CN207625905U - It is a kind of to cross furnace carrier convenient for fixed and good thermal diffusivity SMT - Google Patents
It is a kind of to cross furnace carrier convenient for fixed and good thermal diffusivity SMT Download PDFInfo
- Publication number
- CN207625905U CN207625905U CN201721650016.2U CN201721650016U CN207625905U CN 207625905 U CN207625905 U CN 207625905U CN 201721650016 U CN201721650016 U CN 201721650016U CN 207625905 U CN207625905 U CN 207625905U
- Authority
- CN
- China
- Prior art keywords
- sliding block
- carrier
- smt
- block
- fixing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of furnace carrier is crossed convenient for fixed and good thermal diffusivity SMT,Including carrier ontology,First positioning hole,Fixed block,Second location hole,Cross baffle,Fixing device,Bottom plate,Semiconductor cooling fin,Heating column and heat absorbing sheet,The top inner wall of bottom plate is evenly distributed with heat absorbing sheet,The side of heat absorbing sheet is equipped with heating column,The side of heating column is equipped with semiconductor cooling fin,The side of carrier ontology is equipped with cross baffle,The side of carrier ontology is evenly distributed with fixing device,The both sides of fixing device offer first positioning hole and second location hole respectively,Fixing device is by buffer bar,Threaded hole,Fixture block,Sleeve,Sliding slot,First sliding block,Second sliding block and adjustable spring composition,Sliding slot correspondence is opened on carrier ontology,The inside of sliding slot is separately installed with the first sliding block and the second sliding block,The SMT crosses furnace carrier,It is good convenient for fixed and thermal diffusivity to have the characteristics that.
Description
Technical field
The utility model is related to SMT technical fields, specially a kind of to cross furnace carrier convenient for fixed and good thermal diffusivity SMT.
Background technology
SMT is known as surface mount or surface installation technique, be in current electronic assembly industry a kind of most popular technology and
Craft method.It is a kind of the assembling component on no pin or short leg surface to be mounted on the surface of printed circuit board or other
On the surface of substrate, then it is subject to by the methods of Reflow Soldering or immersed solder the circuit load technology of welding assembly.SMT's answers extensively
With, miniaturization and the multifunction of electronic product is greatly facilitated, for produce in enormous quantities and Low Defectivity production provide abundance
Condition.But it is crossed in furnace carrier in existing SMT, there is the problems such as being difficult to install fixed and poor radiation.Therefore, design is a kind of
It is necessary to cross furnace carrier convenient for fixed and good thermal diffusivity SMT.
Utility model content
Furnace carrier being crossed convenient for fixed and good thermal diffusivity SMT the purpose of this utility model is to provide a kind of, in solution
State the problem of being proposed in background technology.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solutions：One kind is convenient for fixed and thermal diffusivity
Good SMT crosses furnace carrier, including carrier ontology, first positioning hole, fixed block, second location hole, cross baffle, fixing device,
The bottom of bottom plate, semiconductor cooling fin, heating column and heat absorbing sheet, the carrier ontology is equipped with bottom plate, the top of the bottom plate
Inner wall is evenly distributed with heat absorbing sheet, and the side of the heat absorbing sheet is equipped with heating column, and the side of the heating column, which is equipped with, partly leads
The side of body cooling fin, the carrier ontology is equipped with cross baffle, and the side of the carrier ontology is evenly distributed with fixed dress
It sets, the both sides of the fixing device offer first positioning hole and second location hole respectively, and the fixing device is by buffer bar, spiral shell
Pit, fixture block, sleeve, sliding slot, the first sliding block, the second sliding block and adjustable spring composition, the sliding slot correspondence are opened in carrier sheet
On body, the inside of the sliding slot is separately installed with the first sliding block and the second sliding block, first sliding block and the second sliding block and sliding slot
Side inner wall connected by adjustable spring, the side of first sliding block is equipped with sleeve, the side peace of second sliding block
Equipped with fixture block, and buffer bar is connected between two fixture blocks and two sleeves, the side of the buffer bar is equipped with fixed block, institute
It states correspondence on fixture block and sleeve and offers threaded hole.
