CN212115780U - Multilayer HDI circuit board of inlayer interconnection - Google Patents
Multilayer HDI circuit board of inlayer interconnection Download PDFInfo
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- CN212115780U CN212115780U CN202021233030.4U CN202021233030U CN212115780U CN 212115780 U CN212115780 U CN 212115780U CN 202021233030 U CN202021233030 U CN 202021233030U CN 212115780 U CN212115780 U CN 212115780U
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Abstract
The utility model relates to a circuit board technical field specifically is an inlayer interconnection multilayer HDI circuit board, including circuit board main part and electronic components, the top of circuit board main part is connected with the guiding groove, and the internal connection of guiding groove has spherical fixture block, the top of circuit board main part is connected with the electronic components, one side of circuit board main part is connected with the copper, the bottom of circuit board main part is connected with down the connecting block, the back connection of copper has the copper pipe, and the back connection of copper pipe has the metal mesh. This inlayer interconnection multilayer HDI circuit board through setting up through guiding groove and lower connecting block, can conveniently carry out interconnect between the circuit board main part, and the device is through setting up metal mesh and copper pipe, can effectively increase the device's radiating effect to can effectively increase the device life.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is an inlayer interconnection multilayer HDI circuit board.
Background
HDI is an abbreviation for high density interconnect and is a technique for producing printed circuit boards, a circuit board with a relatively high line distribution density using micro-blind buried via technology.
At present, the current partial HDI circuit board, its itself makes things convenient for work under certain special demand, need conveniently interconnect the circuit board, increase its work efficiency itself, but current connected mode is connected through the screw, but it is comparatively inconvenient to use screwed connection, and current partial HDI circuit board, the space is less between its circuit board, and the air flow is relatively poor, leads to its thermal diffusivity not good to probably influence the life of circuit board, consequently need an inlayer interconnect multilayer HDI circuit board to solve above-mentioned problem urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an inlayer interconnection multilayer HDI circuit board to solve the current partial HDI circuit board that proposes in the above-mentioned background art, its interconnection itself is comparatively inconvenient, and current partial HDI circuit board, the not good problem of its self thermal diffusivity.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an inlayer interconnection multilayer HDI circuit board, includes circuit board main part and electron original paper, the top of circuit board main part is connected with the guiding groove, and the internal connection of guiding groove has spherical fixture block, the top of circuit board main part is connected with the electron original paper, one side of circuit board main part is connected with the copper, the bottom of circuit board main part is connected with down the connecting block, the back connection of copper has the copper pipe, and the back connection of copper pipe has the metal mesh.
Preferably, the inner shape and size of the guide groove are matched with the surface shape and size of the lower connecting block, and the lower connecting block is in sliding connection with the guide groove.
Preferably, the copper plates are arranged in two groups, and the two groups of copper plates are uniformly fixed on the left surface and the right surface of the circuit board main body at equal intervals.
Preferably, the lower connecting block is internally provided with a semicircular clamping groove, the shape and size of the semicircular clamping groove are matched with the surface shape and size of the spherical clamping block, and the spherical clamping block is connected in a clamping manner.
Preferably, the metal points are uniformly arranged on the surface of the metal net at equal intervals.
Preferably, the copper pipes are provided with six groups, and the six groups of copper pipes are uniformly fixed on the left side and the right side of the metal net at equal intervals.
Compared with the prior art, the beneficial effects of the utility model are that: this inlayer interconnection multilayer HDI circuit board through setting up through guiding groove and lower connecting block, can conveniently carry out interconnect between the circuit board main part, and the device is through setting up metal mesh and copper pipe, can effectively increase the device's radiating effect to can effectively increase the device life.
1. The device is through being provided with guiding groove and lower connecting block, makes the inside spherical fixture block of guiding groove and the hemisphere type draw-in groove on lower connecting block surface carry out the block fixed to can make things convenient for to interconnect between two groups of circuit board main parts.
2. The device is through being provided with metal mesh and copper pipe, through the contact of copper and air, can effectively increase the radiating effect of the device to can effectively increase the device's life.
Drawings
Fig. 1 is a schematic structural perspective view of the present invention;
fig. 2 is a schematic view of the circuit board main body of the present invention in a back view;
FIG. 3 is a schematic structural right sectional view of the circuit board of the present invention;
fig. 4 is a schematic left-side sectional view of the circuit board main body according to the present invention.
In the figure: 1. a circuit board main body; 2. a guide groove; 3. a copper plate; 4. a lower connecting block; 5. a metal mesh; 6. a copper pipe; 7. a spherical fixture block; 8. an electronic component.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides an inlayer interconnection multilayer HDI circuit board, includes circuit board main part 1 and electronic component 8, and the top of circuit board main part 1 is connected with guiding groove 2, and the internal connection of guiding groove 2 has spherical fixture block 7, and the top of circuit board main part 1 is connected with electronic component 8, and one side of circuit board main part 1 is connected with copper 3, and the bottom of circuit board main part 1 is connected with down connecting block 4, and the back connection of copper 3 has copper pipe 6, and the back connection of copper pipe 6 has metal mesh 5.
