TWM470167U - Heat dissipation fan - Google Patents

Description

Cooling fan

This creation is a cooling fan, especially a cooling fan that allows the cooling fan side wall to have a heat dissipation effect.

When an electronic device operates due to internal components, a large amount of thermal energy is easily generated. To ensure normal operation of the component, a heat dissipating device is required to release excess heat energy to the outside of the electronic device. With the advancement of technology, portable electronic products, such as notebook computers, are becoming more and more lightweight and thinner to meet the needs of users for portability. However, as notebook computers become smaller and smaller, The problem of heat dissipation is more important, because the components inside the notebook computer are fixed, including the motherboard, CPU, hard disk, memory, processing chip, etc., under high frequency operation, it will inevitably produce high heat, but because of the notes The overall size of the computer is reduced, which limits the cooling space inside the notebook.

Therefore, it is necessary to have a new cooling fan. By changing the structure of the fan side wall, the heat is guided to the side wall to assist heat dissipation, thereby increasing the heat dissipation area and heat dissipation efficiency of the cooling fan, so as to solve the problem of insufficient heat dissipation space inside the thin and light notebook computer. problem.

The main purpose of this creation is to provide a cooling fan that allows the cooling fan side wall to have a heat dissipation effect.

The main purpose of the present invention is to provide a cooling pad and a cooling fan disposed on the side wall and adjacent to the heat pipe to conduct heat to the side wall and the base.

In order to achieve the above object, the heat dissipation fan of the present invention comprises a base, a fan assembly, a heat sink, a heat pipe, and a heat dissipation pad, wherein the fan assembly comprises a U-shaped side wall, a fan body and a receiving groove. The U-shaped side wall includes an opening, one end of the U-shaped side wall is connected to the base, and the fan body is disposed in the U-shaped side wall, and the receiving groove is connected to the U-shaped side wall and close to the opening. The heat sink is disposed on the base and adjacent to the opening, and the heat pipe is disposed on the base and adjacent to the opening. The heat dissipation pad is placed in at least one receiving groove and contacts the heat pipe and/or the base to assist in heat dissipation.

According to an embodiment of the present invention, the U-shaped side wall further includes a plurality of accommodating grooves for accommodating the plurality of heat dissipation pads, and the U-shaped side wall includes two oppositely disposed first side walls, wherein the plurality of accommodating grooves are respectively disposed at the two One side wall and close to the heat pipe.

According to an embodiment of the present invention, the heat pipe is sandwiched between the at least one heat dissipation pad and the bearing surface.

According to an embodiment of the present invention, at least one of the heat dissipation pads is a plurality of heat dissipation pads, and at least one of the receiving grooves is a plurality of receiving grooves, and the U-shaped side wall includes two opposite first side walls, wherein the plurality of receiving grooves are respectively disposed on the two The first side wall is adjacent to the heat pipe, and each of the heat dissipation pads is accommodated in each of the accommodating grooves.

Therefore, the U-shaped side wall is provided with a heat-dissipating pad which can contact the heat pipe and/or the base near the heat pipe to increase the heat-dissipating area; in addition, the heat pipe can also be sandwiched between the heat-dissipating pad and the bearing surface, Increase heat dissipation efficiency and enhance heat conduction. Because the creation of this creation is novel, it can provide industrial use, and it has improved efficiency, so it applies for a new patent according to law.

The above and other objects, features and advantages of the present invention will become more apparent and understood.

The cooling fan of the present invention can be used for an electronic device with heat dissipation requirements, and the cooling fan of the present invention is disposed in the electronic device near the heating element. The electronic device may be a computer device, a portable device or other electronic device having a similar heating element therein, but the present invention is not limited thereto.

Please refer to FIG. 1 and FIG. 2 for an embodiment of the cooling fan of the present invention. FIG. 1 is a structural exploded view of one embodiment of the cooling fan of the present invention; FIG. 2 is an implementation of the cooling fan of the present invention. A schematic diagram of an example.