Further, the carrier ontology is made of refractory layer, strengthening layer and wearing layer, the side covering of the refractory layer
There are strengthening layer, the side of the strengthening layer to be covered with wearing layer.
Further, by being welded and fixed between the semiconductor cooling fin and heat absorbing sheet and heating column.
Further, first sliding block and adjustable spring and the second sliding block and adjustable spring are connected by buckle activity
It connects.
Compared with prior art, the advantageous effect that the utility model is reached is：The SMT crosses furnace carrier, on the top of bottom plate
Portion's inner wall is evenly distributed with heat absorbing sheet, and the side of heat absorbing sheet is equipped with heating column, and the side of heating column is equipped with semiconductor cooling
Piece, the heat transfer for being absorbed heat absorbing sheet by heating column carry out radiating treatment to semiconductor cooling on piece, reduce on carrier ontology
Temperature, help to improve the thermal diffusivity that the SMT crosses furnace carrier；First element to be assembled is positioned on fixed block, then is pushed away simultaneously
Dynamic fixture block and sleeve, make it move toward one another, and drive two buffer bars by members clamp to be assembled by fixture block and sleeve, and in fixture block
Threaded hole is offered with correspondence on sleeve, fixture block and sleeve are used cooperatively, i.e., by the threaded hole on fixture block and sleeve after clamping
Alignment, then insert screws into, convenient for element to be assembled to be fixed, prevent it from occurring in Reflow Soldering or immersed solder mobile or becoming
Shape influences total quality, helps to improve the tightness that the SMT crosses furnace carrier.
Description of the drawings
Attached drawing is used to provide a further understanding of the present invention, and a part for constitution instruction, with this practicality
Novel embodiment for explaining the utility model, does not constitute limitations of the present invention together.In the accompanying drawings：
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the whole side structure schematic view of the utility model；
Fig. 3 is the sliding slot internal structure schematic diagram of the utility model；
Fig. 4 is the carrier body interior structural schematic diagram of the utility model；
In figure：1- carrier ontologies；2- buffer bars；3- first positioning holes；4- threaded holes；5- fixed blocks；6- second location holes；
7- fixture blocks；8- sleeves；9- cross baffles；10- fixing devices；11- sliding slots；12- bottom plates；13- semiconductor cooling fins；14- heat conduction
Column；15- heat absorbing sheets；The first sliding blocks of 16-；The second sliding blocks of 17-；18- adjustable springs；19- refractory layers；20- strengthening layers；21- is wear-resisting
Layer.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 4 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of SMT mistakes convenient for fixing and thermal diffusivity is good
Furnace carrier, including carrier ontology 1, first positioning hole 3, fixed block 5, second location hole 6, cross baffle 9, fixing device 10, bottom
The bottom of plate 12, semiconductor cooling fin 13, heating column 14 and heat absorbing sheet 15, carrier ontology 1 is equipped with bottom plate 12, the top of bottom plate 12
Portion's inner wall is evenly distributed with heat absorbing sheet 15, and the side of heat absorbing sheet 15 is equipped with heating column 14, and the side of heating column 14 is equipped with half
The side of conductor cooling fin 13, carrier ontology 1 is equipped with cross baffle 9, and the side of carrier ontology 1 is evenly distributed with fixing device
10, the both sides of fixing device 10 offer first positioning hole 3 and second location hole 6 respectively, and fixing device 10 is by buffer bar 2, spiral shell
Pit 4, fixture block 7, sleeve 8, sliding slot 11, the first sliding block 16, the second sliding block 17 and adjustable spring 18 form, and the correspondence of sliding slot 11 opens up
On carrier ontology 1, the inside of sliding slot 11 is separately installed with the first sliding block 16 and the second sliding block 17, and the first sliding block 16 and second is slided
Block 17 is connect with the side inner wall of sliding slot 11 by adjustable spring 18, and the side of the first sliding block 16 is equipped with sleeve 8, the second sliding block
17 side is equipped with fixture block 7, and buffer bar 2 is connected between two fixture blocks 7 and two sleeves 8, the side installation of buffer bar 2
There is fixed block 5, is corresponded on fixture block 7 and sleeve 8 and offer threaded hole 4.
