CN105338794A - Phased array radar T/R module and heat dissipation assembly thereof - Google Patents
Phased array radar T/R module and heat dissipation assembly thereof Download PDFInfo
- Publication number
- CN105338794A CN105338794A CN201510797199.XA CN201510797199A CN105338794A CN 105338794 A CN105338794 A CN 105338794A CN 201510797199 A CN201510797199 A CN 201510797199A CN 105338794 A CN105338794 A CN 105338794A
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- Prior art keywords
- cavity
- heating panel
- power
- module
- module according
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a phased array radar T/R module and a heat dissipation assembly thereof. The heat dissipation assembly comprises a first cavity and a second cavity which are mutually fastened and fixed, and a heat conductor used for conducting heat is arranged between the first cavity and the second cavity; and the first cavity and the second cavity are aluminum alloy. The invention aims to provide a heat dissipation plate which is light in weight, large in working range, constant in thermal conductivity, simple in production process, high in yield and low in cost, is not influenced by working speed of a product, can be widely used and adopts a high-power T/R module.
Description
Technical field
The present invention relates to microwave transmitting and receiving assembly field, particularly a kind of phased array radar T/R module and radiating subassembly thereof.
Background technology
What the heating panel of microwave current transceiver module generally adopted is heat loss through conduction technology, and heat to be conducted by the high heat outlet parts that is in contact with it that other are local, to ensure the normal work of transceiver module by heat rapidly that namely transceiver module produces.And current high heat outlet parts adopts solid copper prepared material, sintered heat pipe material usually, and their shortcoming is also clearly:
1, large (copper material density: the 8.9g/cm3) Heavy Weight of the parts density of solid copper prepared material, can not meet present product lightweight requirements;
2, heat resistant material is due to the version of its internal heat dissipating groove and heat eliminating medium, causes its operating temperature range limited; The risk having thermal conductivity to reduce under certain power situation; Larger by product work rate; Manufacture craft is more complicated, rate of finished products, low cost are high, is unfavorable for widely using.
Summary of the invention
The object of the invention is to overcome the solid copper heating panel preponderance had in prior art, and heat resistant material cooling plate structure complex forms, rate of finished products are not high, heating panel environment for use is limited, serviceability temperature scope is little, operating speed is restricted, be unfavorable for widely used problem, provide the heating panel that a kind of quality is light, working range is large, thermal conductivity is constant, manufacture craft is simple, rate of finished products is high, cost is low, be not subject to product work rate, can realize widely used high-power transceiver module.
In order to realize foregoing invention object, the invention provides following technical scheme:
A heating panel for high-power T/R module, comprises the first cavity and the second cavity that are mutually fastened, is provided with the heat carrier for heat conduction between described first cavity and the second cavity;
The material of described first cavity and the second cavity is aluminium alloy.
Preferably, described heating panel is provided with fixing hole, described fixing hole through described first cavity, the second cavity and heat carrier, heating panel and heater members are fixed for using securing member by described fixing hole.
Preferably, described first cavity with the second cavity is provided with to the protruding and reinforcing prop contacted with it of intermediate thermal conductivity body.
Preferably, described reinforcing prop is hollow-core construction.
Preferably, the hollow reinforcing prop on described first cavity and the second cavity docks mutually, forms a hollow passageway.
Preferably, described first and second cavity both sides are also provided with complete machine secure fit portion, for heating panel and complete machine being fixed during final assembly.
Preferably, described complete machine secure fit portion being provided with complete machine fixing hole, for using securing member, heating panel and described complete machine being fixed.
Preferably, described heat carrier is high conductive graphite sheet.
Preferably, the contact-making surface of described heat carrier and described first cavity and the second cavity is welded together by solder.
A kind of phased array radar T/R module, is provided with heating panel as above.
compared with prior art, beneficial effect of the present invention: by employing is the heating panel that aluminum alloy materials and high-heat conductivity graphite material are compounded to form high thermal conductivity, and the present invention is had compared with the product of prior art, and quality is light, working range is large, thermal conductivity is constant, manufacture craft is simple, rate of finished products is high, cost is low, by product work rate, can realize widely used advantage.
Accompanying drawing explanation
Fig. 1 is the exploded view of the embodiment of the present invention a kind of phased array radar T/R module and radiating subassembly thereof.
Fig. 2 is the outline drawing of the embodiment of the present invention a kind of phased array radar T/R module and radiating subassembly thereof.
