CN2694493Y

CN2694493Y - Heat pipe type heat radiator

Info

Publication number: CN2694493Y
Application number: CN 200420015366
Authority: CN
Inventors: 简士哲
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2004-02-05
Filing date: 2004-02-05
Publication date: 2005-04-20
Anticipated expiration: 2014-02-05

Abstract

Disclosed is a heat pipe type heat radiator for radiating the heat generated by an electronic element. The utility model comprises a first radiator, a second radiator and a flat heat pipe, and the first radiator is provided with a base. The base is provided with a top surface and a bottom surface, and the top surface is provided with a plurality of radiating fins. One end of the heat pipe which connects with the bottom surface of the base of the first radiator and covers the whole bottom surface of the base of the first radiator is glued on one surface of the electronic element, and the surface of the electronic element is completely glued with the heat pipe. The second radiator is provided with a base and a plurality of radiating fins extendedly arranged on the base, and the other end of the heat pipe is connected with the base of the second radiator.

Description

Heat-pipe radiating apparatus

[technical field]

The utility model is about a kind of heat abstractor, is meant a kind of heat-pipe radiating apparatus that electronic component produces heat that is used for distributing especially.

[background technology]

Along with the continuous progress of integrated circuit technique and improving constantly of commercial Application demand, electronics and information industry vigorously develops rapidly, computer application is popularized, and the speed of its update is accelerated day by day, therefore, in the computer core parts---the running frequency of central processing unit is more and more higher, the high-frequency high-speed processor is constantly released, but the processor running frequency is high more, then the heat that produces in its unit interval is many more, accumulation of heat will cause that temperature raises, thereby cause the performance of its operation to comprise stability decreases, therefore, must be in time the heat of its generation be distributed, the problem of essential solution when at present, heat radiation has become each and releases for high speed processor.

For the heat that electronic components such as central processing unit are produced can distribute timely and effectively, industry is all installed auxiliary its heat radiation of a radiator at electronical elements surface.Mostly traditional radiator is to dispel the heat with the metal conduction pattern merely, it has a pedestal usually and is formed on some radiating fins on the pedestal, passing to radiating fin by pedestal absorption heat distributes again, because the heat dispersion of radiator and the pyroconductivity and the area of dissipation of metal are proportional, under the situation that the conductive coefficient of metal has limited (material is selected), for improving the performance of radiator, usually needing increases the size of radiator and its structure is made optimal design, but, merely obtain breakthrough raising with the mode of the metal conduction heat dispersion that all can't make radiator that dispels the heat regardless of its structure.Therefore, the dealer just seeks to utilize new principle to dispel the heat in the hope of significantly improving the heat-sinking capability of radiator, and heat pipe is exactly typically a kind of, and the application of heat pipe makes that the structural design of radiator is flexible and changeable, and then can obtain high heat dispersion.

Heat pipe is that temperature remains unchanged and can absorb or emit the principle work of big calorimetric when utilizing liquid to change between gas, liquid binary states.It is the liquid that an amount of heat of vaporization height of splendid attire, good fluidity, chemical property are stable in a sealing low pressure tubular shell, boiling point is lower, as water, ethanol, acetone etc., utilize this liquid to be heated and cool off and when between gas, liquid binary states, changing, absorb or emit a large amount of heat and can make heat pass to the other end rapidly by body one end.The entire length of heat pipe is broadly divided into three sections by function, and the part that relies on an end is an evaporation section, and it can contact with thermal source and absorb heat and make the hydraulic fluid vaporization that is positioned at this intersegmental part and spread to the heat pipe other end; And the part that relies on the other end is a condensation segment, is diffused into by evaporation section to be condensed into after the steam cooling of this part liquidly to reflux to evaporation section; Changeover portion between evaporation section and the condensation segment is the adiabatic section, a large amount of steams spread to condensation segment via the adiabatic section from evaporation section, thereby the heat that heat pipe evaporator section is absorbed brings to condensation segment, the liquid hydraulic fluid that condenses after the heat release refluxes to evaporation section via the adiabatic section from condensation segment along the heat pipe inwall by the absorption affinity of inboard wall of tube body capillary structure, thereby reciprocation cycle in heat pipe, hydraulic fluid absorbs heat at evaporation section, in the condensation segment heat release, thereby the heat that heat pipe one end absorbs can be passed to the other end.Because liquid circulation velocity is fast, hydraulic fluid heat of vaporization height in addition, therefore, adopting heat pipes for heat transfer speed is quite fast, and as heat pipe being regarded as a kind of metal material, its conductive coefficient is nearly 100 times of aluminium.The dealer connects a heat conducting base with heat pipe one end, and the other end is in conjunction with some radiating fins or its radiator structure of any base, thereby forms radiator, absorbs heat by pedestal, passes to radiating fin or other radiator structure further distributes again via heat pipe.Since the big quantum jump of use of heat pipe the heat radiation limit of traditional heat-dissipating device, radiating efficiency is increased substantially, the structural design of radiator is also more flexible, heat-pipe radiating apparatus obtains extensive and a large amount of application at present.