As shown in FIG. 1 , in the present embodiment, the heat dissipation fan 1 of the present invention includes a base 10 , a fan assembly 20 , a heat sink 30 , a heat pipe 40 , a heat dissipation pad 50 , and a connecting portion 60 , wherein the base 10 includes a bearing surface. The fan assembly 20 includes a U-shaped side wall 21, a fan body 22, and a cover member 23. The U-shaped side wall 21 includes an opening 211, two opposite first sidewalls 212, and two receiving slots 213.

The base 10 of the present embodiment is made of a metal material. One end of the U-shaped side wall 21 is integrally coupled to the base 10 at the edge of the bearing surface 11 . The fan body 22 is disposed in the U-shaped side wall 21 and located on the bearing surface 11 . As shown in FIG. 1 , the heat dissipating member 30 and the heat pipe 40 are disposed on the bearing surface 11 and adjacent to the opening 211 , and the heat dissipating member 30 of the embodiment is a heat dissipating fin, and the heat pipe 40 of the embodiment is directly welded to the bearing surface 11 . .

As shown in FIG. 1 and FIG. 2, the two receiving slots 213 of the present embodiment are respectively disposed on the two first sidewalls 211 of the U-shaped sidewall 21, and the two receiving slots 213 are respectively adjacent to the opening 211 and the heat pipe 40, and the heat dissipation pad 50 Then, it is placed in the receiving groove 213 to contact and press the bearing surface 11 . Because the heat pipe 40 of the embodiment is directly welded to the bearing surface 11 and the bearing surface 11 is made of a metal material, the heat energy of the heat pipe 40 is dissipated to the bearing surface 11 by the heat-discharging property of the metal, and the heat-dissipating pad 50 contacts the bearing surface 11 The heat energy from the heat pipe 40 is received and the heat is transmitted to the U-shaped side wall 21, so that heat can also be dissipated through the U-shaped side wall 21, so that the heat dissipation area of the cooling fan 1 of the present invention is increased. It should be noted that the number of the receiving slots 213 and the heat dissipating pads 50 in the foregoing embodiment is plural, but the present invention is not limited thereto, and the number of the receiving slots 213 and the heat dissipating pads 50 may be more or less.

The cover member 23 is connected to the fan body 22, and as shown in FIG. 1, the cover member 23 of the embodiment is fastened to the other end of the U-shaped side wall 21, so that the fan assembly 20 and the base 10 form a fan. The housing 22 has a housing space (as shown in Figure 2). In addition, when the cooling fan 1 of the present invention is installed in an electronic device, it is coupled to the electronic device through the connecting portion 60.

Please refer to FIG. 3 for another embodiment of the heat dissipation fan of the present invention. FIG. 3 is a partial enlarged view of another embodiment of the heat dissipation fan of the present invention.

As shown in FIG. 3, another embodiment of the heat dissipation fan of the present invention is that the heat pipe 40 is sandwiched between the heat dissipation pad 50 and the bearing surface 11. Since the vertical direction is the preferred heat dissipation direction of the heat pipe 40, the heat dissipation pad 50 is disposed. As for the heat pipe 40, the heat of the heat pipe 40 is guided to the U-shaped side wall 21 to be dissipated, so as to increase the heat dissipation area and heat dissipation effect of the heat dissipation fan 1a. As shown in FIG. 3, in order to cooperate with the movement of the heat pipe 40, the shape of the base 10, the relative position of the heat pipe 40 and the heat sink 30 may be slightly changed, and the change is based on the actual structural design and installation of the heat dissipation fan 1. The heat dissipation requirements of the electronic device of the cooling fan 1 are different, and the embodiment of the cooling fan 1a shown in FIG. 3 is merely an example.

Please refer to FIG. 4 for another embodiment of the heat dissipation fan of the present invention. FIG. 4 is a schematic diagram of still another embodiment of the heat dissipation fan of the present invention.

As shown in FIG. 4, the heat dissipating fan 1b is different from the foregoing two embodiments in that the receiving groove 213 of the heat dissipating fan 1b is directly exposed to the first side wall 212, and the receiving groove 213a can be directly embedded in the first side wall 212. In order to maintain the thermal pad 50a and the heat pipe 40 in a stable contact state, the shape of the heat dissipation pad 50a needs to be matched with the heat pipe 40.

