JP4978448B2

JP4978448B2 - Stacked cooler

Info

Publication number: JP4978448B2
Application number: JP2007316864A
Authority: JP
Inventors: 尚規杉本; 章山中
Original assignee: Denso Corp
Current assignee: Denso Corp
Priority date: 2007-12-07
Filing date: 2007-12-07
Publication date: 2012-07-18
Anticipated expiration: 2027-12-07
Also published as: JP2009141183A

Description

本発明は、複数の発熱体を両面から冷却するための積層型冷却器に関する。 The present invention relates to a stacked cooler for cooling a plurality of heating elements from both sides.

従来、半導体素子を内蔵した半導体モジュール（発熱体）の放熱を行うために、半導体モジュールを両面から挟持するように冷却管を配設して構成される積層型冷却器が知られている。このような積層型冷却器では、半導体モジュールと冷却管とが交互に積層された構成となっており、積層された複数の冷却管は、連通部材によって連通され、冷却媒体が各冷却管に流通するよう構成されている（例えば、特許文献１参照）。
特開２００５−１９１５２７号公報 2. Description of the Related Art Conventionally, in order to dissipate heat from a semiconductor module (heating element) incorporating a semiconductor element, a stacked type cooler configured by arranging a cooling pipe so as to sandwich the semiconductor module from both sides is known. Such a stacked type cooler has a configuration in which semiconductor modules and cooling pipes are alternately stacked, and the plurality of stacked cooling pipes communicate with each other through a communication member, and a cooling medium flows to each cooling pipe. (For example, refer patent document 1).
JP 2005-191527 A

ところで、上記従来の積層型冷却器において、小型化やコスト削減のために、半導体モジュールへの半導体素子の集積化を図ると、半導体モジュール全体の発熱量が増大する。したがって、半導体素子の許容温度を超えないようにするためには、積層型冷却器の冷却性能を向上させることにより対応する必要がある。 By the way, in the conventional stacked cooler described above, when the semiconductor elements are integrated in the semiconductor module in order to reduce the size and the cost, the amount of heat generated in the entire semiconductor module increases. Therefore, in order not to exceed the allowable temperature of the semiconductor element, it is necessary to cope with it by improving the cooling performance of the stacked cooler.

これに対し、インナーフィンの形状を変更する等、冷却管内側の形状を変更することで、熱伝達率を向上させ、これにより冷却性能を向上させる方法が考えられる。しかしながら、積層型冷却器における冷却媒体の流量は固定で少ないため、搭載性等の理由により、複数の冷却管の全てを冷却媒体が一方向に流れるいわゆる全パス構造が採用されている従来の積層型冷却器においては、冷却管内側形状を改善しても、冷却性能を十分に向上させることができない。 On the other hand, a method of improving the heat transfer rate by changing the shape inside the cooling pipe, such as changing the shape of the inner fin, and thereby improving the cooling performance can be considered. However, since the flow rate of the cooling medium in the laminated cooler is fixed and small, a conventional laminated structure in which a so-called all-pass structure in which the cooling medium flows in one direction through all of the plurality of cooling pipes is adopted for reasons such as mountability. In the mold cooler, even if the shape inside the cooling pipe is improved, the cooling performance cannot be sufficiently improved.

本発明は、上記点に鑑み、最大発熱量が異なる複数種の発熱体を冷却する積層型冷却器において、冷却性能を向上させることを目的とする。 In view of the above points, an object of the present invention is to improve cooling performance in a stacked cooler that cools a plurality of types of heating elements having different maximum heat generation amounts.

上記目的を達成するため、請求項１、２に記載の発明では、発熱体（２）と当接する主面（３１１ａ、３１１ｂ）と、冷却媒体が流通する冷媒通路（３０）とを有する扁平状に形成された複数の冷却管（３）と、冷却管（３）の長手方向両端部に配置され、複数の冷却管（３）を連通する第１、第２連通部材（４ａ、４ｂ）と、第１、第２連通部材（４ａ、４ｂ）のうち少なくとも一方の連通部材（４ａ）の内部を上流側と下流側とに仕切る仕切手段（４３）とを備え、複数の発熱体（２）は、最大発熱量の異なる複数種の発熱体（２１、２２）からなり、複数の冷却管（３）は、冷却管（３）と交互に配置される発熱体（２）を両面から挟持できるように積層配置されているとともに、積層方向の両端に配置された２つの外側冷却管（３１ａ、３２ａ）と、２つの外側冷却管（３１ａ、３２ａ）の間に配置された複数の内側冷却管（３ｂ）とからなり、複数種の発熱体（２）のうち最大発熱量が他の発熱体（２１）よりも相対的に大きい発熱体（２２）が、２つの外側冷却管（３１ａ、３２ａ）のうち仕切手段（４３）より冷却媒体流れ上流側に配置された外側冷却管（３１ａ）に当接するように優先的に配置されていることを特徴としている。 In order to achieve the above object, in the first and second aspects of the invention, a flat shape having a main surface (311a, 311b) in contact with the heating element (2) and a refrigerant passage (30) through which a cooling medium flows. A plurality of cooling pipes (3) formed on the first and second communication members (4a, 4b) disposed at both longitudinal ends of the cooling pipe (3) and communicating with the plurality of cooling pipes (3); A partition means (43) for partitioning the interior of at least one of the first and second communication members (4a, 4b) into an upstream side and a downstream side, and a plurality of heating elements (2) Is composed of a plurality of types of heating elements (21, 22) having different maximum heat generation amounts, and the plurality of cooling pipes (3) can sandwich the heating elements (2) arranged alternately with the cooling pipes (3) from both sides. And two outer cooling pipes (31 arranged at both ends in the stacking direction). a, 32a ) and a plurality of inner cooling pipes (3b) disposed between the two outer cooling pipes (31a, 32a ), and the maximum heating value of the plurality of types of heating elements (2) A heating element (22) that is relatively larger than the heating element (21) has an outer cooling pipe (31a) arranged upstream of the cooling medium flow from the partitioning means (43) of the two outer cooling pipes (31a, 32a ). ) Is preferentially disposed so as to abut.

第１、第２連通部材（４ａ、４ｂ）のうち少なくとも一方の連通部材（４ａ）の内部を上流側と下流側とに仕切る仕切手段（４３）を設けることで、冷却媒体を積層型冷却器内部でターンするように流すことができる。これにより、積層型冷却器に流入する冷却媒体の流量が固定であったとしも、冷却管（３）１つ当たりの冷却媒体の流量を増加させることができる。 By providing partition means (43) for partitioning the inside of at least one communication member (4a) out of the first and second communication members (4a, 4b) into an upstream side and a downstream side, the cooling medium is a stacked type cooler. You can make it flow like it turns inside. Thereby, even if the flow rate of the cooling medium flowing into the stacked cooler is fixed, the flow rate of the cooling medium per cooling pipe (3) can be increased.

しかしながら、冷却媒体が積層型冷却器の内部でターンするように構成しただけでは、ターン後、すなわち仕切手段（４３）より冷却媒体流れ下流側に配置された冷却管（３）の入口部における冷却媒体温度が極端に上昇してしまう。このため、仕切手段（４３）より冷却媒体流れ下流側に配置された冷却管（３）においては、発熱体（２）を十分に冷却することができない。 However, if the cooling medium is simply configured to turn inside the stacked cooler, cooling at the inlet of the cooling pipe (3) disposed after the turn, that is, downstream of the cooling medium flow from the partition means (43). The medium temperature rises extremely. For this reason, in the cooling pipe (3) arranged downstream of the cooling medium flow from the partitioning means (43), the heating element (2) cannot be sufficiently cooled.

ところで、積層型冷却器に搭載される複数の発熱体（２）の最大発熱量が、全ての発熱体（２）において一律でない場合がある。また、積層型冷却器において、積層方向の両端に配置された２つの外側冷却管（３１ａ、３２ａ）では、片面のみが発熱体（２）と当接しているため、内側冷却管（３ｂ）と比較して冷却性能が高くなる。さらに、２つの外側冷却管（３１ａ、３２ａ）のうち仕切手段（４３）より冷却媒体流れ上流側に配置された外側冷却管（３１ａ）は、仕切手段（４３）より冷却媒体流れ下流側に配置された外側冷却管（３２ａ）と比較して冷却性能が高くなる。すなわち、２つの外側冷却管（３１ａ、３２ａ）のうち仕切手段（４３）より冷却媒体流れ上流側に配置された外側冷却管（３１ａ）は、複数の冷却管（３）のうち最も冷却性能が高くなっている。 By the way, the maximum heat generation amount of the plurality of heating elements (2) mounted on the stacked cooler may not be uniform in all the heating elements (2). In the stacked cooler, since only one side of the two outer cooling pipes (31a, 32a ) disposed at both ends in the stacking direction is in contact with the heating element (2), the inner cooling pipe (3b) Compared with the cooling performance. Further, of the two outer cooling pipes (31a, 32a ), the outer cooling pipe (31a) arranged upstream of the cooling medium flow from the partitioning means (43) is arranged downstream of the cooling medium flow from the dividing means (43). The cooling performance is higher than that of the outer cooling pipe (32a). That is, of the two outer cooling pipes (31a, 32a ), the outer cooling pipe (31a) arranged on the upstream side of the cooling medium flow from the partition means (43) has the most cooling performance among the plurality of cooling pipes (3). It is high.

