M309147 八、新型說明： 【新型所屬之技術領域】 一種CPU散熱裝置，用以排除一 cpu因運算而產生 的大置熱源，本創作尤指一種利用與cpu相互接觸之複 數個熱管，將CPU所產生之熱能快速分布於整片吸熱板 上，達到熱能得以快速且均勻擴散的散熱裝置。 【先前技術】 目前習知的CPU散熱裝置種類繁多，其主要係利用 一導熱座及一固定於導熱座上方的風扇，達到使熱能可 快速擴散，以冷卻CPU之功效，其中導熱座係包括一吸 熱板及一散熱鰭片，然而此種單一導熱座的CPU散熱裝 置，係存在極待解決的問題，其原因在於其吸熱板在吸 收CPU所產生的熱能時，僅有與CPU直接接觸的面積内 產生吸收熱能冷卻CPU的功效，但與CPU無直接接觸的 面積則吸收熱能速度緩慢，以致於雖然有散熱鰭片之大 面積的散熱功能，但卻無法將CPU所產生的熱能，透過 吸熱板快速吸收並擴散到所有散熱鰭片表面，請參閱「第 1圖」，圖中所示係為習知的CPU散熱裝置示意圖，如圖 中所不’ C P U 2 0係固定一主機板1 〇 —側，而固定於 CPU20另一側之CPU散熱装置30’其係由一導熱座301 與一固定於導熱座上方之風扇302所組成，其中導熱座 3 01係包括一吸熱板3 011與一散熱鰭片3 01 2，其散熱鰭 片3 01 2係由一層狀結構所組成，並成型於吸熱板3 〇 11 M309147 一側，吸熱板3011另一側，則與cPU 2〇相互組設並直 接接觸，CPU 2 0將熱能藉由接觸傳遞至吸熱板3〇11，且 由吸熱板3011將所吸收之熱能擴散至散熱鰭片3〇12表 面，透過散熱鰭片3012之層狀結構達到大面積之散熱功 能，以達到冷卻CPU 20之功效，然而，其吸熱板3〇11 卻無法將所吸收之熱能快速分散至所有吸熱板3〇11的 表面，即係未直接接觸CPU 20的吸熱板3011無法分擔 到CPU 20所產生之熱能，以致於散熱鰭片3〇12無法發 揮最大功效，造成散熱效果不佳之缺失。 【新型内容】 有鐾於上述的問題，本創作係針對CPU散熱裝置， 加以研九及進行改良，其目的在於提供一種可使cpu所 產生之大置熱能得以快速散去的CPU散熱裝置。 本創作CPU散熱裝置主要係裝設於一電腦主機内的 主機板中，用以排除CPU產生的大量熱能，其係利用一 組熱官將CPU所產生的熱能，迅速的擴散於吸熱板表 面，並利用一組散熱鰭片來達到快速散熱之功能；其中， 吸熱板内均勻成型有複數個長槽，其長槽内則設置有複 數個熱管並填充一介質，用以固定熱管於吸熱板内，其 熱官與CPU相互接觸，用以吸收熱能並均勻擴散分布於 整個吸熱基座内，使散熱鰭片得以完全發揮散熱效果， 以提昇CPU的冷卻速率，使cpu能繼續正常運作，防止 因過熱而造成無法使用；其中，吸熱基座與CPU間塗覆 M309147 有具有良好導熱效果的介質，用以固定或傳輸⑽與 吸熱基’座間的熱能。 為使貴審查委員能清楚了解本發明之内容僅以下 • 列說明搭配圖示，敬請參閱。 【實施方式】 請參閱「第2圖」，圖中所示，係為本創作cpu散献 鲁 裝置立體分解圖，如圖中所示，本創作CPU散熱裝置40 係由一吸熱基座401以及一組散熱鰭片4〇2所組成，其 中吸熱基座401則包括吸熱板4〇11及複數個熱管4〇12 組合而成，其吸熱板4011 —側則成型有複數個均勻分布 的長槽4〇m，其複數個長才曹4〇111係為放置複數個熱 官4012的容置空間，其中，因複數個熱管4〇12因其擴 散特性，使得複數個熱管4〇12在吸收熱能後，會將熱能 迅速擴散且均勻的分布於整個吸熱基座4〇丨内，另，於 • 吸熱板4011外圍，則成型有複數個圓孔40112，係甩一 固定裝置80，將CPU散熱裝置4〇固定於任一機板上， 又，其吸熱基座401上方，則組設有一組由複數片散熱 鰭片層疊而成的散熱鰭片402,其係可大幅增加散熱面 積，吸熱基座401在擴散熱能的同時，其散熱鰭片， 則藉由表面將熱能散出，以達到快速散熱的效果。 請參閱「第3圖」，圖中所示，係為本創作吸熱基座 平面實施示意圖，如圖中所示，吸熱基座401 一側為c即 60放置的位置，其吸熱板4〇11與cpu 6〇相接觸之一側 7 M309147 則成型有複數個長槽40111 ’其複數個長槽4〇ιιι均句 分布於整個吸熱板4〇11内，長槽4〇111内則組設有“ 個熱管4012 ,且熱管4〇12與長槽4G1U之間係以介質 70(例如錫膏）固定，利用熱管4〇12與cpU6〇相互接觸、， 熱管在吸收整個熱能的同時，會將所吸收之熱能迅 速擴散於整片吸熱基座401内（如箭頭方向所示），可大 幅提昇散熱效率，並達到快速冷卻cpu 6〇的效果。M309147 VIII. New description: [New technical field] A CPU heat sink is used to eliminate a large heat source generated by a CPU. This creation refers to a plurality of heat pipes that are in contact with the CPU. The generated heat energy is quickly distributed on the entire heat absorbing plate to achieve a heat sink that rapidly and uniformly diffuses heat. [Prior Art] At present, there are many kinds of CPU heat sinks, which mainly utilize a heat conducting seat and a fan fixed above the heat conducting seat to achieve the function of rapidly diffusing heat energy to cool the CPU, wherein the heat conducting base includes one The heat absorbing plate and a heat sink fin, however, the CPU heat sink of the single heat conducting seat has a problem to be solved, because the heat absorbing plate absorbs only the heat generated by the CPU, and only has direct contact with the CPU. The