CN101541159A - Boiling heat transfer device of electronic component - Google Patents

Boiling heat transfer device of electronic component Download PDF

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Publication number
CN101541159A
CN101541159A CN200910022072A CN200910022072A CN101541159A CN 101541159 A CN101541159 A CN 101541159A CN 200910022072 A CN200910022072 A CN 200910022072A CN 200910022072 A CN200910022072 A CN 200910022072A CN 101541159 A CN101541159 A CN 101541159A
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China
Prior art keywords
heat transfer
boiling
electronic component
square column
boiling heat
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Pending
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CN200910022072A
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Chinese (zh)
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魏进家
薛艳芳
方嘉宾
高秀峰
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Xian Jiaotong University
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Xian Jiaotong University
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Priority to CN200910022072A priority Critical patent/CN101541159A/en
Publication of CN101541159A publication Critical patent/CN101541159A/en
Pending legal-status Critical Current

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Abstract

The invention relates to the research field of boiling phase change heat transfer, in particular to a boiling heat transfer device of an electronic component. The boiling heat transfer device comprises a cooling plate fixed to the surface of the electronic component, a metal foam layer is sintered or welded on the upper surface of the cooling plate, the metal foam layer is provided with square column type microstructures with the width of 50 micron to 200 micron, and the interval between the square column type microstructures is 50 micron to 200 micron.

