CN105865089A - Pin-fin wall surface micro-channel heat exchanger - Google Patents
Pin-fin wall surface micro-channel heat exchanger Download PDFInfo
- Publication number
- CN105865089A CN105865089A CN201610245384.2A CN201610245384A CN105865089A CN 105865089 A CN105865089 A CN 105865089A CN 201610245384 A CN201610245384 A CN 201610245384A CN 105865089 A CN105865089 A CN 105865089A
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- China
- Prior art keywords
- pin
- heat exchanger
- pin rib
- fin
- rib
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/02—Details of evaporators
- F25B2339/024—Evaporators with refrigerant in a vessel in which is situated a heat exchanger
- F25B2339/0241—Evaporators with refrigerant in a vessel in which is situated a heat exchanger having plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/04—Details of condensers
- F25B2339/042—Details of condensers of pcm condensers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention belongs to the technical field of micro-scale phase-change heat transfer and discloses a pin-fin wall surface micro-channel heat exchanger. The heat exchanger comprises a first silicon substrate and a second silicon substrate, wherein the first silicon substrate and the second silicon substrate are bonded together; a heat exchanger inlet and a heat exchanger outlet are formed in the second silicon substrate, and a pin-fin wall surface micro-channel is processed on the surface of the second silicon substrate and is located between the heat exchanger inlet and the heat exchanger outlet; the pin-fin wall surface micro-channel is divided into 12 optical channels by 11 step pin-fin walls, and the step pin-fin walls are composed of a plurality of pin-fin columns and comprise pin-fin dense areas and pin-fin loose areas, wherein the pin-fin loose areas are located on the two sides of the pin-fin dense areas. The heat exchanger solves the problem of unstable flowing in the traditional micro-channel phase-change heat transfer process, has the ultra-stable operation wall temperature in the two-phase heat exchange process, integrates the functions of an evaporator and a condenser and has natural advantages in product commercialization.
Description
Technical field
The invention belongs to minute yardstick phase-change heat transfer technical field, be specifically related to a kind of pin rib wall micro-channel heat exchanger.
Background technology
When in conventional microchannel heat exchanger, fluid is heated and undergoes phase transition, owing to passage water conservancy diameter is small, after bubble produces
Can only the most upstream or downstream expansion, here it is occur what biphase diabatic process commonly encountered " to be subject in microchannel
Limit bubble " phenomenon.The channel size i.e. reduced weakens the 3D effect of passage, makes the easiest blocking channel of bubble of generation,
Flow instability serious in causing single channel.It addition, the micro-channel heat exchanger with using value often uses and UNICOM
, inherently there is various flow rate solution under same drive ram between parallel port, add the impact of " limited bubble " in the form in road,
In making microchannel, two-phase flow becomes extremely unstable.
Under the load of same hot-fluid, the instability of flowing directly results in the erratic fluctuation of cooling wall temperature.When in the face of precision
During the accurate temperature controlling condition that experimentation needs, conventional microchannel cannot provide stable wall temperature.Stable in order to develop high-performance
Micro-cooling system, need badly research and development a kind of micro-channel heat exchanger being capable of precise and stable temperature control.
Summary of the invention
It is an object of the invention to provide a kind of pin rib wall regulation and control two phase flow signals and reach the microchannel of accurate temperature controlling effect
Heat exchanger, the technical scheme taked is as follows:
A kind of pin rib wall micro channel heat exchanger, described heat exchanger includes the first silicon chip 1 and the second silicon chip 2,
First silicon chip 1 and the second silicon chip 2 use high-voltage electrostatic field bonding techniques to be bonded together；
It is machined with heat exchanger entrance 4 and heat exchanger outlet 6, table by dry etching method on described second silicon chip 2
Face is machined with pin rib wall microchannel by MEMS technology, and pin rib wall microchannel is positioned at heat exchanger entrance 4 and heat exchange
Between device outlet 6；Described pin rib wall microchannel is separated into 12 optical channels 9 by 11 step pin rib walls 3；Described step pin rib
Wall 3 is made up of a large amount of single pin rib posts 5, and including pin rib compact district 7 and pin rib puffs 8, it is intensive that pin rib puffs 8 are positioned at pin rib
The both sides in district 7；Described high 75 μm of pin rib post 5, cross section is square, and the cross section length of side is 15 μm.
Wide 336 μm of described step pin rib wall 3, high 75 μm；Distance between adjacent two the pin rib posts 5 in pin rib compact district 7 is 5
μm, overall width 116 μm, the distance between adjacent two the pin rib posts 5 in pin rib puffs 8 is 15 μm, and overall width is 220 μm.
