CN205644395U - Quick -witted case structure of dispelling heat - Google Patents
Quick -witted case structure of dispelling heat Download PDFInfo
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- CN205644395U CN205644395U CN201620337706.1U CN201620337706U CN205644395U CN 205644395 U CN205644395 U CN 205644395U CN 201620337706 U CN201620337706 U CN 201620337706U CN 205644395 U CN205644395 U CN 205644395U
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- fin
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- pcb board
- radiating tube
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Abstract
The utility model provides a quick -witted case structure of dispelling heat including case body, is provided with PCB board and chip in the case body, chip and PCB board fixed connection, and the PCB board passes through the mounting and fixes mutually with case body, still be provided with the heat dissipation module between chip and the case body, the heat dissipation module include cooling tube, first fin and second fin, first fin laminate mutually with the chip, the second fin laminate mutually with case body, laminate with first fin and second fin respectively in the cooling tube both ends, the cooling tube both ends under the effect of mounting respectively with first fin and the unilateral connection of second heat dissipation. The thermal resistance problem that the structure tolerance causes has been solved in this application, and the radiating efficiency is high to simple structure, equipment cost is cheap.
Description
Technical field
The application relates to hardware configuration, particularly a kind of cooling cabinet structure.
Background technology
The applied environment of outdoor version cabinet equipment is relatively more severe, and typically at-30 ~ 70 DEG C, and the high temperature of 70 DEG C is a challenge for chip.In the case of heat radiation is bad, it is easy to cause cabinet equipment to burn out or dull.The particularly chip of some high-temperature resistance differences, problem is even more serious, needs the heat dissipation problem solving cabinet equipment badly.
Utility model content
In view of this, the application provides a kind of cooling cabinet structure, solves the thermal resistance problem that structure tolerance causes, and radiating efficiency is high, and simple in construction, and equipment cost is cheap.
Specifically, the application is achieved by the following technical solution:
A kind of cooling cabinet structure, including cabinet housing, pcb board and chip it is provided with in chassis shell body, described chip is fixing with pcb board to be connected, and pcb board is fixed with cabinet housing by fixture, heat radiation module it is additionally provided with between described chip and cabinet housing, described heat radiation module includes radiating tube, first fin and the second fin, the first described fin fits with chip, the second described fin fits with cabinet housing, fit with the first fin and the second fin respectively in described radiating tube two ends, dispel the heat unilateral connection with described first fin and second under the effect of fixture respectively in described radiating tube two ends.
Preferably, described first fin is fixed with pcb board by spring screw, and the spring of spring screw is between screw cap and pcb board.
Preferably, being provided with cushion between described first fin and cabinet housing, the first fin is fixed under the fixture pressure elastic force with cushion.
Preferably, one layer of phase-change material layers it is provided with between described chip and fin.
Preferably, described radiating tube is the copper pipe of hollow structure.
Preferably, described fin is copper sheet.
Preferably, described fixture is bolt.
Fitting with the first fin and the second fin respectively in radiating tube two ends in the application, dispels the heat unilateral connection with described first fin and second under the effect of fixture respectively in radiating tube two ends.Eliminating structural member tolerance by the deformation of radiating tube, solve the thermal resistance problem that structure tolerance causes, radiating efficiency is high, and simple in construction, and equipment cost is cheap.
Accompanying drawing explanation
Fig. 1 is the cooling cabinet structural representation of prior art；
Fig. 2 is the application heat emission module structure schematic diagram；
Fig. 3 is the embodiment of the present application one front view；
Fig. 4 is the embodiment of the present application one left view；
Fig. 5 is the embodiment of the present application two front view；
Fig. 6 is the embodiment of the present application two left view.
Detailed description of the invention
Here will illustrate exemplary embodiment in detail, its example represents in the accompanying drawings.When explained below relates to accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represents same or analogous key element.Embodiment described in following exemplary embodiment does not represent all embodiments consistent with the application.On the contrary, they only with describe in detail in appended claims, the application some in terms of the example of consistent apparatus and method.
It is only merely for describing the purpose of specific embodiment at term used in this application, and is not intended to be limiting the application." a kind of ", " described " and " being somebody's turn to do " of singulative used in the application and appended claims is also intended to include most form, unless context clearly shows that other implications.It is also understood that any or all possible combination that term "and/or" used herein refers to and comprises one or more project of listing being associated.
In conjunction with Fig. 1, in cabinet, generally comprise cabinet housing 5, in cabinet housing 5, be provided with pcb board 1 and the chip 2 being arranged on pcb board 1.Additionally include the heat radiation module of chip, it is generally the case that heat radiation module includes the louvre on cabinet housing 5, also includes other some radiator structures.On chip 2, such as paste heat conductive pad 3, the heat radiation aluminium block 4 between heat conductive pad 3 and cabinet housing 5.Pcb board 1 is fixed with cabinet housing 5 by fixture 11.It is sent on cabinet housing 5 dispel the heat by the heat of chip 2 by heat conductive pad 3 and heat radiation aluminium block 4.This radiating mode simple in construction, cost is the lowest, but high for some power dissipation density, but the chip of high-temperature resistance difference (similar intel braswell
Chip) for, this mode cannot solve chip cooling problem.Main cause is that the tolerance clearance between above-mentioned existing radiator structure requirement chip 2 and heat radiation aluminium block 4 is less than 0.2 millimeter, and the most general structure die sinking, the tolerance between cabinet housing 5 and pcb board 1 can only control to 0.5 millimeter.If structure machining accuracy to be increased, then also can increase structure processing cost accordingly.Due to the structure tolerance problem between pcb board 1 and cabinet housing 5, must be filled with relatively thick heat conductive pad 3 between the two, result in bigger thermal resistance, affect radiating effect.
