CN203588996U

CN203588996U - Radiator and electronic product

Info

Publication number: CN203588996U
Application number: CN201320461855.5U
Authority: CN
Inventors: 刑哲
Original assignee: Qingdao Hisense Electronics Co Ltd
Current assignee: Qingdao Hisense Electronics Co Ltd
Priority date: 2013-07-31
Filing date: 2013-07-31
Publication date: 2014-05-07
Anticipated expiration: 2023-07-31

Abstract

The utility model discloses a radiator and an electronic product, and solves the technical problem in the prior art that a radiator rear housing is deformed, thus causing interruption of radiation path; the radiator of the utility model comprises a chip and a shield cover used for shielding the chip; the shielding cover is arranged above the chip and is provided with a glue bonding layer, a metal layer and a radiation coating layer coated on one surface of the metal layer; the other surface of the metal layer is provided with the glue bonding layer; the metal layer is bonded on an upper surface of the shielding cover through the glue bonding layer. Through the technical scheme provided by the application embodiment, the radiation path of the radiator cannot be interrupted because of deformation of the rear housing, so the heat generated in the chip of the radiator can be continuously and stably sent out, thereby effectively ensuring product performance.

Description

A kind of heat abstractor and a kind of electronic product

Technical field

the utility model relates to electronic device field, relates in particular to a kind of heat abstractor and a kind of electronic product.

Background technology

in electronic equipment, the heat dissipation technology of chip is the important technology that is related to safety and the performance of electronic equipment, and chip great majority in existing electronic equipment are high-frequency and high-power chip, in the course of work of electronic equipment, the heat of its generation is larger, along with the continuous firing of electronic equipment, the heat of its generation constantly increases, but, if heat can not distribute in time, assemble too much, chip just there will be the phenomenons such as frequency reducing, thereby affect the performance of chip, therefore, for electronic product, it is most important whether heat can distribute in time, in order to ensure the performance of electronic product, certainly will to improve the heat-sinking capability of electronic product.

existing heat abstractor as shown in Figure 1, on circuit board 100, be provided with chip 110, the periphery of chip 110 is provided with radome 130, between chip 110 and radome 130, be provided with heat-conducting glue 120, at the upper surface of radome 130, be provided with graphite flake 140, in production technology, graphite flake 140 is normally fixed all-in-one-piece with back cover 150, when electronic device works, the heat radiation approach of the heat that chip produces is: chip 110 produces after heat, first conduct heat in heat-conducting glue 120, by heat-conducting glue 120, heat is delivered on radome 130, radome 130 and graphite flake 140 transmission of heat by contacts, finally heat is delivered to back cover 150, by back cover 150, dissipation of heat is gone out.

inventor is realizing in process of the present utility model, find that there are the following problems: back cover is generally made by metal or plastics, in use, along with chip caloric value increases, back cover generation thermal expansion and tortoise sticks up, causes producing between graphite flake and radome larger gap, heat conduction path is interrupted, thereby system thermal resistance increases, chip Yin Wendu raises and enters even resting state of frequency reducing.

Summary of the invention

the embodiment of the present application is by providing a kind of heat abstractor and a kind of electronic product, solved in prior art, heat abstractor is because of the technical problem that back cover distortion causes heat radiation approach to interrupt, and realized the technique effect that heat that chip produces can continue, stably distribute.

in order to achieve the above object, the utility model provides a kind of heat abstractor, comprise chip and chip is played to the radome of shielding action, described radome is arranged on the top of described chip, described heat loss through radiation dope layer is applied in the one side of metal level, the another side of described metal level is provided with adhesive layer, and described metal level sticks to the upper surface of described radome by described adhesive layer.

preferably, the medial recess of described radome, and the upper surface of depressed part and described chip connects.

preferably, described heat abstractor also comprises heat-conducting glue, and the cross section of described heat-conducting glue is trapezoidal, and lower section is less than upper section, and wherein, lower section and described chip connect, and upper section and described radome connect.

preferably, be provided with buckle and Access Division on described radome, described buckle is during with the phase clamping of described Access Division, and described radome is fixed on the top of described chip.

preferably, the surface emissivity coefficient of described heat loss through radiation dope layer is greater than 0.6.

preferably, described metal level is copper layer or aluminium lamination.

the present embodiment also provides a kind of electronic product, and this electronic product comprises the heat abstractor described in the present embodiment.