Description

A kind of boiling heat transfer device of electronic component
Technical field
The phase-change heat transfer research field that the present invention relates to seethe with excitement, particularly a kind of boiling heat transfer device of electronic component.
Background technology
Along with the fast development of power electronic technology, the electronic devices and components high frequency, at a high speed, highly integrated requirement is more and more higher, the operational environment of high temperature will certainly influence the performance of electronic devices and components, this just requires that it is carried out efficient more cooling and satisfies its requirement.Therefore, the heat dissipation problem that effectively solves electronic devices and components has become the key technology that current electronic devices and components and electronic equipment are made.
At present, utilize liquid that electronic chip is cooled off the extensive concern that causes the lot of domestic and international scholar, especially electronic chip directly is immersed in the non-conductive liquid, utilize the mode of boiling phase-change heat transfer that it is cooled off.But, non-conductive liquid phase generally has higher wall wetting characteristics and lower boiling heat transfer coefficient than water, and the surface heat transfer thermal resistance becomes the main thermal resistance of the total diabatic process of electronic chip, therefore, utilize the strengthening surface technology to improve boiling heat transfer and seem particularly important.
In order to strengthen the chip boiling heat transfer, the inventor once opens parallel channel at chip surface and carried out research, discovery has obtained reinforcement in low density of heat flow rate district heat exchange, but be not communicated with owing between the conduit in the high heat flux district, easily form steam film, make that liquid is difficult to replenish, cause the bottom dry spot phenomenon to occur, critical heat flux density takes place ahead of time; Proposed to utilize the dry corrosion technology to generate the square column micro-structural afterwards again and strengthened boiling heat transfer at chip surface, the square column micro-structural has formed the rectangle microchannel that is interconnected, result of study shows, this structure can improve the critical heat flux density value greatly, but, the temperature of seething with excitement when initial jump excessively big and wall surface temperature too high, its main cause be the vaporization nucleus calculation of generation steam bubble less due to.
In recent years, other researchers have proposed to utilize porous media coating and foam metal body structure surface to carry out the boiling enhanced heat exchange of chip both at home and abroad, pertinent literature is discovered that this loose structure has increased the vaporization nucleus calculation of generation bubble effectively, and wall surface temperature reduction and temperature were crossed a liter amount minimizing when feasible boiling was initial; Simultaneously, the capillary force that utilizes loose structure is drawn onto generating surface with the fluid of main flow area, strengthens boiling heat transfer.But, because loose structure inside is interlaced, in the nucleate boiling district, the inner steam bubble of loose structure evaporates the generation steam film in a large number, the reverse resistance of gas and main flow liquid formation is bigger like this, cause tiny hole can not overcome liquid flowing resistance to the capillary force of liquid, on heating surface, can not in time obtain at last replenishing of main flow liquid, make heating components and parts surface under lower hot-fluid, just the evaporate to dryness phenomenon may occur, enter film boiling from nucleate boiling in advance, and the wall surface temperature when less critical heat flux density is greater than 85 ℃ of chip operate as normal ceiling temperatures.
As far back as people such as Jones in 1988 at document Electronic cooling through porous layers withwick boiling[A] .H R JACOBS.Proceedings of the National Heat TransferConference:Vol.1[C] .New York:ASME, 523-532. in porous surface is used for the strengthening electronic cooling device conducts heat and to test, steam at first carries out bottom horizontal flow sheet in the vapor film that discovery porous surface bottom produces, upwards overflowed when finding the pore channel of larger aperture, inspire people thus, can reduce the resistance of steam in fluting road, loose structure surface, make steam walk conduit, liquid is walked porous region, thereby Liquid Flow is more orderly, the boiling heat transfer intensity enhancing, critical heat flux density improves, and postpones the transformation of nucleate boiling to film boiling.Thus, many researchers mainly concentrate on the loose structure surface to the porous surface mode of grooving and offer parallel slot, also have some to offer large scale (about 0.5~2mm) right-angled intersection groove.Result of study demonstration porous surface is offered parallel slot can make Liquid Flow more steady, it is similar that but situation about occurring and inventor once directly open parallel slot at chip surface, be not to be communicated with between the conduit, more easily form steam film, reduced the wettability again of heating wall, make the boiling hysteresis effect obviously increase the weight of, influence the stability of boiling process.Porous surface is offered large scale right-angled intersection groove, the heat exchange effect is better when hanging down density of heat flow rate, the initial wall surface temperature that seethes with excitement is lower, and enter high heat flux nucleate boiling zone, and heating components and parts surface heat exchanging worsens, and the density of heat flow rate value increases along with the wall superheating ratio is linear, the critical heat flux density value that obtains simultaneously is on the low side, when its reason was high heat flux, the oversize capillarity that causes of conduit reduced, and is unfavorable for that liquid is supplied to heating surface smoothly by conduit.
