CN218920809U - Soaking plate with fins outside - Google Patents
Soaking plate with fins outside Download PDFInfo
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- CN218920809U CN218920809U CN202221311502.2U CN202221311502U CN218920809U CN 218920809 U CN218920809 U CN 218920809U CN 202221311502 U CN202221311502 U CN 202221311502U CN 218920809 U CN218920809 U CN 218920809U
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- soaking plate
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Abstract
The utility model discloses a soaking plate with fins, and belongs to the technical field of heat exchangers. The soaking plate comprises a soaking plate body, a liquid absorbing layer, outer fins and buckles, wherein two ends of the soaking plate body are arranged in a closed mode, and the liquid absorbing layer is paved on the inner side of the bottom of the soaking plate body and the left and right inner side walls; the lower bottom surface of the outer fin is tightly connected with the end surface of the upper end of the soaking plate body; the buckle is used for buckling the soaking plate body on the heat source. According to the soaking plate, the soaking plate is buckled by the buckle on the heat source package, the coolant and the sponge copper are arranged in the soaking plate, the heat transfer effect on the heat source is realized by the gas-liquid phase circulation of the coolant, and the outer fins are connected to the outer side of the soaking plate, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of heat exchangers, in particular to a soaking plate with fins.
Background
The product development of the scientific industry is approaching to the precision, such as integrated circuits or computers, and besides the miniaturization of the volume design, the heat generated by the devices is also greatly increased relative to the heat generated by the devices, so that the heat generated by the devices is considerable. At present, corresponding heat sinks or heat dissipation devices are arranged for various electronic heating components so as to maintain the normal operation of the electronic heating components at allowable temperature. However, the existing heat radiator or heat dissipation device for various electronic heating components is mainly produced by hot extrusion, and has low heat conductivity, small heat capacity, thick fins and short fins.
In addition, heat transfer through the vapor chamber or vapor chamber is also an application of the existing heat dissipation technology, and the principles of the vapor chamber and vapor chamber are the same, so that the heat transfer effect is provided through the cyclic change of the vapor-liquid phase. The vapor chamber has the characteristics of high heat transfer capacity, high heat conductivity, light weight, simple structure, multiple purposes and the like, so that the vapor chamber is widely applied to the heat accumulation phenomenon of electronic heating components.
However, the body of the existing vapor chamber adopts a single metal milling, pulling, shoveling and other processes. The thermal conductivity is poor, the heat source emits heat in a dot shape, and the overall performance is poor when the heat source area is small. And the radiator and the soaking plate are combined by at least two plate bodies, if the radiator frame is required to be arranged in a matched mode, the radiator and the soaking plate are combined by means of welding and the like, the number of components is large, the working procedure is complex, and the manufacturing cost is high.
Disclosure of Invention
The utility model aims to provide a soaking plate with fins. According to the vapor chamber, the vapor chamber is buckled by the buckle on the heat source package, the coolant and the sponge copper are arranged in the vapor chamber, the heat transfer effect on the heat source is realized by the gas-liquid phase circulation of the coolant, and the outer fins are connected to the outer side of the vapor chamber, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved.
According to an aspect of the present utility model, there is provided a soaking plate with fins outside, wherein the soaking plate includes:
the soaking plate body is provided with two ends in a closed mode;
the liquid absorption layer is paved on the inner side of the bottom of the vapor chamber body and the left and right inner side walls;
the lower bottom surface of the outer fin is tightly connected with the end surface of the upper end of the soaking plate body;
and the buckle is used for buckling the soaking plate body on the heat source.
Preferably, the outer fins are integrally arranged, are arranged in a rectangular waveform along the width direction, extend towards two ends along the length direction, and are arranged on the lower side surfaces of the wave troughs and are welded with the soaking plate body.
Preferably, the outer fins and the soaking plate body are welded by brazing.
Preferably, the outer fins are provided with a plurality of diversion trenches at intervals along the length direction on the side surface between the wave crest and the wave trough, the diversion trenches are cut at intervals along the vertical direction to form a plurality of heat conducting fins, the heat conducting fins are obliquely arranged relative to the length direction of the outer fins, and diversion holes are formed between the adjacent heat conducting fins, and the heat conducting fins in the two adjacent diversion trenches are oppositely arranged, so that the diversion holes of the two adjacent heat conducting trenches are oppositely arranged.
