CN216313700U - Radiator for air-conditioning computer board and air conditioner - Google Patents

Abstract

The application relates to the technical field of heat dissipation, discloses a radiator for air conditioner computer board, includes: the base plate comprises a heat conducting surface and a heat radiating surface, the heat conducting surface is contacted with the computer board, and the heat radiating surface is arranged opposite to the heat conducting surface and comprises a high-heating part; the fins are arranged on the radiating surface and extend back to the radiating surface; the first heat pipe comprises an evaporation section, a connecting section and a condensation section which are sequentially communicated, the evaporation section is arranged on a high-heating part of the heat dissipation surface, and the connecting section and the condensation section penetrate through the fins and/or the fin gaps and extend to the inclined upper side of the evaporation section. This application sets up the evaporation zone of first heat pipe in the high portion of generating heat of base plate to absorb the heat that the high portion of generating heat produced, and make the linkage segment and the condensation segment of first heat pipe pass fin and/or fin clearance and extend to the oblique top of evaporation zone, thereby release the heat to the lower region of heat density, the radiating effect of the high portion of generating heat of reinforcing to the base plate promotes the radiating efficiency to the higher region of computer board generating heat. The application also discloses an air conditioner.

Description

Radiator for air-conditioning computer board and air conditioner

Technical Field

The present application relates to the field of heat dissipation technologies, and for example, to a heat sink for an air-conditioning computer board and an air conditioner.

Background

When the air conditioner is operated, some parts are easy to generate heat, such as computer boards, capacitors, inductance coils, transformers and other components. The reason why the components generate heat can be considered as that the resistors generate heat when the current passes through the resistors and work needs to be done. The degree of heating also depends on the amount of power dissipated by the resistor.

The computer board of the variable frequency air conditioner mainly comprises: IPM, IGBT, diode, rectifier bridge, etc. With the improvement of semiconductor technology, the chip design is more compact, the heat flux density of the device is continuously increased, and the volume of the device tends to be miniaturized. Some heating elements have large heat flux density, so that a heat source is concentrated, and the electrical equipment needs to be efficiently radiated. At present, part of variable frequency air conditioners are provided with a radiator for a computer board, for example, an aluminum radiating plate is arranged, heat of the computer board is transferred to the aluminum radiating plate, and then the heat is released outwards through the aluminum radiating plate.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the common heat dissipation plate has low heat dissipation efficiency to the high-heat-generation area of the computer board, so that the computer board is easy to generate faults.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a radiator for an air-conditioning computer board and an air conditioner, which can quickly radiate a high-heating area of the computer board.

In some embodiments, a heat sink for an air conditioning computer board comprises:

the base plate comprises a heat conducting surface and a heat radiating surface, and the heat conducting surface is contacted with the computer board so as to lead in heat generated by the computer board; the heat dissipation surface is arranged opposite to the heat conduction surface and comprises a high-heating part;

the fins are arranged on the radiating surface and extend back to the radiating surface;

the first heat pipe comprises an evaporation section, a connecting section and a condensation section which are sequentially communicated, wherein the evaporation section is arranged on a high-heating part of the heat dissipation surface, and the connecting section and the condensation section penetrate through a fin and/or a fin gap and extend to the inclined upper part of the evaporation section, so that the heat of the high-heating part is conducted to the inclined upper part of the evaporation section through the evaporation section of the first heat pipe.

In some embodiments, the connection segment comprises:

a straight tube parallel to the fin;

the bent pipe is communicated with the evaporation section and the straight pipe, and the straight pipe and the condensation section, so that the condensation section and the plane where the fins are located form a set included angle.

In some embodiments, the evaporator end and the condenser end are perpendicular to the plane of the fins.

In some embodiments, the heat dissipating surface further includes a low heat generating portion, and the condensing section is disposed in a space corresponding to the low heat generating portion to release heat in the space corresponding to the low heat generating portion.

In some embodiments, the heat dissipating surface further includes a transition portion disposed between the high heat generating portion and the low heat generating portion, and the connection section is disposed in a space corresponding to the transition portion.

In some embodiments, the heat sink further comprises:

the second heat pipe comprises an evaporation part, a connecting part and a condensation part which are sequentially communicated, the evaporation part is arranged on a high-heating part of the radiating surface, the connecting part penetrates through the fins and/or the gaps of the fins and extends to the obliquely upper part of the evaporation part, and the connecting part is arranged above the connecting section of the first heat pipe; so that the heat of the high heat generating portion is conducted to the obliquely upper side of the evaporation portion through the evaporation portion, the connection portion, and the condensation portion.

In some embodiments, the condensing portion is disposed in a space corresponding to the transition portion of the heat radiating surface to release heat in the space corresponding to the transition portion.