The typical heat pipe heat abstractor has a metal heat-conducting plate usually, a heat pipe one end is connected with it, the heat pipe other end is in conjunction with some radiating fins or other heat dissipation element, absorbed by heat-conducting plate that the heat transferred heat pipe passes to radiating fin again or other heat dissipation element distributes then.Therefore link position and combination is different will cause that the heat pipe heating degree is different between heat pipe and heat-conducting plate, thus heat abstractor integral heat sink performance is produced considerable influence.Heat-conducting plate normally is connected with welding manner with heat pipe, and it is to offer a groove at the heat-conducting plate upper surface mostly, and heat pipe is contained in this groove, the part outside wall surface of heat pipe contacts with heat-conducting plate, No. the 5th, 549,155, relevant patent such as No. the 440020th, Taiwan patent announcement and United States Patent (USP).

For strengthening heat by the conduction of heat-conducting plate to heat pipe, the heat that heat-conducting plate is absorbed can in time pass to heat pipe and then improve heat abstractor integral heat sink ability, can on heat-conducting plate, add a cover another heat-conducting plate, after two heat-conducting plates are superimposed heat pipe is inserted and put therebetween, or heat pipe penetrates in the heat-conducting plate, thereby can make the heat pipe perisporium absorb heat, the technology contents that No. the 437998th, concrete structure such as Taiwan patent announcement and Chinese patent disclose for No. 99243628.1.

The heat abstractor that above-mentioned patent discloses absorbs heat by heat-conducting plate and passes to heat pipe again, owing to have the interface thermal resistance between heat-conducting plate and heat pipe, it is bigger that the performance of heat abstractor is influenced by welding quality, the heat of heat-conducting plate absorption many times can not effectively pass to heat pipe, though therefore heat is in a large amount of transmission fast of heat pipe section, but be hampered by itself and the interface that contacts of heat-conducting plate, and cause actual heat pipe utilance not high, the use of opposite heat tube is a kind of waste really.

[summary of the invention]

The purpose of this utility model is to provide a kind of heat abstractor, thereby is meant that especially a kind of effective raising heat pipe utilance carries out the heat-pipe radiating apparatus of high efficiency and heat radiation to heat-generating electronic elements.

The purpose of this utility model realizes by following technical proposal:

The utility model heat-pipe radiating apparatus is in order to dispel the heat to heat-generating electronic elements, comprise a flat hot pipe and a heat dissipation element, fit in one surface of this flat hot pipe and electronic component, and electronic component should the surface and heat pipe fit fully, the heat pipe other end is connected with heat dissipation element.

The utility model heat-pipe radiating apparatus is after installation, one surface of the electronic component heat pipe of fitting fully, the heat of its generation all is directly passed to heat pipe, effectively reduce the heat that the interface thermal resistance that exists in the prior art causes and passed loss, can improve the utilance of heat pipe greatly, thereby heat abstractor integral heat sink performance gets a promotion.

[description of drawings]

With reference to the accompanying drawings, the utility model will be further described in conjunction with the embodiments.