Preferably, the diversion trench is formed by rolling by a rolling machine.
Preferably, the outer fins are integrally arranged and are arranged in a rectangular-like waveform along the width direction, the wave crests and wave troughs of the outer fins are wavy along the length direction, and the lower side surfaces of the wave troughs of the outer fins are welded with the upper side surfaces of the soaking plates.
Preferably, the distance between two adjacent wave crests on the upper side or the lower side of the wavy outer fin is 5-150mm, and the vertical distance between each wave crest and each adjacent wave trough is 2-50mm.
Preferably, the buckle comprises a fixing part and a buckling part, the buckling parts are connected to the two ends of the fixing part, the upper sides of the fixing parts are tightly attached to the bottom of the solid state disk, and the buckling parts are buckled on the side edges of the vapor chamber body.
Preferably, the liquid absorption layer is a sponge copper layer or a copper net layer.
The technical scheme adopted by the utility model has the following remarkable effects:
(1) According to the vapor chamber, the vapor chamber is buckled by the buckle on the heat source package, the coolant and the sponge copper are arranged in the vapor chamber, the heat transfer effect on the heat source is realized by the gas-liquid phase circulation of the coolant, and the outer fins are connected to the outer side of the vapor chamber, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved.
(2) The outer fins are provided with the diversion grooves, the diversion grooves are provided with the heat conducting fins inclined at a certain angle, so that diversion holes are formed between the adjacent diversion fins, flowing air is facilitated to flow, radiating space is increased, radiating efficiency is improved, the flowing air forms turbulent flow through the diversion holes with different orientations, the collision probability of the flowing air and the outer fins is increased, and radiating is further increased.
(3) The upper side and the lower side of the outer fin are wavy along the length direction, so that the heat dissipation area along the length direction is increased, the flowing air flow path is increased, the collision probability of flowing air and the outer fin is increased, a certain turbulence effect is formed on the flowing air in the path, and the heat dissipation is increased.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present utility model;
FIG. 2 is a schematic cross-sectional view of example 1 of the present utility model;
FIG. 3 is a schematic structural view of embodiment 2 of the present utility model;
FIG. 4 is a top view of embodiment 2 of the present utility model;
FIG. 5 is a schematic view showing the structure of embodiment 3 of the present utility model;
fig. 6 is a schematic structural view of a comparative example of the present utility model.
The heat-absorbing heat-dissipating device comprises a 1-vapor chamber, a 2-vapor chamber body, a 3-liquid absorbing layer, 4-outer fins, 5-buckles, 6-fixing parts, 7-buckling parts, 8-heat sources, 9-diversion grooves, 10-heat-conducting fins, 11-diversion holes, 12-heat-dissipating plates and 13-heat-dissipating fins.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be further described in detail below by referring to the accompanying drawings and by illustrating preferred embodiments. It should be noted, however, that many of the details set forth in the description are merely provided to provide a thorough understanding of one or more aspects of the utility model, and that these aspects of the utility model may be practiced without these specific details.
Example 1
As shown in fig. 1, according to the vapor chamber with fins, the vapor chamber 1 includes a vapor chamber body 2 and a liquid absorbing layer 3, the vapor chamber body 2 is made of a single crystal material, and the vapor chamber body 2 in this embodiment is made of copper. The two ends of the soaking plate body 2 are arranged in a closed manner, and the liquid absorption layer 3 is paved on the inner side of the bottom of the soaking plate body 2 and the left and right inner side walls; the vapor chamber is characterized in that the vapor chamber body 2 is integrally formed, the upper end face and the lower end face of the vapor chamber body 2 are horizontal planes, the lower end face is a hot end and is in tight contact with a solid state disk, the liquid absorption layer 3 is paved on the inner side of the lower end face and on the inner side walls of the left side and the right side of the vapor chamber body 2, the liquid absorption layer 3 is a sponge copper layer, cooling liquid is led into the vapor chamber body 2, then the two ends of the vapor chamber body 2 are sealed, the cooling liquid volatilizes after being heated to take away the heat of the hot end, the gaseous cooling liquid meets a cold end, the cold end is the upper end face of the vapor chamber body 2, the gaseous cooling liquid meets a cold liquefaction, flows back to the hot end by a capillary structure of sponge copper, and the next vapor-liquid circulation is continued to provide a heat transfer function. The integrally formed soaking plate 1 reduces the welding step when the soaking plate body 2 is manufactured, has the characteristics of high heat transfer capacity, high heat conductivity, light weight, simple structure, multiple purposes and the like, and is widely applied to electronic heating components.
