CN101211869A - Radiating module and its heat conduction pipe - Google Patents
Radiating module and its heat conduction pipe Download PDFInfo
- Publication number
- CN101211869A CN101211869A CNA2006101673076A CN200610167307A CN101211869A CN 101211869 A CN101211869 A CN 101211869A CN A2006101673076 A CNA2006101673076 A CN A2006101673076A CN 200610167307 A CN200610167307 A CN 200610167307A CN 101211869 A CN101211869 A CN 101211869A
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- China
- Prior art keywords
- heat pipe
- heat
- tube wall
- euthermic chip
- face
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Abstract
The invention relates to a heat dissipation module which comprises a heat conduction pipe with a hollow pipe body, which is provided with a delivery section which sticks and holds to a heating chip; thickness of metal outer-layer pipe wall of the delivery section is larger than that of the heat conduction pipe; a sticking and holding side with at least partially flatness is arranged; and a heat dissipation rectangular fin is connected with the other end of the heat conduction pipe so as to directly stick and hold to the heating chip through the sticking and holding side of the delivery section to prevent from arrangement of a relay part and to deliver heat. More significant, the invention further provides a heat conduction pipe used for the heat dissipation module.
Description
Technical field
The present invention relates to a kind of radiating module, particularly a kind of to strengthen heat pipe (heat pipe) and the direct pipe thickness of pasting the position of supporting of euthermic chip, by the radiating module that is provided with release relaying spare.
Background technology
General electronic installation is in operation, and its inner chip must produce heat, and when service speed was fast more, the heat of its generation was high more, and common example is as the CPU in the computer, VGA, South Bridge chip and north bridge chips etc.Simultaneously, when the heat of this generation if vexedly then often make casing inside because of overheated and impaired in casing and will not derive the time, therefore, with mobile computer, heat radiation, perhaps more relevantly saying derives heat, is the problem of dealer's concern.
Having now and common heat abstractor, is as shown in Figure 1, and it is to be linked to a radiating fin B with one of heat pipe A end, end is then fixedly connected in addition, as is welded in a relaying spare C, is generally good copper billet of heat conduction or copper sheet, then paste and support euthermic chip D, so that its heat is derived with this relaying spare C.
Utilize the main purpose of relaying spare C to be, because the tube wall of heat pipe A is thinner, if under the buffering relaying of non-relay C, then if the heat that produces of euthermic chip D is when being directly conducted to heat pipe A, the continuous high temperature of this heat conduction inequality, cause the inner generation of heat pipe A dry combustion method (dry out) easily, and make heat pipe ineffective, even undermine heat pipe A.
No doubt, use relaying spare C no doubt can obtain the buffering effect, but it is the pattern of non-the best also, its reason is therefore, can produce thermal impedance (thermal resistance) because the binding between heat pipe A and relaying spare C is the electric welding mode, reduce the heat conduction effect, on this external material, on the processing procedure, all expend morely, thereby cost is improved.
In view of this, the applicant is this in being engaged in the experience of information products research and development with production and marketing all the year round, concentrates on studies, and the phase can overcome above-mentioned disappearance, through experiment repeatedly, firstly appears and makes " radiating module and heat pipe thereof " of the present invention.
Summary of the invention
Main purpose of the present invention is to provide a kind of radiating module, and it comprises:
One heat pipe is hollow tube, and it is by the outer layer metal tube wall, and internal layer heat conduction backing member tube wall constitutes; One radiating fin is to be linked to one of described heat pipe end; One derives section, be to be formed at the end in addition of heat pipe and to paste to be butted on euthermic chip, it is by the outer layer metal tube wall, and internal layer heat conduction backing member tube wall constitutes, wherein should derive the metal outer pipe thickness of the metal outer pipe thickness perseverance of section, and it is provided with the local at least smooth attachment face that is in addition greater than heat pipe; So that touch face by directly pasting the subsides of supporting euthermic chip, so that heat is derived, so that exempt the setting of existing relaying spare by this derivation section.
Another object of the present invention, be to provide a kind of heat pipe, be hollow tube, the one end has one derives section, this derives the metal outer pipe thickness of the metal outer pipe thickness of section greater than heat pipe, and this derivation section is provided with the local at least smooth attachment face that is in addition, touches face in order to directly pasting the subsides of supporting euthermic chip, can avoid with welding manner in conjunction with thermal impedance that relaying spare was produced.