In conjunction with Fig. 2-Fig. 6, a kind of heat radiation module that the application proposes includes radiating tube 6 and fin, specifically refers to Fig. 2.Radiating tube 6 is heat conductivity, and good material is made, such as copper pipe.In order to save material, reduce manufacturing cost, the copper pipe of hollow structure can be used.Shape further for radiating tube 6 port cross-sectional is not restricted, and can be circular, square or other.Fin includes the first fin 7 and the second fin 8 two panels.First fin 7 fits with chip 2, second fin 8 fits with cabinet housing 5, fitting with the first fin 7 and the second fin 8 respectively in radiating tube 6 two ends, radiating tube 6 two ends are connected with the first fin 7 and the second fin 8 under the effect of fixture 11 respectively.Fixture 11 specifically can make radiating tube 6 two ends deformation by pressure or pulling force effect, and as a specific embodiment, fixture 11 is bolt, and by the pressure effect of bolt, radiating tube 6 two ends deformation contacts heat radiation with the first fin 7 and the second fin 8.Can certainly be that other produce pulling force or the fixture of pressure effect, the most unrestricted.Second fin 8 is fixing by bolt or other fixtures with cabinet housing 5, and radiating tube 6 two ends can be fixed with the first fin 7 and the second fin 8 by modes such as welding.
Owing to radiating tube 6 deforms upon, reducing structure tolerance problem, it is to avoid the thermal resistance problem that tolerance clearance causes, therefore radiating efficiency is high.
Fixing between the first fin 7 and pcb board 1, the application elaborates two kinds of implementations, certainly has other implementations of phase same-action also in the application protection domain.The first implementation, referring specifically to Fig. 3 and Fig. 4, is fixed the first fin 7 with pcb board 1 by spring screw 10, and the spring of spring screw 10 is between screw cap and pcb board.Can ensure that the distance between pcb board 1 and the first fin 7 can arrive setpoint distance by the fine setting of spring screw 10.Ensure that equipment precision, and eliminate the problem that structure tolerance causes as far as possible.The second implementation, sees Fig. 5 and Fig. 6, arranges cushion 9 between the first fin 7 and cabinet housing 5, is fixed in the bounce of bolt 11 pressure with cushion 9 by the first fin 7.Due to the elastic reaction of cushion 9, the distance between same ensured pcb board 1 and the first fin 7 can arrive setpoint distance.Ensure that equipment precision, and eliminate the problem that structure tolerance causes as far as possible.It should be noted that, here " compression " refers in the case of without any other external force, the extruding force to the first fin 7 is produced, it is ensured that the first fin 7 does not haves and rocks or mobile by the reverse bounce of the downward pressure of bolt 11 and cushion 9.
The connection gap caused in order to avoid the fabrication error of chip 2 and fin, arranges one layer of phase-change material layers between chip 2 and fin.Phase-change material refers to vary with temperature and change the material of state of matter.Such as pine wax etc., at normal temperatures in solid-state, when chip adstante febre, gap is filled up by pine wax thawing, it is to avoid thermal resistance produces.
The cooling cabinet of the application, solves the thermal resistance problem that structure tolerance causes, and radiating efficiency is high, and simple in construction, and equipment cost is cheap.
The foregoing is only the preferred embodiment of the application, not in order to limit the application, all within spirit herein and principle, any modification, equivalent substitution and improvement etc. done, should be included within the scope of the application protection.
Claims (7)
1. a cooling cabinet structure, including cabinet housing, pcb board and chip it is provided with in chassis shell body, described chip is fixing with pcb board to be connected, and pcb board is fixed with cabinet housing by fixture, heat radiation module it is additionally provided with between described chip and cabinet housing, it is characterized in that, described heat radiation module includes radiating tube, first fin and the second fin, the first described fin fits with chip, the second described fin fits with cabinet housing, fit with the first fin and the second fin respectively in described radiating tube two ends, dispel the heat unilateral connection with described first fin and second under the effect of fixture respectively in described radiating tube two ends.
Cooling cabinet structure the most according to claim 1, it is characterised in that described first fin is fixed with pcb board by spring screw, and the spring of spring screw is between screw cap and pcb board.
Cooling cabinet structure the most according to claim 1, it is characterised in that be provided with cushion between described first fin and cabinet housing, the first fin is fixed under the fixture pressure elastic force with cushion.
Cooling cabinet structure the most according to claim 1, it is characterised in that be provided with one layer of phase-change material layers between described chip and fin.
Cooling cabinet structure the most according to claim 1, it is characterised in that described radiating tube is the copper pipe of hollow structure.
Cooling cabinet structure the most according to claim 1, it is characterised in that described fin is copper sheet.
Cooling cabinet structure the most according to claim 1, it is characterised in that described fixture is bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620337706.1U CN205644395U (en) | 2016-04-21 | 2016-04-21 | Quick -witted case structure of dispelling heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620337706.1U CN205644395U (en) | 2016-04-21 | 2016-04-21 | Quick -witted case structure of dispelling heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205644395U true CN205644395U (en) | 2016-10-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201620337706.1U Active CN205644395U (en) | 2016-04-21 | 2016-04-21 | Quick -witted case structure of dispelling heat |
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| CN (1) | CN205644395U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
-
2016
- 2016-04-21 CN CN201620337706.1U patent/CN205644395U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |