CN103702549A - Heat tube for ultrathin electronic product - Google Patents
Heat tube for ultrathin electronic product Download PDFInfo
- Publication number
- CN103702549A CN103702549A CN201310729291.3A CN201310729291A CN103702549A CN 103702549 A CN103702549 A CN 103702549A CN 201310729291 A CN201310729291 A CN 201310729291A CN 103702549 A CN103702549 A CN 103702549A
- Authority
- CN
- China
- Prior art keywords
- heat tube
- heat pipe
- heat
- electronic product
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat tube for an ultrathin electronic product. The section of the heat tube has a quasi-rectangular structure, wherein the two ends of the long side of the quasi-rectangular structure are provided with L-shaped or arc-shaped clamping grooves. When the heat tube is an ordinary heat tube, the thickness is over 0.6 millimeter. When the heat tube is an ultrathin heat tube, the thickness is less than 0.6 millimeter. The clamping grooves of the heat tube are arranged on a bracket in a bonding or welding way. The heat tube has the advantages that the end parts of the heat tube are provided with the clamping grooves, and the heat tube is arranged on the bracket of a component needing heat dissipation such as a mobile phone, a tablet computer and the like, so that excellent heat conduction is performed on components needing heat dissipation. Meanwhile, the thickness of the heat tube can be reduced below 0.6 millimeter, so that the size of the heat tube is further reduced, and further ultrathin tendency and miniaturization of electronic products such as mobile phones, tablet computers and the like are facilitated.
Description
Technical field
the present invention relates to electronic radiation product, particularly a kind of heat pipe for super-thin electronic product heat transmission.
Background technology
heat pipe is to rely on self internal work liquid phase-change to realize the heat transfer element of heat transfer, has the features such as very high thermal conductivity, good isothermal, density of heat flow rate changeability, direction of heat flow invertibity, constant temperature be hot.Be widely used in the industries such as aerospace, military project.Existing heat pipe is relatively thick, be unsuitable for the development of electronic product ultrathin, and common heat radiation module cannot meet the requirement of electronic product to thickness and performance.Therefore, how to improve the structure of heat pipe, make it on the basis of assurance original function, be applied to the super-thin electronic products such as mobile phone, panel computer and get on, become the major issue that modern hot pipe technique development need solves.
Summary of the invention
the problem that is not suitable for the electronic product radiatings such as ultra-thin mobile phone, panel computer for solving existing heat pipe, the invention provides following technical scheme:
for a heat pipe for super-thin electronic product, this heat pipe cross section is class rectangular configuration, and the two ends, long limit of described heat pipe rectangular configuration have draw-in groove.
as a preferred embodiment of the present invention, described draw-in groove is L shaped structure.
as another kind of preferred version of the present invention, described draw-in groove is arcuate structure.
as another preferred version of the present invention, when described heat pipe is general heat pipe, its thickness is more than 0.6mm, and when described heat pipe is super-thin heat pipe, its thickness is less than 0.6mm.
as another preferred version of the present invention, the draw-in groove of described heat pipe is installed on support by the mode boning or weld.
advantage of the present invention is: the present invention is by being provided with draw-in groove by heat pipe end, by draw-in groove, heat pipe is installed on to the support that mobile phone, panel computer etc. need thermal component, thereby the parts of needs heat radiation are carried out to good heat conduction, the present invention simultaneously can be fabricated into heat pipe below 0.6mm, the volume of the heat pipe further reducing, has promoted further ultrathin, the miniaturization of the electronic products such as mobile phone, panel computer.
?
Accompanying drawing explanation
accompanying drawing 1 is heat pipe structure schematic diagram of the present invention;
accompanying drawing 2 is heat pipe mounting structure schematic diagram of the present invention.
number in the figure is:
1-heat pipe, 11-draw-in groove, 2-support
Embodiment
below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
as shown in heat pipe structure schematic diagram as of the present invention in accompanying drawing 1 and accompanying drawing 2 heat pipe mounting structure of the present invention schematic diagram, a kind of heat pipe for super-thin electronic product, this heat pipe 1 cross section rectangular configuration, the two ends, long limit of heat pipe 1 rectangular configuration have draw-in groove 11.
draw-in groove 11 is L shaped structure, arcuate structure or other structures.The draw-in groove 11 of heat pipe 1 is installed on support 2 by the mode boning or weld, and support 2 structures of the electronic products such as the structure of draw-in groove 11 and mobile phone, panel computer need to be coupled.Therefore, the structure of draw-in groove 11 is not limited to L shaped structure or arcuate structure, as long as the support coupling that can need thermal component to install with electronic product, shape can be irregular curve, zigzag, configuration etc.
when heat pipe 1 is general heat pipe, its thickness is more than 0.6mm, and when heat pipe 1 is super-thin heat pipe, its thickness is less than 0.6mm.
the above; it is only the specific embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; the variation that can expect without creative work or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range that claims were limited.
Claims (5)
1. for a heat pipe for super-thin electronic product, it is characterized in that: this heat pipe (1) cross section is class rectangular configuration, the two ends, long limit of described heat pipe (1) rectangular configuration have draw-in groove (11).
2. a kind of heat pipe for super-thin electronic product according to claim 1, is characterized in that: described draw-in groove (11) is L shaped structure.
3. a kind of heat pipe for super-thin electronic product according to claim 1, is characterized in that: described draw-in groove (11) is arcuate structure.
4. a kind of heat pipe for super-thin electronic product according to claim 1, is characterized in that: when described heat pipe (1) is general heat pipe, its thickness is more than 0.6mm, and when described heat pipe (1) is super-thin heat pipe, its thickness is less than 0.6mm.