Be further to disclose concrete technology contents of the present invention, at first see also graphic, wherein:
Fig. 1 is existing heat abstractor schematic diagram;
Fig. 2 is a radiating module schematic diagram of the present invention;
Fig. 3 is the hollow tube A-A sectional schematic diagram of heat pipe of the present invention;
Fig. 4 is the derivation section B-B sectional schematic diagram of heat pipe of the present invention.
Embodiment
As shown in Figure 2, basically, radiating module of the present invention is combined by a heat pipe 1, one radiating fin 2.
Wherein, heat pipe 1 is hollow tube (as shown in Figure 3), and its tube wall is by the good metal pipe-wall of outer thermal conductivity, for example copper tube wall, and internal layer heat conduction backing member 11 tube walls constitute; This metal heat-conducting backing member 11 is for conducting the heat pipe endothecium structure of heat at a high speed, liquid when the heat pipe intension, pure water for example, be subjected to thermosetting gas, can conduct to fast via metal heat-conducting backing member 11 and be linked to the heat radiation of one of radiating fin end, for as, but be not limited to sinter layer (powder), lamina reticularis (mesh) or groove (groove), and this heat pipe 1 is when reality is implemented, its be as, but be not limited to circle, oblong, and even the deltiod equal section, but this is existing skill, so do not intend giving unnecessary details.
One of heat pipe 1 of the present invention end is to be linked to radiating fin 2, be formed with one in heat pipe 1 other end and derive period 12 (as shown in Figure 4), this derivation section 12 also comprises the metal pipe-wall that outer thermal conductivity is good, for example copper tube wall, and internal layer heat conduction backing member 11 tube walls constitute.
Please consult Fig. 4 again, the prior art that differs from of the present invention is to be to make the metal outer pipe thickness of the metal outer pipe thickness of this derivation section 12 greater than heat pipe 1; No matter and whether this derivation section 12 internal layer heat conduction backing members 11 tube walls be thick or thin compared to heat pipe 1 internal layer heat conduction backing member 11 tube walls, this metal outer pipe thickness that derives section 12 must permanent metal outer pipe thickness greater than heat pipe 1.
Simultaneously, for make its can with euthermic chip D, for example CPU, VGA, South Bridge chip or north bridge chips are smooth, so corresponding position part at least is smooth attachment face 13.The metal outer pipe thickness of the present invention's section of derivation 12 is greater than the method for making of the metal outer pipe thickness of heat pipe 1, one for strengthening the metal outer pipe thickness that derives section 12, or be the metal outer pipe thickness of skiving heat pipe 1, its processing mode be as, but be not limited to cut compression moulding then to utilize metal to take out.
Radiating fin 2 is for existing, precedingly addressed, and it is to be linked to differing from of heat pipe 1 to derive one of section 12 end, and should link, for as welding or clamping, and even the screw locking, but this is existing skill, so do not intend giving unnecessary details.
Please consult Fig. 2 again, when the present invention implements in reality, be attachment face 13 positions by the derivation section 12 of heat pipe 1, directly paste the subsides that are butted on euthermic chip D and touch face, in present embodiment is the end face of euthermic chip D, so, the heat that euthermic chip D produces can be derived for conducting to radiating fin 2 backs via the bigger derivation section 12 of metal outer pipe thickness with cushioning.
So via enforcement of the present invention, it can exempt the setting of existing relaying spare, can save material and cost of labor effectively, also can alleviate the weight of finished product, can be rated as one of radiating module quantum jump.
Disclosed, be a kind of of preferred embodiment, patent right category of the present invention is not all taken off in Ju Bu change or modification and come from technological thought of the present invention and be easy to the person of knowing by inference by the people who has the knack of this skill such as.
Claims (20)
1. a radiating module is to be installed on the euthermic chip of computer, it is characterized in that comprising:
One heat pipe is hollow tube, and it is by the outer layer metal tube wall, and internal layer heat conduction backing member tube wall constitutes;
One radiating fin is to be linked to one of described heat pipe end;
One derivation section is to be formed at the end in addition of heat pipe and to paste to be butted on euthermic chip, and it is by the outer layer metal tube wall, reaches internal layer heat conduction backing member tube wall and constitutes, and wherein should derive the metal outer pipe thickness of the metal outer pipe thickness perseverance of section greater than heat pipe;
So that directly paste by deriving section, after heat is directed at radiating fin, derive to euthermic chip by this.