Fig. 1 is the schematic perspective view that the utility model heat-pipe radiating apparatus contacts with central processing unit.

Fig. 2 is along the generalized section of II-II direction among Fig. 1.

Fig. 3 is the upward view of Fig. 1.

[embodiment]

See also Fig. 1 and Fig. 2, the utility model heat-pipe radiating apparatus is in order to be installed in auxiliary its heat radiation such as surface such as central processing unit 50 heat-generating electronic elements such as grade, and it comprises a flat hot pipe 10, first radiator 20 and second radiator 30.

This flat hot pipe 10 is elongated tabular, and the one end is an evaporation section 12, and the other end of evaporation section 12 is a condensation segment 16 relatively, and the part between evaporation section 12 and condensation segment 16 then is adiabatic section 14.

This first radiator 20 has a plate-shaped base 22, and this pedestal 22 has an end face 221 and a bottom surface 222, and its end face 221 upwards extends most radiating fins 24.

This second radiator 30 has a plate-shaped base 32, and the upper surface of this pedestal 32 has extended several dissipation fins 34.

The bottom surface 222 of the upper surface of the evaporation section 12 of this flat hot pipe 10 and first radiator, 20 pedestals 22 is welded to connect and covers the whole bottom surface 222 of this pedestal 22, heat pipe 10 condensation segments 16 connect the pedestal 32 of second radiator 30, it can be positioned at pedestal 32 bottom surfaces or end face, also can penetrate in the pedestal 32.Heat pipe 10 penetrates in second radiator, 30 pedestals 32 in the present embodiment.See also Fig. 3, when this heat-pipe radiating apparatus is installed on the central processing unit 50 at first radiator 20, heat pipe 10 evaporation sections 12 equate with the area of central processing unit 50 upper surfaces with the area that the upper surface of central processing unit 50 is fitted and fitted, be complete and heat pipe 10 applyings of upper surface of central processing unit 50, second radiator 30 that is connected with heat pipe 10 condensation segments 16 can be installed in the computer system position of other any easy for installation and sharp what heat radiation, and heat pipe 10 then can be done corresponding bending.

Above-mentioned second radiator, 30 structures do not limit, and can only be some radiating fin or other radiator structures that are combined in heat pipe 10 condensation segments 16 yet.In addition, first radiator 20 also can adopt alternate manner to be connected with heat pipe 10, as mechanical presses or one-body molded etc.

The utility model heat-pipe radiating apparatus is owing to the upper surface of central processing unit 50 evaporation section 12 complete and heat pipe 10 fits, therefore the heat of central processing unit 50 generations all is directly passed to heat pipe 10, and heat passes to heat pipe because the heat delivered loss that the interface thermal resistance causes via heat-conducting plate in the prior art thereby effectively overcome.The heat part that heat pipe 10 absorbs directly upwards passes to first radiator 20 and distributes, and another part heat passes to second radiator 30 by heat pipe 10 and then distributes.

Claims

1. heat-pipe radiating apparatus, in order to the heat-generating electronic elements heat radiation, comprise a flat hot pipe and a heat dissipation element, an end of this heat pipe links to each other with heat dissipation element, fitting in one surface of the other end and electronic component, it is characterized in that: the complete and heat pipe applying in the above-mentioned surface of electronic component.

2. heat-pipe radiating apparatus according to claim 1, it is characterized in that: the end that described heat pipe and electronic component are fitted is connected with a radiator, this radiator has a pedestal and is arranged on several dissipation fins on the pedestal, and heat pipe promptly links to each other with the radiator base bottom.

3. heat-pipe radiating apparatus according to claim 2 is characterized in that: described heat pipe covers the bottom surface of this radiator base.

4. heat-pipe radiating apparatus according to claim 1 is characterized in that: described heat dissipation element comprises a pedestal and is arranged on several dissipation fins on the pedestal.

5. heat-pipe radiating apparatus according to claim 4 is characterized in that: described heat pipe is connected with the pedestal of this heat dissipation element.