Further, carrier ontology 1 is made of refractory layer 19, strengthening layer 20 and wearing layer 21, and the side of refractory layer 19 is covered
It is stamped strengthening layer 20, the side of strengthening layer 20 is covered with wearing layer 21, convenient for improving service life.
Further, by being welded and fixed between semiconductor cooling fin 13 and heat absorbing sheet 15 and heating column 14, convenient for carrying
Stability when being connected between high semiconductor cooling fin 13, heat absorbing sheet 15 and heating column 14.
Further, the first sliding block 16 and adjustable spring 18 and the second sliding block 17 and adjustable spring 18 pass through buckle activity
The dismounting and replacement of adjustable spring 18 are convenient in connection.
Operation principle：It is evenly distributed with heat absorbing sheet 15 in the top inner wall of bottom plate 12, the side of heat absorbing sheet 15, which is equipped with, leads
The side of plume 14, heating column 14 is equipped with semiconductor cooling fin 13, the heat transfer for being absorbed heat absorbing sheet 15 by heating column 14
Radiating treatment is carried out on to semiconductor cooling fin 13, is reduced the temperature on carrier ontology 1, is helped to improve the SMT and cross furnace carrier
Thermal diffusivity；First element to be assembled is positioned on fixed block 5, then pushes fixture block 7 and sleeve 8 simultaneously, it is made to move toward one another, by
Fixture block 7 and sleeve 8 drive two buffer bars 2 by members clamp to be assembled, and correspondence offers screw thread on fixture block 7 and sleeve 8
Hole 4, fixture block 7 and sleeve 8 are used cooperatively, i.e., are directed at the threaded hole 4 on fixture block 7 and sleeve 8 after clamping, then screw is twisted
Enter, convenient for element to be assembled to be fixed, prevents it from occurring in Reflow Soldering or immersed solder mobile or deforming, influence whole matter
Amount, helps to improve the tightness that the SMT crosses furnace carrier.
Finally it should be noted that：The above descriptions are merely preferred embodiments of the present invention, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it still can be with technical scheme described in the above embodiments is modified, or to which part technical characteristic
Carry out equivalent replacement.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (4)
1. a kind of SMT good convenient for fixation and thermal diffusivity crosses furnace carrier, including carrier ontology (1), first positioning hole (3), fixation
Block (5), second location hole (6), cross baffle (9), fixing device (10), bottom plate (12), semiconductor cooling fin (13), heating column
(14) and heat absorbing sheet (15), it is characterised in that：The bottom of the carrier ontology (1) is equipped with bottom plate (12), the bottom plate (12)
Top inner wall be evenly distributed with heat absorbing sheet (15), the side of the heat absorbing sheet (15) is equipped with heating column (14), the heat conduction
The side of column (14) is equipped with semiconductor cooling fin (13), and the side of the carrier ontology (1) is equipped with cross baffle (9), institute
The side for stating carrier ontology (1) is evenly distributed with fixing device (10), and the both sides of the fixing device (10) offer respectively
A positioning hole (3) and second location hole (6), the fixing device (10) is by buffer bar (2), threaded hole (4), fixture block (7), sleeve
(8), sliding slot (11), the first sliding block (16), the second sliding block (17) and adjustable spring (18) composition, sliding slot (11) correspondence open up
On carrier ontology (1), the inside of the sliding slot (11) is separately installed with the first sliding block (16) and the second sliding block (17), and described
One sliding block (16) and the second sliding block (17) are connect with the side inner wall of sliding slot (11) by adjustable spring (18), first sliding block
(16) side is equipped with sleeve (8), and the side of second sliding block (17) is equipped with fixture block (7), and two fixture blocks (7) and two
Be connected with buffer bar (2) between a sleeve (8), the side of the buffer bar (2) is equipped with fixed block (5), the fixture block (7) and
Correspondence offers threaded hole (4) on sleeve (8).
2. a kind of SMT convenient for fixing and thermal diffusivity is good according to claim 1 crosses furnace carrier, it is characterised in that：It is described
Carrier ontology (1) is made of refractory layer (19), strengthening layer (20) and wearing layer (21), and the side of the refractory layer (19) is covered with
The side of strengthening layer (20), the strengthening layer (20) is covered with wearing layer (21).