したがって、複数種の発熱体（２）のうち最大発熱量が他の発熱体（２１）よりも相対的に大きい発熱体（２２）を、２つの外側冷却管（３１ａ、３２ａ）のうち仕切手段（４３）より冷却媒体流れ上流側に配置された外側冷却管（３１ａ）に当接するように優先的に配置することで、複数種の発熱体（２）のうち最大発熱量が最大となる発熱体（２２）を、複数の冷却管（３）のうち最も冷却性能が高い冷却管（３１ａ）に当接するように配置することができる。このため、積層型冷却器全体としての冷却性能を向上させることが可能となる。 Therefore, the heat generating element (22) having the largest heat generation amount among the plurality of types of heat generating elements (2) is relatively larger than the other heat generating elements (21), and the partitioning means of the two outer cooling pipes (31a, 32a ). (43) Heat generation that maximizes the maximum amount of heat generation among the plurality of types of heating elements (2) by preferentially disposing the outer cooling pipe (31a) disposed upstream of the cooling medium flow. A body (22) can be arrange | positioned so that it may contact | abut to the cooling pipe (31a) with the highest cooling performance among several cooling pipes (3). For this reason, it becomes possible to improve the cooling performance as the whole laminated cooler.

また、請求項４に記載の発明では、複数種の発熱体（２）のうち最大発熱量が他の発熱体（２１）よりも相対的に大きい発熱体（２２）が、複数の冷却管（３）のうち、仕切手段（４３）より冷却媒体流れ上流側に配置され、かつ、内部を流れる冷却媒体の流速が他の冷却管（３）よりも相対的に大きくなる冷却管（３）に当接するように優先的に配置されていることを特徴としている。 Moreover, in invention of Claim 4 , the heat generating body (22) in which the largest calorific value is relatively larger than another heat generating body (21) among several types of heat generating bodies (2) is a plurality of cooling pipes ( 3) of the cooling pipe (3) which is arranged upstream of the cooling medium flow from the partition means (43) and whose flow velocity of the cooling medium flowing inside is relatively larger than that of the other cooling pipes (3). It is characterized by being preferentially disposed so as to abut.

これによれば、最大発熱量が他の発熱体（２１）より大きい発熱体（２２）を、内部を流れる冷却媒体の流速が大きい、すなわち熱伝達率の高い冷却管（３）に当接させることができるため、積層型冷却器全体としての冷却性能を向上させることが可能となる。 According to this, the heating element (22) whose maximum heating value is larger than the other heating elements (21) is brought into contact with the cooling pipe (3) having a high flow rate of the cooling medium flowing inside, that is, a high heat transfer coefficient. Therefore, it is possible to improve the cooling performance of the entire stacked cooler.

また、請求項１、３に記載の発明では、複数の内側冷却管（３ｂ）のうち、仕切手段（４３）に隣接する２つの仕切側冷却管（３ｃ）の間は、発熱体（２）が配置されない発熱体非配置領域（５）になっており、複数種の発熱体（２）のうち最大発熱量が他の発熱体（２１）よりも相対的に大きい発熱体（２２）が、仕切側冷却管（３ｃ）における発熱体非配置領域（５）に対向する側と反対側の主面（３１１ａ、３１１ｂ）に当接するように優先的に配置されていることを特徴としている。 Moreover, in invention of Claim 1, 3 , between two partition side cooling pipes (3c) adjacent to a partition means (43) among several inner side cooling pipes (3b), a heat generating body (2). Is a heating element non-arrangement region (5) where no heating element is arranged, and among the plurality of types of heating elements (2), a heating element (22) whose maximum heating value is relatively larger than that of the other heating elements (21), The partition-side cooling pipe (3c) is preferentially disposed so as to abut on the main surface (311a, 311b) opposite to the side facing the heating element non-arrangement region (5).

仕切側冷却管（３ｃ）は、片面のみが発熱体（２）と当接しているので、他の内側冷却管（３ｂ）と比較して冷却性能が高くなる。このため、最大発熱量が他の発熱体（２１）より大きい発熱体（２２）を、仕切側冷却管（３ｃ）における発熱体非配置領域（５）に対向する側と反対側の主面（３１１ａ、３１１ｂ）に当接するように配置することで、積層型冷却器全体としての冷却性能を向上させることが可能となる。 Since only one side of the partition side cooling pipe (3c) is in contact with the heating element (2), the cooling performance is higher than that of the other inner cooling pipe (3b). For this reason, the heating element (22) whose maximum heating value is larger than the other heating element (21) is disposed on the main surface opposite to the side facing the heating element non-arrangement region (5) in the partition side cooling pipe (3c) ( 311a and 311b), the cooling performance of the stacked cooler as a whole can be improved.

また、請求項５に記載の発明では、複数種の発熱体（２）のうち最大発熱量が他の発熱体（２１）よりも相対的に大きい発熱体（２２）が、２つの外側冷却管（３１ａ、３２ａ）のうち仕切手段（４３）より冷却媒体流れ下流側に配置された外側冷却管（３２ａ）に当接するように優先的に配置されていることを特徴としている。 In the invention according to claim 5 , the heat generating body (22) having the largest heat generation amount among the plural types of heat generating bodies (2) is relatively larger than the other heat generating bodies (21). (31a, 32a ) is preferentially disposed so as to abut on the outer cooling pipe (32a) disposed on the downstream side of the cooling medium flow from the partition means (43).

外側冷却管（３２ｂ）は、片面のみが発熱体（２）と当接しているので、内側冷却管（３ｂ）と比較して冷却性能が高くなる。このため、最大発熱量が他の発熱体（２１）より大きい発熱体（２２）を、外側冷却管（３２ａ）に当接するように優先的に配置することで、積層型冷却器全体としての冷却性能を向上させることが可能となる。 Since only one side of the outer cooling pipe (32b) is in contact with the heating element (2), the cooling performance is higher than that of the inner cooling pipe (3b). For this reason, the heating element (22) whose maximum heat generation amount is larger than that of the other heating elements (21) is preferentially disposed so as to come into contact with the outer cooling pipe (32a), thereby cooling the entire laminated cooler. The performance can be improved.

また、請求項６に記載の発明では、複数種の発熱体（２）のうち他の発熱体（２１）よりも最大発熱量が相対的に大きい発熱体（２２）が、仕切手段（４３）より冷却媒体流れ上流側に配置された冷却管（３）に当接するように優先的に配置されていることを特徴としている。 In the invention according to claim 6 , the heating element (22) having a maximum heat generation amount relatively larger than that of the other heating elements (21) among the plurality of types of heating elements (2) is the partition means (43). It is characterized by being preferentially disposed so as to abut on the cooling pipe (3) disposed on the upstream side of the cooling medium flow.

複数の冷却管（３）のうち仕切手段（４３）より冷却媒体流れ上流側に配置された冷却管（３）は、仕切手段（４３）より冷却媒体流れ下流側に配置された冷却管（３）と比較して冷却性能が高くなる。このため、最大発熱量が他の発熱体（２１）より大きい発熱体（２２）を、仕切手段（４３）より冷却媒体流れ上流側に配置された冷却管（３）に当接するように配置することで、積層型冷却器全体としての冷却性能を向上させることが可能となる。 Among the plurality of cooling pipes (3), the cooling pipe (3) arranged on the upstream side of the cooling medium flow from the partitioning means (43) is the cooling pipe (3) arranged on the downstream side of the cooling medium flow from the dividing means (43). ) Cooling performance will be higher. For this reason, the heating element (22) whose maximum heating value is larger than the other heating elements (21) is arranged so as to abut on the cooling pipe (3) arranged on the upstream side of the cooling medium flow from the partition means (43). As a result, it is possible to improve the cooling performance of the entire stacked cooler.

また、請求項２の記載の発明では、冷却管（３）の長手方向両端部には、冷却管（３）の積層方向に張り出す張出部（３４）が形成されており、隣接する冷却管（３）の張出部（３４）が、互いに冷却管（３）の積層方向に接合されるとともに、張出部（３４）の接合部に形成された貫通孔（３４１ｂ）によって連通することにより、連通部材（４）が構成されており、仕切手段（３４）は、一部の張出部（３４）の接合部を貫通孔（３４１ｂ）が形成されない貫通孔非形成部（３４１ｃ）とし、隣接する張出部（３４）同士を非連通状態にすることにより構成されていることを特徴としている。これによれば、連通部材（４）および仕切手段（４３）を容易に製造することが可能となる。
Further, in the invention described in claim 2 , overhang portions (34) projecting in the stacking direction of the cooling pipe (3) are formed at both ends in the longitudinal direction of the cooling pipe (3). The overhanging portion (34) of the tube (3) is joined to each other in the stacking direction of the cooling tube (3) and communicates with the through hole (341b) formed in the joining portion of the overhanging portion (34). Thus, the communication member (4) is configured, and the partitioning means (34) uses a part of the protruding portion (34) as a through hole non-forming portion (341c) where the through hole (341b) is not formed. It is characterized in that it is configured by bringing adjacent projecting portions (34) into a non-communication state. According to this, it becomes possible to manufacture a communicating member (4) and a partition means (43) easily.

なお、この欄および特許請求の範囲で記載した各手段の括弧内の符号は、後述する実施形態に記載の具体的手段との対応関係を示すものである。 In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

（第１実施形態）
以下、本発明の第１実施形態について図１〜図９に基づいて説明する。図１は、本第１実施形態に係る積層型冷却器１を示す平面図である。 (First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing the stacked cooler 1 according to the first embodiment.

図１に示すように、本実施形態の積層型冷却器１は、複数の電子部品２を両面から冷却するもので、冷却媒体を流通させる冷媒通路３０（図２参照）を有する扁平形状の複数の冷却管３と、複数の冷却管３を連通する連通部材４とを備えている。複数の冷却管３は、電子部品２を両面から挟持できるように複数個積層配置されている。また、連通部材４は、紙面左側に配置された第１連通部材４ａと、紙面右側に配置された第２連通部材４ｂとからなり、第１、第２連通部材４ａ、４ｂは、鉛直方向に延びた形状である。 As shown in FIG. 1, the multilayer cooler 1 of this embodiment cools a plurality of electronic components 2 from both sides, and has a plurality of flat shapes having refrigerant passages 30 (see FIG. 2) for circulating a cooling medium. The cooling pipe 3 and a communication member 4 that communicates the plurality of cooling pipes 3 are provided. A plurality of cooling tubes 3 are arranged in a stacked manner so that the electronic component 2 can be sandwiched from both sides. The communication member 4 includes a first communication member 4a disposed on the left side of the paper and a second communication member 4b disposed on the right side of the paper. The first and second communication members 4a and 4b are arranged in the vertical direction. It is an extended shape.

図２は、図１のＡ−Ａ断面図である。図２に示すように、冷却管３には、電子部品２と当接する第１主面３１１ａを有する第１管壁３１１ｂに面した第１冷媒通路３０１と、第１主面３１１ａの反対側において電子部品２と当接する第２主面３１２ａを有する第２管壁３１２ｂに面した第２冷媒通路３０２とが設けられている。 FIG. 2 is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 2, the cooling pipe 3 includes a first refrigerant passage 301 facing the first pipe wall 311b having a first main surface 311a that contacts the electronic component 2, and a side opposite to the first main surface 311a. A second refrigerant passage 302 facing the second pipe wall 312b having a second main surface 312a that contacts the electronic component 2 is provided.

具体的には、本実施形態の冷却管３は、いわゆるドロンカップ構造となっている。すなわち、冷却管３は、一対の外殻プレート３１と、一対の外殻プレート３１の間に配置される中間プレート３２とを有している。これにより、外殻プレート３１と中間プレート３２との間には、第１冷媒通路３０１および第２冷媒通路３０２がそれぞれ形成されている。したがって、冷却管３には、冷媒通路３０が冷却管３の厚み方向、すなわち冷却管３の積層方向に二段形成されている。 Specifically, the cooling pipe 3 of this embodiment has a so-called drone cup structure. That is, the cooling pipe 3 has a pair of outer shell plates 31 and an intermediate plate 32 disposed between the pair of outer shell plates 31. Thus, a first refrigerant passage 301 and a second refrigerant passage 302 are formed between the outer shell plate 31 and the intermediate plate 32, respectively. Therefore, the coolant pipe 30 is formed in two stages in the cooling pipe 3 in the thickness direction of the cooling pipe 3, that is, in the stacking direction of the cooling pipes 3.

以下、一対の外殻プレート３１のうち、中間プレート３２とともに第１冷媒通路３０１を形成するものを第１外殻プレート３１１といい、中間プレート３２とともに第２冷媒通路３０２を形成するものを第２外殻プレート３１２ともいう。したがって、第１外殻プレート３１１は第１管壁３１１ｂを構成しており、第２外殻プレート３１２は第２管壁３１２ｂを構成している。 Hereinafter, of the pair of outer shell plates 31, the one that forms the first refrigerant passage 301 together with the intermediate plate 32 is referred to as the first outer shell plate 311, and the one that forms the second refrigerant passage 302 together with the intermediate plate 32 is the second. Also called outer shell plate 312. Therefore, the first outer shell plate 311 constitutes the first tube wall 311b, and the second outer shell plate 312 constitutes the second tube wall 312b.

外殻プレート３１と中間プレート３２との間、すなわち第１冷媒通路３０１内および第２冷媒通路３０２内には、冷却媒体と冷却管３との伝熱面積を増加させるインナーフィン３３が配設されている。インナーフィン３３は波状に形成されており、これにより各冷媒通路３０１、３０２は、冷却管３の長手方向および厚み方向にともに直交する方向（以下、冷却管３の幅方向という）に複数に区画されている。なお、本実施形態では、冷却管３の幅方向は冷却風の流通方向と一致している。 Inner fins 33 that increase the heat transfer area between the cooling medium and the cooling pipe 3 are disposed between the outer shell plate 31 and the intermediate plate 32, that is, in the first refrigerant passage 301 and the second refrigerant passage 302. ing. The inner fin 33 is formed in a wave shape, whereby each of the refrigerant passages 301 and 302 is divided into a plurality of sections in a direction orthogonal to the longitudinal direction and the thickness direction of the cooling pipe 3 (hereinafter referred to as the width direction of the cooling pipe 3). Has been. In the present embodiment, the width direction of the cooling pipe 3 coincides with the flow direction of the cooling air.

図３は、図１のＢ−Ｂ断面図である。図３に示すように、インナーフィン３３は、冷却媒体の流れ方向に直列に２つ配設されており、各インナーフィン３３の間には、所定の隙間３２０が形成されている。 3 is a cross-sectional view taken along line BB in FIG. As shown in FIG. 3, two inner fins 33 are arranged in series in the flow direction of the cooling medium, and a predetermined gap 320 is formed between the inner fins 33.

図１に戻り、複数の冷却管３は、積層方向最外側に配置される２つの外側冷却管３ａと、２つの外側冷却管３ａの間に配置された複数の内側冷却管３ｂとからなっている。以下、２つの外側冷却管３ａのうち、冷却媒体流れ上流側に配置されるものを第１外側冷却管３１ａといい、冷却媒体流れ下流側に配置されるものを第２外側冷却管３２ａともいう。 Returning to FIG. 1, the plurality of cooling pipes 3 are composed of two outer cooling pipes 3 a arranged on the outermost side in the stacking direction and a plurality of inner cooling pipes 3 b arranged between the two outer cooling pipes 3 a. Yes. Hereinafter, of the two outer cooling pipes 3a, the pipe disposed on the upstream side of the cooling medium flow is referred to as a first outer cooling pipe 31a, and the pipe disposed on the downstream side of the cooling medium flow is also referred to as a second outer cooling pipe 32a. .

そして、第１外側冷却管３１ａの長手方向における第１連通部材４ａに接続される側の端部には、冷却媒体を積層型冷却器１に導入するための冷媒導入口４１が接続されている。また、第２外側冷却管３２ａの長手方向における第１連通部材４ａに接続される側の端部には、冷却媒体を積層型冷却器１から排出するための冷媒排出口４２が接続されている。冷媒導入口４１および冷媒排出口４２は、ろう付けにより第１、第２外側冷却管３１ａ、３２ａにそれぞれ接合されている。 And the refrigerant | coolant inlet 41 for introducing a cooling medium into the laminated cooler 1 is connected to the edge part by the side connected to the 1st communicating member 4a in the longitudinal direction of the 1st outer side cooling pipe 31a. . Further, a refrigerant discharge port 42 for discharging the cooling medium from the stacked cooler 1 is connected to the end of the second outer cooling pipe 32a on the side connected to the first communication member 4a in the longitudinal direction. . The refrigerant inlet 41 and the refrigerant outlet 42 are joined to the first and second outer cooling pipes 31a and 32a by brazing, respectively.

なお、本実施形態の冷却管３、連通部材４、冷媒導入口４１および冷媒排出口４２は、アルミニウム製である。また、冷却媒体としては、本実施形態ではエチレングリコール系の不凍液が混入した水を用いている。 In addition, the cooling pipe 3, the communication member 4, the refrigerant introduction port 41, and the refrigerant discharge port 42 of the present embodiment are made of aluminum. As the cooling medium, water mixed with an ethylene glycol-based antifreeze is used in the present embodiment.

図４は図１のＣ−Ｃ断面図で、図５は図１のＤ−Ｄ断面図である。図４および図５に示すように、本実施形態の電子部品２は、ＩＧＢＴ等の半導体素子（発熱素子）２０とダイオード（図示せず）とを内蔵した半導体モジュールである。そして、半導体モジュールは、自動車用インバータの一部を構成している。 4 is a cross-sectional view taken along the line CC in FIG. 1, and FIG. 5 is a cross-sectional view taken along the line DD in FIG. As shown in FIGS. 4 and 5, the electronic component 2 of the present embodiment is a semiconductor module in which a semiconductor element (heating element) 20 such as an IGBT and a diode (not shown) are built. And the semiconductor module comprises a part of inverter for motor vehicles.