Further, the inside shape size of guide groove 2 and the surface shape size looks adaptation of lower connecting block 4, lower connecting block 4 and guide groove 2 are sliding connection, and the shape size of looks adaptation enables lower connecting block 4 to insert and establish the inside messenger that the guide groove 2 makes inseparabler to can reduce down the rocking that produces when connecting block 4 slides inside the guide groove 2.
Further, copper 3 is provided with two sets ofly, and two sets of copper 3 equidistance evenly fix at the left and right sides surface of circuit board main part 1, through being provided with two sets of copper 3, can effectively increase the area of contact of the device and air to can make copper 3 increase the device's radiating effect.
Further, a semicircular clamping groove is formed in the lower connecting block 4, the shape and the size of the semicircular clamping groove are matched with the surface shape and the size of the spherical clamping block 7, the spherical clamping block 7 is connected in a clamping mode, and the lower connecting block 4 can be fixed in the guide groove 2 due to the matched shape and the size.
Further, the surface of the metal net 5 is evenly provided with metal points at equal intervals, and the contact area between the metal net 5 and air can be effectively increased and the heat conduction effect is improved by arranging the metal points.
Furthermore, six groups of copper pipes 6 are arranged, the six groups of copper pipes 6 are uniformly fixed on the left side and the right side of the metal net 5 at equal intervals, and the heat conduction efficiency of the device can be further improved by arranging the six groups of copper pipes 6.
The working principle is as follows: when needs interconnect between two groups of circuit board main part 1, can at first place a set of circuit board main part 1 on the surface of another group of circuit board main part 1, simultaneously, can manually insert the lower connecting block 4 of a set of circuit board main part 1 bottom and establish to the inside of another group of circuit board main part 1 top guiding groove 2 to make the inside spherical fixture block 7 of guiding groove 2 and the hemisphere type draw-in groove on lower connecting block 4 surface carry out the block fixed, thereby can make things convenient for interconnect between two sets of circuit board main part 1.
When the electronic component 8 on the top surface of the circuit board main body 1 works, the heat generated on the surface can gradually float upwards, and after the heat is collected to the surface of the metal mesh 5, the heat can be transferred to the surface of the copper pipe 6, meanwhile, the heat can be transferred to the surface of the copper pipe 3 from the surface of the copper pipe 6 through heat transfer, and the heat dissipation effect of the device can be effectively increased through the contact between the copper plate 3 and the air, so that the service life of the device can be effectively prolonged.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides an inlayer interconnection multilayer HDI circuit board, includes circuit board main part (1) and electron original paper (8), its characterized in that: the top of circuit board main part (1) is connected with guiding groove (2), and the internal connection of guiding groove (2) has spherical fixture block (7), the top of circuit board main part (1) is connected with electronic components (8), one side of circuit board main part (1) is connected with copper (3), the bottom of circuit board main part (1) is connected with down connecting block (4), the back connection of copper (3) has copper pipe (6), and the back connection of copper pipe (6) has metal mesh (5).
2. An innerlayer interconnect multilayer HDI wiring board according to claim 1, wherein: the inside shape size of guiding groove (2) and the surperficial shape size looks adaptation of lower connecting block (4), lower connecting block (4) and guiding groove (2) are sliding connection.
3. An innerlayer interconnect multilayer HDI wiring board according to claim 1, wherein: the copper (3) are provided with two groups, and the two groups of copper (3) are equidistantly and uniformly fixed on the left surface and the right surface of the circuit board main body (1).
4. An innerlayer interconnect multilayer HDI wiring board according to claim 1, wherein: the inside of the lower connecting block (4) is provided with a semicircular clamping groove, the shape and size of the semicircular clamping groove are matched with the surface shape and size of the spherical clamping block (7), and the spherical clamping block (7) is connected in a clamping manner.
5. An innerlayer interconnect multilayer HDI wiring board according to claim 1, wherein: and metal points are uniformly arranged on the surface of the metal net (5) at equal intervals.
6. An innerlayer interconnect multilayer HDI wiring board according to claim 1, wherein: six groups of copper pipes (6) are arranged, and the six groups of copper pipes (6) are uniformly fixed on the left side and the right side of the metal net (5) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021233030.4U CN212115780U (en) | 2020-06-29 | 2020-06-29 | Multilayer HDI circuit board of inlayer interconnection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021233030.4U CN212115780U (en) | 2020-06-29 | 2020-06-29 | Multilayer HDI circuit board of inlayer interconnection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212115780U true CN212115780U (en) | 2020-12-08 |
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ID=73628320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021233030.4U Active CN212115780U (en) | 2020-06-29 | 2020-06-29 | Multilayer HDI circuit board of inlayer interconnection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212115780U (en) |
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2020
- 2020-06-29 CN CN202021233030.4U patent/CN212115780U/en active Active
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