CN207443316U - A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control - Google Patents
A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control Download PDFInfo
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- CN207443316U CN207443316U CN201721306520.0U CN201721306520U CN207443316U CN 207443316 U CN207443316 U CN 207443316U CN 201721306520 U CN201721306520 U CN 201721306520U CN 207443316 U CN207443316 U CN 207443316U
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- gasket
- heat
- heat conduction
- mobile phone
- temperature control
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is related to a kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control, and including a gasket, covered with conduction graphite film, gasket is embedded with microcapsules for the lower section of gasket, and microcapsules include hollow micro capsule wall made of polyurethane material；Gasket is gasket made of Heat Conduction Material, and capsule-core made of heat accumulating is enclosed in hollow micro capsule wall；Alternatively, the gasket is gasket made of heat accumulating, capsule-core made of Heat Conduction Material is enclosed in the hollow micro capsule wall.By choosing hollow micro capsule wall made of polyurethane material, microcapsules can be added in gasket by when production, carry out calendering cut-parts and obtain required thickness and size.Heat accumulation, the capsule-core and gasket of Heat Conduction Material are chosen, and has additional conduction graphite film, the heat of heat source is distributed in the surface of gasket, then heat is absorbed by gasket, the temperature rise of mobile phone back almag phone housing can be efficiently controlled.
Description
Technical field
The utility model is related to physical material fields, and in particular to a kind of heat conduction heat accumulation composite materials.
Background technology
Hyundai electronics industry development is rapid, and powerful function is brought to various electronic products, while also brings more
Element heating problem.
Utility model content
The purpose of this utility model is that providing a kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control, solve
Certainly more than technical problem.
Following technical scheme may be employed to realize in the technical issues of the utility model solves：
A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control, including a gasket, which is characterized in that the pad
Covered with conduction graphite film or graphene film, the gasket is embedded with microcapsules for the lower section of piece, and the microcapsules include poly- ammonia
Hollow micro capsule wall made of ester material；
The gasket is gasket made of Heat Conduction Material, and capsule made of heat accumulating is enclosed in the hollow micro capsule wall
Core；
Alternatively, the gasket is gasket made of heat accumulating, being enclosed with Heat Conduction Material in the hollow micro capsule wall is made
Capsule-core.
The innovative point of this patent：
(1) this patent chooses the material of hollow micro capsule wall：Although the method for the preparation of hollow micro capsule wall is more,
It is more mature, but this patent chooses hollow micro capsule wall made of polyurethane material, has good deformability, it, can during production
Microcapsules are added in gasket, after uniformly dispersing, calendering cut-parts is carried out and obtains required thickness and size.
(2) this patent chooses the material of capsule-core and gasket：Using heat accumulating as micro- glue of functional form core
This patent product made from capsule using Heat Conduction Material as gasket, microcapsules have higher latent heat, can store substantial amounts of heat, pad
The piece capacity of heat transmission should be very high, and when having heat conduction in conduction graphite film or graphene film, which can be rapid
Absorption heat, heat transfer area is big, and heat transfer efficiency is high, lays particular emphasis on the rapid cooling after saturation heat accumulation.Using Heat Conduction Material as work(
This patent product, microcapsules there can be the very strong capacity of heat transmission made from the microcapsules using heat accumulating as gasket of core material, pad
Piece has good heat storage capacity, and when having heat conduction in conduction graphite film or graphene film, which also can
Heat is rapidly absorbed, quantity of heat storage is big, lays particular emphasis on the high heat storage in confined space.Which kind of depends on this kind of new material table using
Heat sink conception on face, if heat sink conception more radical (rate of heat dispation comparatively fast such as magnesium alloy) will so select the former；And
(for example the poor material that radiates can only be selected to be attached to this kind of new material surface or as shell in technique when heat sink conception is limited
Body) even when selecting the former fast energy storage heat sink conception, effect is poor, because heat dissipation threshold value has been coated over table
The material in face is limited, so when selecting the latter, plays the ability for high energy storage of radiating slowly, the heat dissipation on the one hand adapting to shell is slow
Characteristic, on the other hand in the case of a kind of slow heat dissipation, material can store the slow heat dissipation of itself simultaneously of more heat in itself
Also ensure that electronic original part does not overheat, it is proper.
(3) having additional conduction graphite film, either graphene film conduction graphite film or the graphene film capacity of heat transmission are stronger, can
Play the role of soaking.The heat of heat source is distributed in the surface of gasket by conduction graphite film or graphene film, then passes through gasket
Heat is absorbed, the temperature rise of mobile phone back almag phone housing can be efficiently controlled, temperature is controlled one
Determine in scope (37~45 DEG C), optimize the usage experience sense of client.The utility model can be used in multiple fields, particularly
In the electronics industry such as portable computer electric appliance field.The product plays outstanding effect in terms of electronic product temperature control.In use, only
It needs, according to thickness and size of the specific requirement by this material cutting into needs, to be attached at heat source, then pass through electronics
Shell or screen of equipment etc. are outwards radiated.
