CN105338794B - A kind of phased-array radar T/R modules and its radiating subassembly - Google Patents
A kind of phased-array radar T/R modules and its radiating subassembly Download PDFInfo
- Publication number
- CN105338794B CN105338794B CN201510797199.XA CN201510797199A CN105338794B CN 105338794 B CN105338794 B CN 105338794B CN 201510797199 A CN201510797199 A CN 201510797199A CN 105338794 B CN105338794 B CN 105338794B
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- China
- Prior art keywords
- cavity
- heat sink
- heat
- modules
- complete machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
Abstract
The invention discloses a kind of phased-array radar T/R modules and its radiating subassembly, radiating subassembly includes the first cavity and the second cavity being mutually fastened, and the heat carrier for conducting heat is provided between first cavity and the second cavity；First cavity and the second cavity are aluminium alloy.It is designed to provide that a kind of light weight, working range is big, thermal conductivity is constant, manufacture craft is simple, high yield rate, heat sink at low cost, not influenced by product operating rate, be can be achieved widely used high-power transceiver module.
Description
Technical field
The present invention relates to microwave transmitting and receiving component field, more particularly to a kind of phased-array radar T/R modules and its radiating subassembly.
Background technology
The heat sink of microwave current transceiver module is generally using heat loss through conduction technology, i.e., the heat generated on transceiver module
Amount is rapidly conducted heat elsewhere by the high heat conduction part being in contact with it, to ensure the normal work of transceiver module.
And the solid copper material of high heat conduction part generally use, sintered heat pipe material at present, and they the shortcomings that be also apparent from:
1, the parts density of solid copper material is big（Copper material density：8.9g/cm3）Weight weight cannot meet present product
Lightweight requirements；
2, heat resistant material is due to the structure type of its internal heat dissipating groove and heat eliminating medium, cause its operating temperature range by
Limit；There is the risk that thermal conductivity reduces under certain power situation；It is affected by product operating rate；Manufacture craft is more complex,
Yield rate, low cost are high, are unfavorable for being widely used.
Invention content
It is an object of the invention to overcome the solid copper heat sink preponderance having in the prior art, and heat resistant material
Cooling plate structure form is complicated, yield rate is not high, heat sink use environment is limited, use temperature range is small, operating speed is limited
The problem of making, being unfavorable for being widely used, provide a kind of light weight, working range is big, thermal conductivity is constant, manufacture craft is simple, at
Product rate is high, heat sink at low cost, not influenced by product operating rate, be can be achieved widely used high-power transceiver module.
In order to achieve the above-mentioned object of the invention, the present invention provides following technical schemes：
A kind of heat sink of high-power T/R modules, including the first cavity and the second cavity that are mutually fastened, described
The heat carrier for conducting heat is provided between one cavity and the second cavity；
The material of first cavity and the second cavity is aluminium alloy.
Preferably, mounting hole is provided on the heat sink, the mounting hole passes through first cavity, the second cavity
Heat carrier between and its, the mounting hole is for heat sink and heating device to be fixed using fastener.
Preferably, it is provided with reinforcement body protrusion to intermediate thermal conductivity and contacted on first cavity and the second cavity
Column.
Preferably, the reinforcing prop is hollow-core construction.
Preferably, the hollow reinforcing prop on first cavity and the second cavity is mutually butted, and forms a hollow passageway.
Preferably, first and second cavity both sides are additionally provided with complete machine secure fit portion, will when for final assembly
Heat sink is fixed with complete machine.
Preferably, be provided with complete machine mounting hole in complete machine secure fit portion, for using fastener by heat sink with
The complete machine is fixed.
Preferably, the heat carrier is high heat conduction graphite flake.
Preferably, the contact surface of the heat carrier and first cavity and the second cavity is welded together by solder.
A kind of phased-array radar T/R modules, are provided with heat sink as described above.
Compared with prior art, beneficial effects of the present invention：By using be aluminum alloy materials and high heat conduction graphite material
Material is compounded to form the heat sink of high thermal conductivity so that the present invention has that light weight, working range are big, lead compared with the product of the prior art
Heating rate is constant, manufacture craft is simple, high yield rate, it is at low cost, do not influenced by product operating rate, can be achieved it is widely used excellent
Point.
Description of the drawings
Fig. 1 is the exploded view of a kind of phased-array radar T/R modules of the embodiment of the present invention and its radiating subassembly.
