CN218634395U

CN218634395U - PCB circuit board capable of quickly radiating

Info

Publication number: CN218634395U
Application number: CN202222788183.0U
Authority: CN
Inventors: 张左菊; 李璨
Original assignee: Jiangsu Yaoshu Intelligent Technology Co ltd
Current assignee: Jiangsu Yaoshu Intelligent Technology Co ltd
Priority date: 2022-10-21
Filing date: 2022-10-21
Publication date: 2023-03-14
Anticipated expiration: 2032-10-21

Abstract

The utility model discloses a PCB circuit board that can dispel heat fast, including PCB circuit board main part, the equal fixedly connected with fixed block in both sides of PCB circuit board main part, the cavity has been seted up to the inside of fixed block, the inside of PCB circuit board main part is seted up flutedly, the inside fixedly connected with thermal-arrest siphunculus of recess, the front end intercommunication of thermal-arrest siphunculus has the pipe. This PCB circuit board that can dispel heat fast, can gather the heat in the PCB circuit board main part through the thermal-arrest siphunculus, make the heat carry out centralized processing, can transmit the heat on the thermal-arrest siphunculus through the silica gel fin and give off, make the heat outwards drain away, can produce wind-force through the fan, utilize the forced air cooling to dispel the heat to PCB circuit board main part, can wind-force carry to PCB circuit board main part through the pipe around every electron device, make every electron device can both receive wind-force and dispel the heat, thereby the heat dispersion of this device has been improved.

Description

PCB circuit board capable of quickly dissipating heat

Technical Field

The utility model relates to a PCB circuit board technical field specifically is a PCB circuit board that can dispel the heat fast.

Background

The PCB is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing technique, it is called "printed" circuit board, and after the electronic equipment adopts printed board, because of the consistency of the printed board of the same kind, it can prevent the error of manual wiring, and can implement automatic plug-in mounting or sticking mounting, automatic soldering tin and automatic detection of electronic component, and can ensure the quality of electronic equipment, raise labour productivity, reduce cost and is convenient for maintenance.

The comparison document "a PCB circuit board that can dispel the heat fast", patent number (CN 217406793U), through setting up first louvre, the cooperation of second louvre and graphite alkene board is used, can dispel the heat to the top of PCB circuit board through two kinds of modes, it can adsorb the dust on PCB circuit board surface to set up the electrostatic absorption board simultaneously, avoid PCB circuit board surface because the existence of dust reduces the heat dispersion of PCB circuit board, however, but PCB circuit board that can dispel the heat fast is when using, adopt natural radiating design, lead to the heat dissipation to receive the limitation, can not directly cover the heat dissipation to the device on the circuit board, lead to the radiating efficiency lower, bring inconvenience for the user.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a PCB circuit board that can dispel heat fast to carrying the PCB circuit board that can dispel the heat fast in solving above-mentioned background art when using, adopting the design of natural heat dissipation, leading to the heat dissipation to receive the limitation, can not directly cover the heat dissipation to the device on the circuit board, lead to the radiating efficiency lower, bring inconvenient problem for the user.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a PCB circuit board that can dispel heat fast, includes PCB circuit board main part, the equal fixedly connected with fixed block in both sides of PCB circuit board main part, the cavity has been seted up to the inside of fixed block, the recess has been seted up to the inside of PCB circuit board main part, the inside fixedly connected with thermal-arrest siphunculus of recess, the front end intercommunication of thermal-arrest siphunculus has the pipe, the rear surface fixedly connected with silica gel fin of pipe, the equal fixedly connected with fan in relative one side in two connecting blocks, the equal intercommunication of one side relative of two fans has the guide duct.

Compared with the prior art, the beneficial effects of the utility model are that:

this PCB circuit board that can dispel heat fast, can gather the heat in the PCB circuit board main part through the thermal-arrest siphunculus, make the heat carry out centralized processing, can transmit the heat on the thermal-arrest siphunculus through the silica gel fin and give off, make the heat outwards discharge away, can produce wind-force through the fan, utilize the forced air cooling to dispel the heat to PCB circuit board main part, can wind-force carry to PCB circuit board main part through the pipe around every electron device, make every electron device can both receive wind-force and dispel the heat, thereby the heat dispersion of this device has been improved, the practicality of this device has been improved, user's user demand has been satisfied.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a sectional view of the structure of the present invention;

FIG. 3 is an enlarged view of part A of FIG. 2;

fig. 4 is a right side sectional view of the PCB main body of the present invention.

In the figure: 1. a PCB circuit board main body; 2. a fixed block; 3. a groove; 4. a heat collection through pipe; 5. a conduit; 6. a silica gel radiating fin; 7. a fan; 8. an air guide pipe; 9. locking the groove; 10. a resistor; 11. a capacitor.