Wide 164 μm of described optical channel 9, deep 75 μm.
The thickness of described second silicon chip 2 is 400 μm.
Described heat exchanger realizes the principle of overstable operation wall temperature: pin rib wall has substantial amounts of corner angle, for passage
The nucleation boiling of interior fluid provides a large amount of coring caves, and the bubble of generation is close from the pin rib of step pin rib wall due to the traction of capillary force
Ji Qu swims automatically to a certain optical channel.Cause its pressure slightly to rise due to bubble expansion in this optical channel, make step pin rib wall
Fluid flow to adjacent optical channel, change the dissipation direction of bubble, be thusly-formed bubble in adjacent optical channel alternately
Harmomegathus.
In flow boiling heat transfer, heat transfer coefficient is relevant to biphase heat transfer area, and the alternately harmomegathus of bubble means equivalence
Biphase heat transfer area alternate so that the localized heat transfer effect of adjacent optical channel does small floating, wall temperature around equilibrium point
Along with the floating of optical channel local heat transfer coefficient and minor fluctuations, it is achieved the overstable operation of wall temperature.
The invention have the benefit that
1, when described heat exchanger overcomes conventional microchannel phase-change heat transfer, " limited bubble " blocking channel causes the most not
The problem of steady flow, and then decrease owing to there is various flow solution between conventional tubeless wall parallel port, and in gateway
Produce flow hands over the mixed unstability causing parallel port；In optical channel, gas-liquid two-phase interface presents " high-frequency fluctuation " feature,
When making biphase heat exchange, channel wall temperature fluctuation amplitude is less than 0.1 DEG C, has overstable operation wall temperature, for suppression flow instabilities
Provide new direction；
2, in pin rib wall microchannel, the friendship of fluid is mixed has promoted augmentation of heat transfer, and the design for high-performance heat exchanger provides newly
Thinking；
3, described heat exchanger integrates vaporizer and condenser function, is especially advantageous for batch production in the industrial production
Exchange with product, in product commercialization, there is inherent advantage.
Accompanying drawing explanation
Fig. 1 is the schematic appearance of described heat exchanger.
Fig. 2 is the internal structure schematic diagram of described heat exchanger.
Fig. 3 is the structural representation of step pin rib wall.
Fig. 4 be during boiling heat transfer bubble from the growth of pin rib compact district the schematic diagram of dissipation laterally.
Fig. 5 is gas-liquid two-phase flow pattern figure in optical channel；Wherein, Pg,i, Pf,iIt is saturated in bubble in i-th optical channel respectively
Gas pressure fluid pressure outer with bubble, Pg,i+1, Pf,i+1Be respectively in i+1 optical channel in bubble saturated gas pressure with
The outer fluid pressure of bubble.
In figure, label is respectively as follows: 1-the first silicon chip, 2-the second silicon chip, 3-step pin rib wall, 4-heat exchanger entrance, 5-
Pin rib post, 6-heat exchanger exit, 7-pin rib compact district, 8-pin rib puffs, 9-optical channel.
Detailed description of the invention
The invention will be further described with embodiment below in conjunction with the accompanying drawings, but protection scope of the present invention is not limited to this.
Embodiment
A kind of pin rib wall micro channel heat exchanger, described heat exchanger includes the first silicon chip 1 and the second silicon chip 2,
First silicon chip 1 and the second silicon chip 2 use high-voltage electrostatic field bonding techniques to be bonded together；
It is machined with heat exchanger entrance 4 and heat exchanger outlet 6, table by dry etching method on described second silicon chip 2
Face is machined with pin rib wall microchannel by MEMS technology, and pin rib wall microchannel is positioned at heat exchanger entrance 4 and heat exchange
Between device outlet 6；Described pin rib wall microchannel is separated into 12 optical channels 9 by 11 step pin rib walls 3；Described step pin rib
Wall 3 is made up of a large amount of single pin rib posts 5, and including pin rib compact district 7 and pin rib puffs 8, it is intensive that pin rib puffs 8 are positioned at pin rib
The both sides in district 7；Described high 75 μm of pin rib post 5, cross section is square, and the cross section length of side is 15 μm.
Wide 336 μm of described step pin rib wall 3, high 75 μm；Distance between adjacent two the pin rib posts 5 in pin rib compact district 7 is 5
μm, overall width 116 μm, the distance between adjacent two the pin rib posts 5 in pin rib puffs 8 is 15 μm, and overall width is 220 μm.