In some embodiments, the heat sink further comprises:

and the third heat pipe is attached to the radiating surface of the substrate so as to exchange heat with the radiating surface.

In some embodiments, the condensation end of the third heat pipe is disposed at the low heat generating portion of the heat dissipating surface, so that the condensation end releases heat at the low heat generating portion.

In some embodiments, an air conditioner includes:

a computer board; and the radiator is connected with the computer board.

The radiator and the air conditioner for the air-conditioning computer board provided by the embodiment of the disclosure can realize the following technical effects: set up the base plate and carry out the heat transfer with the computer board, and set up first heat pipe on the base plate, make the evaporation zone setting of first heat pipe in the high portion of generating heat of base plate, a heat for absorbing the high portion of generating heat and producing, make the linkage segment and the condensation segment of first heat pipe pass fin and/or fin clearance and extend to the oblique top of evaporation zone, thereby make the refrigerant flow to linkage segment and condensation segment from the evaporation zone to oblique top, with heat release to the lower region of heat density, the radiating effect of the high portion of generating heat of reinforcing to the base plate, and then promote the radiating efficiency to the higher region of generating heat of computer board.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

FIG. 1 is a schematic structural diagram of a heat sink for an air-conditioning computer board according to an embodiment of the present disclosure;

FIG. 2 is a schematic structural diagram of a heat sink for an air-conditioning computer board according to an embodiment of the present disclosure, in which heat pipes are hidden;

FIG. 3 is a schematic structural view of a heat sink for an air-conditioning computer board according to an embodiment of the present disclosure, with fins hidden;

fig. 4 is a schematic structural diagram of another heat sink for an air-conditioning computer board according to an embodiment of the disclosure.

Reference numerals:

10. a substrate; 11. a heat dissipating surface; 110. a high heat generating portion; 111. a low-heat generating portion; 112. a transition section; 20. a fin; 21. a guide groove; 30. a first heat pipe; 31. an evaporation section; 32. a connecting section; 320. a straight pipe; 321. bending the pipe; 33. a condensing section; 40. a second heat pipe; 41. an evaporation section; 42. a connecting portion; 43. a condensing section; 50. and a third heat pipe.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other cases, well-known structures and tanks may simplify the illustration, to simplify the drawings.

The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and embodiments thereof, and are not intended to limit the indicated tanks, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; either directly or indirectly through an intermediary, or internal communication between two tanks, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.

The term "plurality" means two or more unless otherwise specified.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

With reference to fig. 1 and 3, an embodiment of the present disclosure provides a heat sink for an air-conditioning computer board, including: the heat pipe comprises a base plate 10, a plurality of fins 20 and a first heat pipe 30, wherein the base plate 10 comprises a heat conducting surface and a heat radiating surface 11, and the heat conducting surface is in contact with a computer board so as to lead in heat generated by the computer board; the heat dissipation surface 11 is arranged opposite to the heat conduction surface and includes a high heat generation portion 110; the fins 20 are arranged on the heat dissipation surface 11 and extend away from the heat dissipation surface 11; the first heat pipe 30 includes an evaporation section 31, a connection section 32 and a condensation section 33 which are sequentially communicated, the evaporation section 31 is disposed on the high heat generation portion 110 of the heat dissipation surface 11, and the connection section 32 and the condensation section 33 pass through the fin 20 and/or the gap of the fin 20 and extend obliquely upward of the evaporation section 31, so that the heat of the high heat generation portion 110 is conducted to the obliquely upward of the evaporation section 31 through the evaporation section 31 of the first heat pipe 30.

By adopting the heat sink provided by the embodiment of the disclosure, the base plate 10 is arranged for exchanging heat with a computer board, the first heat pipe 30 is arranged on the base plate 10, the evaporation section 31 of the first heat pipe 30 is arranged on the high-heat-generating portion 110 of the base plate 10 and is used for absorbing heat generated by the high-heat-generating portion 110, the connection section 32 and the condensation section 33 of the first heat pipe 30 pass through the gap between the fins 20 and/or the fins 20 and extend to the obliquely upper side of the evaporation section 31, so that a refrigerant flows obliquely upward from the evaporation section 31 to the connection section 32 and the condensation section 33, the heat is released to an area with lower heat density, the heat dissipation effect on the high-heat-generating portion 110 of the base plate 10 is enhanced, and the heat dissipation efficiency of an area with higher heat generation on the computer board is further improved.