2. radiating module as claimed in claim 1 is characterized in that, the metal outer tube wall of described this heat pipe is copper.
3. radiating module as claimed in claim 1 is characterized in that, the metal outer tube wall of described this derivation section is copper.
4. radiating module as claimed in claim 1 is characterized in that, described this derivation section is directly to paste the subsides of supporting euthermic chip to touch face, and should derivations section being provided with part at least, to be that face is touched in the subsides of smooth attachment face and euthermic chip smooth.
5. radiating module as claimed in claim 1 is characterized in that, the end face that face is an euthermic chip is touched in described these subsides.
6. radiating module as claimed in claim 1 is characterized in that, described this heat pipe is a flat.
7. radiating module as claimed in claim 1 is characterized in that, described this metal heat-conducting backing member is one of sinter layer, lamina reticularis or groove.
8. a heat pipe is a hollow tube, is installed in the radiating module of computer, and the one end is to be installed in radiating fin, and end then pastes and is butted on euthermic chip in addition; This heat pipe is by the outer layer metal tube wall, reaches internal layer heat conduction backing member tube wall and constitutes, and it is characterized in that:
Paste this end that is butted on euthermic chip in this heat pipe and be formed with a derivation section, this derivation section is by the outer layer metal tube wall, reach internal layer heat conduction backing member tube wall and constitute, and the metal outer pipe thickness of this derivation section must the permanent metal outer pipe thickness person of forming greater than heat pipe.
9. heat pipe as claimed in claim 8 is characterized in that, the metal outer tube wall of described this heat pipe is copper person.
10. heat pipe as claimed in claim 8 is characterized in that, described this derivation section metal outer tube wall is copper.
11. heat pipe as claimed in claim 8 is characterized in that, described this heat pipe is a flat.
12. heat pipe as claimed in claim 8 is characterized in that, described this derivation section is directly to paste the subsides of supporting euthermic chip to touch face, and should derivations section being provided with part at least, to be that face is touched in the subsides of smooth attachment face and euthermic chip smooth.
13. heat pipe as claimed in claim 8 is characterized in that, the end face that face is an euthermic chip is touched in described these subsides.
14. radiating module as claimed in claim 8 is characterized in that, described this metal heat-conducting backing member, and it is one of sinter layer, lamina reticularis or groove.
15. a heat pipe is a hollow tube, is installed in the radiating module of computer, the one end is to be installed in radiating fin, and end then pastes and is butted on euthermic chip in addition; It is characterized in that:
Paste this end that is butted on euthermic chip in this heat pipe and be formed with a derivation section, the pipe thickness of this derivation section must permanent pipe thickness greater than heat pipe form.
16. heat pipe as claimed in claim 15 is characterized in that, the tube wall of described this heat pipe is copper.
17. heat pipe as claimed in claim 15 is characterized in that, the tube wall of described this derivation section is copper.
18. heat pipe as claimed in claim 15 is characterized in that, described this heat pipe is a flat.
19. heat pipe as claimed in claim 15 is characterized in that, described this derivation section is directly to paste the subsides of supporting euthermic chip to touch face, and should derivations section being provided with part at least, to be that face is touched in the subsides of smooth attachment face and euthermic chip smooth.
20. heat pipe as claimed in claim 15 is characterized in that, the end face that face is an euthermic chip is touched in described these subsides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101673076A CN101211869A (en) | 2006-12-27 | 2006-12-27 | Radiating module and its heat conduction pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101673076A CN101211869A (en) | 2006-12-27 | 2006-12-27 | Radiating module and its heat conduction pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101211869A true CN101211869A (en) | 2008-07-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101673076A Pending CN101211869A (en) | 2006-12-27 | 2006-12-27 | Radiating module and its heat conduction pipe |
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| Country | Link |
|---|---|
| CN (1) | CN101211869A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
-
2006
- 2006-12-27 CN CNA2006101673076A patent/CN101211869A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104039115A (en) * | 2014-05-14 | 2014-09-10 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
| CN104039115B (en) * | 2014-05-14 | 2016-09-21 | 中山伟强科技有限公司 | Mobile phone heat dissipation module |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Open date: 20080702 |