effect of absorbing heat energy to cool the CPU is generated, but the area that is not in direct contact with the CPU absorbs the heat energy slowly, so that although there is a large area of heat dissipation function of the heat sink fin, the heat energy generated by the CPU cannot be transmitted through the heat absorbing plate. Quickly absorb and diffuse to the surface of all heat sink fins. Please refer to "Figure 1". The figure shows a schematic diagram of the known CPU heat sink. As shown in the figure, the CPU 2 0 is fixed to a motherboard 1 〇 The CPU heat sink 30' fixed to the other side of the CPU 20 is composed of a heat conducting base 301 and a fan 302 fixed above the heat conducting seat, wherein the heat conducting seat 3 01 The utility model comprises a heat absorbing plate 3 011 and a heat dissipating fin 301 2 , wherein the heat dissipating fin 3 01 2 is composed of a layer structure and is formed on one side of the heat absorbing plate 3 〇11 M309147, and the other side of the heat absorbing plate 3011 And the cPU 2〇 is arranged and directly in contact with each other, and the CPU 20 transfers the thermal energy to the heat absorbing plate 3〇11 by the contact, and the absorbed heat energy is diffused by the heat absorbing plate 3011 to the surface of the heat radiating fin 3〇12, through The layered structure of the heat dissipating fins 3012 achieves a large-area heat dissipation function to achieve the effect of cooling the CPU 20. However, the heat absorbing plate 3〇11 cannot quickly disperse the absorbed heat energy to the surface of all the heat absorbing plates 3〇11. That is, the heat absorbing plate 3011 that is not in direct contact with the CPU 20 cannot share the heat energy generated by the CPU 20, so that the heat radiating fins 3〇12 cannot perform the maximum effect, resulting in a lack of heat dissipation effect. [New content] In view of the above problems, this creation is aimed at improving the CPU heat sink, and aims to provide a CPU heat sink that allows the large heat generated by the CPU to be quickly dissipated. The CPU heat sink of the present invention is mainly installed in a motherboard of a computer host to exclude a large amount of heat generated by the CPU, and the heat generated by the CPU is rapidly diffused on the surface of the heat absorbing plate by a group of heat officials. A set of heat dissipating fins is used to achieve rapid heat dissipation. Among them, a plurality of long slots are uniformly formed in the heat absorbing plate, and a plurality of heat pipes are disposed in the long slots and filled with a medium for fixing the heat pipes in the heat absorbing plate. The hot official and the CPU are in contact with each other to absorb heat energy and uniformly spread over the entire heat absorbing base, so that the heat dissipation