Accompanying drawing explanation

fig. 1 is the structural representation of the heat abstractor of available technology adopting.

fig. 2 is the structural representation that the back cover of the heat abstractor of available technology adopting deforms.

fig. 3 is the structural representation of heat loss through radiation sheet in the embodiment of the present application.

fig. 4 is one of structural representation of heat abstractor in the embodiment of the present application one.

fig. 5 be heat abstractor in the embodiment of the present application one structural representation two.

fig. 6 be heat abstractor in the embodiment of the present application one structural representation three.

fig. 7 is the heat radiation approach schematic diagram of heat-conducting glue in prior art.

fig. 8 is the heat radiation approach schematic diagram of heat-conducting glue in the embodiment of the present application one.

Embodiment

based on the existing heat radiation approach of existing heat abstractor, be out of shape the problem of interrupting because of back cover, the present invention proposes a kind of new heat abstractor, change heat conducting radiating mode of the prior art into thermal-radiating radiating mode, make the heat radiation approach can be because not producing space between the medium of transferring heat, and cause heat radiation approach to interrupt, when effectively having promoted the heat-sinking capability of electronic product, guaranteed the performance of electronic product.

in order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further described.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.

embodiment mono-

generally, in order to prevent that the chip in electronic product is subject to the electromagnetic interference that in electronic equipment, other electronic devices bring, also prevent that chip self from causing electromagnetic interference to other electronic devices, can radome be set above chip, to avoid the problems referred to above simultaneously.

as shown in Figure 4, the embodiment of the present application provides a kind of new heat abstractor, comprises chip 310 and the radome 320 to 310 shielding actions of chip, and described radome 320 is arranged on the top of described chip 310,on described radome 320, be provided with adhesive layer 420, metal level 410 and heat loss through radiation dope layer 330, described heat loss through radiation dope layer 330 is applied in the one side of described metal level 410, and the another side of described metal level 410 is provided with adhesive layer 420, and described metal level 410 sticks to the upper surface of described radome 320 by described adhesive layer 420.

in the course of work of electronic product, chip 310 continues to produce heat, and transfer heat to radome 320, radome 320 further passes to heat loss through radiation dope layer 330 by metal level 410 heat, heat loss through radiation dope layer is to go out dissipation of heat to extraradial mode, because whether the radiating mode of radiation is to not contacting and require between the medium of transferring heat, in other words, in the present embodiment, heat loss through radiation dope layer 330 does not need to contact with the back cover of electronic product, just heat can be passed to back cover, so, the approach of transferring heat can not interrupt because of the distortion of back cover.

wherein, described metal level 410, adhesive layer 420 and heat loss through radiation dope layer 330 can form the form of heat loss through radiation sheet, heat loss through radiation sheet 340 as shown in Figure 3, it is comprised of three-decker, is followed successively by from top to bottom: heat loss through radiation dope layer, metal level and adhesive layer.The metal of the metal layers here can be copper or aluminium; the good heat dispersion performance of copper or aluminium; use copper or the aluminium metal level as heat loss through radiation sheet; heat can be distributed better; and metal level has certain function of shielding; sticked to the upper surface of radome, can strengthen the function of shielding of radome, protection chip is avoided the interference of electromagnetic radiation.

further, as shown in Figure 5, the medial recess of described radome 600, and the upper surface of depressed part and described chip 310 connects.Here the definite medium position that said middle part does not refer to can be the position at 1/3rd to 2/3rds places of whole radome length surface.

here it should be noted that, between the circuit board at radome and chip place, surround a space, this space can be the space of sealing, also can be the space of not sealing, as long as this space makes chip can not be subject to the electromagnetic interference of extraneous electronic device, self also can electronic device formation electromagnetic interference to external world all can not simultaneously.Simultaneously, in order to make radome be fixed on preferably the top of chip, can weld the junction between radome and circuit board, make radome be fixed on the top of chip, also can buckle and Access Division be set at the two ends of radome, when described buckle is during with the phase clamping of described Access Division, radome is fixed on the top of chip 310.

further, the surface emissivity coefficient of described heat loss through radiation dope layer is greater than 0.6, the namely radiation coefficient of heat loss through radiation dope layer of the surface emissivity coefficient of heat loss through radiation dope layer.Preferably, the radiation coefficient of heat loss through radiation dope layer is greater than 0.8, and the surface emissivity coefficient of heat loss through radiation dope layer is larger, illustrates that the heat loss through radiation ability of heat loss through radiation dope layer is just stronger, therefore the surface emissivity coefficient of heat loss through radiation dope layer is the bigger the better, and does not have peaked restriction.

described heat loss through radiation dope layer heat radiation coating used can be acrylate heat radiation coating, described acrylate heat radiation coating is solvent-type acrylic ester heat radiation coating, by coolant, be distributed in acrylate solution, carry out in-situ polymerization and form, described coolant is comprised of carbon fiber and nano material.

