CN1925734A - Heat pipe radiator - Google Patents

Abstract

A heat pipe cooling device, comprising a bottom plate and a plurality of cooling fins arranged on the bottom plate, a groove is formed on one surface of the bottom plate, at least two heat pipes are embedded in the groove, and each heat pipe is bent to have a first heat transfer section and a Both ends of the first heat transfer section bend and extend in the same direction as the second heat transfer section, and the second heat transfer sections of the two heat pipes are parallel to each other. The first heat transfer section and the second heat transfer section of the two heat pipes are distributed on the bottom plate, which can quickly and evenly distribute the heat generated by the electronic components to the entire bottom plate. There is a big improvement.

Description

heat pipe radiator

【Technical field】

The invention relates to a heat dissipation device, in particular to a heat pipe heat dissipation device for cooling electronic components.

【Background technique】

Electronic components (such as central processing unit) generate a lot of heat during operation, which increases the temperature of itself and the system, which in turn leads to a decrease in its operating performance. In order to ensure the normal operation of electronic components, heat sinks are usually installed on the electronic components to dissipate the large amount of heat generated by them.

A traditional heat sink generally includes a base plate in contact with electronic components and a plurality of cooling fins arranged on the base plate. The heat generated by the operation of the electronic components is absorbed by the bottom plate, and then dissipated to the surrounding environment through the heat sink to cool the electronic components. However, usually only a part of the bottom plate, generally the central part of the bottom plate, is in direct contact with the electronic components and absorbs heat, so that the temperature of the central part of the bottom plate is too high, while the temperature of other areas on the bottom plate is relatively low. As a result, the heat sink located in the area away from the center of the bottom plate cannot fully absorb and dissipate heat, and the performance of the heat sink needs to be further improved.

【Content of invention】

The present invention is illustrated by the following examples.

The heat pipe cooling device according to the embodiment of the present invention comprises a bottom plate and a plurality of cooling fins arranged on the bottom plate, a groove is formed on one surface of the bottom plate, and at least two heat pipes are embedded in the groove, wherein each heat pipe is bent to have a first heat transfer A section and a second heat transfer section bent and extended from both ends of the first heat transfer section in the same direction, and the second heat transfer sections of the two heat pipes are parallel to each other.

Compared with the prior art, this embodiment has the following advantages: the first heat transfer section and the second heat transfer section of the two heat pipes are distributed on the bottom plate, which can quickly and evenly distribute the heat generated by the electronic components to the entire bottom plate, so Compared with the traditional heat dissipation device, the heat pipe heat dissipation device of the present invention has greatly improved performance.

The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

【Description of drawings】

FIG. 1 is a perspective view of an embodiment of a heat pipe cooling device of the present invention.

Fig. 2 is an exploded view of the heat pipe cooling device in Fig. 1 .

FIG. 3 is a perspective view of the hidden heat sink group in FIG. 2 .

Fig. 4 is a perspective view of an assembled heat pipe and a bottom plate in another embodiment of the present invention.

【Detailed ways】

The heat pipe cooling device of the present invention is used for cooling electronic components such as a central processing unit (not shown in the figure).

Please refer to FIG. 1 to FIG. 3 , which are an embodiment of the heat pipe cooling device of the present invention. The heat pipe cooling device includes a bottom plate 10 , a cooling fin set 20 disposed on the bottom plate 10 and two sets of heat pipes 32 , 36 . Two sets of heat pipes 32 , 36 are sandwiched between the bottom plate 10 and the heat sink set 20 .

Both sets of heat pipes 32 and 36 are bent into a U shape and are flat. Each heat pipe 32 includes two parallel sections with equal lengths and spaced apart from each other, respectively serving as an evaporating section 322 for absorbing heat and a condensing section 324 for releasing heat. Each heat pipe 36 includes two parallel sections with unequal lengths and spaced apart from each other, serving as an evaporating section 362 for absorbing heat and a condensing section 364 for releasing heat respectively.

The bottom plate 10 is made of materials with good thermal conductivity, such as copper and aluminum, and its bottom surface is in contact with the electronic component 40 to absorb the heat generated by the electronic component 40 during operation. A rectangular recess 12 and a plurality of grooves 14 are formed in the central area of the upper surface of the bottom plate 10 for accommodating the heat pipes 32 , 36 . The grooves 14 extend from two ends of the recessed portion 12 and are distributed on other parts of the bottom plate 10 . The heat pipes 32 , 36 can be fixed in the recessed portion 12 and the groove 14 by welding or bonding, and form a plane together with the upper surface of the bottom plate 10 .

