CN1842265A - Heat pipe radiator - Google Patents
Heat pipe radiator Download PDFInfo
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- CN1842265A CN1842265A CN 200510033998 CN200510033998A CN1842265A CN 1842265 A CN1842265 A CN 1842265A CN 200510033998 CN200510033998 CN 200510033998 CN 200510033998 A CN200510033998 A CN 200510033998A CN 1842265 A CN1842265 A CN 1842265A
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- heat
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a heat pipe heat abstractor which comprises a heating radiator and at least one heat pipe, wherein the heating radiator comprises a base which can touch the electric unit and a dissipating heat finned group positioned on the base; the heating radiator also comprises a cover plate which is touched with the dissipating heat finned group; one side of the dissipating heat finned group forms a groove; the two ends of the heat pipe is touched with the base and the cover plate; the middle part is touched with the groove rim of the dissipating heat finned group.
Description
[technical field]
The present invention relates to a kind of heat abstractor, particularly a kind of heat-pipe radiating apparatus that is used for cooling electronic components.
[background technology]
Along with the constantly development of electronic information industry, electronic component (especially central processing unit) running frequency and speed are in continuous lifting.But the heat that high-frequency high-speed will make electronic component produce increases thereupon, makes its temperature constantly raise, and the performance when the electronic component operation in serious threat can normally be moved for guaranteeing electronic component, must in time discharge a large amount of heats that electronic component produced.
For this reason, industry uses heat abstractor that electronic component is carried out auxiliary heat dissipation, and existing heat abstractor comprises a base and the some radiating fins that are located on the base, and this base end face is level and smooth entity metal, is for being sticked on the central processing unit surface.And along with the central processing unit volume is more and more littler, its heating is also more concentrated, because of being confined to the heat transfer property of metal, the heat of base center is often too concentrated, and can't be delivered on the radiating fin fast and then distribute, thereby have a strong impact on the integral heat sink effect, make the decreased performance of central processing unit, error rate increases, even burns.
For overcoming the problems referred to above, industry adopts the heat abstractor of heat pipe conduction heat increasing, heat pipe is that capillary structure thing (as powder sintered thing, groove structure, screen net structure etc.) is set in the metal body, and the sealing hydraulic fluid (as water, alcohol etc.) of packing into, be evacuated to vacuum state then, rely on carry out liquid gas two phase change after hydraulic fluid is heated and absorb, release heat because Heat Transfer of Heat Pipe on Heat Pipe non-directional and certain length is arranged, can be with heat transferred to than far-end.No. the 532758th, TaiWan, China patent announcement discloses a kind of heat radiator of electronic element that uses heat pipe, and it comprises a pedestal, be arranged at the heat pipe that some radiating fins and two on the pedestal roughly are " コ " shape.This base bottom surface and electronical elements surface are fitted, and the ora terminalis correspondence is offered two pairs of semi-circular recesses under this pedestal upper surface and the radiating fin, and each heat pipe one end is binded by heat-conducting glue or is welded in the above-mentioned groove.These radiating fins are offered perforation away from the appropriate location of pedestal, for being sheathed on heat pipe the other end.The heat transferred that electronic component produces is to pedestal, then by heat pipe with heat transferred to the radiating fin on top, by radiating fin heat is dispersed in the surrounding air at last, reach the purpose of cooling electronic components.But, because of heat pipe upper end and radiating fin contact area little, the heat that conducts to radiating fin top is less relatively, can not make full use of the position, top of radiating fin, give full play to far away, the fast performance of conducting heat of Heat Transfer of Heat Pipe on Heat Pipe, this kind situation radiating fin vertically and horizontal size more obvious when big.
[summary of the invention]
The heat-pipe radiating apparatus that provides a kind of radiating efficiency high is provided the object of the invention.
The present invention seeks to be achieved through the following technical solutions:
Heat-pipe radiating apparatus of the present invention comprises a radiator and at least one heat pipe, this radiator comprises that one can and be arranged on radiating fin group on the pedestal with the electronic component substrate contacted, above-mentioned radiator also comprises a cover plate, this cover plate and radiating fin set of contact, above-mentioned radiating fin group one side forms a groove, these heat pipe two ends contact with pedestal, cover plate, the recess edge thermo-contact of middle part and radiating fin group.
The present invention compares with prior art has following advantage: the heat part that pedestal absorbs is upwards transmitted along the radiating fin group, a part is passed to cover plate rapidly by heat pipe, heat is transmitted in the path to radiating fin along the radiator two ends, the heat pipe that is clipped in simultaneously in the radiating fin group groove transmits at the path to the radiator two ends heat along the centre, two paths are evenly distributed on heat on the radiating fin, favourable quick heat radiating, Heat Transfer of Heat Pipe on Heat Pipe is far away, the fast performance of conducting heat is not fully exerted, and heat pipe and groove fully contact between effective increase heat pipe and radiating fin and contact area, not only improve the utilance of heat pipe, heat abstractor integral heat sink efficient also improves.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is the three-dimensional combination figure of heat-pipe radiating apparatus of the present invention.
Fig. 2 is the three-dimensional exploded view of heat-pipe radiating apparatus of the present invention.
Fig. 3 is the part assembled state figure of heat-pipe radiating apparatus of the present invention.
Fig. 4 is a heat-pipe radiating apparatus heat-transfer path schematic diagram of the present invention.
[embodiment]
See also Fig. 1, heat-pipe radiating apparatus of the present invention is to be used for being installed on the central processing unit heat-generating electronic elements such as (figure do not show) it is dispelled the heat.This heat-pipe radiating apparatus comprises a radiator 10, with the heat pipe 20 of radiator 10 bottoms, middle part and upper bond and be installed in the fan structure 30 of radiator 10 1 sides.
Shown in Fig. 2-3, the radiating fin group 14 and that above-mentioned radiator 10 comprises a pedestal 12, be arranged at pedestal 12 upper surfaces is clipped in cover plate 16 between itself and the pedestal 12 with radiating fin group 14.These pedestal 12 lower surfaces and central processing unit surface fit, and its upper surface is offered semicircle tubular first groove 120 of pair of parallel, and the opposite side that pedestal 12 is vertical with first groove 120 is offered pair of apertures 122.Above-mentioned cover plate 16 lower surfaces are offered semicircle tubular second groove 160 of pair of parallel, and the opposite side that cover plate 16 is vertical with second groove 160 is offered pair of apertures 162.This radiating fin group 14 comprises that some lateral margins have the radiating fin 140 (as shown in Figure 3) of a breach, and this radiating fin 140 is superimposed with each other and forms radiating fin group 14.The vertical in the same way respectively bending of each radiating fin 140 upper/lower terminal extends to form flanging 142, and flanging 142 forms a plane continuously.The indentation, there of each radiating fin 140 vertically bends in the same way and extends to form flanging 143, and flanging 143 forms inner concaves continuously.Wherein the plane that is formed by flanging 142 fits with the lower surface of pedestal 12 upper surfaces and cover plate 16 respectively, and first groove 120 of corresponding pedestal 12 is provided with semicircle tubular first recess, 144, the first grooves 120 and first recess, the 144 common first cylindric internal channels 44 that form on this plane.Second groove 160 of corresponding cover plate 16 is provided with semicircle tubular second recess, 146, the second grooves 160 and second recess, the 146 common second cylindric internal channels 46 that form on this plane.The inner concave that above-mentioned flanging 143 forms continuously forms groove 148 in radiating fin group 14 1 sides, this groove 148 comprises first groove 1480 and the second steeper groove 1482 of the gradient that a gradient is slow.