fins can fully exert the heat dissipation effect, so as to improve the cooling rate of the CPU, so that the cpu can continue to operate normally, preventing the cause Overheating causes it to be unusable; among them, the M309147 is coated between the heat absorbing base and the CPU to have a good thermal conductivity to fix or transfer the thermal energy between the (10) and the heat absorbing base. In order for your review board to have a clear understanding of the contents of the present invention, please refer to the following. [Embodiment] Please refer to "Fig. 2", which is a three-dimensional exploded view of the cpu-distributing device. As shown in the figure, the CPU heat sink 40 is composed of a heat absorbing base 401 and The heat absorbing base 401 includes a heat absorbing plate 4〇11 and a plurality of heat pipes 4〇12, and the heat absorbing plate 4011 is formed on the side with a plurality of evenly distributed long grooves. 4〇m, its multiple long Cao 4〇111 series is the accommodating space for placing a plurality of thermal officers 4012. Among them, due to the diffusion characteristics of a plurality of heat pipes 4〇12, a plurality of heat pipes 4〇12 are absorbing heat energy. After that, the heat energy is rapidly diffused and evenly distributed in the entire heat absorbing base 4〇丨. Further, on the periphery of the heat absorbing plate 4011, a plurality of circular holes 40112 are formed, and a fixing device 80 is attached to the CPU heat sink. 4〇 is fixed on any of the boards, and above the heat absorbing base 401, a set of heat dissipating fins 402 formed by laminating a plurality of fins is provided, which can greatly increase the heat dissipating area, and the heat absorbing base 401, while diffusing thermal energy, its fins are borrowed. Thermal energy radiated surface, in order to achieve rapid cooling effect. Please refer to "Fig. 3", which is a schematic diagram of the plane of the heat absorbing base. As shown in the figure, the side of the heat absorbing base 401 is at the position where c is 60, and the heat absorbing plate is 4〇11. One side of the contact with the cpu 6 7 7 M309147 is formed with a plurality of long grooves 40111 'the plurality of long grooves 4 〇 ιιι are distributed throughout the heat absorbing plate 4 〇 11 , and the long groove 4 〇 111 is set "A heat pipe 4012, and the heat pipe 4〇12 and the long groove 4G1U are fixed by a medium 70 (for example, solder paste), and the heat pipe 4〇12 and cpU6〇 are in contact with each other, and the heat pipe absorbs the entire heat energy, and the heat pipe will The absorbed heat energy is rapidly diffused into the entire heat absorbing base 401 (as indicated by the direction of the arrow), which can greatly improve the heat dissipation efficiency and achieve the effect of rapidly cooling the cpu 6 。.