3. a kind of SMT convenient for fixing and thermal diffusivity is good according to claim 1 crosses furnace carrier, it is characterised in that：It is described
By being welded and fixed between semiconductor cooling fin (13) and heat absorbing sheet (15) and heating column (14).
4. a kind of SMT convenient for fixing and thermal diffusivity is good according to claim 1 crosses furnace carrier, it is characterised in that：It is described
First sliding block (16) and adjustable spring (18) and the second sliding block (17) and adjustable spring (18) are flexibly connected by buckling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721650016.2U CN207625905U (en) | 2017-11-30 | 2017-11-30 | It is a kind of to cross furnace carrier convenient for fixed and good thermal diffusivity SMT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721650016.2U CN207625905U (en) | 2017-11-30 | 2017-11-30 | It is a kind of to cross furnace carrier convenient for fixed and good thermal diffusivity SMT |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207625905U true CN207625905U (en) | 2018-07-17 |
Family
ID=62824866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721650016.2U Expired - Fee Related CN207625905U (en) | 2017-11-30 | 2017-11-30 | It is a kind of to cross furnace carrier convenient for fixed and good thermal diffusivity SMT |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207625905U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109462939A (en) * | 2018-10-30 | 2019-03-12 | 江苏德联达智能科技有限公司 | A kind of SMT stationary fixture device |
| CN109890148A (en) * | 2019-02-20 | 2019-06-14 | 苏州市吴通智能电子有限公司 | A kind of SMT attachment being adapted to sizes product was with printing furnace carrier |
-
2017
- 2017-11-30 CN CN201721650016.2U patent/CN207625905U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109462939A (en) * | 2018-10-30 | 2019-03-12 | 江苏德联达智能科技有限公司 | A kind of SMT stationary fixture device |
| CN109462939B (en) * | 2018-10-30 | 2024-03-19 | 江苏德联达智能科技有限公司 | SMT mounting fixture device |
| CN109890148A (en) * | 2019-02-20 | 2019-06-14 | 苏州市吴通智能电子有限公司 | A kind of SMT attachment being adapted to sizes product was with printing furnace carrier |
| CN109890148B (en) * | 2019-02-20 | 2024-05-07 | 苏州市吴通智能电子有限公司 | Printing furnace carrier suitable for SMT mounting of products of various sizes |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6839235B2 (en) | Embedded heat pipe for a conduction cooled circuit card assembly | |
| CN207625905U (en) | It is a kind of to cross furnace carrier convenient for fixed and good thermal diffusivity SMT | |
| WO2021115249A1 (en) | Circuit board apparatus and electronic device | |
| CN212461679U (en) | Power semiconductor device package assembly and on-vehicle machine that charges | |
| CN209767915U (en) | PCB board with rapid heat dissipation | |
| CN105338794A (en) | Phased array radar T/R module and heat dissipation assembly thereof | |
| CN217363615U (en) | Radiator for intelligent terminal | |
| CN215871957U (en) | Fine circuit flexible circuit board combining thick gold, immersion gold and OSP | |
| CN210183640U (en) | Laminated PCB board | |
| CN207820306U (en) | A kind of radiator structure of Novel PCB board | |
| CN219267636U (en) | Copper substrate structure of high-voltage field effect transistor | |
| CN221240539U (en) | Heat dissipation type microelectronic assembly | |
| CN217088232U (en) | Intensive pad high-density printed circuit board | |
| CN214800035U (en) | Aluminum substrate for television | |
| CN219372670U (en) | Be applied to quick installation radiator unit of PCB plug-in components pin | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability | |
| CN215991724U (en) | Circuit board with heat dissipation function | |
| CN220173472U (en) | Circuit board capable of enhancing overcurrent capacity | |
| CN209462832U (en) | A kind of circuit board with radiator | |
| CN118309992B (en) | Direct-insert type LED heat dissipation structure | |
| CN212115780U (en) | Multilayer HDI circuit board of inlayer interconnection | |
| CN219248465U (en) | Power module heat radiation structure | |
| CN211457519U (en) | PCB capable of efficiently dissipating heat | |
| CN220570833U (en) | Industrial PCB based on circuit technology | |
| CN213066044U (en) | LED circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180717 Termination date: 20201130 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |