CN101078949A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN101078949A CN101078949A CN 200610060761 CN200610060761A CN101078949A CN 101078949 A CN101078949 A CN 101078949A CN 200610060761 CN200610060761 CN 200610060761 CN 200610060761 A CN200610060761 A CN 200610060761A CN 101078949 A CN101078949 A CN 101078949A
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- CN
- China
- Prior art keywords
- radiating fin
- heat
- heat abstractor
- radiating
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a dissipating heat device, which is characterized by the following: comprising a base and several radiating fin with radial arrangement on the top of the base; forming gas flow passage during adjacent radiating fin; setting the radiating fin as heat-sink device and radiating section; connecting the heat-sink device to the base; connecting the radiating section to the heat-sink device; displaying wavy of the radiating section; comprising several peak section and wave bottom section with alternative distribution. This invention can increase fin efficiency.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly a kind of heat radiator of electronic element.
Background technology
When moving, can produce a large amount of heats such as computer cpu, north bridge chips, the contour power electronic element of video card,, will directly cause temperature sharply to rise, and seriously hamper the normal operation of electronic component if these heats can not be left effectively.For this reason, need heat abstractor to come these electronic components are dispelled the heat, traditional heat abstractor generally includes pedestal and some radiating fins that is arranged in the pedestal top; Wherein, pedestal is used for absorbing the heat that electronic component discharges, and radiating fin is used to increase the contact area with air.In operational process, pedestal contacts with electronic component, and absorbs the heat that electronic component discharges, and then heat is conducted to radiating fin, by radiating fin heat is dispersed in the surrounding air.
Above-mentioned heat abstractor can not be that very high electronic component dispels the heat for some thermal values preferably.Yet along with development of electronic technology, the travelling speed of above-mentioned electronic component is more and more faster, and its heat that produces when operation is also more and more, and it is not enough that the heat dispersion of above-mentioned heat abstractor more and more seems.
Summary of the invention
In view of this, be necessary the heat abstractor that provides a kind of radiating efficiency high.
A kind of heat abstractor, comprise a pedestal and some being spaced in the radiating fin at this pedestal top, form gas channel between adjacent radiating fin, described radiating fin comprises an endothermic section that links to each other with described pedestal and a radiating part that links to each other with this endothermic section, described radiating part is wavy, and comprises some alternatively distributed crest portions and trough portion.
Above-mentioned wavy radiating part can increase area of dissipation effectively under the certain situation of radiating fin height and spacing, thereby can improve radiating efficiency.
The invention will be further described below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is the constitutional diagram of heat abstractor in the one embodiment of the invention.
Fig. 2 is the exploded view of heat abstractor shown in Figure 1.
Fig. 3 is the partial exploded view of radiating fin shown in Figure 2.
Fig. 4 is the constitutional diagram of heat abstractor in another embodiment of the present invention.
Fig. 5 is the side view of radiating fin shown in Figure 4.
Embodiment
Fig. 1 to Fig. 3 shows the heat abstractor 1 in the one embodiment of the invention, and it is particularly suitable for dispelling the heat for electronic component (such as the contour power electronic element of computer cpu, north bridge chips and video card).As shown in Figure 1, heat abstractor 1 mainly comprises a heat conducting base 10 and some radiating fins 20 that is erected on this pedestal 10.Heat conducting base 10 is used to absorb the heat that electronic component produces, and with heat transferred radiating fin 20, by radiating fin 20 heat is distributed in the surrounding air, thereby realizes the heat radiation of electronic component.In the present embodiment, be to improve radiating efficiency, also utilize two heat pipes 31,32 to link to each other away from pedestal 10 places, so that heat distributes on radiating fin 20 is more even on pedestal 10 and the radiating fin 20; In addition, also the sidepiece at radiating fin 20 is provided with a fan 40 by a fan Fixture 50, to quicken flowing of air.
As shown in Figure 2, pedestal 10 is rectangular substantially, and it adopts the good materials of heat conductivility such as copper, aluminium to make.Respectively extend in four corners of pedestal 10 registration arm 11, to cooperate with fastener (not shown), heat abstractor 1 is fastened to the circuit board that heat-generating electronic elements is installed (not shown).The end face of pedestal 10 offers the groove 12,13 that two sides from pedestal 10 extend to relative opposite side in the medium position parallel interval, is used for the endothermic section 311,321 of ccontaining heat pipe 31,32 respectively.The profile of the shape of groove 12,13 and heat pipe 31,32 adapts, because the heat pipe 30,32 in the present embodiment is tubular, so groove 12,13 is curved.The bottom surface of pedestal 10 is used for contacting with electronic component, to absorb the heat that electronic component produces; In use, an amount of heat-conducting medium (for example, heat-conducting glue) also is set usually, with the bottom surface of raising pedestal 10 and the temperature conductivity between the electronic component between the bottom surface of pedestal 10 and the electronic component.The above-mentioned two opposite sides of pedestal 10 also are respectively equipped with a screw 14, are connected with fan Fixture 50 to cooperate with a screw (not shown).