The soaking plate body 2 is provided with outer fins 4 on the upper end face, the outer fins 4 are integrally arranged, are rectangular wave-shaped along the width direction, extend towards two ends along the length direction, are arranged on the lower side face of the trough and are welded with the soaking plate body 2, and the outer fins 4 are welded with the soaking plate body 2 through brazing. The outer fins 4 increase the heat dissipation areas in the vertical direction and the horizontal direction, so that the effective heat dissipation area is increased on the basis of unit area, and the heat dissipation of the soaking plate is matched, so that the temperature difference of each part is small.
The soaking plate body 2 is buckled with a heat source 8 (the heat source 8 is a solid state disk) through a buckle 5, the buckle 5 comprises a fixing part 6 and a buckling part 7, buckling parts 7 are connected to two ends of the fixing part 6, the upper side of the fixing part 6 is tightly attached to the bottom of the solid state disk, and the buckling parts 7 are buckled on the side edges of the soaking plate body 2. The buckle 5 enables the lower end of the soaking plate body 2 to be in close contact with a heat core on the solid state disk, and the buckle 5 enables the soaking plate body 2 to be buckled on a heat source 8 such as the solid state disk.
Example 2
As shown in fig. 2, according to the soaking plate with fins, the soaking plate 1 comprises a soaking plate body 2 and a liquid absorbing layer 3, wherein the soaking plate body 2 is made of single crystal material, and the soaking plate body 2 of the embodiment is made of copper. The two ends of the soaking plate body 2 are arranged in a closed manner, and the liquid absorption layer 3 is paved on the inner side of the bottom of the soaking plate body 2 and the left and right inner side walls; the vapor chamber is characterized in that the vapor chamber body 2 is integrally formed, the upper end face and the lower end face of the vapor chamber body are horizontal planes, the lower end face is a hot end, the vapor chamber body is tightly contacted with heat sources such as a solid state disk and the like, the liquid absorption layer 3 is paved on the inner side of the lower end face, and on the inner side walls of the left side and the right side of the vapor chamber body 2, the liquid absorption layer 3 is a sponge copper layer, cooling liquid is led into the vapor chamber body 2, then the two ends of the vapor chamber body 2 are sealed, the cooling liquid volatilizes after being heated, heat of the hot end is taken away, gaseous cooling liquid meets the cold end, the cold end is the upper end face of the vapor chamber 1, the gaseous cooling liquid meets the cold and liquefies, and flows back to the hot end by the capillary structure of the sponge copper, and the next vapor-liquid circulation is continued, so that the heat transfer effect is provided. The integrally formed soaking plate reduces the welding step when the soaking plate body 2 is manufactured, has the characteristics of high heat transfer capacity, high heat conductivity, light weight, simple structure, multiple purposes and the like, and is widely applied to electronic heating components.
The soaking plate is characterized in that an outer fin 4 is arranged on the upper end face of the soaking plate body 2, the outer fin 4 is integrally arranged, is rectangular in waveform arrangement along the width direction and extends towards two ends along the length direction, the outer fin 4 is arranged on the lower side face of a trough and is welded with the soaking plate body, and the outer fin 4 and the soaking plate body are welded through brazing. The outer fins 4 increase the heat dissipation areas in the vertical direction and the horizontal direction, so that the effective heat dissipation area is increased on the basis of unit area, and the heat dissipation of the soaking plate is matched, so that the temperature difference of each part is small.