Mark in figure: 10-first cavity, 11-second cavity, 20-solder, 21 solders, 3-height conductive graphite material sheet, 4-fixing hole, 5-reinforcing prop, 6-complete machine secure fit portion.
Embodiment
Below in conjunction with test example and embodiment, the present invention is described in further detail.But this should be interpreted as that the scope of the above-mentioned theme of the present invention is only limitted to following embodiment, all technology realized based on content of the present invention all belong to scope of the present invention.
embodiment 1
A heating panel for high-power T/R module, referring to Fig. 1, comprises the first cavity 10 and the second cavity 11 interfixed.The heat carrier for heat conduction is provided with between described first cavity and the second cavity;
Described first cavity 10 and the second cavity 11 are aluminium alloy.
Further, described heat carrier adopts high conductive graphite sheet 3, and described high conductive graphite sheet 3 is welded together by solder 20 and 21 with the contact-making surface of described first cavity 10 and the second cavity 11, adopts general solder herein, as scolding tin etc.
Further, the two ends of described first cavity, the second cavity are provided with 2 fixing holes 4, also 2 immediate fixing holes 4 are provided with the while of middle, described fixing hole 4 through described first cavity, the second cavity and high conductive graphite sheet, for using pin, the heater members end of heating panel and T/R module is fixed.
During embody rule:
When distance between T/R module with 2 fixing holes outermost on described first cavity, the second cavity is equal, now only use these two fixing holes T/R module and heating panel entirety can be fixed.
As another kind of preferred embodiment of the present invention, this heating panel can also be used for installing 2 little T/R modules, and now on described first cavity, the second cavity, 2 fixing holes of every side connect a little T/R module.
Further, by the length of the first cavity and the second cavity is increased, and the increase of fixing hole quantity, the T/R module of more than 3 or 3 can be installed.
Further, described first cavity is provided with to protruding 2 the hollow reinforcing props 5 also contacted with it of middle graphite flake with middle on the second cavity.Described reinforcing prop is when the first cavity and the second cavity are with middle high conductive graphite sheet high-temperature soldering, with the solder contact under molten condition, thus fix with described high conductive graphite sheet after the cooling period, further enhance the firm welding degree of the first cavity and the second cavity and high conductive graphite sheet.
Further, the hollow reinforcing prop on described first cavity and the second cavity docks mutually, forms a hollow passageway, when installing multiple T/R module, screw now can be used to pass described reinforcing prop and fixed by the T/R model calling being positioned at described reinforcing prop both sides.
Further, be also provided with complete machine secure fit portion at described first cavity and the second cavity both sides, described complete machine secure fit portion 6 is provided with complete machine fixing hole, when final assembly, screw or pin can be used heating panel and complete machine to be fixed.
In a particular application, by part contact high for quantity of heat production on the transceiver module on heating panel of the present invention and phased array radar, radiating end heat being delivered to heating panel that heating panel can be very fast, thus the normal work ensureing transceiver module.
Meanwhile, the present embodiment heating panel profile is revised accordingly namely can be used in other assemblies.
In sum, the embodiment of the present invention adopts aluminum alloy materials and high-heat conductivity graphite material to be compounded to form the heating panel of high thermal conductivity, such that its its version is simple, rate of finished products is high, cost is lower; Meanwhile, because the density of high conductive graphite sheet is less than aluminium alloy, make the present invention under same volume spread hot plate than the solid copper material of existing same volume and the aluminum alloy materials density of sintering structure form less, achieve the lightweight of product; And due to itself design feature (without other nonmetal mediums), therefore only otherwise exceed its scope of application, its heat transfer efficiency is substantially unchanged; Because aluminium alloy and graphite material are all the materials that a kind of wide temperature range uses, so the serviceability temperature scope of this heating panel can reach-50 DEG C ~+125 DEG C, and not by the restriction on product operating speed.
Claims (10)
1. a heating panel for high-power T/R module, is characterized in that, comprises the first cavity and the second cavity that are mutually fastened, is provided with the heat carrier for heat conduction between described first cavity and the second cavity;
The material of described first cavity and the second cavity is aluminium alloy.
2. the heating panel of a kind of high-power T/R module according to claim 1, it is characterized in that, described heating panel is provided with fixing hole, described fixing hole through described first cavity, the second cavity and heat carrier, heating panel and heater members are fixed for using securing member by described fixing hole.
3. the heating panel of a kind of high-power T/R module according to claim 2, is characterized in that, described first cavity with the second cavity is provided with to the protruding and reinforcing prop contacted with it of intermediate thermal conductivity body.