本実施形態では、図４に示すように、１つの半導体モジュール（電子部品２）内に１つの半導体素子２０が配置されているもの（以下、第１電子部品２１という）と、図５に示すように、１つの半導体モジュール（電子部品２）内に２つの半導体素子２０が配置されているもの（以下、第２電子部品２２という）との２種類の電子部品２を備えている。そして、第２電子部品２２の最大発熱量は、第１電子部品２１の最大発熱量の約２倍になっている。また、第２電子部品２２内において、２つの半導体素子２０は、図５に示すように、冷却管３内の冷却媒体流れ方向に対して直列に配置されているとともに、冷却管３の幅方向における略中央部に配置されている。 In the present embodiment, as shown in FIG. 4, one semiconductor element 20 is disposed in one semiconductor module (electronic component 2) (hereinafter referred to as first electronic component 21), and shown in FIG. As described above, two types of electronic components 2 are provided such as one in which two semiconductor elements 20 are arranged in one semiconductor module (electronic component 2) (hereinafter referred to as second electronic component 22). The maximum heat generation amount of the second electronic component 22 is about twice the maximum heat generation amount of the first electronic component 21. In the second electronic component 22, the two semiconductor elements 20 are arranged in series with respect to the cooling medium flow direction in the cooling pipe 3 as shown in FIG. It is arrange | positioned in the approximate center part.

図６は、本第１実施形態に係る積層型冷却器１を模式的に示す断面図である。図６に示すように、第１連通部材４ａは、第１連通部材４ａの内部を上流側と下流側とに仕切る仕切部４３を備えている。そして、仕切部４３により、第１連通部材４ａの内部空間が、複数の冷却管３のうち上流側（紙面上側）に配置される上流側冷却管群３０Ａの一端および冷媒導入口４１と連通する上流側空間４Ａと、複数の冷却管３のうち下流側（紙面下側）に配置される下流側冷却管群３０Ｂの一端および冷媒排出口４２と連通する下流側空間４Ｂとに仕切られている。なお、仕切部４３が、本発明の仕切手段に相当している。 FIG. 6 is a cross-sectional view schematically showing the stacked cooler 1 according to the first embodiment. As shown in FIG. 6, the first communication member 4 a includes a partition portion 43 that partitions the inside of the first communication member 4 a into an upstream side and a downstream side. The partition portion 43 allows the internal space of the first communication member 4 a to communicate with one end of the upstream side cooling pipe group 30 A disposed on the upstream side (upper side in the drawing) of the plurality of cooling pipes 3 and the refrigerant inlet 41. The upstream space 4A is partitioned into one end of a downstream cooling tube group 30B disposed on the downstream side (lower side in the drawing) and the downstream space 4B communicating with the refrigerant discharge port 42 among the plurality of cooling tubes 3. . In addition, the partition part 43 is equivalent to the partition means of this invention.

これにより、冷却媒体は、冷媒導入口４１から第１連通部材４ａの上流側空間４Ａに流入し、上流側冷却管群３０Ａを通じて第２連通部材４ｂの内部空間に流れる。続いて、下流側冷却管群３０Ｂを経て第１連通部材４ａの下流側空間４Ｂに流入し、冷媒排出口４２から流出するというＵターン状に流れる。このように、冷却媒体が冷却管３内の冷媒通路３０を流通する間に、電子部品２との間で熱交換を行って、電子部品２を冷却するようになっている。 As a result, the cooling medium flows from the refrigerant inlet 41 into the upstream space 4A of the first communication member 4a, and flows into the internal space of the second communication member 4b through the upstream cooling pipe group 30A. Subsequently, it flows into the downstream space 4B of the first communication member 4a through the downstream cooling pipe group 30B and flows in a U-turn shape to flow out of the refrigerant discharge port 42. Thus, while the cooling medium flows through the refrigerant passage 30 in the cooling pipe 3, heat exchange is performed with the electronic component 2 to cool the electronic component 2.

図７は図１のＥ−Ｅ断面図で、図８は図１のＦ−Ｆ断面図である。図１、図７および図８に示すように、冷却管３の外殻プレート３１における長手方向両端部には、冷却管３の積層方向に張り出す張出部３４が形成されている。そして、隣接する冷却管３の張出部３４が、互いに冷却管３の積層方向に接合されるとともに、張出部３４の接合部に形成された後述する貫通孔３４１ｂによって連通することにより、連通部材４が構成されている。 7 is a cross-sectional view taken along the line EE in FIG. 1, and FIG. 8 is a cross-sectional view taken along the line FF in FIG. As shown in FIGS. 1, 7, and 8, overhang portions 34 that project in the stacking direction of the cooling tubes 3 are formed at both longitudinal ends of the outer shell plate 31 of the cooling tubes 3. The overhanging portions 34 of the adjacent cooling pipes 3 are joined to each other in the stacking direction of the cooling pipes 3 and communicated by through-holes 341b described later formed in the joining portions of the overhanging parts 34. A member 4 is configured.

より詳細には、図１の紙面下側に配置される第２外殻プレート３１２の張出部（以下、第２張出部３４２という）は、両端部が開口した略円筒状に形成されている。一方、一対の外殻プレート３のうち図１の紙面上側に配置される第１外殻プレート３１１の張出部（以下、第１張出部３４１という）は、冷却管３の積層方向における第１外殻プレート３１１に対向する側の端部が閉塞された円筒状（コップ状）に形成されている。以下、第１張出部３４１の、冷却管３の積層方向における第１外殻プレート３１１に対向する側にある閉塞された端部を、閉塞端部３４１ａという。この閉塞端部３４１ａには、図７に示すように、貫通孔３４１ｂが形成されている。 More specifically, the overhanging portion (hereinafter referred to as the second overhanging portion 342) of the second outer shell plate 312 disposed on the lower side in FIG. 1 is formed in a substantially cylindrical shape with both ends opened. Yes. On the other hand, of the pair of outer shell plates 3, the overhanging portion of the first outer shell plate 311 (hereinafter referred to as the first overhanging portion 341) disposed on the upper side in FIG. It is formed in a cylindrical shape (cup shape) in which the end on the side facing the outer shell plate 311 is closed. Hereinafter, the closed end portion of the first overhang portion 341 on the side facing the first outer shell plate 311 in the stacking direction of the cooling pipe 3 is referred to as a closed end portion 341a. As shown in FIG. 7, the closed end 341a is formed with a through hole 341b.

そして、隣接する冷却管３の張出部３４同士を、第１張出部３４１の外壁面と第２張出部３４２の内壁面とが接触した状態でろう付けにより接合することで、連通部材４が形成される。このとき、第１張出部３４１の閉塞端部３４１ａには貫通孔３４１ｂが形成されているため、複数の冷却管３を連通させることができる。 Then, by connecting the projecting portions 34 of the adjacent cooling pipes 3 by brazing while the outer wall surface of the first projecting portion 341 and the inner wall surface of the second projecting portion 342 are in contact with each other, the communication member 4 is formed. At this time, since the through hole 341b is formed in the closed end portion 341a of the first overhang portion 341, a plurality of cooling pipes 3 can be communicated with each other.

また、図８に示すように、第１連通部材４ａを構成する、すなわち図１中左側に配置される複数の第２張出部３４２のうち、１つの第２膨出部３４２の閉塞端部３４１ａは、貫通孔が設けられていない貫通孔非形成部３４１ｃとなっている。このため、貫通孔非形成部３４１ｃにおいて、隣接する第１、第２膨出部３４１、３４２同士は非連通状態となっている。したがって、第１連通部材４ａ内の空間は、貫通孔非形成部３４１ｃにより上流側と下流側とに仕切られている。すなわち、貫通孔非形成部３４１ｃにより、本実施形態の仕切部４３（図６参照）が構成されている。以上により、連通部材４および仕切部４３を容易に製造することができる。 Further, as shown in FIG. 8, the closed end portion of one second bulging portion 342 among the plurality of second overhanging portions 342 constituting the first communication member 4 a, that is, arranged on the left side in FIG. 1. 341a is a through hole non-forming part 341c in which no through hole is provided. For this reason, in the through-hole non-forming part 341c, the adjacent first and second bulging parts 341 and 342 are not in communication with each other. Therefore, the space in the first communication member 4a is partitioned into an upstream side and a downstream side by the through hole non-forming portion 341c. That is, the partition part 43 (refer FIG. 6) of this embodiment is comprised by the through-hole non-formation part 341c. By the above, the communication member 4 and the partition part 43 can be manufactured easily.

図６に戻り、本実施形態では、電子部品２は、冷却管３の第１、第２外殻プレート３１１、３１２のそれぞれに対して２個ずつ設けられている。換言すると、１枚の第１外殻プレート３１１に対して２個の電子部品２が設けられるとともに、１枚の第２外殻プレート３１２に対して２個の電子部品２が設けられている。各外殻プレート３１１、３１２に設けられた２つの電子部品２は、それぞれ冷却媒体の流れ方向に直列に配置されている。 Returning to FIG. 6, in this embodiment, two electronic components 2 are provided for each of the first and second outer shell plates 311 and 312 of the cooling pipe 3. In other words, two electronic components 2 are provided for one first outer shell plate 311, and two electronic components 2 are provided for one second outer shell plate 312. The two electronic components 2 provided on the outer shell plates 311 and 312 are respectively arranged in series in the flow direction of the cooling medium.

なお、積層型冷却器１においては、電子部品２を両面から冷却する必要がある。このため、外側冷却管３ｂにおいては、第１、第２外殻プレート３１１、３１２のうち、冷却管３の積層方向内側に配置される外殻プレートにのみ、電子部品２が当接するようになっている。すなわち、外側冷却管３ｂの第１、第２外殻プレート３１１、３１２のうち、冷却管３の積層方向外側に配置される外殻プレートには、電子部品２が配設されていない。 In the laminated cooler 1, it is necessary to cool the electronic component 2 from both sides. For this reason, in the outer cooling pipe 3b, the electronic component 2 comes into contact with only the outer shell plate arranged on the inner side in the stacking direction of the cooling pipe 3 among the first and second outer shell plates 311 and 312. ing. That is, of the first and second outer shell plates 311 and 312 of the outer cooling tube 3b, the electronic component 2 is not disposed on the outer shell plate disposed outside the cooling tube 3 in the stacking direction.