On the basis of the above, a plurality of diversion trenches 9 are arranged on the side surface of the outer fin 4 between the wave crest and the wave trough at intervals along the length direction, the diversion trenches 9 are formed by rolling by a rolling machine, the diversion trenches 9 are cut at intervals along the vertical direction to form a plurality of heat conducting fins 10, the heat conducting fins 10 are obliquely arranged relative to the length direction of the outer fin 4, the oblique angle is 33 degrees, diversion holes 11 are formed between the adjacent heat conducting fins, the heat conducting fins 10 in the two adjacent diversion trenches 9 are oppositely arranged, and the diversion holes 11 of the two adjacent heat conducting trenches 9 are oppositely arranged. The diversion holes 11 are beneficial to the flowing of flowing air, and the flowing air is enabled to form turbulent flow in different directions, so that the collision probability of the flowing air to the external fins is increased, and the heat dissipation efficiency is increased.
Example 3
As shown in fig. 3, according to the soaking plate with fins, the soaking plate 1 comprises a soaking plate body 2 and a liquid absorbing layer 3, wherein the soaking plate body 2 is made of single crystal material, and the soaking plate body 2 of the embodiment is made of copper. The two ends of the soaking plate body 2 are arranged in a closed manner, and the liquid absorption layer 3 is paved on the inner side of the bottom of the soaking plate body 2 and the left and right inner side walls; the vapor chamber is characterized in that the vapor chamber body 2 is integrally formed, the upper end face and the lower end face of the vapor chamber body are horizontal planes, the lower end face is a hot end, the vapor chamber body is tightly contacted with a heat source 8 such as a solid state disk, the liquid absorption layer 3 is paved on the inner side of the lower end face, and on the inner side walls of the left side and the right side of the vapor chamber body 2, the liquid absorption layer 3 is a sponge copper layer, cooling liquid is led into the vapor chamber body 2, then the two ends of the vapor chamber body 2 are sealed, the cooling liquid volatilizes after being heated, heat of the hot end is taken away, gaseous cooling liquid meets the cold end, the cold end is the upper end face of the vapor chamber body 2, the gaseous cooling liquid is liquefied after meeting the cold end, and flows back to the hot end by virtue of a capillary structure of sponge copper, and the next vapor-liquid circulation is continued, so as to provide a heat transfer effect. The integrally formed soaking plate body 2 reduces the welding step when the soaking plate body 2 is manufactured, has the characteristics of high heat transfer capacity, high heat conductivity, light weight, simple structure, multiple purposes and the like, and is widely applied to electronic heating components.
The soaking plate is characterized in that an outer fin 4 is arranged on the upper end face of the soaking plate body 2, the outer fin 4 is integrally arranged and is arranged in a rectangular-like waveform along the width direction, the wave crest and the wave trough of the outer fin 4 are wavy along the length direction, and the lower side face of the wave trough of the outer fin 4 is welded with the upper side face of the soaking plate body 2. The distance between two adjacent wave crests on the upper side or the lower side of the wavy outer fin 4 is 15mm, and the vertical distance between each wave crest and each adjacent wave trough is 6mm. The wave crests and the wave troughs of the outer fins are wavy along the length direction, the heat dissipation area of the outer fins 4 along the length direction is increased, and the wavy diversion mode enables flowing air to collide with the outer fins, so that heat dissipation is further increased.
Comparative example
As shown in fig. 4, the conventional heat dissipation structure on the electronic component is: a heat radiation plate 12 is attached to the end face of the heat source 8, and a plurality of heat radiation fins 13 are provided at intervals on the upper end face of the heat radiation plate 12. The heat dissipation structure can only dissipate heat to the surrounding air through contact heat transfer, the heat dissipation efficiency is low, the heat dissipation fins 13 are of a sheet-shaped structure, the heat dissipation area is limited, and the heat transfer efficiency is low.
Based on the same size of package heat source, the heat dissipation conditions of example 1, example 3 and comparative example are shown in tables 1-3 below for TDP at 20w, 30w, 50 w.