As shown in FIG. 3 , when the heat pipes 32 and 36 are installed on the bottom plate 10 , the two heat pipes 32 are arranged side by side with their U-shaped openings in the same direction, and the two evaporation sections 322 are in close contact. The heat pipes 36 are also arranged side by side on the bottom plate 10 , and the direction of the U-shaped opening of the heat pipe 32 is opposite to that of the U-shaped opening of the heat pipe 32 . The two evaporating sections 362 of the heat pipe 36 are respectively in contact with the two evaporating sections 322 of the heat pipe 32 , and the two condensing sections 364 thereof are parallel to the condensing sections 324 of the heat pipe 32 , and the heat pipe 32 is sandwiched between the two condensing sections 364 . After the heat pipes 32, 36 are installed on the bottom plate 10, the evaporation sections 322, 362 of the heat pipes 32, 36 are closely arranged in the recessed part 12, and the condensation sections 324, 364 extend from the recessed part 12 and are distributed on the bottom plate 10. other parts. Wherein, the evaporating section 362 of the heat pipe 36 is located between the evaporating section 322 and the condensing section 324 of its adjacent heat pipe 32; between. Arranged in this way, the evaporation sections 322, 362 of the two sets of heat pipes 32, 36 arranged in the recessed part 12 can quickly absorb the heat generated by the electronic component 40, and then quickly and evenly distribute the heat to the whole through the condensation sections 324, 364 On the bottom plate 10, this helps to quickly transfer heat from the bottom plate 10 to the heat sink set 20, thereby improving the heat dissipation performance of the heat sink.

The heat sink group 20 is composed of several heat sinks 22 connected to each other, and each heat sink 22 is made of a material with good thermal conductivity such as copper and aluminum. The heat sink group 20 is fixed on the upper surface of the bottom plate 10 by means of welding or the like and is in direct contact with the heat pipes 32, 36, and all the heat pipes 32, 36 are buried between the bottom plate 10 and the heat sink group 20, so that heat pipes 32, 36 can be directly connected 36 absorbs heat, and can absorb heat from base plate 10 again.

FIG. 4 is an assembly diagram of a heat pipe and a bottom plate in another embodiment of the present invention. Compared with the above-mentioned embodiments, this embodiment further includes a straight heat pipe 300 disposed between the two evaporation sections 322 of the heat pipe 32 . The heat-absorbing section of the heat pipe 300 is also located in the recessed part 12, and its condensing section extends from the recessed part 12 to the opposite sides of the bottom plate 10', so that the heat can be distributed to the entire bottom plate 10' more quickly and evenly, thereby improving the overall cooling capacity.

Claims (9)

1. heat-pipe radiating apparatus, comprise a base plate and be located at most fin on the base plate, this base plate one surface is formed with groove, be embedded at least two heat pipes in the groove, it is characterized in that: each heat pipe bends and has first heat transfer segment and bend second heat transfer segment of extending in the same way by the first heat transfer segment two ends, and second heat transfer segment of two heat pipes is parallel to each other.

2. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: this two heat pipe is the U type.

3. heat-pipe radiating apparatus as claimed in claim 2 is characterized in that: the U type opening direction of this two heat pipe is identical.

4. heat-pipe radiating apparatus as claimed in claim 2 is characterized in that: the U type opening direction of this two heat pipe is opposite.

5. heat-pipe radiating apparatus as claimed in claim 2 is characterized in that: second heat transfer segment of each heat pipe is between two heat transfer segment of another heat pipe.

6. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: base plate one surface is formed with a depressed part that is communicated with groove, and at least one heat transfer segment of each heat pipe is positioned at this depressed part.

7. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: also comprise two heat pipes that dispose in the same manner, this two heat pipe and above-mentioned heat pipe are disposed in the groove of backplate surface symmetrically.

8. heat-pipe radiating apparatus as claimed in claim 7 is characterized in that: also comprise the heat pipe always that is embedded at backplate surface, this directly-heated pipe is between above-mentioned at least two heat pipes.

9. heat-pipe radiating apparatus as claimed in claim 1 is characterized in that: heat pipe is located between base plate and the fin.

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