また、本実施形態では、第１連通部材４ａの仕切部４３に隣接する２つの冷却管（以下、仕切部側冷却管３ｃという）の間は、電子部品２が配置されない電子部品非配置領域５となっている。したがって、仕切部側冷却管３ｃの第１、第２外殻プレート３１１、３１２のうち、電子部品非配置領域５に対向する外殻プレートには、電子部品２が配設されていない。 In the present embodiment, the electronic component non-arrangement region 5 in which the electronic component 2 is not disposed between the two cooling pipes adjacent to the partition portion 43 of the first communication member 4a (hereinafter referred to as the partition portion side cooling pipe 3c). It has become. Therefore, the electronic component 2 is not disposed on the outer shell plate facing the electronic component non-arrangement region 5 among the first and second outer shell plates 311 and 312 of the partition portion side cooling pipe 3c.

続いて、上記構成の積層型冷却器１における複数の電子部品２の配置方法について説明する。積層型冷却器１には複数の電子部品２が配置されるが、第１電子部品２１より最大発熱量が大きい第２電子部品２２の配置位置を優先的に決定した後に、第１電子部品２１を配置するようにしている。 Then, the arrangement | positioning method of the some electronic component 2 in the laminated cooler 1 of the said structure is demonstrated. A plurality of electronic components 2 are arranged in the multilayer cooler 1, but after the arrangement position of the second electronic component 22 having the largest heat generation amount larger than that of the first electronic component 21 is determined preferentially, the first electronic component 21 is arranged. Is trying to arrange.

まず、第２電子部品２２を、第１外側冷却管３１ａに当接するように配置する。より詳細には、第２電子部品２２を、第１外側冷却管３１ａの第２外殻プレート３１２（すなわち、一対の外殻プレート３１１、３１２のうち隣接する内側冷却管３ｂに対向する側の外殻プレート３１２）に当接するように配置する。 First, the second electronic component 22 is disposed so as to contact the first outer cooling pipe 31a. More specifically, the second electronic component 22 is connected to the second outer shell plate 312 of the first outer cooling pipe 31a (that is, the outer side of the pair of outer shell plates 311 and 312 facing the adjacent inner cooling pipe 3b). It arrange | positions so that it may contact | abut to the shell plate 312).

次に、配置位置が決定されていない第２電子部品２２を、複数の冷却管３のうち、冷却管３内の冷却媒体の流速が最も大きくなる冷却管３に当接するように配置する。 Next, the second electronic component 22 whose arrangement position has not been determined is arranged so as to abut on the cooling pipe 3 among the plurality of cooling pipes 3 where the flow rate of the cooling medium in the cooling pipe 3 is the highest.

図９は、冷却管３の段数と冷却媒体の流量割合との関係を示す特性図である。図９に示すように、積層型冷却器１を構成する複数の冷却管３のうち、２段目の冷却管、すなわち冷媒導入口４１が接続されている外側冷却管３ａに隣接する内側冷却管３ｂは、冷却管内部における冷却媒体の流速が他の冷却管３に比べて大きくなっている。 FIG. 9 is a characteristic diagram showing the relationship between the number of stages of the cooling pipes 3 and the flow rate of the cooling medium. As shown in FIG. 9, among the plurality of cooling pipes 3 constituting the laminated cooler 1, the second stage cooling pipe, that is, the inner cooling pipe adjacent to the outer cooling pipe 3a to which the refrigerant inlet 41 is connected. In 3b, the flow rate of the cooling medium inside the cooling pipe is larger than that of the other cooling pipes 3.

したがって、本実施形態では、第２電子部品２２を、第１外側冷却管３１ａに隣接する内側冷却管３ｂに当接するように配置する。より詳細には、第２電子部品２２を、第１外側冷却管３１ａと、第１外側冷却管３１ａに隣接する内側冷却管３ｂとの間に配置する。 Therefore, in the present embodiment, the second electronic component 22 is disposed so as to contact the inner cooling pipe 3b adjacent to the first outer cooling pipe 31a. More specifically, the second electronic component 22 is disposed between the first outer cooling pipe 31a and the inner cooling pipe 3b adjacent to the first outer cooling pipe 31a.

次に、配置位置が決定されていない第２電子部品２２を、電子部品非配置領域５に隣接する仕切部側冷却管３ｃに当接するように配置する。より詳細には、第２電子部品２２を、仕切部側冷却管３ｃの一対の外殻プレート３１１、３１２のうち、電子部品非配置領域５に対向していない外殻プレートに当接するように配置する。 Next, the second electronic component 22 whose arrangement position has not been determined is arranged so as to abut against the partition-side cooling pipe 3 c adjacent to the electronic component non-arrangement region 5. More specifically, the second electronic component 22 is disposed so as to abut on the outer shell plate that does not face the electronic component non-arrangement region 5 out of the pair of outer shell plates 311 and 312 of the partition side cooling pipe 3c. To do.

次に、配置位置が決定されていない第２電子部品２２を、第２外側冷却管３２ａに当接するように配置する。より詳細には、第２電子部品２２を、第２外側冷却管３２ａの第１外殻プレート３１１（すなわち、一対の外殻プレート３１１、３１２のうち隣接する内側冷却管３ｂに対向する側の外殻プレート３１１）に当接するように配置する。 Next, the second electronic component 22 whose arrangement position is not determined is arranged so as to contact the second outer cooling pipe 32a. More specifically, the second electronic component 22 is connected to the first outer shell plate 311 of the second outer cooling pipe 32a (that is, the outer side of the pair of outer shell plates 311 and 312 facing the adjacent inner cooling pipe 3b). It arrange | positions so that it may contact | abut to the shell plate 311).

以上で複数の第２電子部品２２の配置位置が全て決定されたので、第１電子部品２１を、第２電子部品２２が配置されていない箇所に配置する。これにより、複数の電子部品２の全てが積層型冷却器１に搭載される。 Since the arrangement positions of the plurality of second electronic components 22 are all determined as described above, the first electronic component 21 is arranged at a location where the second electronic component 22 is not arranged. Thereby, all of the plurality of electronic components 2 are mounted on the multilayer cooler 1.

なお、本実施形態では、上流側冷却管群３０Ａと電子部品２とを交互に積層した上流側積層構造体と、下流側冷却官群３０Ｂと電子部品２とを交互に積層した下流側積層構造体とを別々に製造し、その後、２つの積層構造体を接合することにより積層型冷却器１を製造している。 In the present embodiment, an upstream laminated structure in which the upstream cooling tube group 30A and the electronic component 2 are alternately laminated, and a downstream laminated structure in which the downstream cooling officer group 30B and the electronic component 2 are alternately laminated. The laminated cooler 1 is produced by separately manufacturing the body and then joining the two laminated structures.

本実施形態のように、第１連通部材４ａの内部を上流側と下流側とに仕切る仕切部４３を設けることで、冷却媒体を積層型冷却器１の内部でＵターンするように流すことができる。これにより、積層型冷却器１に流入する冷却媒体の流量が固定であったとしも、冷却管３一つ当たりの冷却媒体の流量を増加させることができる。 Like this embodiment, by providing the partition part 43 which partitions the inside of the 1st communicating member 4a into an upstream side and a downstream side, a cooling medium can be flowed so that it may make a U-turn inside the multilayer cooler 1. FIG. it can. Thereby, even if the flow rate of the cooling medium flowing into the multilayer cooler 1 is fixed, the flow rate of the cooling medium per cooling pipe 3 can be increased.

しかしながら、冷却媒体が積層型冷却器１の内部でＵターンするように構成しただけでは、ターン後、すなわち仕切部４３より冷却媒体流れ下流側に配置された冷却管３の入口部における冷却媒体温度が極端に上昇してしまう。このため、仕切部４３より冷却媒体流れ下流側に配置された冷却管３、すなわち下流側冷却管群３０Ｂに属する冷却管３においては、電子部品２を十分に冷却することができない。 However, if the cooling medium is simply configured to make a U-turn inside the stacked cooler 1, the cooling medium temperature at the inlet of the cooling pipe 3 disposed after the turn, that is, downstream of the cooling medium flow from the partition 43. Will rise extremely. For this reason, in the cooling pipe 3 arrange | positioned downstream from the partition part 43 at the cooling medium flow, ie, the cooling pipe 3 which belongs to the downstream cooling pipe group 30B, the electronic component 2 cannot fully be cooled.

ところで、電子部品２の最大発熱量が、全ての電子部品２において一律でない場合がある。例えば、本実施形態のように、複数の電子部品２の一部において半導体素子２０の集積化を図っている場合、半導体素子２０が集積化された第２電子部品２２と、半導体素子２０が集積化されていない第１電子部品２１では、最大発熱量が異なっている。 By the way, the maximum heat generation amount of the electronic component 2 may not be uniform in all the electronic components 2. For example, when the semiconductor element 20 is integrated in a part of the plurality of electronic components 2 as in the present embodiment, the second electronic component 22 in which the semiconductor element 20 is integrated and the semiconductor element 20 are integrated. In the first electronic component 21 that is not converted, the maximum heat generation amount is different.