In combination with the above embodiments, the heat dissipation fan 1, 1a, 1b of the present invention can transfer the heat energy of the heat pipe 40 to the U-shape through the heat dissipation pad 50 by designing the heat dissipation pad 50 and the receiving groove 213 of the U-shaped side wall 21. The side wall 21 increases the heat dissipation area of the heat dissipation fan 1, 1a, 1b of the present invention to enhance the heat dissipation effect of the heat dissipation fan 1, 1a, 1b of the present invention. Therefore, when the cooling fan 1, 1a, 1b of the present invention is used inside the thin and light notebook computer, even if the heat dissipation space inside the notebook computer is insufficient, compared with the conventional heat dissipation wind, the cooling fan 1, 1a of the creation, 1b still has better heat dissipation performance.

In summary, this creation, regardless of its purpose, means and efficacy, is showing its characteristics that are different from the well-known techniques. You are kindly requested to review the examination and express the patent as soon as possible. It is to be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the claims is intended to be limited by the scope of the claims.

1, 1a, 1b‧‧‧ cooling fan
10‧‧‧ Pedestal
20‧‧‧Fan components
21‧‧‧U-shaped side wall
211‧‧‧ openings
212‧‧‧First side wall
22‧‧‧Fan body
213, 213a‧‧‧ accommodating slots
23‧‧‧Care fittings
30‧‧‧ Heat sink
40‧‧‧heat pipe
50, 50a‧‧‧ Thermal pad
60‧‧‧Connecting Department

Figure 1 is a structural exploded view of one embodiment of the cooling fan of the present invention. FIG. 2 is a schematic diagram of an embodiment of the cooling fan of the present invention. 3 is a partial enlarged view of another embodiment of the heat dissipation fan of the present invention. 4 is a schematic view of still another embodiment of the heat dissipation fan of the present invention.

1‧‧‧ cooling fan

21‧‧‧U-shaped side wall

213‧‧‧ accommodating slots

23‧‧‧Care fittings

30‧‧‧ Heat sink

40‧‧‧heat pipe

50‧‧‧ Thermal pad

60‧‧‧Connecting Department

Claims (7)

A cooling fan includes: a base; a fan assembly, comprising: a U-shaped side wall, one end of the U-shaped side wall is connected to the base, and the U-shaped side wall includes an opening and at least one receiving groove. The at least one receiving slot is adjacent to the opening; a fan body is disposed in the U-shaped side wall; a heat dissipating member is disposed on the base and adjacent to the opening; a heat pipe is disposed on the base and adjacent to the And an at least one heat dissipating pad disposed in the at least one receiving groove and contacting the heat pipe and/or the base to assist in heat dissipation. The heat dissipation fan of claim 1, wherein the base further includes a bearing surface, wherein the heat pipe and the base are coupled to the bearing surface, and the at least one heat sink contacts and presses the bearing surface. The heat dissipation fan of claim 1, wherein the base further comprises a bearing surface, wherein the heat pipe is sandwiched between the at least one heat dissipation pad and the bearing surface. The heat dissipation fan of claim 1, wherein the at least one heat dissipation pad is a plurality of heat dissipation pads, and the at least one accommodating groove is a plurality of accommodating grooves, and the U-shaped side wall includes two opposite first side walls, wherein The plurality of accommodating grooves are respectively disposed on the two first side walls and adjacent to the heat pipe, and each of the heat dissipation pads is received in each of the accommodating grooves. The heat dissipation fan of claim 4, wherein the base further comprises a bearing surface, wherein the heat pipe and the base are coupled to the bearing surface, and one of the plurality of thermal pads contacts and presses the bearing surface . The heat dissipation fan of claim 4, wherein the base 10 further includes a bearing surface, wherein the heat pipe is sandwiched between one of the plurality of heat dissipation pads and the bearing surface. The heat dissipation fan of claim 1, wherein the fan assembly further comprises a cover member, wherein the cover member is coupled to the fan body, and the cover member is coupled to the other end of the U-shaped side wall.