It is outer to further include encapsulation made of a Heat Conduction Material for a kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control
Shell, the gasket are encapsulated in the package casing.To be used under some particular surroundings.
As a preferred embodiment, thermally conductive gel is filled in the package casing, using the thermally conductive gel as gasket,
The microcapsules are dispersed in the thermally conductive gel.Thermally conductive gel be beneficial to microcapsules movement, can by the movement of microcapsules with
And the flowing of thermally conductive gel in itself, further improve heat-conducting effect.
In ellipsoid, semi-minor axis is 1~2 μm for the microcapsules periphery, and major semiaxis is 2~3 μm.Ensure for being applicable in majority
Gasket.
The thickness of the gasket is 0.8~1mm.The thickness of the graphite film uses 0.05mm~0.07mm.Card is applicable in hand
The electronic product stringent to space requirement such as mechanical, electrical brain.
The heat accumulating can be sodium sulphate hydrated salt, any one in paraffin, iron oxide.To ensure stronger storage
Thermal energy power.
The Heat Conduction Material can be alloy aluminium, alloyed copper, one kind in thermally conductive gel.To ensure preferable thermal conductivity
Property.
Description of the drawings
Fig. 1 is a kind of sectional view of structure of the utility model；
Fig. 2 is the sectional view of the utility model another kind structure；
Fig. 3 is the microcapsules sectional view of the utility model.
Specific embodiment
In order to be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, tie below
Conjunction is specifically illustrating that the present invention is further explained.
Referring to Figures 1 and 2, a kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control, including a gasket 2, pad
Covered with conduction graphite film 4 or graphene film, gasket 2 is embedded with microcapsules 3 for the lower section of piece 2, and microcapsules 3 include polyurethane material
Hollow micro capsule wall 5 made of material；Gasket 2 is gasket made of Heat Conduction Material, and being enclosed with heat accumulating in hollow micro capsule wall 5 is made
Capsule-core 6；Alternatively, gasket 2 is gasket made of heat accumulating, capsule-core made of Heat Conduction Material is enclosed in hollow micro capsule wall 5
6。
The innovative point of this patent：(1) this patent chooses the material of hollow micro capsule wall：Although hollow micro capsule wall
The method of preparation is more, more mature, but this patent chooses hollow micro capsule wall made of polyurethane material, has variable well
Microcapsules during production, can be added in gasket by shape, after uniformly dispersing, carry out calendering cut-parts obtain required thickness and
Size.(2) this patent chooses the material of capsule-core and gasket：Microcapsules using heat accumulating as functional form core with
Heat Conduction Material has higher latent heat, can store substantial amounts of heat, gasket is led as this patent product made from gasket, microcapsules
Thermal energy power should be very high, and when having heat conduction in conduction graphite film or graphene film, which can rapidly inhale
Heat is received, heat transfer area is big, and heat transfer efficiency is high, lays particular emphasis on the rapid cooling after saturation heat accumulation.Using Heat Conduction Material as functional form
This patent product made from the microcapsules using heat accumulating as gasket of core, microcapsules have the very strong capacity of heat transmission, and gasket has
Good heat storage capacity, when having heat conduction in conduction graphite film or graphene film, which also can be rapid
Absorption heat, quantity of heat storage is big, lays particular emphasis on the high heat storage in confined space.Which kind of depended on using on this kind of new material surface
Heat sink conception, if heat sink conception more radical (rate of heat dispation comparatively fast such as magnesium alloy) will so select the former；And when scattered
Hot scheme is limited (for example the poor material that radiates can only be selected to be attached to this kind of new material surface or as housing in technique)
Even when selecting the former fast energy storage heat sink conception, effect is poor, because heat dissipation threshold value has been coated over surface
Material limited, so when selecting the latter, play the ability of high energy storage of radiating slowly, the heat dissipation on the one hand adapting to shell is slowly special
Property, on the other hand in the case of a kind of slow heat dissipation, material can store the slow heat dissipation of itself simultaneously of more heat in itself
It ensure that electronic original part does not overheat, it is proper.(3) conduction graphite film or graphene film, conduction graphite film are had additional
Or the graphene film capacity of heat transmission is stronger, can play the role of soaking.Conduction graphite film or graphene film are by the heat of heat source
The surface of gasket is distributed in, then heat is absorbed by gasket, can be efficiently controlled outside the almag mobile phone of mobile phone back
The temperature rise of shell, by temperature control within the specific limits (37~45 DEG C), optimizes the usage experience sense of client.This practicality is new
Type can be used in multiple fields, particularly in the electronics industry such as portable computer electric appliance field.The product is in electronic product temperature control
Aspect plays outstanding effect.In use, only need according to thickness and size of the specific requirement by this material cutting into needs,
It is attached at heat source, then is outwards radiated by the shell of electronic equipment or screen etc..
Suitable for the heat conduction heat accumulation composite materials of mobile phone temperature control, package casing 1 made of a Heat Conduction Material is further included,
Gasket 2 is encapsulated in package casing 1.To be used under some particular surroundings.In the case where there is package casing, it can not set and lead
Hot graphite film 4, using package casing come soaking.The top of preferred gasket, the surrounding of gasket are all covered with conduction graphite film at this time
Either graphene film is using conduction graphite film or graphene film as package casing.It, can also in the case where there is package casing
Conduction graphite film 4 is covered on the lower surface of package casing.
