CN216313701U - Radiator for air-conditioning computer board and air conditioner - Google Patents

Abstract

The application relates to the technical field of heat dissipation, discloses a radiator for air conditioner computer board, includes: the base plate comprises a heat conducting surface and a heat radiating surface, the heat conducting surface is contacted with the computer board, and the heat radiating surface is arranged opposite to the heat conducting surface and comprises a high heating part and a low heating part; the heat pipe is arranged on the radiating surface and comprises an evaporation section and a condensation section, the evaporation section is arranged on the high-heating part, and the condensation section is arranged on the low-heating part. This application sets up the high portion that generates heat at the cooling surface through the evaporation zone with the heat pipe, and the condensation segment sets up the low portion that generates heat at the cooling surface, makes the heat of cooling surface can be by the transmission of the high portion that generates heat to the low portion that generates heat to make the cooling surface temperature more balanced, the reinforcing is to the radiating effect of the high portion that generates heat of cooling surface, thereby promotes the radiating efficiency to the higher position of computer board calorific capacity, avoids the computer board because of local calorific capacity is higher and leads to burning out or the ability performance that restricts complete machine air conditioner. The application also discloses an air conditioner.

Description

Radiator for air-conditioning computer board and air conditioner

Technical Field

The present application relates to the field of heat dissipation technologies, and for example, to a heat sink for an air-conditioning computer board and an air conditioner.

Background

In a high-temperature environment in summer, the computer board chip of the variable frequency air conditioner has poor heat dissipation, so that the air conditioner is slow and difficult to increase the refrigeration frequency, thereby causing easy error reporting of control logic, insufficient refrigeration capacity, high running power consumption and causing complaints of users. Under the working condition of T3 (53 ℃) or higher, the ambient air temperature of the frequency conversion chip is plus 10 ℃ (63 ℃), the difference value between the heat source temperature (68 ℃ -120 ℃) and the ambient temperature (5 ℃ -57 ℃) of the computer board heating becomes smaller, the heat dissipation power becomes smaller, and even the computer board is burnt and the system is down, thus causing hardware faults.

At present, part of variable frequency air conditioners are provided with a radiator for a computer board, for example, an aluminum radiating plate is arranged, heat of the computer board is transferred to the aluminum radiating plate, and then the heat is released outwards through the aluminum radiating plate.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the heat distribution of the computer board is not uniform, and the common heat dissipation plate can not quickly dissipate the local high temperature of the computer board, so that the computer board is easy to break down.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a radiator for an air-conditioning computer board and an air conditioner, which can enhance the temperature uniformity of different areas of the computer board and enable the part with higher heating of the computer board to quickly radiate heat.

In some embodiments, a heat sink for an air conditioning computer board comprises:

the base plate comprises a heat conducting surface and a heat radiating surface, the heat conducting surface is contacted with the computer board, and the heat radiating surface is arranged opposite to the heat conducting surface and comprises a high heating part and a low heating part;

the heat pipe comprises an evaporation section and a condensation section, the evaporation section is arranged on the high-heating part of the heat dissipation surface, and the condensation section is arranged on the low-heating part of the heat dissipation surface;

wherein, the heat of the high heating part is conducted to the low heating part through the heat pipe.

In some embodiments, the heat pipe is attached to the heat dissipation surface.

In some embodiments, the heat dissipating surface is provided with a guide groove extending from the high heat generating portion to the low heat generating portion, and the heat pipe is disposed in the guide groove.

In some embodiments, the guide groove and the heat pipe are both S-shaped, and the corner of the guide groove is a right-angle bend, and the corner of the heat pipe is an arc bend.

In some embodiments, the heat dissipating surface further comprises:

a transition part arranged between the high heating part and the low heating part;

wherein, the heat pipe extends from the high heating part to the low heating part through the transition part.

In some embodiments, the heat pipe further comprises:

the first bending section is communicated with the evaporation section;

the second bending section is communicated with the first bending section and forms an inverted U shape with the first bending section;

the third bending section is communicated with the second bending section and has the opposite bending direction to the second bending section;

wherein, the second bending section and the third bending section are arranged at the transition part.