Wide 164 μm of described optical channel 9, deep 75 μm.
The thickness of described second silicon chip 2 is 400 μm.
Gas liquid two-phase flow is included by described heat exchanger with the step coupling regulation and stability regulation of conducting heat:
(1) cold-producing medium at heat exchanger entrance carries out phase-change heat transfer after accepting the heat that enough thermals source distribute, trapezoidal
The substantial amounts of corner angle in pin rib wall pin rib compact district are that cold-producing medium provides substantial amounts of boiling nucleation cave, and bubble produces from boiling nucleation cave
With grow up, under the effect of capillary pull strength and evaporation momentum force, the bubble of pin rib compact district during growing up constantly to
The optical channel dissipation of both sides.As shown in Figure 4, first bubble produces bubble dissipation process in the boiling nucleation cave in somewhere, pin rib compact district
Raw, absorb bubble after the heat of step pin rib wall and start gradually to grow up；Bubble in growth process on the one hand by edge
The impulsive force of flow direction upstream fluid, on the one hand by the little space of pin rib wall to the capillary pull strength of large space, make bubble from
The pin rib compact district dissipation of step pin rib wall to optical channel, completes the passive regulation and control of two phase flow signals in heat exchanger.
(2) bubble is after a certain sidelight passage dissipation, and based on thin film convection heat transfer' heat-transfer by convection mechanism, bubble is at evaporation momentum force
Effect is lower to increase rapidly, and on the one hand the bubble of increase makes the fluid temperature (F.T.) in this optical channel raise, saturation pressure raises, the opposing party
Face makes in this optical channel the area of section shared by liquid reduce, and effective water conservancy diameter of liquid flowing reduces, and causes liquid phase resistance
Increase；Force action in terms of the two makes fluid in this optical channel stride across trapezoidal pin rib wall and flows to adjacent optical channel, increases
Use is mixed up in the friendship of Liao Zhenlei district fluid, enhances heat exchange, balances the pressure reduction between adjacent optical channel simultaneously, makes adjacent optical channel
Cross section air content presents reverse property in time.Fig. 5 is gas-liquid two-phase flow pattern figure in optical channel, and gas phase is collected in optical channel, root
P is had according to pressure balanceg,i+Pf,i=Pg,i+1+Pf,i+1；According to The Ideal-Gas Equation, it is assumed that gas density is constant, saturated air
Body pressure is the monotropic function of saturation temperature, and the saturation temperature of same section is suitable, therefore satisfying in bubble in adjacent optical channel
With gas pressure Pg,iAnd Pg,i+1Equal；Meanwhile, the outer fluid pressure of bubble in i-th optical channelμ in formulaf-
Hydrodynamic viscosity, L-bubble length, mf-fluid mass flow rate, Deff-effective flow diameter；When bubble width in i optical channel
During increase, the effectively circulation diameter D of liquid in this optical channeleffReducing, resistance increases, and causes Pf,i>Pf,i+1, make liquid from i-th
Individual optical channel flows to i+1 optical channel, realizes pressure mixed with the friendship of liquid in adjacent optical channel, and liquid friendship radially is mixed to increase
The stability that heat exchanger runs it has been greatly reinforced while biphase heat transfer coefficient.
(3) when certain optical channel cross section air content increases, Local Condensing Heat Transfer Coefficients increases, and wall temperature declines, when cross section air content
During minimizing, local heat transfer coefficient reduces, and wall temperature rises；In the most same optical channel, air content and wall temperature are in time in inverse change,
The wall temperature and the interface air content that make same optical channel present reverse property over time；Adjacent optical channel cross section air content is at any time
Between present reverse property, the wall temperature of same optical channel and cross section air content and present in reverse property and optical channel two over time
The high-frequency fluctuation of boundary jointly completes turbulent flow and heat transfer regulation and runs the superregulated property of wall temperature.
Claims (4)
1. a pin rib wall micro channel heat exchanger, it is characterised in that described micro channel heat exchanger includes the first silicon chip
(1) and the second silicon chip (2), the first silicon chip (1) and the second silicon chip (2) use high-voltage electrostatic field bonding techniques to be bonded in one
Rise；
Heat exchanger entrance (4), heat exchanger outlet (6) and pin rib wall microchannel it is provided with on described second silicon chip (2),
Pin rib wall microchannel is positioned between heat exchanger entrance (4) and heat exchanger outlet (6)；Described pin rib wall microchannel is by 11
Bar step pin rib wall (3) separates into 12 optical channels (9)；Described step pin rib wall (3) is made up of a large amount of single pins rib post (5),
Including pin rib compact district (7) and pin rib puffs (8), pin rib puffs (8) are positioned at the both sides of pin rib compact district (7)；Described pin
High 75 μm of rib post (5), cross section is square, and the cross section length of side is 15 μm.
