated by the heat generating component 30 to the heat conducting plate 1 to prevent heat from accumulating around the heat generating component 30, so as to improve the heat dissipation efficiency of the heat sink 10.
相較習知手持通訊裝置之散熱器，其僅利用導熱板直接熱貼接發熱元件，使熱量容易累積在導熱板鄰近發熱元件的局部，即熱量容易累積在發熱元件的周圍。
Compared with the heat sink of the conventional handheld communication device, the heat-generating component is directly heat-bonded only by the heat-conducting plate, so that heat is easily accumulated in the portion of the heat-conducting plate adjacent to the heat-generating component, that is, heat is easily accumulated around the heat-generating component.
本發明薄型化散熱結構10及手持通訊裝置100之使用狀態，如第七圖所示，其中熱管（Heat Pipe）2的傳熱及散熱效果較導熱板1佳，因此熱管（Heat Pipe）2熱貼接於發熱元件30時，能夠利用熱管（Heat Pipe）2將發熱元件30產生之熱量均勻地傳導至導熱板1上，進而避免熱量累積於發熱元件30的周圍，並發揮導熱板1之功效，透過導熱板1將熱量均勻分配至手持通訊裝置100上，使薄型化散熱結構10具有良好地散熱效率。
The use state of the thin heat dissipation structure 10 and the handheld communication device 100 of the present invention is as shown in the seventh figure, wherein the heat pipe and the heat dissipation effect of the heat pipe 2 are better than that of the heat conduction plate 1, so the heat pipe 2 is hot. When the heat generating component 30 is attached, the heat generated by the heat generating component 30 can be uniformly conducted to the heat conducting plate 1 by the heat pipe 2, thereby preventing heat from accumulating around the heat generating component 30 and exerting the effect of the heat conducting plate 1. The heat is evenly distributed to the handheld communication device 100 through the heat conducting plate 1, so that the thinned heat dissipation structure 10 has good heat dissipation efficiency.
另外，熱管（Heat Pipe）2設置於穿槽11內並和突出片13相互卡合，使熱管（Heat Pipe）2透過突出片13的支承以穩固地定位在穿槽11內，進而提升薄型化散熱結構10之結構穩定度。
In addition, a heat pipe 2 is disposed in the through groove 11 and engaged with the protruding piece 13 to allow the heat pipe 2 to pass through the support of the protruding piece 13 to be stably positioned in the through groove 11 to further reduce the thickness. The structural stability of the heat dissipation structure 10.
再者，熱管（Heat Pipe）2係以沖壓方式成型並埋設於穿槽11內，使熱管（Heat Pipe）2的厚度h2實質上等於導熱板1的厚度h1，以使薄型化散熱結構10達到薄型化之優點，讓薄型化散熱結構10具有體積輕薄，不占空間、方便組裝之功效。
Furthermore, the heat pipe 2 is formed by stamping and embedded in the through slot 11 such that the thickness h2 of the heat pipe 2 is substantially equal to the thickness h1 of the heat conducting plate 1 so that the thinned heat dissipating structure 10 reaches The advantage of the thinning is that the thin heat dissipation structure 10 has the advantages of light volume, no space occupation and convenient assembly.
又，熱管（Heat Pipe）2係以沖壓方式成型，並令熱管（Heat Pipe）2和突出片13共同形成共面結構S，使發熱元件30的表面更容易緊密貼接於共面結構S，進而提升薄型化散熱結構10之散熱效率。
Moreover, the heat pipe 2 is formed by stamping, and the heat pipe 2 and the protruding piece 13 together form a coplanar structure S, so that the surface of the heat generating component 30 is more easily adhered to the coplanar structure S, Further, the heat dissipation efficiency of the thinned heat dissipation structure 10 is improved.
此外，熱管（Heat Pipe）2設有凹陷段21，凹陷段21對應突出片13嵌合，使突出片13能夠提供面積以貼覆熱管（Heat Pipe）2，讓發熱元件30產生之熱量快速地傳導至導熱板1上，達到短時間內均溫散熱之優點。
In addition, the heat pipe 2 is provided with a recessed section 21, and the recessed section 21 is fitted corresponding to the protruding piece 13, so that the protruding piece 13 can provide an area to cover the heat pipe 2, so that the heat generated by the heat generating component 30 is quickly generated. Conducted on the heat conducting plate 1 to achieve the advantage of uniform temperature dissipation in a short time.
請參考第八至九圖所示，係本發明薄型化散熱結構第三實施例、第四實施例，第三實施例、第四實施例和第一實施例不同之處在於，熱管（Heat Pipe）2除為一字形管體外，其也可為L字形管體或U字形管體，穿槽11的形狀會和熱管（Heat Pipe）2的形狀相互配合，進一步說明如下。
Referring to the eighth to ninth drawings, the third embodiment, the fourth embodiment, the third embodiment, the fourth embodiment and the first embodiment of the thinned heat dissipation structure of the present invention are different in that the heat pipe (Heat Pipe) 2 is divided into an L-shaped tube body, which may also be an L-shaped tube body or a U-shaped tube body, and the shape of the through-groove 11 matches the shape of the heat pipe 2, which is further described below.