In some embodiments, the junction of the second and third bent segments is disposed proximate to the first side edge of the substrate.

In some embodiments, the heat pipe further comprises:

the fourth bending section is communicated with the third bending section and the condensing section and forms a U shape with the third bending section;

and the joint of the third bending section and the fourth bending section is arranged close to the second side edge of the substrate.

In some embodiments, the condensing section is disposed near a third side of the substrate.

In some embodiments, an air conditioner includes:

a computer board; and

the heat sink as in any of the preceding embodiments, wherein the heat sink is connected to the computer board.

The radiator and the air conditioner for the air-conditioning computer board provided by the embodiment of the disclosure can realize the following technical effects: the heat conducting surface of the base plate is in contact with the computer board, the heat of the computer board is absorbed and transferred to the radiating surface, the evaporation section of the heat pipe is arranged at the high-heating part of the radiating surface, the condensation section is arranged at the low-heating part of the radiating surface, so that the heat of the radiating surface can be transferred from the high-heating part to the low-heating part, the temperature of the radiating surface is more balanced, the radiating effect on the high-heating part of the radiating surface is enhanced, the radiating efficiency of the higher part of the computer board with higher heat productivity is improved, and the computer board is prevented from being burnt down or limited to the performance of the whole air conditioner due to higher local heat productivity.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

FIG. 1 is a side view of a heat sink for an air-conditioning computer board according to an embodiment of the present disclosure;

FIG. 2 is a cross-sectional view of FIG. 1;

FIG. 3 is a cross-sectional view A-A of FIG. 1;

fig. 4 is an overall structural diagram of a heat sink for an air-conditioning computer board according to an embodiment of the disclosure.

Reference numerals:

10. a substrate; 11. a heat dissipating surface; 12. a first side edge; 13. a second side edge; 14. a third side; 15. a fourth side; 20. a heat pipe; 21. an evaporation section; 22. a first bending section; 23. a second bending section; 24. a third bending section; 25. a fourth bending section; 26. a condensing section; 30. a guide groove; 40. and a fin.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other cases, well-known structures and tanks may simplify the illustration, to simplify the drawings.

The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and embodiments thereof, and are not intended to limit the indicated tanks, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; either directly or indirectly through an intermediary, or internal communication between two tanks, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.

The term "plurality" means two or more unless otherwise specified.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

With reference to fig. 1 to 3, the present disclosure provides a heat sink for an air-conditioning computer board, including a substrate 10 and a heat pipe 20, wherein the substrate 10 includes a heat conducting surface and a heat dissipating surface 11, the heat conducting surface is in contact with the computer board, and the heat dissipating surface 11 is opposite to the heat conducting surface and includes a high heat generating portion and a low heat generating portion; the heat pipe 20 includes an evaporation section 21 and a condensation section 26, the evaporation section 21 is disposed on the high heat generation portion of the heat dissipation surface 11, and the condensation section 26 is disposed on the low heat generation portion of the heat dissipation surface 11; wherein the heat of the high heat generating part is conducted to the low heat generating part through the heat pipe 20.

By adopting the heat radiator provided by the embodiment of the disclosure, the heat of the computer board can be absorbed and transferred to the radiating surface 11 by contacting the heat conducting surface of the substrate 10 with the computer board, the evaporation section 21 of the heat pipe 20 is arranged at the high-heating part of the radiating surface 11, and the condensation section 26 is arranged at the low-heating part of the radiating surface 11, so that the heat of the radiating surface 11 can be transferred from the high-heating part to the low-heating part, the temperature of the radiating surface 11 is more balanced, the heat radiating effect on the high-heating part of the radiating surface 11 is enhanced, the heat radiating efficiency on the part with higher heat productivity of the computer board is improved, and the computer board is prevented from being burnt down or the performance of the whole air conditioner is prevented from being exerted due to higher local heat productivity.

The evaporation section 21 and the condensation section 26 of the heat pipe 20 of the embodiment of the disclosure are respectively located in different areas of the heat dissipation surface 11, such as a high heat generation portion and a low heat generation portion, so that the heat of the high heat generation portion can be transferred to the low heat generation portion via the heat pipe 20, the temperature of the high heat generation portion is reduced, the temperature of the low heat generation portion is raised, and the temperatures of the areas of the heat dissipation surface 11 are more balanced.