Summary of the invention
At existing strengthening surface technology cooling exists to the high heat flux electronic device deficiency and defective, the object of the present invention is to provide a kind of boiling heat transfer device of electronic component, can eliminate the temperature of chip when boiling is initial and cross the amount of liter, wall surface temperature when the reduction boiling is initial, reduce the thermal shock that temperature causes chip, further strengthen the nucleate boiling heat exchange, nucleate boiling is postponed to the transformation of film boiling, significantly improve critical heat flux density, reduce the probability of heating wall evaporate to dryness.
In order to achieve the above object, the present invention is achieved by the following technical solutions.
A kind of boiling heat transfer device of electronic component, it is characterized in that, comprise: the heating panel that is fixed on the electronic devices and components surface, sintering or be welded with metal foam layers above the heating panel, offering width on the metal foam layers is 50 μ m~200 μ m square column type micro-structurals, and the mutual spacing of square column type micro-structural is 50 μ m~200 μ m.
Further improvement of the present invention and characteristics are:
Described heating panel is bonded in the electronic devices and components surface by insulating heat-conductive silica gel.
Described heating panel is copper coin or aluminium sheet.
Described metal foam layers is copper froth bed or aluminum foam layer.
Offering of described square column type micro-structural adopts the laser marking technology to realize.
The present invention is a kind of dual reinforcement technique of efficient cooling, has outstanding advantage and obvious effect.
(1) adopt metal foaming material to form loose structure, utilize himself material to have outstanding feature and the high pyroconductivity of metal material that proportion is little, porosity is high, specific area is big, enhanced heat exchange surface area and vaporization nucleus calculation have been increased widely, make nucleate boiling be improved significantly, compare other enhanced heat exchange surface textures, having solved the too high and temperature of boiling beginning temperature and having crossed the bigger problem of the amount of liter, thermal shock and the electronic devices and components having avoided simultaneously electronic devices and components are caused start difficult problem.
(2) traditional porous media Surface Machining structure is in high hot-fluid nucleate boiling district, steam bubble evaporates in a large number in the loose structure, form steam film, and loose structure is interlaced, cause in the Small Holes gap structure liquid flowing resistance excessive and be not easy to arrive smoothly heating surface, the dry spot phenomenon occurs on heating electronic devices and components surface easily.And the present invention offers square column type micro-structural at the metal foam laminar surface, the width 50 μ m~200 μ m of square column type micro-structural, the mutual spacing of square column type micro-structural is 50 μ m~200 μ m, utilize the thermocapillary convection effect that forms between little square column structure, make fresh liquid on the heating surface can be in time supply with replenishing easily, postponed the transformation of nucleate boiling to film boiling, guarantee stable nucleate boiling state, the electronic devices and components wall surface temperature is changed with the increase of density of heat flow rate hardly, can improve the critical heat flux density value significantly.
Description of drawings
Fig. 1 has the metal foam schematic diagram of square column type micro-structural
Embodiment
Below in conjunction with drawings and Examples the specific embodiment of the present invention is described in further detail.
With reference to Fig. 1, boiling heat transfer device of electronic component of the present invention, comprise: the heating panel that is fixed on the electronic devices and components surface, sintering has metal foam layers above the heating panel, offering width d on the metal foam is 50 μ m~200 μ m square column type micro-structurals, and the mutual spacing of square column type micro-structural is 50 μ m~200 μ m; Wherein, metal foam layers is copper froth bed or aluminum foam layer, and heating panel is copper coin or aluminium sheet, and heating panel is bonded in the electronic devices and components surface by insulating heat-conductive silica gel.