また、積層型冷却器１において、２つの外側冷却管３１ａ、３１ｂでは、片面のみが電子部品２と当接しているので、内側冷却管３ｂと比較して冷却性能が高くなる。さらに、仕切部４３より冷却媒体流れ上流側に配置された第１外側冷却管３１ａは、仕切部４３より冷却媒体流れ下流側に配置された第２外側冷却管３２ａと比較して冷却性能が高くなる。すなわち、仕切部４３より冷却媒体流れ上流側に配置された第１外側冷却管３１ａは、複数の冷却管３のうち最も冷却性能が高くなっている。 In the stacked cooler 1, since only one side of the two outer cooling pipes 31a and 31b is in contact with the electronic component 2, the cooling performance is higher than that of the inner cooling pipe 3b. Further, the first outer cooling pipe 31a arranged on the upstream side of the cooling medium flow from the partition part 43 has higher cooling performance than the second outer cooling pipe 32a arranged on the downstream side of the cooling medium flow from the partition part 43. Become. That is, the cooling performance of the first outer cooling pipe 31 a disposed on the upstream side of the cooling medium flow from the partition portion 43 is the highest among the cooling pipes 3.

したがって、本実施形態のように、複数種の電子部品２のうち最大発熱量が第１電子部品２１より大きい第２電子部品２２を、第１外側冷却管３１ａに当接するように優先的に配置することで、複数種の電子部品２のうち最大発熱量が最も大きくなる電子部品２２を、複数の冷却管３のうち最も冷却性能が高い冷却管３１ａに当接させることができる。このため、積層型冷却器１の基本構造を変更することなく、積層型冷却器１全体としての冷却性能を向上させることが可能となる。 Therefore, as in the present embodiment, among the plurality of types of electronic components 2, the second electronic component 22 having the maximum heat generation amount larger than the first electronic component 21 is preferentially disposed so as to contact the first outer cooling pipe 31 a. By doing so, the electronic component 22 having the largest maximum calorific value among the plurality of types of electronic components 2 can be brought into contact with the cooling tube 31 a having the highest cooling performance among the plurality of cooling tubes 3. For this reason, it becomes possible to improve the cooling performance of the multilayer cooler 1 as a whole without changing the basic structure of the multilayer cooler 1.

また、複数種の電子部品２のうち最大発熱量が第１電子部品２１より大きい第２電子部品２２を、複数の冷却管３のうち、仕切部４３より冷却媒体流れ上流側に配置され、かつ、内部を流れる冷却媒体の流速が他の冷却管３より大きくなる、すなわち熱伝達率が他の冷却管３より高くなる冷却管３に当接するように配置することで、積層型冷却器１全体としての冷却性能をより向上させることが可能となる。 Further, the second electronic component 22 having a maximum calorific value larger than the first electronic component 21 among the plurality of types of electronic components 2 is arranged on the upstream side of the cooling medium flow from the partition portion 43 in the plurality of cooling pipes 3, and By arranging the cooling medium 1 so that the flow velocity of the cooling medium flowing inside becomes larger than that of the other cooling pipes 3, that is, the cooling pipe 3 whose heat transfer coefficient is higher than that of the other cooling pipes 3, As a result, the cooling performance can be further improved.

ところで、仕切部４３に隣接する仕切側冷却管３ｃは、片面のみが電子部品２と当接するように構成されているので、他の内側冷却管３ｂと比較して冷却性能が高くなる。このため、複数種の電子部品２のうち最大発熱量が第１電子部品２１より大きい第２電子部品２２を、仕切側冷却管３ｃにおける電子部品非配置領域５に対向する側と反対側の主面３１１ａ、３１１ｂに当接するように優先的に配置することで、積層型冷却器１全体としての冷却性能をより向上させることが可能となる。 By the way, since the partition side cooling pipe 3c adjacent to the partition part 43 is comprised so that only one side may contact | abut the electronic component 2, cooling performance becomes high compared with the other inner side cooling pipe 3b. For this reason, among the plurality of types of electronic components 2, the second electronic component 22 having a maximum calorific value larger than the first electronic component 21 is the main side opposite to the side facing the electronic component non-arrangement region 5 in the partition side cooling pipe 3 c. By preferentially arranging so as to contact the surfaces 311a and 311b, it is possible to further improve the cooling performance of the stacked cooler 1 as a whole.

ところで、上述したように、外側冷却管３２ｂは、片面のみが電子部品２と当接するように構成されているので、内側冷却管３ｂと比較して冷却性能が高くなる。このため、複数種の電子部品２のうち最大発熱量が第１電子部品２１より大きい第２電子部品２２を、第２外側冷却管３２ａに当接するように優先的に配置することで、積層型冷却器１全体としての冷却性能をより向上させることが可能となる。 By the way, as described above, the outer cooling pipe 32b is configured such that only one surface is in contact with the electronic component 2, so that the cooling performance is higher than that of the inner cooling pipe 3b. For this reason, the second electronic component 22 having a maximum heat generation amount larger than the first electronic component 21 among the plurality of types of electronic components 2 is preferentially disposed so as to be in contact with the second outer cooling pipe 32a. It becomes possible to further improve the cooling performance of the cooler 1 as a whole.

ところで、積層型冷却器１は、冷却管３と電子部品２とを交互に積層した積層構造体を、冷却管３の積層方向外側から押圧しながらろう付けを行うことにより製造される。しかしながら、本実施形態のように、積層型冷却器１内に電子部品非配置領域５が設けられている場合、積層構造体を冷却管３の積層方向外側から押圧することが難しい。 By the way, the laminated cooler 1 is manufactured by brazing a laminated structure in which the cooling pipes 3 and the electronic components 2 are alternately laminated from the outside in the lamination direction of the cooling pipe 3. However, when the electronic component non-arrangement region 5 is provided in the stacked cooler 1 as in this embodiment, it is difficult to press the stacked structure from the outside in the stacking direction of the cooling pipe 3.

これに対し、本実施形態のように、上流側冷却管群３０Ａと電子部品２とを交互に積層した上流側積層構造体と、下流側冷却官群３０Ｂと電子部品２とを交互に積層した下流側積層構造体とを別々に製造した後、２つの積層構造体を接合することにより積層型冷却器１を製造することで、ろう付け時に冷却管３の積層方向外側から押圧することが可能となる。 On the other hand, as in the present embodiment, the upstream side laminated structure in which the upstream side cooling pipe group 30A and the electronic component 2 are alternately laminated, and the downstream side cooling officer group 30B and the electronic component 2 are alternately laminated. It is possible to press from the outside of the cooling pipe 3 in the stacking direction when brazing by manufacturing the stacked cooler 1 by manufacturing the downstream stacked structure separately and then joining the two stacked structures. It becomes.

（第２実施形態）
次に、本発明の第２実施形態について図１０に基づいて説明する。上記第１実施形態と同様の部分については同一の符号を付して説明を省略する。図１０は、本第２実施形態に係る積層型冷却器１を模式的に示す断面図である。 (Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. The same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. FIG. 10 is a cross-sectional view schematically showing the stacked cooler 1 according to the second embodiment.

図１０に示すように、本実施形態では、第２電子部品２２が、上流側冷却管群３０Ａに属する複数の冷却管３に当接するように配置されており、第１電子部品２１が、下流側冷却管群３０Ｂに属する複数の冷却管３に当接するように配置されている。 As shown in FIG. 10, in the present embodiment, the second electronic component 22 is disposed so as to contact the plurality of cooling tubes 3 belonging to the upstream cooling tube group 30 A, and the first electronic component 21 is disposed downstream. It arrange | positions so that it may contact | abut the some cooling pipe 3 which belongs to the side cooling pipe group 30B.

複数の冷却管３のうち仕切部４３より冷却媒体流れ上流側に配置された冷却管３（すなわち、上流側冷却管群３０Ａに属する複数の冷却管３）は、仕切部４３より冷却媒体流れ下流側に配置された冷却管３（すなわち、下流側冷却管群３０Ｂに属する複数の冷却管３）と比較して冷却性能が高くなる。このため、複数種の電子部品２のうち最大発熱量が第１電子部品２１より大きい第２電子部品２２を、仕切部４３より冷却媒体流れ上流側に配置された冷却管３に当接するように配置することで、積層型冷却器１全体としての冷却性能を向上させることが可能となる。 Among the plurality of cooling pipes 3, the cooling pipes 3 (that is, the plurality of cooling pipes 3 belonging to the upstream side cooling pipe group 30 A) arranged on the upstream side of the cooling medium flow from the partition portion 43 are downstream of the cooling medium flow from the partition portion 43. As compared with the cooling pipes 3 arranged on the side (that is, the plurality of cooling pipes 3 belonging to the downstream cooling pipe group 30B), the cooling performance is improved. For this reason, among the plurality of types of electronic components 2, the second electronic component 22 having a maximum calorific value larger than the first electronic component 21 is brought into contact with the cooling pipe 3 arranged on the upstream side of the cooling medium flow from the partition portion 43. By disposing, the cooling performance of the stacked cooler 1 as a whole can be improved.