The high heat generation portion of the heat dissipation surface 11 is generated because the heat conduction surface of the substrate 10 mainly absorbs the portion of the computer board with high heat generation, and the low heat generation portion is generated because the heat conduction surface of the substrate 10 mainly absorbs the portion of the computer board with low heat generation. The computer board generates heat at a high position, for example, an IPM (Intelligent Power Module) position, an IGBT (Insulated Gate Bipolar Transistor) position, a diode position, a rectifier bridge position, and the like. The positions generate higher heat in the operation process, so that the temperature of the positions can be higher than that of other positions. If the high-heating part of the heat dissipation surface 11 can be effectively dissipated, the temperature of the part with high heat generation of the computer board can be reduced, and the fault caused by the overhigh temperature can be avoided.

Optionally, the substrate 10 is aluminum. The aluminum substrate 10 is not easily corroded by the refrigerant, and has high heat transfer coefficient and good heat dissipation effect.

The heat pipe 20 is a pipe section with two closed ends, the inside of the pipe section circulates refrigerants, the liquid refrigerants change into gas after absorbing heat in the evaporation section 21 and flow to the condensation section 26 along the heat pipe 20, the liquid refrigerants change into liquid after releasing heat in the condensation section 26, and the liquid refrigerants flow back to the evaporation section 21 along the pipe wall to absorb heat through evaporation by utilizing siphon force to sinter copper powder, so that circulation is formed. The heat transfer is realized through the phase change and the circular flow of the refrigerant.

Under the action of the temperature of the high-heating part of the heat dissipation surface 11 of the substrate 10, the heat pipe 20 can realize self-circulation of the refrigerant density difference without electric driving. Optionally, the heat dissipation surface 11 of the base plate 10 is provided with fins 40. The heat pipe 20 cooperates with the forced convection heat transfer of the fins 40 to further enhance the heat dissipation effect.

The heat pipe 20 has a seamless metal pipe casing, which may be made of different materials such as copper, aluminum, carbon steel, stainless steel, alloy steel, etc. according to different requirements. The tube of the heat pipe 20 may be a standard circle or a profile, such as an oval, square, rectangle, flat, bellows, etc.

Alternatively, the heat pipe 20 is a round pipe or a flat pipe. The circular tube or the flat tube is adopted, so that the refrigerant can smoothly flow in the tube, and the refrigerant can smoothly flow in the tube. The flat tube can increase the contact area between the heat pipe 20 and the heat dissipating surface 11, and enhance the heat exchange effect between the refrigerant and the heat dissipating surface 11.

Optionally, the height of the evaporator end 21 of the heat pipe 20 is lower than the height of the condenser end 26. The refrigerant is changed into a gaseous state in the evaporation section 21 through heat absorption and evaporation, the density of the gaseous refrigerant is low, the gaseous refrigerant tends to flow upwards, and the height of the condensation section 26 is higher than that of the evaporation section 21, so that the gaseous refrigerant can flow from the evaporation section 21 to the condensation section 26. The refrigerant is changed into liquid state by heat release condensation in the condensation section 26, the density of the liquid refrigerant is higher, and the liquid refrigerant tends to flow downwards, and the height of the evaporation section 21 is lower than that of the condensation section 26, so that the liquid refrigerant can flow back to the evaporation section 21 from the condensation section 26. The power of the refrigerant circulating flow can be enhanced by providing a difference in height between the evaporation stage 21 and the condensation stage 26.

In some embodiments, the heat pipe 20 is disposed in close contact with the heat dissipation surface 11. The heat pipe 20 is attached to the heat dissipation surface 11, so that on one hand, the refrigerant in the heat pipe 20 can fully exchange heat with the heat dissipation surface 11, and the refrigerant in the evaporation section 21 of the heat pipe 20 fully absorbs the heat generated by the heat dissipation surface 11 so as to be vaporized; on the other hand, the heat pipe 20 is closer to the heat radiating surface 11, and the overall structure of the radiator can be made more compact.