Offering of square column type micro-structural adopts the laser marking technology to realize.The laser marking technology is a mature technology, has mentioned this technology as far back as Lee east people such as bright grade in 1997 in document (application prospect [J] the aviation manufacturing engineering of laser marking in aviation).The method of specifically offering of square column type micro-structural of the present invention is: carving is vacated the size mask plate consistent with the square column micro-structural on the template that an Al or Cu make, expand the laser radiation of bundle on mask plate through telescope, light passes through from carving empty part, figure on the mask plate through lens imaging on the metal foam layers of sintering on heating panel, metal foam laminar surface through laser emission is heated vaporization rapidly or is produced chemical reaction then, change color takes place, and forms distinguishable clear square column micro-structural mark.
Among the present invention, metal foam refers to the open celled foam metal, utilizes investment casting to prepare, and can certainly utilize the additive method preparation, such as the seepage flow casting, and sputter deposited method, sintering dissolution method etc.In the metal foam layers, the porosity ε of pore structure (percentage of the shared volume in metal foam mesopore of certain volume) can reach 80%~97%, hole density PPI (the hole number on the per inch length) can reach 50~100, it and the aperture relation of being inversely proportional to, aperture can be worked into 1~10 micron number magnitude.
Metal foam also is foam metal, behind its cooling forming, and sintering or be welded on the copper coin or aluminium sheet as heating panel with scolding tin.Then, go out square column type micro-structural at the metal foam laminar surface with the laser marking technical mark, owing to exist capillarity and flow resistance to interact between the square column micro-structural, deriving according to the dynamic balance condition obtains P a - P 2 = 2 δ r , P wherein aBe atmospheric pressure, P 2Be the pressure in the steam bubble, δ is the surface tension on the liquid-vaqor interface, and r is the steam bubble radius.When r reduces P 2Reduce, the thermocapillary convection between the square column micro-structural strengthens, and the flow of gas dynamic resistance increases simultaneously, otherwise, when r increases P 2Increase, the thermocapillary convection between the square column micro-structural weakens, and the flow of gas dynamic resistance weakens simultaneously, and Comprehensive Experiment is the result show, having the width of best square column micro-structural is 50 μ m~200 μ m.
The square column type micro-structural that the metal foam laminar surface is offered, sintering has the column that the square porous media constitutes on the similar copper coin.By being bonded together electronic chip with copper coin sintering foam metal structural entity together with insulating heat-conductive silica gel, produce hot-fluid by electronic chip heating wall, by copper coin heat conduction, the metal foam that utilization has the more nucleus of boiling also offers the rectangle microchannel that a series of square column type micro-structurals are interconnected with formation thereon as radiating surface, playing provides a large amount of nucleus of boiling and is convenient to the dual enhanced heat exchange that fresh liquid is in time supplied to heating surface at high heat flux, makes electronic chip obtain efficient cooling effect.
The present invention adopts technique scheme, has outstanding advantage and significant effect.
One of advantage: utilize among the present invention the dual reinforcement technique of electronic devices and components high efficiency cooling to eliminate The nucleate boiling initial temperature that art methods occurs under low heat flow density zone is crossed bigger the asking of the amount of liter Topic so just can be eliminated big temperature difference to the thermal shock potential problem that electronic chip causes, and prolongs widely Grow up service life of electronic components of high power.
Two of advantage: compare with the strengthening surface technology of existing electronic device cooling usefulness, efficient among the present invention The dual reinforcement technique of cooling can be strengthened the nucleate boiling heat exchange greatly, makes the heat flow density of chip heating surface Increase and sharply increase with the wall degree of superheat, reduce significantly the wall surface temperature of electronic chip, can be significantly Improve the critical heat flux density value, greatly postpone nucleate boiling to the transformation of film boiling. Solved existing skill The vaporization nucleus calculation that exists in the art is less and boiling initial temperature that occur is higher, conduit is not communicated with and causes Heating wall large tracts of land dry spot phenomenon appears and the metal foam surface has large scale right-angled intersection conduit And cause that the heat flow density that occurs on the chip heating surface increases and the gained critical heat flux with the wall degree of superheat is linear The problems such as density value is lower.
Three of advantage: utilize metal foam self material to have that quality is light, volume is little, absorbing sound and lowering noise is mechanical Outstanding feature and the metal material heat transfer efficiency height such as performance is good, porosity is high, specific area is big make its tool Good heat exchange property is arranged, in the cooling heat radiator of various electronic devices and components, all can use, especially suitable Be used for the high efficiency and heat radiation cooling of computer chip and CPU etc.