5. a kind of heat pipe for super-thin electronic product according to claim 1, is characterized in that: the draw-in groove (11) of described heat pipe (1) is installed on support (2) by the mode boning or weld.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310729291.3A CN103702549A (en) | 2013-12-26 | 2013-12-26 | Heat tube for ultrathin electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310729291.3A CN103702549A (en) | 2013-12-26 | 2013-12-26 | Heat tube for ultrathin electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103702549A true CN103702549A (en) | 2014-04-02 |
Family
ID=50363909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310729291.3A Pending CN103702549A (en) | 2013-12-26 | 2013-12-26 | Heat tube for ultrathin electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103702549A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228410A (en) * | 2014-09-25 | 2016-01-06 | 维沃移动通信有限公司 | A kind of heat abstractor of terminal and terminal |
| CN105979748A (en) * | 2015-10-22 | 2016-09-28 | 乐视移动智能信息技术（北京）有限公司 | Middle frame of mobile terminal and mobile terminal |
| CN106163212A (en) * | 2015-03-30 | 2016-11-23 | 双鸿科技股份有限公司 | A kind of radiating subassembly being applicable to mobile device |
| EP3968745A4 (en) * | 2019-08-31 | 2022-05-18 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus, device, equipment rack, and system |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004028442A (en) * | 2002-06-25 | 2004-01-29 | Furukawa Electric Co Ltd:The | Plate type heat pipe, and its mounting structure |
| CN202747869U (en) * | 2011-12-30 | 2013-02-20 | 奇鋐科技股份有限公司 | Heat radiation structure for heat radiation unit |
| TW201339814A (en) * | 2012-02-24 | 2013-10-01 | Furukawa Electric Co Ltd | Sheet-like heat pipe, and electronic device provided with same |
| CN103398613A (en) * | 2013-07-22 | 2013-11-20 | 施金城 | Vapor chamber and method for manufacturing same |
| CN203708737U (en) * | 2013-12-26 | 2014-07-09 | 苏州天脉导热科技有限公司 | Heat pipe used for ultrathin electronic product |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
-
2013
- 2013-12-26 CN CN201310729291.3A patent/CN103702549A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004028442A (en) * | 2002-06-25 | 2004-01-29 | Furukawa Electric Co Ltd:The | Plate type heat pipe, and its mounting structure |
| CN202747869U (en) * | 2011-12-30 | 2013-02-20 | 奇鋐科技股份有限公司 | Heat radiation structure for heat radiation unit |
| TW201339814A (en) * | 2012-02-24 | 2013-10-01 | Furukawa Electric Co Ltd | Sheet-like heat pipe, and electronic device provided with same |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
| CN103398613A (en) * | 2013-07-22 | 2013-11-20 | 施金城 | Vapor chamber and method for manufacturing same |
| CN203708737U (en) * | 2013-12-26 | 2014-07-09 | 苏州天脉导热科技有限公司 | Heat pipe used for ultrathin electronic product |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228410A (en) * | 2014-09-25 | 2016-01-06 | 维沃移动通信有限公司 | A kind of heat abstractor of terminal and terminal |
| CN106163212A (en) * | 2015-03-30 | 2016-11-23 | 双鸿科技股份有限公司 | A kind of radiating subassembly being applicable to mobile device |
| CN105979748A (en) * | 2015-10-22 | 2016-09-28 | 乐视移动智能信息技术（北京）有限公司 | Middle frame of mobile terminal and mobile terminal |
| EP3968745A4 (en) * | 2019-08-31 | 2022-05-18 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus, device, equipment rack, and system |
| US11903164B2 (en) | 2019-08-31 | 2024-02-13 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus, device, rack, and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103702549A (en) | Heat tube for ultrathin electronic product | |
| US20140311713A1 (en) | Heat dissipation component | |
| US9307678B2 (en) | Low thermal resistance cooler module for embedded system | |
| CN103047581A (en) | Backlight module and display device with same | |
| CN102299127B (en) | Bidirectional radiator used for packaged component and assembly method thereof | |
| CN203708737U (en) | Heat pipe used for ultrathin electronic product | |
| CN203327470U (en) | Heat radiation structure of hand-held mobile device | |
| CN102798042A (en) | Backlight module and liquid crystal display | |
| WO2015106587A1 (en) | New heat dissipation and reflection sheet | |
| CN102404976A (en) | Electronic device | |
| CN204090411U (en) | Heat pipe assembly structure and mobile phone thereof | |
| CN203588996U (en) | Radiator and electronic product | |
| CN203759586U (en) | Industrial integrated computer mechanism with excellent heat dispersion performance | |
| CN205040131U (en) | Compound radiating wing | |
| CN203369031U (en) | Heat conduction and radiation apparatus | |
| CN204810787U (en) | Radiator unit and electronic equipment | |
| CN204069617U (en) | A kind of electronic installation possessing heat-conducting piece | |
| CN103344144A (en) | Composite conduit hot pipe | |
| CN203504942U (en) | Ultrathin liquid-cooling heat radiation module | |
| CN204010576U (en) | Large-screen lc display device | |
| CN213546139U (en) | Heat dissipation capacitor | |
| CN205644395U (en) | Quick -witted case structure of dispelling heat | |
| CN203277869U (en) | Novel filtering coil welding structure | |
| US20130118718A1 (en) | Heat pipe assembly | |
| CN205793856U (en) | The fixing device of power tube |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140402 |