（第３実施形態）
次に、本発明の第３実施形態について図１１に基づいて説明する。上記第１実施形態と同様の部分については同一の符号を付して説明を省略する。図１１は、本第３実施形態に係る積層型冷却器１を模式的に示す断面図である。 (Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. The same parts as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted. FIG. 11 is a cross-sectional view schematically showing the stacked cooler 1 according to the third embodiment.

図１１に示すように、本実施形態の冷媒排出口４２は、第２外側冷却管３２ａの長手方向における第２連通部材４ｂに接続される側の端部に設けられている。また、第２連通部材４ｂは、第２連通部材４ｂの内部を上流側と下流側とに仕切る仕切部４３を備えている。この仕切部４３は、第１連通部材４ａ内に設けられている仕切部４３よりも冷却媒体流れ下流側（紙面下側）に配置されている。したがって、本実施形態の積層型冷却器１は、電子部品非配置領域５を２つ備えている。 As shown in FIG. 11, the refrigerant discharge port 42 of the present embodiment is provided at an end portion on the side connected to the second communication member 4 b in the longitudinal direction of the second outer cooling pipe 32 a. Moreover, the 2nd communication member 4b is provided with the partition part 43 which partitions the inside of the 2nd communication member 4b into the upstream and the downstream. This partition part 43 is arrange | positioned rather than the partition part 43 provided in the 1st communication member 4a in the cooling-medium flow downstream (paper surface lower side). Therefore, the stacked cooler 1 of this embodiment includes two electronic component non-arrangement regions 5.

以下、第１連通部材４ａ内に設けられている仕切部４３を第１仕切部４３ａといい、第２連通部材４ａ内に設けられている仕切部４３を第２仕切部４３ｂという。また、複数の冷却管３のうち、第１仕切部４３ａより上流側（紙面上側）に配置されるものを上流側冷却管群３０Ａといい、第２仕切部４３ｂより下流側（紙面下側）に配置されるものを下流側冷却管群３０Ｂといい、第１仕切部４３ａより下流側（紙面下側）かつ第２仕切部４３ｂより上流側（紙面上側）に配置されるものを中間冷却管群３０Ｃという。 Hereinafter, the partition portion 43 provided in the first communication member 4a is referred to as a first partition portion 43a, and the partition portion 43 provided in the second communication member 4a is referred to as a second partition portion 43b. Of the plurality of cooling pipes 3, the pipe arranged upstream (first side of the paper) from the first partition 43 a is referred to as an upstream side cooling pipe group 30 A, and downstream (second lower side of the page) from the second partition 43 b. The downstream cooling pipe group 30B is referred to as the downstream cooling pipe group 30B, and the downstream cooling pipe group 30B is the downstream cooling pipe group 30B, and the downstream cooling pipe group 30B is the downstream cooling pipe group 30B. It is called group 30C.

第２仕切部４３ｂにより、第２連通部材４ｂの内部空間が、上流側冷却管群３０Ａの一端および中間冷却管群３０Ｃの一端と連通する上流側空間４Ｃと、下流側冷却管群３０Ｂの一端および冷媒排出口４２と連通する下流側空間４Ｄとに仕切られている。これにより、冷却媒体は、冷媒導入口４１から第１連通部材４ａの上流側空間４Ａに流入し、上流側冷却管群３０Ａを通じて第２連通部材４ｂの上流側空間４Ｃに流れる。続いて、中間冷却管群３０Ｃを経て第１連通部材４ａの下流側空間４Ｂに流入し、さらに下流側冷却管群３０Ｂを通じて第２連通部材４ｂの下流側空間４Ｄに流入し、冷媒排出口４２から流出するというＳターン状に流れる。 The second partition 43b allows the internal space of the second communication member 4b to communicate with one end of the upstream cooling pipe group 30A and one end of the intermediate cooling pipe group 30C, and one end of the downstream cooling pipe group 30B. And a downstream space 4 D communicating with the refrigerant discharge port 42. Thus, the cooling medium flows from the refrigerant inlet 41 into the upstream space 4A of the first communication member 4a, and flows through the upstream cooling pipe group 30A to the upstream space 4C of the second communication member 4b. Subsequently, the refrigerant flows into the downstream space 4B of the first communication member 4a through the intermediate cooling pipe group 30C, and further flows into the downstream space 4D of the second communication member 4b through the downstream cooling pipe group 30B. It flows in an S-turn shape that flows out of the water.

続いて、本実施形態の積層型冷却器１における複数の電子部品２の配置方法について説明する。 Then, the arrangement | positioning method of the some electronic component 2 in the multilayer cooler 1 of this embodiment is demonstrated.

まず、第２電子部品２２を、第１外側冷却管３１ａに当接するように配置する。より詳細には、第２電子部品２２を、第１外側冷却管３１ａの第２外殻プレート３１２（すなわち、一対の外殻プレート３１１、３１２のうち隣接する内側冷却管３ｂに対向する側の外殻プレート）に当接するように配置する。 First, the second electronic component 22 is disposed so as to contact the first outer cooling pipe 31a. More specifically, the second electronic component 22 is connected to the second outer shell plate 312 of the first outer cooling pipe 31a (that is, the outer side of the pair of outer shell plates 311 and 312 facing the adjacent inner cooling pipe 3b). (Shell plate)

このように構成された積層型冷却器１においても、上記第１実施形態と同様の効果を得ることができる。 Also in the laminated cooler 1 configured in this way, the same effect as in the first embodiment can be obtained.

（第４実施形態）
次に、本発明の第４実施形態について図１２に基づいて説明する。上記第３実施形態と同様の部分については同一の符号を付して説明を省略する。図１２は、本第４実施形態に係る積層型冷却器１を模式的に示す断面図である。 (Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. The same parts as those in the third embodiment are denoted by the same reference numerals and description thereof is omitted. FIG. 12 is a cross-sectional view schematically showing the stacked cooler 1 according to the fourth embodiment.

図１２に示すように、本実施形態では、第２電子部品２２が、上流側冷却管群３０Ａに属する複数の冷却管３に当接するように配置されており、第１電子部品２１が、下流側冷却管群３０Ｂに属する複数の冷却管３に当接するように配置されている。さらに、第２電子部品３３が、中間冷却管群３０Ｃに属する複数の冷却管３のうち最上流側に配置されている冷却管３に当接するように配置されており、第１電子部品２１が、中間冷却管群３０Ｃに属する複数の冷却管３のうち最上流側以外に配置されている冷却管３に当接するように配置されている。 As shown in FIG. 12, in the present embodiment, the second electronic component 22 is disposed so as to contact the plurality of cooling tubes 3 belonging to the upstream cooling tube group 30A, and the first electronic component 21 is arranged downstream. It arrange | positions so that it may contact | abut the some cooling pipe 3 which belongs to the side cooling pipe group 30B. Further, the second electronic component 33 is arranged so as to abut on the cooling pipe 3 arranged on the most upstream side among the plurality of cooling pipes 3 belonging to the intermediate cooling pipe group 30C, and the first electronic component 21 is arranged. The plurality of cooling pipes 3 belonging to the intermediate cooling pipe group 30C are arranged so as to abut on the cooling pipes 3 arranged on the other side than the most upstream side.

複数の冷却管３のうち、上流側冷却管群３０Ａに属する複数の冷却管３は、下流側冷却管群３０Ｂに属する複数の冷却管３と比較して冷却性能が高くなる。また、中間冷却管群３０Ｃに属する複数の冷却管３のうち最上流側に配置されている冷却管３は、片面のみが電子部品２と当接するように構成されているので、中間冷却管群３０Ｃに属する他の内側冷却管３ｂと比較して冷却性能が高くなる。 Among the plurality of cooling pipes 3, the cooling pipes 3 belonging to the upstream side cooling pipe group 30A have higher cooling performance than the plurality of cooling pipes 3 belonging to the downstream side cooling pipe group 30B. Further, the cooling pipe 3 arranged on the most upstream side among the plurality of cooling pipes 3 belonging to the intermediate cooling pipe group 30C is configured such that only one surface is in contact with the electronic component 2, so that the intermediate cooling pipe group The cooling performance is higher than that of the other inner cooling pipe 3b belonging to 30C.

このため、複数種の電子部品２のうち最大発熱量が第１電子部品２１より大きい第２電子部品２２を、仕切部４３より冷却媒体流れ上流側に配置された冷却管３、および中間冷却管群３０Ｃに属する複数の冷却管３のうち最上流側に配置されている冷却管３に当接するように配置することで、積層型冷却器１全体としての冷却性能を向上させることが可能となる。 For this reason, among the plurality of types of electronic components 2, the second electronic component 22 having a maximum calorific value larger than the first electronic component 21, the cooling pipe 3 disposed on the upstream side of the cooling medium flow from the partition portion 43, and the intermediate cooling pipe By arranging the plurality of cooling pipes 3 belonging to the group 30C so as to come into contact with the cooling pipe 3 arranged on the most upstream side, it is possible to improve the cooling performance of the stacked cooler 1 as a whole. .

