CN104039115B - Mobile phone heat dissipation module - Google Patents
Mobile phone heat dissipation module Download PDFInfo
- Publication number
- CN104039115B CN104039115B CN201410204181.XA CN201410204181A CN104039115B CN 104039115 B CN104039115 B CN 104039115B CN 201410204181 A CN201410204181 A CN 201410204181A CN 104039115 B CN104039115 B CN 104039115B
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- CN
- China
- Prior art keywords
- mobile phone
- heat
- padded coaming
- hot
- euthermic chip
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 title abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000000428 dust Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000292 calcium oxide Substances 0.000 claims description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 3
- 230000003750 conditioning effect Effects 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 239000011147 inorganic material Substances 0.000 claims description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 3
- 239000000347 magnesium hydroxide Substances 0.000 claims description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 239000012745 toughening agent Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000005751 Copper oxide Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims description 2
- 229910000431 copper oxide Inorganic materials 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 229910017083 AlN Inorganic materials 0.000 claims 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract 4
- 238000010521 absorption reaction Methods 0.000 abstract 2
- 238000005338 heat storage Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Abstract
The invention provides a mobile phone heat dissipation module, which mainly comprises a heating chip, a flat heat pipe and a thermal buffer material, wherein the heating chip is arranged on a circuit board; one end of the flat heat pipe is a heat absorption section, and the other end of the flat heat pipe is a heat dissipation section, wherein the heat absorption section is attached above the heating chip and is used for conducting the heat energy of the heating chip to the heat dissipation section at the other end rapidly; the heat buffer material is attached to or covers the heat dissipation section of the flat heat pipe, and the outer surface of the heat buffer material can be in contact with the mobile phone shell, so that heat energy conducted to the heat dissipation section is absorbed and gradually released to the mobile phone shell.
Description
Technical field
The present invention relates to mobile phone radiator structure field, in particular, relate to a kind of mobile phone and dissipate
Thermal modules.
Background technology
Have people in recent years and heat pipe is used in the heat radiation of mobile phone, but owing to the past is in meter on knee
Calculation machine (Laptop computer) uses the experience of heat pipe, usually one end of heat pipe can be added
One radiating fin (heat sink) is arranged at an opening part and extremely should by hot blow with a fan
Opening part dispels the heat.But owing to present smart mobile phone requires waterproof and dust-proof, add requirement super
The superelevation specification requirements such as thin design, causing cannot be by the heat dissipation design of past laptop computer
Directly move to and use on mobile phone, it is therefore necessary to use other heat dissipation design.
The radiating mode of existing smart mobile phone be use punched metal sheet, graphite or both arrange in pairs or groups
Realizing, though can quickly be dispersed by heat energy, but this can allow user sensation scald one's hand uncomfortable, along with
Mobile telephone power consumption is more and more higher, and the radiating mode of this kind of design can not meet following higher power consumption
Demand.
Summary of the invention:
It is an object of the invention to overcome shortcoming of the prior art with not enough, make offer one tie
Simple and more heat radiation function the mobile phone radiating module of structure.
In order to achieve the above object, the technical scheme is that:
Mobile phone radiating module provided by the present invention is mainly by euthermic chip, flat hot pipe and heat
Padded coaming is formed, wherein said euthermic chip, is arranged at a circuit board；Described is flat
Flat heat pipe one end is endotherm section, and the other end is then radiating segment, and wherein said endotherm section attaches
In the top of described euthermic chip, make to be rapidly transferred to for conducting the heat energy of described euthermic chip
At the radiating segment of the other end；Described hot padded coaming then attaches or envelopes described flat heat
The radiating segment of pipe, the outer surface of described hot padded coaming can contact with hand set machine shell, makes suction
Receive the heat energy at the radiating segment that conduction is the most described, and be gradually released into described hand set machine shell；
Wherein, described hot padded coaming is by ceramic powders or metal dust 20～100 parts；
Epoxy resin 50～100 parts；Firming agent 1～20 parts and other a small amount of composition ground solidification promotion
Agent, powder surface conditioning agent, toughener etc. are formed, and use solvent by these material blendings
After make it solidify to form.
