CN203759586U - Industrial integrated computer mechanism with excellent heat dispersion performance - Google Patents

Industrial integrated computer mechanism with excellent heat dispersion performance Download PDF

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Publication number
CN203759586U
CN203759586U CN201320878301.5U CN201320878301U CN203759586U CN 203759586 U CN203759586 U CN 203759586U CN 201320878301 U CN201320878301 U CN 201320878301U CN 203759586 U CN203759586 U CN 203759586U
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CN
China
Prior art keywords
industrial
integral computer
heat sink
back cover
rear heat
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Expired - Fee Related
Application number
CN201320878301.5U
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Chinese (zh)
Inventor
赵景广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Million Scape Video Signal Science And Technology Ltds Of Shenzhen
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Million Scape Video Signal Science And Technology Ltds Of Shenzhen
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Priority to CN201320878301.5U priority Critical patent/CN203759586U/en
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Publication of CN203759586U publication Critical patent/CN203759586U/en
Anticipated expiration legal-status Critical
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Abstract

The utility model discloses an industrial integrated computer mechanism with excellent heat dissipation performance. The industrial integrated computer mechanism comprises a front shell, a rear shell and a middle installation clapboard which is arranged between the front shell and the rear shell, wherein the middle installation clapboard and the front shell are assembled to form a space used for containing a display screen or a touch screen; the middle installation clapboard and the rear shell are assembled to form a space used for containing a mainboard; a heat dissipation structure is arranged on the external surface of the rear shell; the heat dissipation structure comprises raised lines. According to the industrial integrated computer mechanism with the excellent heat dissipation performance, the requirements of reinforcement, protection and the like of an industrial integrated computer are met, the heat dissipation performance is excellent, the installation is flexible, the industrial integrated computer mechanism is tightly applied to and matched with an industrial computer, and is firm, reliable, attractive and practical, the cost of the system and the system integration difficulty are not greatly increased, and the industrial integrated computer mechanism with the excellent heat dissipation performance is suitable for industrial application occasions.