The heat pipe 20 is attached to the heat dissipation surface 11, that is, the bottom of the outer pipe wall of the heat pipe 20 is in contact with the heat dissipation surface 11, and heat can be rapidly transferred between the heat dissipation surface 11 and the heat pipe 20 through the contact.

In some embodiments, the heat dissipating surface 11 is provided with a guide groove 30 extending from a high heat generating portion to a low heat generating portion, and the heat pipe 20 is disposed in the guide groove 30.

By providing the guide groove 30 extending from the high heat generation portion to the low heat generation portion on the heat radiation surface 11, the heat pipe 20 can be disposed in the guide groove 30, and the heat pipe 20 can be extended from the high heat generation portion to the low heat generation portion. The heat pipe 20 is disposed in the guide groove 30, and the heat exchange area with the heat dissipation surface 11 is increased, and the heat pipe can be closer to the heat conduction surface, so that the heat exchange effect with the heat dissipation surface 11 can be enhanced. In addition, the heat pipe 20 is disposed in the guide groove 30, so that the heat sink structure can be compact and the heat pipe 20 can be protected to a certain extent.

The guide groove 30 is formed by recessing a partial region of the heat dissipation surface 11 inward. The guide groove 30 is advantageous to limit the position of the heat pipe 20, and the guide pipe can be more firmly and stably. When the heat pipe 20 is a flat pipe, the depth of the guide groove 30 does not need to be set too deep, and the flat pipe can be embedded in the guide groove 30. The depth of the guide groove 30 is in a shallow range, which is also advantageous in ensuring the mechanical strength of the substrate 10.

Alternatively, the cross-section of the guide groove 30 is adapted to the cross-sectional shape of the heat pipe 20. The heat pipe 20 can be inserted into the guide groove 30, and is firmly and stably maintained, and is sufficiently contacted with the heat dissipation surface 11 to exchange heat.

Optionally, a gap exists between the guide groove 30 and the heat pipe 20. The existence of the gap can enable the air flow to pass through the gap, partial heat is taken away by the air flow, and the heat dissipation effect can be enhanced to a certain degree.

Optionally, the depth of the guide groove 30 is smaller than the pipe diameter of the heat pipe 20. Thus, the heat pipe 20 is partially exposed from the guide groove 30, protrudes outward from the heat radiating surface 11, and releases heat to the external environment by the protruding portion.

Optionally, the depth of the guide groove 30 is greater than the pipe diameter of the heat pipe 20. Thus, the heat pipe 20 can be completely placed in the guide groove 30, and sufficiently absorbs the heat generated from the heat radiating surface 11.

Alternatively, the groove surface of the guide groove 30 is coated with silicone grease. By coating the silicone grease on the groove faces, the heat dissipation effect of the heat dissipation surface 11 can be enhanced.

Alternatively, the depth of the guide groove 30 gradually increases from the high heat generation portion to the low heat generation portion, and the tube diameter of the evaporation section 21 of the heat pipe 20 is larger than the depth of the guide groove 30 located at the high heat generation portion. Thus, in the high-heating part, the heat pipe 20 is partially positioned in the guide groove 30, and partially protrudes outwards relative to the heat dissipation surface 11, so that after the heat of the high-heating part is transferred to the heat pipe 20, part of the heat can be released to the outside air in time, and the heat dissipation effect on the high-heating part is enhanced; in the low heat generation portion, the heat pipe 20 is entirely located in the guide groove 30, and the heat from the high heat generation portion is sufficiently released to the low heat generation portion, so that the temperature of the entire heat radiation surface 11 is more equalized.

In some embodiments, the guide groove 30 and the heat pipe 20 are both S-shaped, and the corner of the guide groove 30 is a right-angle bend, and the corner of the heat pipe 20 is an arc bend.

The extension shape of the heat pipe 20 is designed to be S-shaped, so that the length of the heat pipe 20 can be extended, the heat pipe 20 penetrates through a plurality of areas of the heat dissipation surface 11, the refrigerant in the heat pipe 20 and the heat dissipation surface 11 perform sufficient heat exchange, and the heat exchange effect is improved. The extended shape of the guide groove 30 is designed to be S-shaped, which enables the heat pipe 20 to be more adapted to its shape to extend therein in an S-shape.