In the mobile phone radiating module of the present invention, described euthermic chip is the computing of integrated circuit
Processor.
In the mobile phone radiating module of the present invention, described ceramic powders is by aluminium oxide, nitridation
Aluminum, copper oxide, titanium dioxide, ferrum oxide, silicon dioxide, magnesium oxide, calcium oxide, carbonization
One or more institute's groups in the powdered inorganic material such as silicon, aluminium hydroxide, magnesium hydroxide and graphite
Close.Described metal dust or the particle diameter of ceramic powders are 0.1 μm-50 μm.Described mobile phone
Radiating module material (less than 150 DEG C, more than-60 DEG C) within the temperature range of using is to produce
Raw phase change, described hot padded coaming specific heat capacity C in the range of 1000～3000J/kg*K,
And optimal specific heat capacitance is 2000～3000J/kg*K.
In the mobile phone radiating module of the present invention, the endotherm section for described euthermic chip contact can
It is located at the interlude of described flat hot pipe, and attaches for described hot padded coaming or bag
The radiating segment covered then is located at the two ends of described flat hot pipe.
Being designed as of the present invention meets present smart mobile phone and requires waterproof and dustproof and ultra-thin design
Specification, the one end of the flat hot pipe being therefore less than 0.6mm with thickness is attached to the upper of euthermic chip
Side, the other end then imposes thermal compensation mode and designs a hot padded coaming attaching or envelope.
Compared with prior art, more single than commonly use due to hot padded coaming used in the present invention
Metal or graphite have higher heat storage capacity, it is possible to be widely used in higher power consumption
Mobile device, it is not necessary to large area or fan strengthen thermal convection current effect, and therefore the present invention is not only
Radiating effect is good, and it also can reach effect of significant reduction in manufacturing cost.
Accompanying drawing illustrates:
Fig. 1 is mobile phone radiating module structure figure.
Fig. 2 is that radiating module is in the application drawing of mobile phone.
Fig. 3 is temperature rise figure during mobile phone operation.
Fig. 4 is the heat-transfer path of radiating module.
Fig. 5 is the A-A sectional view of Fig. 2, is the heat radiation schematic diagram under standby status of mobile phone.
Fig. 6 is the another kind of example structure figure of mobile phone radiating module.
Detailed description of the invention:
Referring to shown in Fig. 1 and Fig. 2, the mobile phone radiating module that disclosed herein is mainly by sending out
Hot chip 1, flat hot pipe 2 and hot padded coaming 3 are constituted, wherein said euthermic chip
1 refers to be located at the arithmetic processor of the integrated circuit on mobile phone interior circuit board；Described flat heat
Pipe 2 one end is endotherm section 21, and the other end is then radiating segment 22, wherein said endotherm section
21 tops being attached at described euthermic chip 1, for conducting the heat energy of described euthermic chip 1
Make to be rapidly transferred at the radiating segment 22 of the other end；Described hot padded coaming 3 then attaches
Or envelope at the radiating segment 22 of described flat hot pipe 2, another described hot padded coaming 3
Outer surface then can contact with hand set machine shell 4, makes Assimilation and conductivity at the most described radiating segment 22
Heat energy, and be gradually released into described hand set machine shell 4.
Described flat hot pipe 2 is the ultrathin heat pipe using below 1.0mm, its bending shape
Arbitrarily can adjust according to the position of CPU, the charging euthermic chip such as IC, power management chip.
Described hot padded coaming 3 is a kind of high thermal conductivity coefficient k, the material of high specific heat C, is
The composite being combined with epoxy resin by metal dust or ceramic powders.This hot padded coaming 3
Advantage be, heat can be spread rapidly by the high capacity of heat transmission of metal or ceramic powders, uniformly divides
It is distributed in hot padded coaming surface, and substantial amounts of heat can be stored by the high specific heat value of epoxide resin material,
Make mobile phone CPU and the skin temperature will not too high (as shown in Figure 3).I.e.