（他の実施形態）
なお、上記各実施形態では、電子部品２の最大発熱量が全ての電子部品２において一律でない場合として、半導体素子２０が集積化された第２電子部品２２と、半導体素子２０が集積化されていない第１電子部品２１とを用いた例について説明したが、これに限らず、電子部品２を、昇圧コンバータと複数のモータジェネレータとを備える自動車用インバータの一部を構成する半導体モジュールとしてもよい。この場合も、昇圧用コンバータや複数のモータジェネレータに搭載される半導体モジュールの最大発熱量がそれぞれ異なっているため、最大発熱量が全ての電子部品２において一律でなくなる。 (Other embodiments)
In each of the embodiments described above, the second electronic component 22 in which the semiconductor elements 20 are integrated and the semiconductor element 20 are integrated, assuming that the maximum heat generation amount of the electronic components 2 is not uniform in all the electronic components 2. However, the present invention is not limited thereto, and the electronic component 2 may be a semiconductor module that constitutes a part of an automotive inverter including a boost converter and a plurality of motor generators. . Also in this case, since the maximum heat generation amounts of the semiconductor modules mounted on the boost converter and the plurality of motor generators are different, the maximum heat generation amount is not uniform in all the electronic components 2.

また、上記各実施形態では、電子部品２を、冷却管３の第１、第２外殻プレート３１１、３１２のそれぞれに対して２個ずつ設けた例について説明したが、これに限らず、電子部品２を、冷却管３の第１、第２外殻プレート３１１、３１２のそれぞれに対して３個以上ずつ設けてもよい。 Further, in each of the above embodiments, the example in which two electronic components 2 are provided for each of the first and second outer shell plates 311 and 312 of the cooling pipe 3 has been described. Three or more parts 2 may be provided for each of the first and second outer shell plates 311 and 312 of the cooling pipe 3.

第１実施形態に係る積層型冷却器１を示す正面図である。It is a front view which shows the lamination type cooler 1 which concerns on 1st Embodiment. 図１のＡ−Ａ断面図である。It is AA sectional drawing of FIG. 図１のＢ−Ｂ断面図である。It is BB sectional drawing of FIG. 図１のＣ−Ｃ断面図である。It is CC sectional drawing of FIG. 図１のＤ−Ｄ断面図である。It is DD sectional drawing of FIG. 第１実施形態に係る積層型冷却器１を模式的に示す断面図である。1 is a cross-sectional view schematically showing a stacked cooler 1 according to a first embodiment. 図１のＥ−Ｅ断面図である。It is EE sectional drawing of FIG. 図１のＦ−Ｆ断面図である。It is FF sectional drawing of FIG. 冷却管３の段数と冷却媒体の流量割合との関係を示す特性図である。It is a characteristic view which shows the relationship between the number of stages of the cooling pipe 3, and the flow rate ratio of a cooling medium. 第２実施形態に係る積層型冷却器１を模式的に示す断面図である。It is sectional drawing which shows typically the multilayer cooler 1 which concerns on 2nd Embodiment. 第３実施形態に係る積層型冷却器１を模式的に示す断面図である。It is sectional drawing which shows typically the laminated | stacked cooler 1 which concerns on 3rd Embodiment. 第４実施形態に係る積層型冷却器１を模式的に示す断面図である。It is sectional drawing which shows typically the multilayer cooler 1 which concerns on 4th Embodiment.

Explanation of symbols

２、２１、２２…電子部品（発熱体）、３…冷却管、３ｂ…内側冷却管、３ｃ…仕切側冷却管、４ａ、４ｂ…連通部材、５…電子部品非配置領域（発熱体非配置領域）、３０…冷媒通路、３１ａ、３２ａ…外側冷却管、３４…張出部、４３…仕切部（仕切手段）、３１１ａ、３１１ｂ…主面、３４１ｂ…貫通孔、３４１ｃ…貫通孔非形成部。 2, 21, 22 ... electronic parts (heating elements), 3 ... cooling pipes, 3b ... inner cooling pipes, 3c ... partition side cooling pipes, 4a, 4b ... communication members, 5 ... electronic parts non-arrangement area (heating elements non-arrangement) Area), 30 ... refrigerant passage, 31a, 32a ... outer cooling pipe, 34 ... overhanging part, 43 ... partitioning part (partitioning means), 311a, 311b ... main surface, 341b ... through hole, 341c ... through hole non-forming part .

Claims

A stacked cooler for cooling a plurality of heating elements (2) from both sides,
A plurality of cooling pipes (3) formed in a flat shape having a main surface (311a, 311b) in contact with the heating element (2) and a refrigerant passage (30) through which a cooling medium flows;
First and second communicating members (4a, 4b) disposed at both longitudinal ends of the cooling pipe (3) and communicating with the plurality of cooling pipes (3);
Partition means (43) for partitioning the inside of at least one communication member (4a) of the first and second communication members (4a, 4b) into an upstream side and a downstream side;
The plurality of heating elements (2) are composed of a plurality of types of heating elements (21, 22) having different maximum heat generation amounts,
The plurality of cooling pipes (3) are arranged in a stacked manner so that the heating elements (2) arranged alternately with the cooling pipe (3) can be sandwiched from both sides, and are arranged at both ends in the stacking direction. Two outer cooling pipes (31a, 32a ) and a plurality of inner cooling pipes (3b) disposed between the two outer cooling pipes (31a, 32a ),
Of the plurality of types of heat generating elements (2), the heat generating element (22) having a maximum calorific value larger than that of the other heat generating elements (21) is the two of the two outer cooling pipes (31a, 32a ). A stacked type cooler that is preferentially disposed so as to contact the outer cooling pipe (31a) disposed upstream of the cooling medium flow from the partitioning means (43) ;
Of the plurality of inner cooling pipes (3b), between the two partition-side cooling pipes (3c) adjacent to the partition means (43), the heating element non-arrangement region (5) in which the heating element (2) is not arranged. )
Among the plurality of types of heating elements (2), the heating element (22) having a maximum heat generation amount relatively larger than that of the other heating elements (21) is not disposed in the partition side cooling pipe (3c). A stacked cooler preferentially disposed so as to abut on the main surface (311a, 311b) opposite to the side facing the region (5) .

A stacked cooler for cooling a plurality of heating elements (2) from both sides,
A plurality of cooling pipes (3) formed in a flat shape having a main surface (311a, 311b) in contact with the heating element (2) and a refrigerant passage (30) through which a cooling medium flows;
First and second communicating members (4a, 4b) disposed at both longitudinal ends of the cooling pipe (3) and communicating with the plurality of cooling pipes (3);
Partition means (43) for partitioning the inside of at least one communication member (4a) of the first and second communication members (4a, 4b) into an upstream side and a downstream side;
The plurality of heating elements (2) are composed of a plurality of types of heating elements (21, 22) having different maximum heat generation amounts,
The plurality of cooling pipes (3) are arranged in a stacked manner so that the heating elements (2) arranged alternately with the cooling pipe (3) can be sandwiched from both sides, and are arranged at both ends in the stacking direction. It consists of two outer cooling pipes (31a, 32a) and a plurality of inner cooling pipes (3b) arranged between the two outer cooling pipes (31a, 32a),
Of the plurality of types of heat generating elements (2), the heat generating element (22) having a maximum calorific value relatively larger than that of the other heat generating elements (21) is the two of the two outer cooling pipes (31a, 32a). A stacked type cooler that is preferentially disposed so as to contact the outer cooling pipe (31a) disposed upstream of the cooling medium flow from the partitioning means (43);
Overhang portions (34) projecting in the stacking direction of the cooling pipe (3) are formed at both ends in the longitudinal direction of the cooling pipe (3),
The overhang portions (34) of the adjacent cooling pipes (3) are joined to each other in the stacking direction of the cooling pipe (3), and through holes formed in the joint portion of the overhang portions (34) The communication member (4) is configured by communicating with (341b),
In the partitioning means (43), a joint portion of a part of the overhang portion (34) is a through hole non-formed portion (341c) where the through hole (341b) is not formed, and the adjacent overhang portion (34) product layer type cooler you characterized in that it is constituted by the each other in a non-communicating state.

Of the plurality of inner cooling pipes (3b), between the two partition-side cooling pipes (3c) adjacent to the partition means (43), the heating element non-arrangement region (5) in which the heating element (2) is not arranged. )
Among the plurality of types of heating elements (2), the heating element (22) having a maximum heat generation amount relatively larger than that of the other heating elements (21) is not disposed in the partition side cooling pipe (3c). 3. The stacked cooler according to claim 2 , wherein the stacked cooler is preferentially disposed so as to come into contact with the main surface (311 a, 311 b) opposite to the side facing the region (5).

Of the plurality of types of heating elements (2), a heating element (22) having a maximum calorific value relatively larger than that of the other heating elements (21) is the partitioning means of the plurality of cooling pipes (3). (43) is arranged on the upstream side of the cooling medium flow, and abuts against the cooling pipe (3) in which the flow velocity of the cooling medium flowing inside becomes relatively larger than that of the other cooling pipes (3). The stacked cooler according to any one of claims 1 to 3, wherein the stacked cooler is preferentially arranged.

Of the plurality of types of heat generating elements (2), the heat generating element (22) having a maximum calorific value larger than that of the other heat generating elements (21) is the two of the two outer cooling pipes (31a, 32a ). to any one of claims 1 to 4, characterized in that is preferentially positioned so as to contact the outer cooling tube that is disposed on the cooling medium flow downstream of the divider means (43) (32a) The laminated cooler described.

Of the plurality of types of heating elements (2), a heating element (22) having a relatively large maximum heating value than the other heating elements (21) is located upstream of the partitioning means (43) in the cooling medium flow. The stacked cooler according to any one of claims 1 to 4 , wherein the stacked cooler is preferentially disposed so as to abut on the disposed cooling pipe (3).