A kind of pin rib wall micro channel heat exchanger the most according to claim 1, it is characterised in that described step pin rib wall
(3) wide 336 μm, high 75 μm；Distance between adjacent two pins rib post (5) in pin rib compact district (7) is 5 μm, overall width 116 μm,
Distance between adjacent two pins rib post (5) in pin rib puffs (8) is 15 μm, and overall width is 220 μm.
A kind of pin rib wall micro channel heat exchanger the most according to claim 1, it is characterised in that described optical channel (9)
Wide 164 μm, deep 75 μm.
A kind of pin rib wall micro channel heat exchanger the most according to claim 1, it is characterised in that described second silicon chip
(2) thickness is 400 μm.
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| CN201610245384.2A CN105865089B (en) | 2016-04-19 | 2016-04-19 | A kind of pin rib wall surface micro-channel heat exchanger |
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| CN201610245384.2A CN105865089B (en) | 2016-04-19 | 2016-04-19 | A kind of pin rib wall surface micro-channel heat exchanger |
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| Publication Number | Publication Date |
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| CN105865089A true CN105865089A (en) | 2016-08-17 |
| CN105865089B CN105865089B (en) | 2018-05-25 |
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Cited By (8)
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| CN108562067A (en) * | 2018-04-17 | 2018-09-21 | 华南理工大学 | Electric field-enhanced refrigerant boiling heat transfer micro-channel heat exchanger based on needle electrode |
| CN109000488A (en) * | 2017-09-14 | 2018-12-14 | 华北电力大学 | A kind of dot matrix heat exchanger |
| US11199112B2 (en) | 2017-08-18 | 2021-12-14 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Method and system for heat recovery |
| CN115474415A (en) * | 2022-10-14 | 2022-12-13 | 苏州浪潮智能科技有限公司 | Radiator and server |
| US11828548B2 (en) | 2021-01-08 | 2023-11-28 | Fang-Shou LEE | Two-phase immersion-cooling micro-grooved boiler |
| CN115451750B (en) * | 2022-09-22 | 2024-06-28 | 安徽工业大学 | Passive grid microstructure for enhancing boiling heat transfer |
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Cited By (11)
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| US11199112B2 (en) | 2017-08-18 | 2021-12-14 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Method and system for heat recovery |
| CN109000488A (en) * | 2017-09-14 | 2018-12-14 | 华北电力大学 | A kind of dot matrix heat exchanger |
| CN109000488B (en) * | 2017-09-14 | 2024-05-28 | 华北电力大学 | Dot matrix heat exchanger |
| CN108225079A (en) * | 2017-12-26 | 2018-06-29 | 华北电力大学 | A kind of non-homogeneous wetability silicon substrate microchannel phase-change heat-exchanger of top unicom |
| CN108521745A (en) * | 2018-03-12 | 2018-09-11 | 上海卫星工程研究所 | The efficient phase-change energy storage for adapting to the big heat spreader of pulsed is heat sink |
| CN108562067A (en) * | 2018-04-17 | 2018-09-21 | 华南理工大学 | Electric field-enhanced refrigerant boiling heat transfer micro-channel heat exchanger based on needle electrode |
| CN108562067B (en) * | 2018-04-17 | 2023-12-05 | 华南理工大学 | Electric field enhanced refrigerant boiling heat transfer micro-channel heat exchanger based on needle electrode |
| US11828548B2 (en) | 2021-01-08 | 2023-11-28 | Fang-Shou LEE | Two-phase immersion-cooling micro-grooved boiler |
| CN115451750B (en) * | 2022-09-22 | 2024-06-28 | 安徽工业大学 | Passive grid microstructure for enhancing boiling heat transfer |
| CN115474415A (en) * | 2022-10-14 | 2022-12-13 | 苏州浪潮智能科技有限公司 | Radiator and server |
| CN115474415B (en) * | 2022-10-14 | 2024-01-19 | 苏州浪潮智能科技有限公司 | Radiator and server |
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| CN105865089B (en) | 2018-05-25 |
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