The corners of the guide groove 30 and the corners of the heat pipe 20 are designed in different shapes, so that the heat pipe 20 is not completely attached to and matched with the guide groove 30, and a gap is formed between the guide groove 30 and the corners of the heat pipe 20, so that heat of part of the side walls of the guide groove 30 can be directly released into the air. And, the fitting of the heat pipe 20 into the guide groove 30 is also facilitated.

In some embodiments, the heat dissipation surface 11 further includes a transition portion disposed between the high heat generation portion and the low heat generation portion; wherein the heat pipe 20 extends from a high heat generating portion to a low heat generating portion through a transition portion.

The transition part is arranged between the high heating part and the low heating part, and the heating degree of the transition part is also arranged between the high heating part and the low heating part. By providing the transition portion between the high-heat generating portion and the low-heat generating portion and passing the heat pipe 20 through the transition portion, the refrigerant in the heat pipe 20 can fully release part of the heat at the transition portion, so as to facilitate the heat pipe 20 to release the residual heat at the low-heat generating portion, and enhance the heat dissipation effect of the heat pipe 20. In addition, the heat pipe 20 releases partial heat at the transition portion, which is beneficial to more uniform temperature distribution of the heat dissipation surface 11 and effectively avoids over-high temperature of the high-heating portion.

In some embodiments, heat pipe 20 further comprises: the first bending section 22, the second bending section 23 and the third bending section 24, wherein the first bending section 22 is communicated with the evaporation section 21; the second bending section 23 is communicated with the first bending section 22 and forms an inverted U shape with the first bending section 22; the third bending section 24 is communicated with the second bending section 23 and is opposite to the bending direction of the second bending section 23; wherein the second bending section 23 and the third bending section 24 are arranged at the transition portion.

The heat pipe 20 is provided with a plurality of bending sections, the refrigerant can flow from the evaporation section 21 to the condensation section 26 through the transition sections through the sequential communication of the bending sections, the first bending section 22 and the second bending section 23 form an inverted U shape, so that the heat pipe 20 can extend from a high-heat-generation part to a transition part adjacent to the high-heat-generation part, and the flow path of the refrigerant is prolonged; the second bending section 23 and the third bending section 24 are bent in opposite directions, so that the heat pipe 20 can be continuously bent while maintaining the tendency of extending toward the low-heat-generation portion, and the heat pipe 20 extends from the transition portion toward the low-heat-generation portion. Through the design of bending of second bending section 23 and third bending section 24, can make the refrigerant have longer flow path in transition portion, be favorable to the heat with high heat generation portion to transition portion transmission, promote the samming effect to cooling surface 11.

Optionally, the first bending section 22 and the second bending section 23 are both arc-shaped, and the corresponding central angle is 90 °. Thus, the heat pipe 20 is bent to a moderate degree, and can meander through different regions, thereby avoiding the influence of heat dissipation due to too close pipe sections, and the length of the heat pipe 20 can be extended as much as possible, thereby extending the path length of the refrigerant flow and enhancing the heat transfer effect.

Optionally, the heights of the evaporation section 21, the third bending section 24 and the fourth bending section 25 are the same, the heights of the condensation section 26, the first bending section 22 and the second bending section 23 are the same, and the height of the evaporation section 21 is smaller than that of the condensation section 26. Through the arrangement of the height of each pipe section, the refrigerant in different phase states can flow in the heat pipe 20, the circulating flow power of the refrigerant can be enhanced, and the heat transfer effect of the heat pipe 20 from a high heating part to a low heating part is improved.

The height refers to the distance between the heat pipe 20 and the ground when the substrate 10 is in a horizontal state in practical use of the heat sink.

In some embodiments, the junction of the second bend segment 23 and the third bend segment 24 is disposed proximate the first side edge 12 of the substrate 10.

When the refrigerant flows through the joint of the second bending section 23 and the third bending section 24, because the position is close to the first side 12 of the substrate 10, the heat is released to the external environment more easily than the heat released from the central position of the substrate 10, so that the refrigerant releases more heat to the external environment, and the heat dissipation effect of the heat pipe 20 is improved.