Q=ρ × V × C × Δ T, when volume V, density p and the heat Q of material fix, C is more
Greatly, then temperature rise Δ T is the least.When volume V, density p and the temperature rise Δ T of material fix
Time, C is the biggest, then the heat stored is the most.
Described hot padded coaming 3 is by ceramic powders 20～90 parts；Epoxy resin 20～90 parts；
Firming agent 1～20 parts and other a small amount of composition ground curing accelerator, powder surface conditioning agent,
Toughener etc. are formed, and use solvent to form making it solidify after these material blendings.
Described ceramic powders be by aluminium oxide, oxidized aluminum nitride copper, titanium dioxide, ferrum oxide,
Silicon dioxide, magnesium oxide, calcium oxide, carborundum, aluminium hydroxide, magnesium hydroxide and graphite etc.
Combined by one or more in powdered inorganic material, described metal dust or ceramic powders
Particle diameter is 0.1 μm-50 μm.Described mobile phone radiating module material is within the temperature range of using
(less than 150 DEG C, more than-60 DEG C) are to produce phase change, described hot padded coaming specific heat
C is in the range of 1000～3000J/kg*K for appearance, and optimal specific heat capacitance is
2000～3000J/kg*K.
The sinking path of this mobile phone radiating module entirety is the high conduction energy by flat hot pipe 2
The heat of CPU is quickly transferred to the hot fender at hot padded coaming 3, described in recycling by power
The high heat storage ability of material 3 is by heat storage (as shown in Figure 4), when cell phone standby or low-power consumption are transported
During row, by phone housing 4, heat is slowly dissipated (as shown in Figure 5).
It addition, as shown in Figure 6, the endotherm section 21 for described euthermic chip 1 contact can quilt
Be located at the interlude of described flat hot pipe 2, and attach for described hot padded coaming 3 or
The radiating segment 22 of cladding is then located at the two ends of described flat hot pipe 2.
Owing to described hot padded coaming has higher heat storage capacity, it is possible to extensively should
Mobile device for higher power consumption, it is not necessary to large area or fan strengthen thermal convection current effect,
Therefore the present invention not only radiating effect is good, its effect that also can reduce in manufacturing cost.
Above-described embodiment is for presently preferred embodiments of the present invention, but embodiments of the present invention are not
Being restricted to the described embodiments, other are any deviates from and is made under spirit of the invention and principle
Change, modify, substitute, combine, simplification etc. all should be the substitute mode of equivalence, and it all should
Comprise within the scope of the present invention.
Claims (4)
1. a mobile phone radiating module, comprises:
One euthermic chip, is arranged at a circuit board；
One flat hot pipe, described flat hot pipe one end is endotherm section, and the other end is then radiating segment, and wherein said endotherm section is attached at the top of described euthermic chip, makes to be rapidly transferred at the radiating segment of the other end for conducting the heat energy of described euthermic chip；With
One hot padded coaming, attaches or envelopes the radiating segment of described flat hot pipe, and the outer surface of described hot padded coaming can contact with hand set machine shell, makes Assimilation and conductivity to the heat energy at the most described radiating segment, and is gradually released into described hand set machine shell；
Wherein, described hot padded coaming is by ceramic powders or metal dust 20～90 parts；Epoxy resin 20～90 parts；Firming agent 1～20 parts and other a small amount of composition ground curing accelerator, powder surface conditioning agent, toughener etc. are formed, and use solvent to form making it solidify after these material blendings.
2. according to the mobile phone radiating module described in claim 1, it is characterised in that: described euthermic chip is the arithmetic processor of integrated circuit.
3. according to the mobile phone radiating module described in claim 1, it is characterized in that: described ceramic powders is by aluminium oxide, aluminium nitride, copper oxide, titanium dioxide, ferrum oxide, silicon dioxide, magnesium oxide, calcium oxide, carborundum, aluminium hydroxide, combined by one or more in the powdered inorganic material such as magnesium hydroxide and graphite, described metal dust is by copper powder, aluminum powder, combined by one or more in the metal dust such as iron powder and magnesium powder, described ceramic powders or the particle diameter of metal dust are 0.1 μm-50 μm, described hot padded coaming specific heat capacity C is in the range of 1000～3000J/kg*K.