Above-mentioned heat pipe 20 comprises a S shape heat pipe 22 and one " ㄈ " font heat pipe 24, and this S shape heat pipe 22 is bent to form first horizontal segment 220, second horizontal segment 222 and the 3rd horizontal segment 224 continuously, thereby heat pipe 22 is whole S-shaped.First horizontal segment 220 of heat pipe 22 and the 3rd horizontal segment 224 can be by heat-conducting glue mode such as bonding or tin cream welding fit in respectively in above-mentioned first groove 120, second groove 160, and second horizontal segment 222 of heat pipe 22 can be fastened in the above-mentioned groove 148 by modes such as tin cream welding or interference fit.Wherein the bending part between first horizontal segment 220 and second horizontal segment 222 drops on first groove, 1480 places, and second horizontal segment 222 is clipped in second groove 1482, and fits tightly with its inner concave, increases the contact area between heat pipe 22 and the fin 140.Above-mentioned " ㄈ " font heat pipe 24 comprises an evaporation section 240 and a condensation segment 244.The evaporation section 240 of heat pipe 24 and condensation segment 244 also can be by heat-conducting glue first groove 120 that is arranged side by side with first horizontal segment 220 of placing S shape heat pipe 22 respectively of mode such as bonding or tin cream welding, second groove 160 that the 3rd horizontal segment 224 is arranged side by side engage.
Fan structure 30 comprises a fan 32 and a fan Fixture 34, this fan Fixture 34 is a quadra, this framework one opposite side vertically bends in the same way and extends to form a conduplication side 340,340 liang of ends of every flanging are provided with and above-mentioned aperture 122,162 corresponding holes 342, screw passes hole 342 in turn, aperture 122,162 is fixed on fan Fixture 34 on the radiator 10, so that provide cold wind, strengthen the radiating efficiency of radiator 10 to it.
The heat-transfer path of heat-pipe radiating apparatus of the present invention as shown in Figure 4, during central processing unit work, the heat transferred that produces is to the pedestal 12 of radiator 10, part heat directly upwards is passed to radiating fin group 14 by pedestal 12, simultaneously another part heat makes working fluid in the heat pipe 20 at first horizontal segment 220, evaporation section 240 is subjected to thermal evaporation, at second horizontal segment 222, the 3rd horizontal segment 224 and condensation segment 244 are condensed, make the heat of radiator 10 bottoms can conduct to its middle part and top fast, be evenly distributed in the radiating fin 140, improve the thermal convection speed of radiator 10 and surrounding air again by fan 32, strengthen the integral heat sink efficient of heat-pipe radiating apparatus.
Heat-pipe radiating apparatus of the present invention in the above-described embodiments, heat pipe 20 is cylindric, heat-pipe radiating apparatus of the present invention also can use S shape plate shaped heat pipe, and at this moment, the square tubular passage of first, second passage 44,46 relative formation that is installed with heat pipe 20 on radiating fin group 14 and pedestal 12 and the cover plate 16 gets final product.
In the foregoing description, radiator 10 has a pedestal 12, and this pedestal 12 mainly is to absorb the heat that central processing unit produces, then respectively with bottom and the heat pipe 20 of heat transferred to radiating fin group 14.S shape heat pipe 22 comprises first horizontal segment 220, second horizontal segment 222 and the 3rd horizontal segment 224 that is bent to form continuously.Be appreciated that ground, the heat pipe of heat-pipe radiating apparatus of the present invention can also be according to actual radiating requirements, form three above horizontal segments such as the 4th, the 5th through continuous bending, some horizontal segments that this moment, radiator 10 correspondences were positioned at mid portion are provided with the some grooves that insert and put above-mentioned horizontal segment.
Claims (8)
1. heat-pipe radiating apparatus, comprise a radiator and at least one heat pipe, this radiator comprises that one can and be arranged on radiating fin group on the pedestal with the electronic component substrate contacted, it is characterized in that: above-mentioned radiator also comprises a cover plate, this cover plate and radiating fin set of contact, above-mentioned radiating fin group one side forms a groove, and these heat pipe two ends contact with pedestal, cover plate, the recess edge thermo-contact of middle part and radiating fin group.
2. heat-pipe radiating apparatus as claimed in claim 1, it is characterized in that: above-mentioned heat pipe is the S font, this heat pipe comprises first horizontal segment, second horizontal segment and the 3rd horizontal segment, first horizontal segment of this heat pipe, the 3rd horizontal segment respectively with pedestal, cover plate is hot engages, this second horizontal segment is folded in the groove.