further, as shown in Figure 6, described heat abstractor also comprises heat-conducting glue 710, and the cross section of described heat-conducting glue 710 is trapezoidal, and lower section is less than upper section, and wherein, lower section and described chip 310 connect, and upper section and described radome 700 connect.The surface emissivity coefficient of the thermal conductivity ratio heat loss through radiation dope layer of heat-conducting glue is much smaller, but heat-conducting glue is set in heat abstractor, can between chip and radome, play the effect of transferring heat, and in the present embodiment, it is trapezoidal structure that heat-conducting glue 710 is arranged to cross section, the heat that is more conducive to chip to produce is delivered on radome 700, its heat radiation approach as shown in Figure 8, than the heat radiation approach that is provided with the heat abstractor of heat-conducting glue in the prior art shown in Fig. 7, heat-conducting glue area of dissipation of the present utility model is larger, the heat that can in time chip be produced is delivered on radome, thereby be delivered on the heat loss through radiation dope layer being arranged on radome, dissipation of heat is gone out the most at last.

the approach of dissipation of heat can be divided into three kinds, it is respectively conduction, convection current and radiation, wherein, the form of conduction will guarantee that each parts keep in touch, in prior art, heat abstractor arranges graphite flake between radome and back cover, because graphite flake is the form of conducting, dissipation of heat is gone out, so must guarantee the each parts contact in heat abstractor, in theory, gap between each parts is 0, again because contain carbon dust in graphite flake, carbon dust has the performance of conduction, in the assembling process of heat abstractor, if adopt the mode that graphite flake is fitted in to radome, can cause carbon dust to fall into the situation of described confined space, cause larger electromagnetic interference, therefore in actual applications, graphite flake and back cover are integrated, the heat producing when chip is when very large, back cover is out of shape because of thermal expansion, tortoise occurs to be stuck up, thereby produce gap between graphite flake and radome, as shown in Figure 2, thereby heat conducting approach is interrupted, heat is assembled in described confined space, temperature raises, cause even dormancy of chip frequency reducing.In the embodiment of the present application, replacing existing graphite flake is heat loss through radiation dope layer, adopt the mode of radiation that dissipation of heat is gone out, and heat loss through radiation does not need between each parts to contact, therefore, the heat producing when chip is very large, while causing back cover thermal expansion distortion, can not cause the approach of heat conduction to interrupt, guarantee that heat can distribute in real time, has guaranteed the performance of product yet.

take adopt rear shell material as PC-GF10, conductive coefficient is the heat-conducting glue of 2W/K*M, chip power is that 7 cun of panel computers of 2W are example, the heat loss through radiation dope layer that adhesive surface radiation coefficient is 0.85 on the radome of this panel computer, and the area of this heat loss through radiation dope layer is 90% of radome area, tests, at panel computer, play the media file of two hours under the ambient temperature of 30 degrees Celsius, after temperature reaches poised state, the temperature of measuring chip is 53 degrees Celsius.And adopt same product, under same ambient temperature, adopt the graphite flake that conductive coefficient is 330W/K*M, and the area of graphite flake is 120% of radome area, under same ambient temperature, test, temperature reaches after poised state, and the temperature of chip is 62 degrees Celsius.

the embodiment of the present application also provides a kind of electronic product, has comprised described heat abstractor.

although described preferred embodiment of the present utility model, once those skilled in the art obtain the basic creative concept of cicada, can make other change and modification to these embodiment.So claims are intended to be interpreted as comprising preferred embodiment and fall into all changes and the modification of the utility model scope.

obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.

Claims

1. a heat abstractor, comprise chip and chip is played to the radome of shielding action, described radome is arranged on the top of described chip, it is characterized in that, on described radome, be provided with adhesive layer, metal level and heat loss through radiation dope layer, described heat loss through radiation dope layer is applied in the one side of described metal level, and the another side of described metal level is provided with adhesive layer, and described metal level sticks to the upper surface of described radome by described adhesive layer.

2. heat abstractor according to claim 1, is characterized in that, the medial recess of described radome, and the upper surface of depressed part and described chip connects.

3. heat abstractor according to claim 1 and 2, is characterized in that, described heat abstractor also comprises heat-conducting glue, the cross section of described heat-conducting glue is trapezoidal, and lower section is less than upper section, wherein, lower section and described chip connect, and upper section and described radome connect.

4. heat abstractor according to claim 3, is characterized in that, is provided with buckle and Access Division on described radome, and described buckle is during with the phase clamping of described Access Division, and described radome is fixed on the top of described chip.

5. heat abstractor according to claim 1, is characterized in that, the surface emissivity coefficient of described heat loss through radiation dope layer is greater than 0.6.

6. heat abstractor according to claim 1, is characterized in that, described metal level is copper layer or aluminium lamination.

7. an electronic product, is characterized in that, comprises the heat abstractor described in claim 1 ~ 6 any one.