4. the mobile phone radiating module as described in claim 1, it is characterized in that: the endotherm section for described euthermic chip contact can be located at the interlude of described flat hot pipe, attach for described hot padded coaming or the radiating segment of cladding is then located at the two ends of described flat hot pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410204181.XA CN104039115B (en) | 2014-05-14 | 2014-05-14 | Mobile phone heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410204181.XA CN104039115B (en) | 2014-05-14 | 2014-05-14 | Mobile phone heat dissipation module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104039115A CN104039115A (en) | 2014-09-10 |
| CN104039115B true CN104039115B (en) | 2016-09-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410204181.XA Active CN104039115B (en) | 2014-05-14 | 2014-05-14 | Mobile phone heat dissipation module |
Country Status (1)
| Country | Link |
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| CN (1) | CN104039115B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104980534B (en) * | 2014-09-17 | 2018-01-19 | 广东欧珀移动通信有限公司 | The skin temperature adjusting apparatus and method of a kind of mobile terminal |
| CN105228410A (en) * | 2014-09-25 | 2016-01-06 | 维沃移动通信有限公司 | A kind of heat abstractor of terminal and terminal |
| CN105682418B (en) * | 2014-11-20 | 2018-09-25 | 奇鋐科技股份有限公司 | Mobile electronic device radiator structure |
| JP5945047B1 (en) * | 2015-08-19 | 2016-07-05 | 株式会社フジクラ | Thermal diffusion plate for portable electronic devices |
| CN105744822B (en) * | 2016-04-29 | 2019-06-14 | Oppo广东移动通信有限公司 | Shielding case, circuit board and mobile terminal |
| CN105744810B (en) * | 2016-04-29 | 2018-12-11 | 广东欧珀移动通信有限公司 | A kind of shell and mobile terminal of terminal |
| CN106455452B (en) * | 2016-11-25 | 2019-02-26 | 华为技术有限公司 | Single plate radiator and communication equipment |
| CN106774665A (en) * | 2016-12-16 | 2017-05-31 | 歌尔科技有限公司 | A kind of virtual helmet radiator structure |
| CN110365815B (en) | 2018-03-26 | 2021-03-30 | 华为技术有限公司 | Heat conduction assembly and terminal |
| CN110248527B (en) * | 2019-07-19 | 2023-11-07 | 江西耐乐铜业有限公司 | Production method of oxygen-free copper tube for mobile phone heat tube and mobile phone heat tube |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211869A (en) * | 2006-12-27 | 2008-07-02 | 仁宝电脑工业股份有限公司 | Radiating module and its heat conduction pipe |
| CN103001428A (en) * | 2012-12-26 | 2013-03-27 | 上海摩软通讯技术有限公司 | Flat motor and mobile terminal |
| TW201314398A (en) * | 2011-09-30 | 2013-04-01 | Quanta Comp Inc | Electronic device and temperature modulation method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8976528B2 (en) * | 2012-06-08 | 2015-03-10 | Apple Inc. | Fasteners and dual-thickness thermal stages in electronic devices |
| US9210832B2 (en) * | 2012-08-13 | 2015-12-08 | Asustek Computer Inc. | Thermal buffering element |
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2014
- 2014-05-14 CN CN201410204181.XA patent/CN104039115B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211869A (en) * | 2006-12-27 | 2008-07-02 | 仁宝电脑工业股份有限公司 | Radiating module and its heat conduction pipe |
| TW201314398A (en) * | 2011-09-30 | 2013-04-01 | Quanta Comp Inc | Electronic device and temperature modulation method |
| CN103001428A (en) * | 2012-12-26 | 2013-03-27 | 上海摩软通讯技术有限公司 | Flat motor and mobile terminal |
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| Publication number | Publication date |
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| CN104039115A (en) | 2014-09-10 |
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