Fig. 2 is the outline drawing of a kind of phased-array radar T/R modules of the embodiment of the present invention and its radiating subassembly.
It is marked in figure：The first cavitys of 10-, the second cavitys of 11-, 20- solders, 21 solders, 3- high heat conduction graphite material pieces, 4- are solid
Determine hole, 5- reinforcing props, 6- complete machine secure fits portion.
Specific implementation mode
With reference to test example and specific implementation mode, the present invention is described in further detail.But this should not be understood
It is only limitted to embodiment below for the range of the above-mentioned theme of the present invention, it is all that this is belonged to based on the technology that the content of present invention is realized
The range of invention.
Embodiment 1
A kind of heat sink of high-power T/R modules, referring to Fig. 1, including the first cavity 10 being fixed to each other and the second cavity
11.The heat carrier for conducting heat is provided between first cavity and the second cavity；
First cavity, 10 and second cavity 11 is aluminium alloy.
Further, the heat carrier uses high heat conduction graphite flake 3, the high heat conduction graphite flake 3 and first cavity
10 and second the contact surface of cavity 11 welded together by solder 20 and 21, use general solder, such as scolding tin herein.
Further, 2 mounting holes 4 are provided at both ends with from first cavity, the second cavity, centre is also provided with simultaneously
Have 2 mounting holes nestled up 4, the mounting hole 4 across first cavity, the second cavity and its high heat conduction graphite
Piece, for heat sink and the heating device end of T/R modules to be fixed using pin.
When concrete application：
When T/R modules with the distance between outermost 2 mounting holes are equal on first cavity, the second cavity when,
Only T/R modules can integrally be fixed with heat sink using only the two mounting holes at this time.
As another preferred embodiment of the present invention, this heat sink can be also used for 2 small T/R modules of installation,
First cavity, 2 mounting holes on the second cavity per side connect one small T/R modules at this time.
Further, by the way that the length of the first cavity and the second cavity is increased, and fixed hole number increase, can be with
The T/R modules of installation 3 or 3 or more.
Further, intermediate on first cavity and the second cavity to be provided with to intermediate graphite flake protrusion and contact
2 hollow reinforcing props 5.The reinforcing prop is in the first cavity and the second cavity and intermediate high heat conduction graphite flake high-temperature soldering
When, with the solder contact under molten condition first is further enhanced to be fixed after the cooling period with the high heat conduction graphite flake
The firm welding degree of cavity and the second cavity and high heat conduction graphite flake.
Further, the hollow reinforcing prop on first cavity and the second cavity is mutually butted, and formation one is hollow logical
Road can be used screw will be positioned at the T/R on the reinforcing prop both sides across the reinforcing prop at this time when installing multiple T/R modules
Module is connected and fixed.
Further, complete machine secure fit portion, the complete machine are additionally provided in first cavity and the second cavity both sides
It is provided with complete machine mounting hole in secure fit portion 6, in final assembly, screw or pin can be used to carry out heat sink and complete machine
It is fixed.
In a particular application, by the high part of quantity of heat production on the transceiver module on the heat sink and phased-array radar of the present invention
Contact, the radiating end heat transfer to heat sink that heat sink can be quickly, to ensure the normal work of transceiver module.
Meanwhile the present embodiment heat sink shape being revised accordingly and can be used in other assemblies.
In conclusion the embodiment of the present invention is compounded to form high thermal conductivity using aluminum alloy materials with high-heat conductivity graphite material
Heat sink so that its its structure type is simple, high yield rate, cost are relatively low；Simultaneously as the density of high heat conduction graphite flake is less than
Aluminium alloy so that the present invention under same volume spreads aluminium alloy of the hot plate than the solid copper material and sintering structure form of existing same volume
Density of material smaller realizes the lightweight of product；And due to itself design feature（Without other nonmetal mediums）, therefore
Without departing from its use scope, heat transfer efficiency is substantially unchanged；Since aluminium alloy and graphite material are all a kind of width Wen Fan
The material used is enclosed, so the use temperature range of the heat sink can reach -50 DEG C ~+125 DEG C, and is not used speed by product
Limitation on degree.