Optionally, the distance between the joint of the second bending section 23 and the third bending section 24 and the first side 12 is 0.5cm to 1 cm.

Optionally, the substrate 10 comprises: the structure comprises a first side edge 12, a second side edge 13, a third side edge 14 and a fourth side edge 15, wherein the first side edge 12 and the second side edge 13 are opposite, one end of the third side edge 14 is connected with the first side edge 12, and the other end of the third side edge 14 is connected with the second side edge 13, and the third side edge 14 is opposite to the fourth side edge 15.

Alternatively, the high heat generating portion, the low heat generating portion and the transition portion of the heat dissipating surface 11 are located in an area enclosed by the first side 12, the second side 13, the third side 14 and the fourth side 15, the high heat generating portion, the transition portion and the low heat generating portion are sequentially arranged in the area, and the heat pipe 20 extends from the high heat generating portion to the low heat generating portion through the transition portion.

With reference to fig. 1 and 3, a heat sink for an air-conditioning computer board is further provided in an embodiment of the present disclosure, including a substrate 10 and a heat pipe 20, where the substrate 10 includes a heat conducting surface and a heat dissipating surface 11, the heat conducting surface contacts with the computer board, and the heat dissipating surface 11 is disposed opposite to the heat conducting surface and includes a high heat generating portion and a low heat generating portion; the heat pipe 20 is arranged on the heat dissipation surface 11 and comprises an evaporation section 21, a first bending section 22, a second bending section 23, a third bending section 24, a fourth bending section 25 and a condensation section 26 which are sequentially communicated, wherein the evaporation section 21 extends linearly from the second side 13 to the first side 12 in a high-heat-generation region, the first bending section 22 is communicated with the evaporation section 21 and bends and extends towards the third side 14, the second bending section 23 is communicated with the first bending section 22 and bends and extends towards the first side 12, the third bending section 24 is communicated with the second bending section 23 and bends and extends towards the third side 14, the fourth bending section 25 is communicated with the third bending section 24 and bends and extends towards the second side 13, and the evaporation section 21 is communicated with the fourth bending section 25 and extends linearly towards the second side 13; the evaporation section 21 is disposed in a high heat generation portion, and the condensation section 26 is disposed in a low heat generation portion.

In some embodiments, heat pipe 20 further includes a fourth bend section 25, fourth bend section 25 being in communication with third bend section 24 and condensing section 26, and forming a U-shape with third bend section 24; wherein, the connection point of the third bending section 24 and the fourth bending section 25 is disposed near the second side edge 13 of the substrate 10.

Through setting up third bending section 24 and fourth bending section 25 and making it form the U-shaped, make heat pipe 20 extend to the condensing part from the transition portion in bending to prolonged the flow path of refrigerant in heat pipe 20, strengthened the heat transfer effect with cooling surface 11, make the heat fully transfer to low heat generation portion from high heat generation portion, promoted the samming radiating effect to base plate 10, avoided the high heat generation portion of base plate 10 high temperature, thereby prevent that the local high temperature of air conditioner computer board is too high. When the refrigerant flows through the joint of the third bending section 24 and the fourth bending section 25, because the position is close to the second side edge 13 of the substrate 10, the heat is released to the external environment more easily than the position at the center of the substrate 10, so that the refrigerant releases more heat to the external environment, and the heat dissipation effect of the heat pipe 20 is improved.

In addition, the connection between the first bending section 22 and the second bending section 23 and the connection between the third bending section 24 and the fourth bending section 25 are close to different sides, so that the influence between the first bending section and the second bending section can be reduced, and the heat can be fully released by the refrigerant.

In some embodiments, the condensation section 26 is disposed proximate the third side 14 of the substrate 10. The condensing section 26 is close to the third side 14, so that the refrigerant in the condensing section 26 can release heat to the external environment more easily.