Description

A kind of industrial integral computer mechanism with good heat dispersion
Technical field
The utility model relates to a kind of industrial integral computer mechanism, relates in particular to a kind of industrial integral computer mechanism with good heat dispersion.
Background technology
Industry integrated computer, is applied to the integrated computer of industrial circle, and display device and main frame are integrated, and has that line is few, volume is little, the feature that integrated level is high.In industrial application, very high to the reliability requirement of computer, in many specific environments for use, as hot and humid, dust etc., all need to guarantee normal good work.Therefore, except to the good design of industrial integrated computer Circuits System reliability, structural design is also an important ring of properties of product.
Industrial occasions application, solid strong be a basic requirement.Meanwhile, the mounting means of industrial integrated computer in its application scenario is also the problem that must think better of in design.For certain applications occasion, as installed in rack etc., require integrated computer to there is the feature of the low thickness of small size.Good heat radiation is a very important ring that guarantees industrial computer reliability, in the application scenario of part fan-free, if shell does not possess the ability of auxiliary heat dissipation, will make computer performance have a greatly reduced quality even cannot to meet system normally to move needs.
Industry integrated computer construction design method is various, but according to small size integrated computer self structure feature, possess simultaneously meet strong, the requirements such as protection, be applicable to industrial occasions and install, volume is small and exquisite, and having applicable fan-free, to design the method for designing of good auxiliary heat dissipation effect uncommon.
Utility model content
The purpose of this utility model is to overcome above-mentioned deficiency, and a kind of industrial integral computer mechanism with good heat dispersion is provided.
The utility model is achieved in that a kind of industrial integral computer mechanism with good heat dispersion, comprise fore shell, back cover and the middle dress dividing plate between fore shell and back cover, in the middle of described, dress dividing plate and fore shell assembling form the space that holds display screen or touch-screen, and described middle dress dividing plate and back cover assembling form the space that holds mainboard; Described back cover outside surface is provided with radiator structure, and described cooling mechanism is raised line.
One preferred embodiment in, described raised line is hollow-core construction, the space forming with centre dress dividing plate and back cover assembling is connected.
One preferred embodiment in, described back cover is split-type structural, by rear heat sink, two be positioned at the side shield of rear heat sink both sides, the interface baffle plate that is positioned at the front apron of rear heat sink front end and is positioned at rear heat sink rear end forms.
Preferably, described rear heat sink and side shield are provided with described radiator structure.
Wherein, described interface baffle plate is provided with the required interface of various computers and port, such as data-signal transmission interface (USB interface, VGA interface etc.), PORT COM, lan interfaces etc.
In a progress preferred embodiment, the front end of two described side shields is provided with the groove of allowing that front apron inserts, and the tail end of two described side shields is provided with the groove of allowing that interface baffle plate inserts.Thereby can change front apron and interface baffle plate, with the mainboard of compatible distinct interface.
Preferably, the both sides of described side shield are respectively equipped with the screw hole for being connected with middle assemble in diaphragm with rear heat sink.
Preferably, described rear heat sink is provided with the mounting hole matching with support.
Described mounting hole is 75x75 standard VESA, and standard supporting structure on adaptive market, for stent-type mounting means.
One preferred embodiment in, described fore shell is comprised of front panel and sidewall, described front panel is provided with the window of allowing that display screen or touch-screen expose.
Preferably, described front panel and sidewall are structure as a whole.
Preferably, described fore shell is made by aluminium alloy.
The utility model provides has the industrial integral computer mechanism of good heat dispersion, in strong, the protection etc. that meets industrial integral computer, require simultaneously, excellent radiation performance, flexible for installation, coordinate closely with industrial computer application, solid and reliable, attractive in appearance and practicality, cost and the system integration difficulty that can not increase considerably system simultaneously, be suitable for industrial applications.
Accompanying drawing explanation
The front elevation of the industrial integral computer mechanism with good heat dispersion that Fig. 1 provides for the utility model;
The rear view of the industrial integral computer mechanism with good heat dispersion that Fig. 2 provides for the utility model;
Fig. 3 is the side view of rear heat sink;
The vertical view of the industrial integral computer mechanism with good heat dispersion that Fig. 4 provides for the utility model;
The upward view of the industrial integral computer mechanism with good heat dispersion that Fig. 5 provides for the utility model;
Fig. 6 is the side view of side shield.
Embodiment
With reference to the accompanying drawings, the utility model will be further described in conjunction with specific embodiments, to understand better the utility model.
With reference to Fig. 1-5, the present embodiment provides a kind of industrial integral computer mechanism with good heat dispersion, comprise fore shell 10, back cover 20 and the middle dress dividing plate 30 between fore shell 10 and back cover 20, middle dress dividing plate 30 forms with fore shell 10 assemblings the space that holds display screen or touch-screen, and middle dress dividing plate 30 forms with back cover 20 assemblings the space that holds mainboard.
Middle assemble in diaphragm 30, in order to industrial integrated computer internal components is fixed, makes computer have the feature of fastening structure, anti-vibration.
In the present embodiment, fore shell 10 is comprised of front panel 11 and sidewall 12, and front panel 11 is provided with the window 13 of allowing that display screen or touch-screen expose.
One preferred embodiment in front panel 11 and sidewall 12 be structure as a whole, by aluminium alloy, made, meet strong requirement, and process and can realize the requirement of fore shell IP65 degree of protection through simple seal, and aluminum specific heat capacity is high, radiating efficiency is high, can the CPU heat through self structure conduction be dispelled the heat.
Back cover 20 outside surfaces are provided with radiator structure 21, and cooling mechanism 21 is raised line, and radiator structure 21 has increased the external surface area of back cover 20, has increased area of dissipation, and the industrial integral computer mechanism that makes that the present embodiment provides has good heat dispersion.One preferred embodiment in, described raised line is hollow-core construction, the space forming with centre dress dividing plate and back cover assembling is connected (inside surface that is back cover 20 is provided with groove), has further increased the internal surface area of back cover 20, makes heat dispersion better.
One preferred embodiment in, back cover 20 is split-type structural, by rear heat sink 22, two be positioned at the side shield 23 of rear heat sink 22 both sides, the interface baffle plate 25 that is positioned at the front apron 24 of rear heat sink 22 front ends and is positioned at rear heat sink 22 rear ends forms.
One preferred embodiment in, rear heat sink 22 and side shield 23 are provided with radiator structure 21, as shown in Figures 2 and 3.
Wherein, interface baffle plate 25 is provided with the required interface of various computers 26, such as data-signal transmission interface (USB interface, VGA interface etc.), PORT COM, lan interfaces etc.
In a progress preferred embodiment, the front end of two side shields 23 is provided with the groove B that allows that front apron 24 inserts, and the tail end of two side shields 23 is provided with the groove B that allows that interface baffle plate 25 inserts.Thereby can change front apron 24 and interface baffle plate 25, with the mainboard of compatible distinct interface.
The both sides of side shield 23 are respectively equipped with the screw hole A for being connected with middle assemble in diaphragm 30 with rear heat sink 22.
Rear heat sink 22 is provided with the mounting hole 27 matching with support, and described mounting hole is 75x75 standard VESA, and standard supporting structure on adaptive market, for stent-type mounting means.
Above specific embodiment of the utility model be have been described in detail, but it is as example, the utility model is not restricted to specific embodiment described above.To those skilled in the art, any equivalent modifications that this practicality is carried out and alternative also all among category of the present utility model.Therefore,, not departing from the equalization conversion of doing under spirit and scope of the present utility model and revising, all should be encompassed in scope of the present utility model.