Claims (5)

1, a kind of boiling heat transfer device of electronic component, it is characterized in that, comprise: the heating panel that is fixed on the electronic devices and components surface, sintering or be welded with metal foam layers above the heating panel, offering width on the metal foam layers is 50 μ m~200 μ m square column type micro-structurals, and the mutual spacing of square column type micro-structural is 50 μ m~200 μ m.
2, a kind of boiling heat transfer device of electronic component according to claim 1 is characterized in that, described heating panel is bonded in the electronic devices and components surface by insulating heat-conductive silica gel.
3, a kind of boiling heat transfer device of electronic component according to claim 1 is characterized in that, described heating panel is copper coin or aluminium sheet.
4, a kind of boiling heat transfer device of electronic component according to claim 1 is characterized in that, described metal foam layers is copper froth bed or aluminum foam layer.
5, a kind of boiling heat transfer device of electronic component according to claim 1 is characterized in that, offering of described square column type micro-structural adopts the laser marking technology to realize.
CN200910022072A 2009-04-16 2009-04-16 Boiling heat transfer device of electronic component Pending CN101541159A (en)

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Application Number Priority Date Filing Date Title
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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102661524A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (light-emitting diode) line lamp provided with metal heat abstractor
CN102683305A (en) * 2012-05-14 2012-09-19 西安交通大学 Chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces
CN102713427A (en) * 2010-05-04 2012-10-03 上海优利贸易有限公司 Method for manufacturing a light-emitting diode lamp
CN102820405A (en) * 2012-07-17 2012-12-12 大连理工大学 Integrated manufacturing method of silicon base plate and copper micro heat pipe of LED (light emitting diode) apparatus
CN103033535A (en) * 2013-01-11 2013-04-10 西安交通大学 Composite electronic chip cooling and boiling heat transfer enhancement experiment device
CN103200803A (en) * 2013-03-20 2013-07-10 西安交通大学 Loop heat pipe cooling device with pool boiling function
CN103591566A (en) * 2013-10-12 2014-02-19 苏州嘉德鲁机电科技有限公司 Phase-change radiator
CN103673739A (en) * 2013-06-09 2014-03-26 北京化工大学 Metal and thermal conductive plastic composite micro heat exchanger structure
CN105865089A (en) * 2016-04-19 2016-08-17 华北电力大学 Pin-fin wall surface micro-channel heat exchanger
CN107867020A (en) * 2017-10-31 2018-04-03 东南大学 A kind of enhanced boiling heat transfer structure with porous foam metal and preparation method thereof
CN110158127A (en) * 2019-05-15 2019-08-23 重庆大学 A kind of method for the critical heat flux density that enhanced heat transfer surfaces liquid film dryouies
CN110473848A (en) * 2019-08-08 2019-11-19 清华大学 Heat sink and cooling system
CN110595241A (en) * 2019-09-10 2019-12-20 西安交通大学深圳研究院 Partitioned block type enhanced boiling heat exchange microstructure and manufacturing method thereof

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102713427A (en) * 2010-05-04 2012-10-03 上海优利贸易有限公司 Method for manufacturing a light-emitting diode lamp
CN102661524A (en) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 High-power LED (light-emitting diode) line lamp provided with metal heat abstractor
CN102683305A (en) * 2012-05-14 2012-09-19 西安交通大学 Chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces
CN102683305B (en) * 2012-05-14 2014-12-10 西安交通大学 Chip reinforced boiling heat transfer structure of multi-pore microcolumn variable camber molded surfaces
CN102820405A (en) * 2012-07-17 2012-12-12 大连理工大学 Integrated manufacturing method of silicon base plate and copper micro heat pipe of LED (light emitting diode) apparatus
CN102820405B (en) * 2012-07-17 2015-06-24 大连理工大学 Integrated manufacturing method of silicon base plate and copper micro heat pipe of LED (light emitting diode) apparatus
CN103033535A (en) * 2013-01-11 2013-04-10 西安交通大学 Composite electronic chip cooling and boiling heat transfer enhancement experiment device
CN103200803A (en) * 2013-03-20 2013-07-10 西安交通大学 Loop heat pipe cooling device with pool boiling function
CN103200803B (en) * 2013-03-20 2015-12-02 西安交通大学 A kind of heat radiation device for loop heat pipe having pool boiling
CN103673739A (en) * 2013-06-09 2014-03-26 北京化工大学 Metal and thermal conductive plastic composite micro heat exchanger structure
CN103673739B (en) * 2013-06-09 2016-04-27 北京化工大学 A kind of metal and conductive plastic composite micro heat exchanger structure
CN103591566A (en) * 2013-10-12 2014-02-19 苏州嘉德鲁机电科技有限公司 Phase-change radiator
CN105865089A (en) * 2016-04-19 2016-08-17 华北电力大学 Pin-fin wall surface micro-channel heat exchanger
CN105865089B (en) * 2016-04-19 2018-05-25 华北电力大学 A kind of pin rib wall surface micro-channel heat exchanger
CN107867020A (en) * 2017-10-31 2018-04-03 东南大学 A kind of enhanced boiling heat transfer structure with porous foam metal and preparation method thereof
CN110158127A (en) * 2019-05-15 2019-08-23 重庆大学 A kind of method for the critical heat flux density that enhanced heat transfer surfaces liquid film dryouies
CN110473848A (en) * 2019-08-08 2019-11-19 清华大学 Heat sink and cooling system
CN110473848B (en) * 2019-08-08 2020-12-08 清华大学 Heat absorbing device and heat dissipation system
CN110595241A (en) * 2019-09-10 2019-12-20 西安交通大学深圳研究院 Partitioned block type enhanced boiling heat exchange microstructure and manufacturing method thereof
CN110595241B (en) * 2019-09-10 2020-11-27 西安交通大学深圳研究院 Partitioned block type enhanced boiling heat exchange microstructure and manufacturing method thereof

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