請參閱「第4圖」，圖中所示，係為本創作卿散敎 裝置平面實施示意圖’如圖中所示，本創作咖散熱裝 置40’係由一固定裝置8〇固定於主機板5〇 一側，c別6〇 則置放於cpu散熱裝置40與主機板5〇間，cpu6〇產生 熱能後，透過與前述熱管相互接觸，將熱能（如箭頭所示） 直接擴散於整片吸熱基座術内，熱能由吸熱基座如 傳導於上方散熱韓片4G2,再由散熱鰭片術表面迅速 擴政於空氣之間’達到散熱效能。 請參閱「第5圖」，圖中所示，係為本創作cpu散敎 裝置另-實施例，如圖中所示，其吸熱基座與咖 間可塗覆一介f m例如錫膏），用以固scpu6〇於吸 熱基座401 一側，並防止CP請滑動，且可填補CPU 60 與吸熱基座401間的空隙’以利提昇熱能傳遞之效率。 由以上所述可知，本創作咖散熱裝置主要係利用 複數個與CHI相互接觸的熱管，將複數個熱管所吸收之 熱能快速分布於整個吸熱基座上，達到熱能得以快速且 均勻擴散的散熱裝置。 8 M309147 均勻擴散的散熱裝置。 =所述可得知，本創作⑽散熱裝置其據以實施 :貝可達到—種有效提昇cpu散熱效果之目的。 、隹’以上所述者，僅為本創作之較佳之實施例而已， 二限定本創作實施之範圍；任何熟習此技藝者， π脫離本創作之精神與範圍下所作之均等變化與修 飾，皆應涵蓋於本創作之專利範圍内。 Τ上所述，本創作cpu散熱裝置之功效，係具創作 之實用性與進步性；申請人麦依專利法之規定，向鈞 局提起新型專利之申請。Please refer to "Fig. 4", which is shown in the figure. It is a schematic diagram of the plane implementation of the creative device. As shown in the figure, the creative coffee heat sink 40' is fixed to the motherboard 5 by a fixing device 8〇. 〇 one side, c other than 6 〇 is placed between the cpu heat sink 40 and the motherboard 5 ,, cpu6 〇 after generating thermal energy, through the contact with the heat pipe, the thermal energy (as indicated by the arrow) directly spread to the whole piece of heat absorption In the pedestal, the heat is radiated by the heat absorbing base, such as the 4G2, which is radiated to the upper side, and then the surface of the heat sink fin is rapidly expanded between the air to achieve heat dissipation. Please refer to "Fig. 5", which is a different embodiment of the cpu dilating device. As shown in the figure, the heat absorbing base and the coffee room can be coated with a fm such as solder paste. The solid scpu6 is placed on the side of the heat absorbing base 401, and prevents the CP from sliding, and can fill the gap between the CPU 60 and the heat absorbing base 401 to improve the efficiency of heat transfer. It can be seen from the above that the heat dissipation device of the present invention mainly uses a plurality of heat pipes that are in contact with the CHI to rapidly distribute the heat energy absorbed by the plurality of heat pipes to the entire heat absorption base, thereby achieving a heat dissipation device capable of rapidly and uniformly diffusing heat energy. . 8 M309147 Heat sink that spreads evenly. = It can be known that the creation (10) heat sink device is implemented according to the following: Beike can achieve the purpose of effectively improving the heat dissipation effect of the CPU. The above descriptions are only preferred embodiments of the present invention, and the scope of the present invention is limited; any person skilled in the art, π is separated from the equal changes and modifications made by the spirit and scope of the creation. It should be covered by the scope of this creation patent. As mentioned above, the effectiveness of the cpu heat sink is based on the practicality and progress of the creation; the applicant's patent law of Maiyi, filed a new patent application with the bureau.
9 M309147 【圖式簡單說明】 第1圖，為習知的CPU散熱裝置示意圖。 第2圖，為本創作CPU散熱裝置立體分解圖。 第3圖，為本創作吸熱基座平面實施示意圖。 第4圖，為本創作CPU散熱裝置平面實施示意圖。 第5圖，為本創作CPU散熱裝置另一實施例。 【主要元件符號說明】9 M309147 [Simple description of the diagram] Figure 1 is a schematic diagram of a conventional CPU heat sink. Figure 2 is an exploded perspective view of the CPU heat sink. Fig. 3 is a schematic view showing the plane implementation of the heat absorbing base of the present invention. Figure 4 is a schematic diagram of the plane implementation of the CPU heat sink. Fig. 5 is another embodiment of the CPU heat sink of the present invention. [Main component symbol description]
10 主機板 20 CPU 30 CPU散熱裝置 301 導熱座 3011 吸熱板 3012 散熱鰭片 302 風扇 40 CPU散熱裝置 401 吸熱基座 4011 吸熱板 40111 長槽 40112 圓孔 4012 熱管 402 散熱鰭片 50 主機板 60 CPU 10 M309147 70 介質 80 固定裝置10 Motherboard 20 CPU 30 CPU heat sink 301 Thermal pad 3011 Heat sink 3012 Heat sink fin 302 Fan 40 CPU heat sink 401 Heat sink base 4011 Heat sink 40111 Long slot 40112 Round hole 4012 Heat pipe 402 Heat sink fin 50 Motherboard 60 CPU 10 M309147 70 medium 80 fixture
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