Claims (10)

1. an industrial integral computer mechanism with good heat dispersion, it is characterized in that, comprise fore shell, back cover and the middle dress dividing plate between fore shell and back cover, in the middle of described, dress dividing plate and fore shell assembling form the space that holds display screen or touch-screen, and described middle dress dividing plate and back cover assembling form the space that holds mainboard; Described back cover outside surface is provided with radiator structure, and described cooling mechanism is raised line.
2. industrial integral computer according to claim 1 mechanism, is characterized in that, described raised line is hollow-core construction, and the space forming with centre dress dividing plate and back cover assembling is connected.
3. industrial integral computer according to claim 1 mechanism, it is characterized in that, described back cover is split-type structural, by rear heat sink, two be positioned at the side shield of rear heat sink both sides, the interface baffle plate that is positioned at the front apron of rear heat sink front end and is positioned at rear heat sink rear end forms.
4. industrial integral computer according to claim 3 mechanism, is characterized in that, described rear heat sink and side shield are provided with described radiator structure.
5. industrial integral computer according to claim 4 mechanism, is characterized in that, the front end of two described side shields is provided with the groove of allowing that front apron inserts, and the tail end of two described side shields is provided with the groove of allowing that interface baffle plate inserts.
6. according to the industrial integral computer mechanism described in any one in claim 3-5, it is characterized in that, the both sides of described side shield are respectively equipped with the screw hole for being connected with middle assemble in diaphragm with rear heat sink.
7. industrial integral computer according to claim 3 mechanism, is characterized in that, described rear heat sink is provided with the mounting hole matching with support.
8. industrial integral computer according to claim 1 mechanism, is characterized in that, described fore shell is comprised of front panel and sidewall, and described front panel is provided with the window of allowing that display screen or touch-screen expose.
9. industrial integral computer according to claim 8 mechanism, is characterized in that, described front panel and sidewall are structure as a whole.
10. according to the industrial integral computer mechanism described in claim 1,8 or 9, it is characterized in that, described fore shell is made by aluminium alloy.
CN201320878301.5U 2013-12-27 2013-12-27 Industrial integrated computer mechanism with excellent heat dispersion performance Expired - Fee Related CN203759586U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320878301.5U CN203759586U (en) 2013-12-27 2013-12-27 Industrial integrated computer mechanism with excellent heat dispersion performance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320878301.5U CN203759586U (en) 2013-12-27 2013-12-27 Industrial integrated computer mechanism with excellent heat dispersion performance

Publications (1)

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CN203759586U true CN203759586U (en) 2014-08-06

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104951010A (en) * 2015-07-17 2015-09-30 成都阿普奇自动化技术有限公司 Combined industrial tablet computer
CN105940775A (en) * 2014-09-10 2016-09-14 华为技术有限公司 Heat-dissipation shielding structure and communication product
CN107505978A (en) * 2017-08-01 2017-12-22 苏州海特自动化设备有限公司 Touch-screen industrial computer with film key
CN108319396A (en) * 2018-02-08 2018-07-24 深圳市志凌伟业技术股份有限公司 A kind of touch panel with heat sinking function

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105940775A (en) * 2014-09-10 2016-09-14 华为技术有限公司 Heat-dissipation shielding structure and communication product
CN104951010A (en) * 2015-07-17 2015-09-30 成都阿普奇自动化技术有限公司 Combined industrial tablet computer
CN104951010B (en) * 2015-07-17 2019-03-08 成都阿普奇科技股份有限公司 Combined industry tablet computer
CN107505978A (en) * 2017-08-01 2017-12-22 苏州海特自动化设备有限公司 Touch-screen industrial computer with film key
CN108319396A (en) * 2018-02-08 2018-07-24 深圳市志凌伟业技术股份有限公司 A kind of touch panel with heat sinking function
CN108319396B (en) * 2018-02-08 2020-06-30 深圳市志凌伟业技术股份有限公司 Touch panel with heat dissipation function

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140806

Termination date: 20141227

EXPY Termination of patent right or utility model