熱管（Heat Pipe）2可為L字形管體或U字形管體，使熱管（Heat Pipe）2能利用形狀在有限的空間裡，大面積地貼接導熱板1，以提升熱管（Heat Pipe）2與導熱板1之間的熱貼接面積，進而增加薄型化散熱結構10之散熱功效。
The heat pipe 2 can be an L-shaped pipe body or a U-shaped pipe body, so that the heat pipe 2 can be attached to the heat-conducting plate 1 over a large area by using a shape in a limited space to heat the heat pipe (Heat Pipe). 2 The heat bonding area with the heat conducting plate 1 further increases the heat dissipation effect of the thin heat dissipation structure 10.
綜上所述，本發明之手持通訊裝置及其薄型化散熱結構，亦未曾見於同類產品及公開使用，並具有產業利用性、新穎性與進步性，完全符合發明專利申請要件，爰依專利法提出申請，敬請詳查並賜准本案專利，以保障發明人之權利。
In summary, the handheld communication device and the thinned heat dissipation structure thereof of the present invention have not been seen in similar products and are used publicly, and have industrial applicability, novelty and advancement, and fully comply with the requirements for invention patent applications, and are subject to the patent law. To file an application, please check and grant the patent in this case to protect the rights of the inventor.
100‧‧‧手持通訊裝置 100‧‧‧Handheld communication device
10‧‧‧薄型化散熱結構 10‧‧‧Thin-shaped heat dissipation structure
1‧‧‧導熱板 1‧‧‧heat conducting plate
11‧‧‧穿槽 11‧‧‧through slot
13‧‧‧突出片 13‧‧‧ Highlights
2‧‧‧熱管 2‧‧‧heat pipe
20‧‧‧殼體 20‧‧‧shell
30‧‧‧發熱元件 30‧‧‧heating components
40‧‧‧電路板 40‧‧‧ boards
Claims (12)
一導熱板，設有一穿槽及於該穿槽內周緣形成一內環壁，該內環壁延伸有至少一突出片；以及
一熱管，設置於該穿槽內並和該突出片相互卡合。A thin heat dissipation structure comprising:
a heat conducting plate is provided with a through groove and an inner ring wall is formed on the inner periphery of the through groove, the inner ring wall extends at least one protruding piece; and a heat pipe disposed in the through groove and engaged with the protruding piece .
一殼體，內部設有一容腔；
一發熱元件，容置在該容腔內；以及
如請求項1至10任一項所述之薄型化散熱結構，容置在該容腔內，並該熱管熱貼接於該發熱元件。A handheld communication device comprising:
a casing having a cavity inside;
A heat generating component is disposed in the cavity; and the thinned heat dissipation structure according to any one of claims 1 to 10 is housed in the cavity, and the heat pipe is thermally attached to the heat generating component.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102127000A TWI533791B (en) | 2013-07-26 | 2013-07-26 | Handheld communication apparatus and thin heat-dissipating structure thereof |
| CN201310378592.6A CN104349651A (en) | 2013-07-26 | 2013-08-22 | Handheld communication device and thinned heat dissipation structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102127000A TWI533791B (en) | 2013-07-26 | 2013-07-26 | Handheld communication apparatus and thin heat-dissipating structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201505533A true TW201505533A (en) | 2015-02-01 |
| TWI533791B TWI533791B (en) | 2016-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102127000A TWI533791B (en) | 2013-07-26 | 2013-07-26 | Handheld communication apparatus and thin heat-dissipating structure thereof |
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| Country | Link |
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| CN (1) | CN104349651A (en) |
| TW (1) | TWI533791B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327997A (en) * | 2017-08-01 | 2019-02-12 | 东莞市普威玛精密工业有限公司 | The connection of the heat pipe and metal shell of electronic apparatus constructs |
| TWM565467U (en) * | 2018-02-13 | 2018-08-11 | 昇業科技股份有限公司 | Handheld communication device and thin heat-dissipation structure thereof |
| CN110740611A (en) * | 2018-07-20 | 2020-01-31 | 深圳富泰宏精密工业有限公司 | Radiator and electronic device with same |
| CN113811135A (en) * | 2020-06-12 | 2021-12-17 | 维峰科技股份有限公司 | Heat radiation module and manufacturing method thereof |
-
2013
- 2013-07-26 TW TW102127000A patent/TWI533791B/en active
- 2013-08-22 CN CN201310378592.6A patent/CN104349651A/en active Pending
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| Publication number | Publication date |
|---|---|
| TWI533791B (en) | 2016-05-11 |
| CN104349651A (en) | 2015-02-11 |
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