Detailed Description

The present invention will be described in more detail with reference to the following embodiments, which are provided by way of illustration only and are not intended to limit the scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a can be radiating PCB circuit board fast, the locked groove has all been seted up to the position by the four corners of PCB circuit board main part front surface, and the design of for integration between locked groove and the PCB circuit board main part, locked groove convenient to use person is spacing to this device locking.

The quantity that the recess was seted up is a plurality of, and the design as an organic whole between recess and the PCB circuit board main part, and the recess is used for placing the thermal-arrest siphunculus.

The front end of the guide pipe penetrates through the PCB main body and extends to the outside of the PCB main body, and the guide pipe plays a role in air guiding.

The rear end of the silica gel radiating fin penetrates through the PCB main body and extends to the outside of the PCB main body, and the silica gel radiating fin can radiate materials.

The opposite sides of the two air guide pipes penetrate through the two fixing blocks and the PCB main body respectively and are communicated with the guide pipes, and the air guide pipes can transmit wind power.

The top and the bottom of leaning on of PCB circuit board main part front surface one side all fixedly connected with resistor, the resistor can monitor resistance.

The capacitor is fixedly connected to the position, close to the bottom, of one side of the front surface of the PCB body, and the capacitor can play a role in isolating direct current.

The working principle is as follows: when using this device, the user starts fan 7 and produces wind-force, later the wind-force that fan 7 produced will pass through guide duct 8 and carry to thermal-arrest siphunculus 4 in, carry to the wind-force in the thermal-arrest siphunculus 4 will outwards discharge through pipe 5, and the extensive distribution of pipe 5 is on PCB circuit board main part 1, just so can guarantee that every device can both have dispels the heat, and thermal-arrest siphunculus 4 can also gather the thermal-arrest volume, the heat of gathering can be through the outside heat dissipation of silica gel fin 6, further improvement this device's radiating efficiency.

According to the working process, the following steps can be obtained:

this PCB circuit board that can dispel heat fast, can gather the heat in PCB circuit board main part 1 through thermal-arrest siphunculus 4, make the heat carry out centralized processing, can transmit the heat on the thermal-arrest siphunculus 4 through silica gel fin 6 and give off, make the heat outwards discharge away, can produce wind-force through fan 7, utilize the forced air cooling to dispel the heat to PCB circuit board main part 1, can wind-force carry to PCB circuit board main part 1 through pipe 5 around every electron device, make every electron device can both receive wind-force and dispel the heat, thereby the heat dispersion of this device has been improved, the practicality of this device has been improved, user's user demand has been satisfied.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a PCB circuit board that can dispel heat fast, includes PCB circuit board main part (1), its characterized in that: the utility model discloses a PCB heat-insulation board, including PCB circuit board main part (1), the equal fixedly connected with fixed block in both sides (2) of PCB circuit board main part (1), the cavity has been seted up to the inside of fixed block (2), recess (3) have been seted up to the inside of PCB circuit board main part (1), the inside fixedly connected with thermal-arrest siphunculus (4) of recess (3), the front end intercommunication of thermal-arrest siphunculus (4) has pipe (5), the rear surface fixedly connected with silica gel fin (6) of pipe (5), equal fixedly connected with fan (7) in two fixed blocks (2) relative one side, two fan (7) relative one side all communicate has guide duct (8).

2. The PCB circuit board capable of dissipating heat rapidly according to claim 1, wherein: the PCB circuit board is characterized in that locking grooves (9) are formed in the positions, close to four corners, of the front surface of the PCB circuit board main body (1), and the locking grooves (9) and the PCB circuit board main body (1) are designed in an integrated mode.

3. The PCB circuit board capable of dissipating heat rapidly according to claim 1, wherein: the number of the grooves (3) is a plurality, and the grooves (3) and the PCB main body (1) are designed integrally.

4. The PCB circuit board capable of dissipating heat rapidly according to claim 1, wherein: the front end of the guide pipe (5) penetrates through the PCB main body (1) and extends to the outside of the PCB main body.

5. The PCB circuit board capable of dissipating heat rapidly according to claim 1, wherein: the rear end of the silica gel radiating fin (6) penetrates through the PCB circuit board main body (1) and extends to the outside of the PCB circuit board main body.

6. The PCB circuit board capable of dissipating heat rapidly according to claim 1, wherein: one opposite sides of the two air guide pipes (8) respectively penetrate through the two fixing blocks (2) and the PCB main body (1) and are communicated with the guide pipe (5).

7. The PCB circuit board capable of dissipating heat rapidly as claimed in claim 1, wherein: the resistor (10) is fixedly connected to the positions close to the top and the bottom of one side of the front surface of the PCB circuit board main body (1).

8. The PCB circuit board capable of dissipating heat rapidly according to claim 1, wherein: the position close to the bottom of one side of the front surface of the PCB circuit board main body (1) is fixedly connected with a capacitor (11).