Together with reference to Fig. 3, radiating fin 20 also adopts the good materials of heat conductivility such as copper, aluminium to make, radiating fin 20 with root edge in conjunction with (for example, welding or bonding) in the end face of pedestal 10, and parallel interval is arranged.Be formed with between the adjacent radiating fin 20 with fan 40 over against gas channel 21.Each radiating fin 20 includes an endothermic section 22 that combines with pedestal 10 end faces and a radiating part 23 vertical with endothermic section 22, and endothermic section 22 is made of the flanging of radiating fin 20 root edges, and radiating part 23 is wavy plate body structure.The groove 12,13 of corresponding pedestal 10 end faces of the root edge of radiating fin 20 is provided with groove 24,25, and groove 24,25 cooperates with groove 12,13 respectively, and formation is the containing hole (not label) that places of the endothermic section 311,321 of heating tube 31,32 respectively.Also offer the containing hole 233,234 that the heat unit 313,314 of heating tube 31,32 respectively places away from pedestal 10 places (for example, radiating part 23 middle parts or near upper edge) on the radiating part 23.Radiating fin 20 apical margins also offer a draw-in groove 26 that cooperates with fan Fixture 50 near fan 40 places.
Again as shown in Figure 3, the radiating part 23 of radiating fin 20 includes some alternatively distributed crest portions 231 and trough portion 232, and crest portion 231 is all parallel with pedestal 10 with trough portion 232, and its end surface shape all is trapezoidal substantially.The 231a of crest portion of the radiating part 23a of each radiating fin 20a and the 232a of trough portion 231b of crest portion and the 232b of trough portion with adjacent radiating fin 20b respectively are corresponding.In the present embodiment, the radiating part 23 of radiating fin 20 is wavy setting, can under the situation of height that does not increase radiating fin 20 and spacing, increase area of dissipation on the one hand, the turbulent effect in the air flow process can be increased on the other hand, thereby the radiating efficiency of this heat abstractor 1 can be improved.
Fan Fixture 50 comprises that one is used for fixing the body 51 and an inverted U-shaped framework 52 of extending from the edge of body 51 of fan 40, the top of framework 52 is extended a fixture block 53 corresponding with the draw-in groove 26 of radiating fin 20 respectively downwards near two ends places, and the bottom offers the perforation 54 corresponding with the screw 14 of pedestal 10.Four corners of fan 40 are respectively equipped with a through hole 41, pass to supply screw (not shown) respectively, fan 40 are fixed on the body 51 of fan Fixture 50, and body 51 is provided with the screw corresponding with through hole 41 (figure does not show).
During assembling, at first with radiating fin 20 in conjunction with (for example, welding) in the end face of pedestal 10, and make the groove 24,25 of radiating fin 20 root edges corresponding, the formation containing hole with the groove 12,13 of pedestal 10 end faces.Then, the endothermic section 311 and the heat unit 313 of heat pipe 31 are inserted containing hole and the containing hole 233 that is formed by groove 24 and groove 12 respectively, the endothermic section 311 and the heat unit 313 of heat pipe 32 are inserted respectively in the containing hole and containing hole 234 that is formed by groove 25 and groove 13.Again fan Fixture 50 is fastened on the sidepiece of radiating fin 20, makes the fixture block 53 at fan Fixture 50 tops snap in the draw-in groove 26 at radiating fin 20 tops, and pass the sidepiece that pedestal 10 is fixed in the bottom of fan Fixture 50 in perforation 54 by screw.At last, fan 40 is installed on the fan Fixture 50, promptly finishes assembling.Be understandable that radiating fin 20 can be assembled in aggregates in advance, to improve packaging efficiency.
Fig. 4 and Fig. 5 show the heat abstractor 2 in another embodiment of the present invention, and the similar of the heat abstractor 1 among itself and the last embodiment comprises mainly that also pedestal 10 and some parallel interval are arranged in the radiating fin 60 at pedestal 10 tops.Be to improve radiating efficiency, also link to each other away from the pedestal place on pedestal 10 and the radiating fin 60, and by fan Fixture 50 fan 40 is set at the sidepiece of radiating fin 60 by heat pipe 31,32.
Heat abstractor 2 is that radiating fin 60 comprises two symmetrical groups radiating fin 60a, 60b with the difference of heat abstractor 1; Radiating fin 60a comprises endothermic section 62a and heat unit 63a, heat unit 63a comprises the 631a of crest portion and the 632a of trough portion of some arranged alternate, and the 631a of crest portion of each radiating fin 60a and the 632a of trough portion 631a of crest portion and the 632a of trough portion with adjacent radiating fin 60a respectively are corresponding; Radiating fin 60b comprises endothermic section 62b and heat unit 63b, heat unit 63b comprises the 631b of crest portion and the 632b of trough portion of some arranged alternate, and the 631b of crest portion of each radiating fin 60b and the 632b of trough portion 631b of crest portion and the 632b of trough portion with adjacent radiating fin 60b respectively are corresponding; The 631a of crest portion of radiating fin 60a and the 632a of trough portion 632b of trough portion and the 631b of crest portion with radiating fin 60b respectively are corresponding.This kind setting can effectively be utilized the blast around the fan 40, thereby improves radiating efficiency.