As a preferred embodiment, filled with thermally conductive gel, using thermally conductive gel as gasket, microcapsules in package casing 1
It is dispersed in thermally conductive gel.Thermally conductive gel is beneficial to the movement of microcapsules, can be by the movement of microcapsules and thermally conductive gel in itself
Flowing, further improve heat-conducting effect.
With reference to Fig. 3, for the preferred periphery of microcapsules 3 in ellipsoid, semi-minor axis is 0.8~1 μm, and major semiaxis is 1~3 μm.Ensure
For being applicable in most gaskets.The thickness of gasket 2 is 0.8~1mm.The thickness of graphite film 4 uses 0.05mm~0.07mm.Card is applicable in
The electronic product product stringent to space requirement such as mobile phone, computer.Heat accumulating can be sodium sulphate hydrated salt, paraffin, oxidation
Any one in iron.To ensure stronger heat storage capacity.Heat Conduction Material can be alloy aluminium, alloyed copper, in thermally conductive gel
One kind.To ensure preferable thermal conductivity.
The basic principle of the utility model and main feature and the advantages of the utility model has been shown and described above.One's own profession
The technical staff of industry is it should be appreciated that the present utility model is not limited to the above embodiments, described in above embodiments and description
Simply illustrate the principle of the utility model, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
Various changes and modifications are had, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed scope is defined by the appending claims and its equivalent thereof.
Claims (9)
1. a kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control, including a gasket, which is characterized in that the gasket
Lower section covered with conduction graphite film or graphene film, the gasket is embedded with microcapsules, and the microcapsules include polyurethane
Hollow micro capsule wall made of material；
The gasket is gasket made of Heat Conduction Material, and capsule-core made of heat accumulating is enclosed in the hollow micro capsule wall；
Alternatively, the gasket is gasket made of heat accumulating, capsule made of Heat Conduction Material is enclosed in the hollow micro capsule wall
Core.
2. the heat conduction heat accumulation composite materials according to claim 1 suitable for mobile phone temperature control, it is characterised in that：Also wrap
Package casing made of a Heat Conduction Material is included, the gasket is encapsulated in the package casing.
3. the heat conduction heat accumulation composite materials according to claim 2 suitable for mobile phone temperature control, it is characterised in that：Gasket
Top, the surrounding of gasket be all covered with conduction graphite film either graphene film using conduction graphite film or graphene film as
Package casing.
4. the heat conduction heat accumulation composite materials suitable for mobile phone temperature control according to claim 1,2 or 3, feature exist
In：The microcapsules periphery is in ellipsoid.
5. the heat conduction heat accumulation composite materials according to claim 4 suitable for mobile phone temperature control, it is characterised in that：Ellipsoid
Semi-minor axis for 2~4 μm, major semiaxis is 4~6 μm.
6. the heat conduction heat accumulation composite materials suitable for mobile phone temperature control according to claim 1,2 or 3, feature exist
In：The thickness of the gasket is 1~1.5mm.
7. the heat conduction heat accumulation composite materials suitable for mobile phone temperature control according to claim 1,2 or 3, feature exist
In：The thickness of the graphite film is 0.05mm~0.07mm.
8. the heat conduction heat accumulation composite materials suitable for mobile phone temperature control according to claim 1,2 or 3, feature exist
In：The heat accumulating is any one in sodium sulphate hydrated salt, paraffin, iron oxide.
9. the heat conduction heat accumulation composite materials suitable for mobile phone temperature control according to claim 1,2 or 3, feature exist
In：The Heat Conduction Material is one kind in alloy aluminium, alloyed copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721306520.0U CN207443316U (en) | 2017-10-11 | 2017-10-11 | A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721306520.0U CN207443316U (en) | 2017-10-11 | 2017-10-11 | A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207443316U true CN207443316U (en) | 2018-06-01 |
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| CN201721306520.0U Active CN207443316U (en) | 2017-10-11 | 2017-10-11 | A kind of heat conduction heat accumulation composite materials suitable for mobile phone temperature control |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836505A (en) * | 2019-04-15 | 2020-10-27 | 辰展股份有限公司 | Thermal phase change heat storage module |
| CN113099697A (en) * | 2021-04-12 | 2021-07-09 | 中山大学 | Phase-change film temperature control material |
| CN113382611A (en) * | 2021-06-21 | 2021-09-10 | 上海电力大学 | Phase change's heat dissipation subsides |
-
2017
- 2017-10-11 CN CN201721306520.0U patent/CN207443316U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111836505A (en) * | 2019-04-15 | 2020-10-27 | 辰展股份有限公司 | Thermal phase change heat storage module |
| CN113099697A (en) * | 2021-04-12 | 2021-07-09 | 中山大学 | Phase-change film temperature control material |
| CN113382611A (en) * | 2021-06-21 | 2021-09-10 | 上海电力大学 | Phase change's heat dissipation subsides |
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