TABLE 1 TDP 20w room temperature 25 DEG C
| Comparative example | Example 1 | Example 3 | |
| Highest temperature of substrate | 98℃ | 68℃ | 63℃ |
| Minimum temperature of substrate | 71℃ | 63℃ | 58℃ |
| Temperature difference of substrate | 27 |
5 |
5℃ |
| Maximum temperature of fin | 89℃ | 67℃ | 60℃ |
| Minimum temperature of fin | 71 | 58 | 54 |
| Temperature difference of fins | 18 | 9 | 6 |
| Integral temperature difference | 27 | 10 | 9 |
TABLE 2 TDP 30w at room temperature 25 DEG C
| Comparative example | Example 1 | Example 3 | |
| Maximum temperature of substrate- | 136 | 90 | 83 |
| Minimum temperature of substrate | 96 | 80 | 76 |
| Temperature difference of substrate | 40 | 10 | 6 |
| Maximum temperature of fin | 123 | 90 | 83 |
| Fin typeMinimum temperature | 99 | 74 | 70 |
| Temperature difference of fins | 24 | 16 | 7 |
| Integral temperature difference | 40 | 16 | 7 |
TABLE 3 TDP 50w at room temperature 25 DEG C
From the above tables 1 to 3, the heat dissipation capacity of the embodiment 1 and the embodiment 3 are better than that of the comparative example, and the temperature difference of each part is smaller, which means that the vapor chamber of the embodiment 1 and the embodiment 3 is more stable, the temperature difference floating is small, the heat dissipation fins can be made larger, the work of the components is facilitated, and the damage of the components caused by the excessive temperature difference is avoided.
The foregoing is merely a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model, which are intended to be comprehended within the scope of the present utility model.
Claims (8)
1. A soaking plate with fins outside, wherein the soaking plate comprises:
the soaking plate body is provided with two ends in a closed mode;
the liquid absorption layer is paved on the inner side of the bottom of the vapor chamber body and the left and right inner side walls;
the lower bottom surface of the outer fin is tightly connected with the end surface of the upper end of the soaking plate body;
and the buckle is used for buckling the soaking plate body on the heat source.
2. The externally finned vapor chamber of claim 1 wherein: the outer fins are integrally arranged, are rectangular in waveform along the width direction and extend towards two ends along the length direction, and are arranged on the lower side face of the trough and are welded with the soaking plate body.
3. The externally finned vapor chamber of claim 2 wherein: the outer fins and the soaking plate body are welded by brazing.
4. The externally finned vapor chamber of claim 2 wherein: the side surfaces of the outer fins between the wave crests and the wave troughs are provided with a plurality of diversion trenches at intervals along the length direction;
the heat conduction grooves are cut at intervals along the vertical direction to form a plurality of heat conduction sheets, the heat conduction sheets are obliquely arranged relative to the length direction of the outer fins, and a diversion hole is formed between the adjacent heat conduction sheets, and the heat conduction sheets in the two adjacent heat conduction grooves are oppositely arranged, so that the diversion holes of the two adjacent heat conduction grooves are oppositely arranged.
5. The externally finned vapor chamber of claim 4 wherein: the diversion trench is formed by rolling by a rolling machine.
6. The externally finned vapor chamber of claim 1 wherein: the outer fins are integrally arranged and are arranged in a rectangular-like waveform along the width direction, the wave crests and wave troughs of the outer fins are wavy along the length direction, and the lower side surfaces of the wave troughs of the outer fins are welded with the upper side surfaces of the soaking plates.
7. The externally finned vapor chamber of claim 6 wherein: the distance between two adjacent wave crests on the upper side or the lower side of the wavy outer fin is 5-150mm, and the vertical distance between each wave crest and each adjacent wave trough is 2-50mm.
8. The externally finned vapor chamber of claim 1 wherein: the buckle comprises a fixing part and a buckling part, wherein the buckling part is connected to two ends of the fixing part, the upper side of the fixing part is tightly attached to the bottom of the heat source, and the buckling part is buckled on the side edge of the vapor chamber body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221311502.2U CN218920809U (en) | 2022-05-25 | 2022-05-25 | Soaking plate with fins outside |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221311502.2U CN218920809U (en) | 2022-05-25 | 2022-05-25 | Soaking plate with fins outside |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218920809U true CN218920809U (en) | 2023-04-25 |
Family
ID=86016582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221311502.2U Active CN218920809U (en) | 2022-05-25 | 2022-05-25 | Soaking plate with fins outside |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218920809U (en) |
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2022
- 2022-05-25 CN CN202221311502.2U patent/CN218920809U/en active Active
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