Claims (5)
1. a kind of heat sink of high-power T/R modules, which is characterized in that including the first cavity and the second chamber being mutually fastened
Body is provided with the heat carrier for conducting heat between first cavity and the second cavity；
The material of first cavity and the second cavity is aluminium alloy；
The heat carrier is high heat conduction graphite flake；
The contact surface of the heat carrier and first cavity and the second cavity is welded together by solder；
Reinforcing prop body protrusion to intermediate thermal conductivity and contacted, the reinforcement are provided on first cavity and the second cavity
Column is hollow-core construction；Hollow reinforcing prop on first cavity and the second cavity is mutually butted, and forms a hollow passageway；
The reinforcing prop is when the first cavity and the second cavity are with intermediate high heat conduction graphite flake high-temperature soldering, and under molten condition
Solder contact led with height with reinforcing the first cavity and the second cavity to being fixed after the cooling period with the high heat conduction graphite flake
The firm welding degree of hot graphite flake.
2. a kind of heat sink of high-power T/R modules according to claim 1, which is characterized in that on the heat sink
Be provided with mounting hole, the mounting hole across first cavity, the second cavity and its heat carrier, the mounting hole uses
In heat sink and heating device are fixed using fastener.
3. a kind of heat sink of high-power T/R modules according to claim 1, which is characterized in that described first and second
Cavity both sides are additionally provided with complete machine secure fit portion, and heat sink and complete machine are fixed when for final assembly.
4. a kind of heat sink of high-power T/R modules according to claim 3, which is characterized in that the complete machine fixation is matched
Complete machine mounting hole is provided in conjunction portion, for heat sink and the complete machine to be fixed using fastener.
5. a kind of phased-array radar T/R modules, which is characterized in that setting is radiated just like Claims 1-4 any one of them
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510797199.XA CN105338794B (en) | 2015-11-18 | 2015-11-18 | A kind of phased-array radar T/R modules and its radiating subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510797199.XA CN105338794B (en) | 2015-11-18 | 2015-11-18 | A kind of phased-array radar T/R modules and its radiating subassembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105338794A CN105338794A (en) | 2016-02-17 |
| CN105338794B true CN105338794B (en) | 2018-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510797199.XA Active CN105338794B (en) | 2015-11-18 | 2015-11-18 | A kind of phased-array radar T/R modules and its radiating subassembly |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107953616A (en) * | 2017-09-23 | 2018-04-24 | 世星科技股份有限公司 | The composite construction and its preparation process of a kind of conduction graphite film |
| CN109459728B (en) * | 2018-12-12 | 2021-04-09 | 中国电子科技集团公司第三十八研究所 | T/R module structure and liquid cooling board plug-in unit with same |
| CN113784590B (en) * | 2021-09-06 | 2022-08-02 | 无锡华测电子系统有限公司 | Tile type TR assembly device and external heat dissipation structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1496218A (en) * | 2002-08-21 | 2004-05-12 | ���µ�����ҵ��ʽ���� | Power miniature assembly and its mfg. method |
| CN200990750Y (en) * | 2006-12-27 | 2007-12-12 | 华为技术有限公司 | A radiating structure and equipment including the same radiating structure |
| US7663883B2 (en) * | 2004-02-13 | 2010-02-16 | Fujitsu Limited | Heat transfer mechanism, heat dissipation system, and communication apparatus |
| CN102769001A (en) * | 2012-08-07 | 2012-11-07 | 华为技术有限公司 | Heat sink |
-
2015
- 2015-11-18 CN CN201510797199.XA patent/CN105338794B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1496218A (en) * | 2002-08-21 | 2004-05-12 | ���µ�����ҵ��ʽ���� | Power miniature assembly and its mfg. method |
| US7663883B2 (en) * | 2004-02-13 | 2010-02-16 | Fujitsu Limited | Heat transfer mechanism, heat dissipation system, and communication apparatus |
| CN200990750Y (en) * | 2006-12-27 | 2007-12-12 | 华为技术有限公司 | A radiating structure and equipment including the same radiating structure |
| CN102769001A (en) * | 2012-08-07 | 2012-11-07 | 华为技术有限公司 | Heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105338794A (en) | 2016-02-17 |
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Address after: 610041 Shiyang Industrial Park, No.288, Yixin Avenue, hi tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu lightning Micro Power Technology Co., Ltd Address before: 610041 Shiyang Industrial Park, hi tech Zone, Chengdu, Sichuan Patentee before: RML TECHNOLOGY Co.,Ltd. |
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