4. the heating panel of a kind of high-power T/R module according to claim 3, it is characterized in that, described reinforcing prop is hollow-core construction.
5. the heating panel of a kind of high-power T/R module according to claim 4, is characterized in that, the hollow reinforcing prop on described first cavity and the second cavity docks mutually, forms a hollow passageway.
6. the heating panel of a kind of high-power T/R module according to claim 1, is characterized in that, described first and second cavity both sides are also provided with complete machine secure fit portion, for heating panel and complete machine being fixed during final assembly.
7. the heating panel of a kind of high-power T/R module according to claim 6, is characterized in that, described complete machine secure fit portion is provided with complete machine fixing hole, heating panel and described complete machine is fixed for using securing member.
8. the heating panel of a kind of high-power T/R module according to claim 1, is characterized in that, described heat carrier is high conductive graphite sheet.
9. the heating panel of a kind of high-power T/R module according to claim 1, it is characterized in that, the contact-making surface of described heat carrier and described first cavity and the second cavity is welded together by solder.
10. a phased array radar T/R module, is characterized in that, is provided with the heating panel as described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510797199.XA CN105338794B (en) | 2015-11-18 | 2015-11-18 | A kind of phased-array radar T/R modules and its radiating subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510797199.XA CN105338794B (en) | 2015-11-18 | 2015-11-18 | A kind of phased-array radar T/R modules and its radiating subassembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105338794A true CN105338794A (en) | 2016-02-17 |
| CN105338794B CN105338794B (en) | 2018-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510797199.XA Active CN105338794B (en) | 2015-11-18 | 2015-11-18 | A kind of phased-array radar T/R modules and its radiating subassembly |
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| CN (1) | CN105338794B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107953616A (en) * | 2017-09-23 | 2018-04-24 | 世星科技股份有限公司 | The composite construction and its preparation process of a kind of conduction graphite film |
| CN109459728A (en) * | 2018-12-12 | 2019-03-12 | 中国电子科技集团公司第三十八研究所 | A kind of T/R modular structure and the liquid cooling board package with the structure |
| CN113784590A (en) * | 2021-09-06 | 2021-12-10 | 无锡华测电子系统有限公司 | Tile type TR assembly device, external heat dissipation structure and rework structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1496218A (en) * | 2002-08-21 | 2004-05-12 | ���µ�����ҵ��ʽ���� | Power miniature assembly and its mfg. method |
| CN200990750Y (en) * | 2006-12-27 | 2007-12-12 | 华为技术有限公司 | A radiating structure and equipment including the same radiating structure |
| US7663883B2 (en) * | 2004-02-13 | 2010-02-16 | Fujitsu Limited | Heat transfer mechanism, heat dissipation system, and communication apparatus |
| CN102769001A (en) * | 2012-08-07 | 2012-11-07 | 华为技术有限公司 | Heat sink |
-
2015
- 2015-11-18 CN CN201510797199.XA patent/CN105338794B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1496218A (en) * | 2002-08-21 | 2004-05-12 | ���µ�����ҵ��ʽ���� | Power miniature assembly and its mfg. method |
| US7663883B2 (en) * | 2004-02-13 | 2010-02-16 | Fujitsu Limited | Heat transfer mechanism, heat dissipation system, and communication apparatus |
| CN200990750Y (en) * | 2006-12-27 | 2007-12-12 | 华为技术有限公司 | A radiating structure and equipment including the same radiating structure |
| CN102769001A (en) * | 2012-08-07 | 2012-11-07 | 华为技术有限公司 | Heat sink |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107953616A (en) * | 2017-09-23 | 2018-04-24 | 世星科技股份有限公司 | The composite construction and its preparation process of a kind of conduction graphite film |
| CN109459728A (en) * | 2018-12-12 | 2019-03-12 | 中国电子科技集团公司第三十八研究所 | A kind of T/R modular structure and the liquid cooling board package with the structure |
| CN113784590A (en) * | 2021-09-06 | 2021-12-10 | 无锡华测电子系统有限公司 | Tile type TR assembly device, external heat dissipation structure and rework structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105338794B (en) | 2018-07-31 |
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Address after: 610041 Shiyang Industrial Park, No.288, Yixin Avenue, hi tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu lightning Micro Power Technology Co., Ltd Address before: 610041 Shiyang Industrial Park, hi tech Zone, Chengdu, Sichuan Patentee before: RML TECHNOLOGY Co.,Ltd. |
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