With reference to fig. 1 to 4, an embodiment of the present disclosure further provides a heat sink for an air-conditioning computer board, including: the heat pipe comprises a substrate 10, a heat pipe 20 and fins 40, wherein the substrate 10 comprises a heat conducting surface and a heat radiating surface 11, the heat conducting surface is in contact with a computer board, and the heat radiating surface 11 is arranged opposite to the heat conducting surface and comprises a high heating part and a low heating part; the heat pipe 20 is disposed on the heat dissipating surface 11, and includes an evaporation section 21 and a condensation section 26, the evaporation section 21 is disposed on the high heat generating portion, and the condensation section 26 is disposed on the low heat generating portion; the heat dissipating surface 11 is provided with a guide groove 30 extending from a high heat generating portion to a low heat generating portion, and the heat pipe 20 is disposed in the guide groove 30; the fins 40 are provided on the heat radiating surface 11 and across the notches of the guide grooves 30.

Optionally, the fins 40 extend away from the heat dissipation surface 11. The fins 40 can release heat on the heat dissipation surface 11 and the heat pipe 20 to the external environment quickly, and the heat dissipation effect of the heat sink is improved. By arranging the heat pipe 20, the temperature uniformity of the substrate 10 is enhanced, the temperature of a high heating part is prevented from being too high, and the temperature of each part of the substrate 10 can be further balanced by matching the heat dissipation effect of the fins 40 on the substrate 10 and the heat pipe 20, so that the local high temperature of the substrate 10 is reduced, and the heat dissipation effect of the heat sink is improved.

An embodiment of the present disclosure further provides an air conditioner, including: a computer board and a heat sink as provided in any of the above embodiments, the heat sink being connected to the computer board.

By arranging the radiator, the heat of the radiating surface 11 of the substrate 10 can be transferred from the high-heating part to the low-heating part through the effects of the substrate 10 and the heat pipe 20, so that the temperature of the radiating surface 11 is more balanced, the radiating effect of the high-heating part of the radiating surface 11 is enhanced, the radiating efficiency of the part with higher heat productivity of the computer board is improved, and the situation that the computer board is burnt down or the capability of the whole air conditioner is limited to be exerted due to the higher local heat productivity is avoided.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A heat sink for an air conditioning computer board, comprising:

the heat dissipation surface is arranged opposite to the heat conduction surface and comprises a high heating part and a low heating part;

the heat pipe comprises an evaporation section and a condensation section, the evaporation section is arranged on the high-heating part of the heat dissipation surface, and the condensation section is arranged on the low-heating part of the heat dissipation surface;

wherein the heat of the high heat generating part is conducted to the low heat generating part through the heat pipe.

2. The heat sink of claim 1, wherein the heat pipe is attached to the heat dissipating surface.

3. The heat sink according to claim 2, wherein the heat radiating surface is provided with a guide groove extending from the high heat generating portion to the low heat generating portion, and the heat pipe is disposed in the guide groove.

4. The heat sink as claimed in claim 3, wherein the guide groove and the heat pipe are both S-shaped, and the corner of the guide groove is a right angle bend and the corner of the heat pipe is an arc bend.

5. The heat sink according to any one of claims 1 to 4, wherein the heat dissipating surface further comprises:

a transition portion provided between the high heat generation portion and the low heat generation portion;

wherein the heat pipe extends from the high heat generation portion to the low heat generation portion through the transition portion.

6. The heat sink of claim 5, wherein the heat pipe further comprises:

the first bending section is communicated with the evaporation section;

the second bending section is communicated with the first bending section and forms an inverted U shape with the first bending section;

the third bending section is communicated with the second bending section and has the opposite bending direction to the second bending section;

wherein the second bending section and the third bending section are arranged at the transition part.

7. The heat sink of claim 6, wherein the junction of the second bend segment and the third bend segment is disposed proximate to the first side of the substrate.

8. The heat sink of claim 6, wherein the heat pipe further comprises:

the fourth bending section is communicated with the third bending section and the condensing section and forms a U shape with the third bending section;

and the joint of the third bending section and the fourth bending section is close to the second side edge of the substrate.

9. The heat sink according to any one of claims 1 to 4, wherein the condensation section is disposed near a third side of the substrate.

10. An air conditioner, comprising:

a computer board; and

the heat sink of any of claims 1-9, wherein the heat sink is coupled to the computer board.

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