Claims (10)
1. heat abstractor, comprise a pedestal and some being spaced in the radiating fin at this pedestal top, form gas channel between adjacent radiating fin, it is characterized in that: described radiating fin comprises an endothermic section that links to each other with described pedestal and a radiating part that links to each other with this endothermic section, described radiating part is wavy, and comprises some alternatively distributed crest portions and trough portion.
2. heat abstractor as claimed in claim 1 is characterized in that: the crest portion of each radiating fin and trough portion are corresponding with the crest portion and the trough portion of adjacent radiating fin respectively.
3. heat abstractor as claimed in claim 1 is characterized in that: described radiating fin comprises two groups of radiating fins, and the crest portion of radiating fin and trough portion are corresponding with the crest portion and the trough portion of adjacent radiating fin on the same group respectively in each group radiating fin.
4. heat abstractor as claimed in claim 3 is characterized in that: in described two groups of radiating fins, the crest portion of one group of radiating fin and trough portion are corresponding with the trough portion and the crest portion of another group radiating fin respectively.
5. heat abstractor as claimed in claim 4 is characterized in that: described two groups of radiating fins are symmetrical expression and arrange.
6. heat abstractor as claimed in claim 1 is characterized in that: further comprise at least one heat pipe, an end of this at least one heat pipe links to each other with described pedestal, and the other end is connected on the described radiating fin away from described pedestal place.
7. heat abstractor as claimed in claim 1 is characterized in that: further comprise a fan, this fan is fixed in a side of described radiating fin by a fan Fixture, and over against described gas channel.
8. heat abstractor as claimed in claim 7 is characterized in that: described fan Fixture comprises that a body and is from the extended framework of this body; The top of described framework is incorporated on the described radiating fin, and the bottom is incorporated on the described pedestal.
9. heat abstractor as claimed in claim 8 is characterized in that: the top of described framework is extended one downwards and is snapped in described radiating fin top fixture block, and the top of described radiating fin is provided with the draw-in groove corresponding with described fixture block.
10. heat abstractor as claimed in claim 8 or 9, it is characterized in that: described framework is inverted U-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610060761A CN101078949B (en) | 2006-05-24 | 2006-05-24 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610060761A CN101078949B (en) | 2006-05-24 | 2006-05-24 | Radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101078949A true CN101078949A (en) | 2007-11-28 |
| CN101078949B CN101078949B (en) | 2010-05-12 |
Family
ID=38906445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610060761A Expired - Fee Related CN101078949B (en) | 2006-05-24 | 2006-05-24 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101078949B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609060A (en) * | 2011-01-19 | 2012-07-25 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN103950282A (en) * | 2014-05-12 | 2014-07-30 | 谢娟 | Embossing roll heat dissipation device of embossing machine |
| CN105101752A (en) * | 2015-08-10 | 2015-11-25 | 深圳市萨伏特电池电源有限公司 | Charger heat dissipation device |
| CN113251846A (en) * | 2021-06-01 | 2021-08-13 | 中国石化集团胜利石油管理局有限公司胜利发电厂 | Thermal power generating unit heat recovery device |
| CN116185155A (en) * | 2023-04-21 | 2023-05-30 | 荣耀终端有限公司 | Heat dissipation system and electronic equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2519322Y (en) * | 2001-12-03 | 2002-10-30 | 英业达股份有限公司 | Heat radiator |
| KR20040052425A (en) * | 2002-12-17 | 2004-06-23 | 김태형 | Cpu cooler |
| TWI267337B (en) * | 2003-05-14 | 2006-11-21 | Inventor Prec Co Ltd | Heat sink |
| CN2682474Y (en) * | 2003-12-15 | 2005-03-02 | 智翎股份有限公司 | Cooling fin set |
| CN2770091Y (en) * | 2004-12-24 | 2006-04-05 | 富准精密工业(深圳)有限公司 | Radiator |
-
2006
- 2006-05-24 CN CN200610060761A patent/CN101078949B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102609060A (en) * | 2011-01-19 | 2012-07-25 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN103950282A (en) * | 2014-05-12 | 2014-07-30 | 谢娟 | Embossing roll heat dissipation device of embossing machine |
| CN105101752A (en) * | 2015-08-10 | 2015-11-25 | 深圳市萨伏特电池电源有限公司 | Charger heat dissipation device |
| CN113251846A (en) * | 2021-06-01 | 2021-08-13 | 中国石化集团胜利石油管理局有限公司胜利发电厂 | Thermal power generating unit heat recovery device |
| CN113251846B (en) * | 2021-06-01 | 2021-09-10 | 中国石化集团胜利石油管理局有限公司胜利发电厂 | Thermal power generating unit heat recovery device |
| CN116185155A (en) * | 2023-04-21 | 2023-05-30 | 荣耀终端有限公司 | Heat dissipation system and electronic equipment |
| CN116185155B (en) * | 2023-04-21 | 2023-09-01 | 荣耀终端有限公司 | Heat dissipation system and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101078949B (en) | 2010-05-12 |
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| C06 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20140524 |