3. heat-pipe radiating apparatus as claimed in claim 2 is characterized in that: it further comprises " ㄈ " font heat pipe that two ends are connected with pedestal, cover plate respectively.
4. heat-pipe radiating apparatus as claimed in claim 2, it is characterized in that: above-mentioned radiating fin group comprises some radiating fins of overlapped combination, one lateral margin of each radiating fin is provided with a breach, and above-mentioned breach forms above-mentioned groove in radiating fin group one side.
5. heat-pipe radiating apparatus as claimed in claim 4 is characterized in that: above-mentioned groove comprises near S font heat pipe second horizontal segment bending place and steep second groove that first groove reaches and S font heat pipe second horizontal segment is close to, the gradient is slow of the gradient.
6. heat-pipe radiating apparatus as claimed in claim 4, it is characterized in that: lower limb is respectively equipped with the groove of ccontaining heat pipe on the above-mentioned radiating fin group, above-mentioned cover plate, pedestal respective grooves are respectively equipped with recess, and this recess forms the passage of ccontaining heat pipe respectively with corresponding groove.
7. heat-pipe radiating apparatus as claimed in claim 4 is characterized in that: above-mentioned radiator is provided with a fan structure at the opposite side relative with having groove one side.
8. heat-pipe radiating apparatus as claimed in claim 7 is characterized in that: the said fans structure comprises a fan and a fan Fixture, and this fan Fixture cooperates with cover plate, pedestal respectively fan is fixed on the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510033998A CN1842265B (en) | 2005-04-03 | 2005-04-03 | Heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510033998A CN1842265B (en) | 2005-04-03 | 2005-04-03 | Heat pipe radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1842265A true CN1842265A (en) | 2006-10-04 |
| CN1842265B CN1842265B (en) | 2010-05-12 |
Family
ID=37031060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510033998A Expired - Fee Related CN1842265B (en) | 2005-04-03 | 2005-04-03 | Heat pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1842265B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188921B (en) * | 2006-11-15 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101610656B (en) * | 2008-06-18 | 2011-11-30 | 富准精密工业(深圳)有限公司 | Heat sink and assembly method thereof |
| CN101316495B (en) * | 2007-06-01 | 2011-12-21 | 富准精密工业(深圳)有限公司 | Heat sink assembly |
| CN101448381B (en) * | 2007-11-27 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN102958320A (en) * | 2011-08-22 | 2013-03-06 | 富瑞精密组件（昆山）有限公司 | Radiator |
| CN112790705A (en) * | 2019-11-14 | 2021-05-14 | 宁波方太厨具有限公司 | Cleaning machine with drying function and cleaning method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2497431Y (en) * | 2001-09-11 | 2002-06-26 | 泰硕电子股份有限公司 | Moulded radiating apparatus |
| US6785140B2 (en) * | 2002-08-28 | 2004-08-31 | Dell Products L.P. | Multiple heat pipe heat sink |
-
2005
- 2005-04-03 CN CN200510033998A patent/CN1842265B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101188921B (en) * | 2006-11-15 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN101316495B (en) * | 2007-06-01 | 2011-12-21 | 富准精密工业(深圳)有限公司 | Heat sink assembly |
| CN101448381B (en) * | 2007-11-27 | 2012-05-16 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN101610656B (en) * | 2008-06-18 | 2011-11-30 | 富准精密工业(深圳)有限公司 | Heat sink and assembly method thereof |
| CN102958320A (en) * | 2011-08-22 | 2013-03-06 | 富瑞精密组件（昆山）有限公司 | Radiator |
| CN102958320B (en) * | 2011-08-22 | 2017-09-08 | 富瑞精密组件（昆山）有限公司 | Heat abstractor |
| CN112790705A (en) * | 2019-11-14 | 2021-05-14 | 宁波方太厨具有限公司 | Cleaning machine with drying function and cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1842265B (en) | 2010-05-12 |
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Granted publication date: 20100512 Termination date: 20150403 |
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