The high heat generation portion 110 of the heat dissipation surface 11 is generated by the heat conduction surface of the substrate 10 mainly absorbing the portion of the computer board generating high heat, and the low heat generation portion 111 is generated by the heat conduction surface of the substrate 10 mainly absorbing the portion of the computer board generating low heat. The computer board generates heat at a high position, for example, an IPM (Intelligent Power Module) position, an IGBT (Insulated Gate Bipolar Transistor) position, a diode position, a rectifier bridge position, and the like. The positions generate higher heat in the operation process, so that the temperature of the positions can be higher than that of other positions. If the high heat generating part 110 of the heat dissipating surface 11 can be effectively dissipated, the temperature of the part of the computer board which generates high heat can be reduced, and the fault caused by the high temperature can be avoided.

Optionally, the substrate 10 is aluminum. The aluminum substrate 10 is not easily corroded by the refrigerant, and has high heat transfer coefficient and good heat dissipation effect.

The heat pipe is a pipe section with two closed ends, the refrigerant circulates inside, the liquid refrigerant changes into a gas state after absorbing heat in the evaporation section 31 and flows to the condensation section 33 along the heat pipe, the liquid refrigerant changes into a liquid state after releasing heat in the condensation section 33, and the liquid refrigerant flows back to the evaporation section 31 along the pipe wall to absorb heat by evaporation by utilizing siphon force, so that circulation is formed. The heat transfer is realized through the phase change and the circular flow of the refrigerant.

Under the action of the temperature of the high heat generating part 110 on the heat radiating surface 11 of the substrate 10, the heat pipe can realize self-circulation of the refrigerant density difference without electric driving. Optionally, the heat dissipation surface 11 of the base plate 10 is provided with fins 20. The heat pipe is matched with the forced convection heat transfer of the fins 20, so that the heat dissipation effect can be further enhanced.

The pipe shell of the heat pipe is mostly a metal seamless steel pipe, and different materials such as copper, aluminum, carbon steel, stainless steel, alloy steel and the like can be adopted according to different requirements. The tube of the heat pipe can be in a standard circle shape, and can also be in a special shape, such as an oval shape, a square shape, a rectangular shape, a flat shape, a corrugated tube and the like.

Optionally, the heat pipe is a round pipe or a flat pipe. The circular tube or the flat tube is adopted, so that the refrigerant can smoothly flow in the tube, and the refrigerant can smoothly flow in the tube. The flat pipe is adopted, so that the contact area between the heat pipe and the radiating surface 11 can be increased, and the heat exchange effect between the refrigerant and the radiating surface 11 is enhanced.

Alternatively, the plurality of fins 20 and the gaps between the adjacent fins 20 constitute a fin 20 space, and when the heat pipe passes through the fin 20 space, a perforation or a groove is provided at a position where the heat pipe needs to pass through the fin 20. In this way, the heat pipe can be passed through the fin 20 space.

In some embodiments, the evaporation section 31 is attached to the high heat generation portion 110 of the heat dissipation surface 11. The evaporation section 31 is attached to the high-heating part 110, so that on one hand, the refrigerant in the heat pipe can fully exchange heat with the radiating surface 11, and the refrigerant in the evaporation section 31 of the heat pipe fully absorbs the heat generated by the radiating surface 11 so as to be vaporized; on the other hand, the heat pipe is closer to the heat radiating surface 11, and the overall structure of the heat sink can be made more compact.

Alternatively, the high heat generation portion 110 of the heat radiation surface 11 is provided with the guide groove 21, and the evaporation stage 31 is provided in the guide groove 21. By providing the guide groove 21 in the high-heat-generating portion 110 of the heat radiating surface 11 and providing the evaporation stage 31 in the guide groove 21, the heat exchange area between the evaporation stage 31 and the heat radiating surface 11 can be increased, and the heat exchange effect with the high-heat-generating portion 110 can be enhanced. Moreover, the evaporation section 31 is arranged in the guide groove 21, and can also play a certain limiting and protecting role on the heat pipe.

Alternatively, the plurality of fins 20 are arranged at intervals and are perpendicular to the heat dissipation surface 11, and the plurality of fins 20 are arranged to form a rectangular parallelepiped shape. Thus, the plurality of fins 20 can radiate heat from the heat radiating surface 11 well.

In some embodiments, the connecting section 32 includes a straight tube 320 and an elbow 321, the straight tube 320 being parallel to the fins 20; the bent pipe 321 connects the evaporation section 31 and the straight pipe 320, and the straight pipe 320 and the condensation section 33, so that the condensation section 33 forms a predetermined angle with the plane of the fin 20.

The straight tube 320 is parallel to the fins 20, so that smooth flow of air flow between the fins 20 and between the straight tube 320 and the fins 20 is facilitated, heat carried by a refrigerant in the straight tube 320 can be quickly released by the air flow between the fins 20, and the heat dissipation effect of the straight tube 320 is improved. The bent pipe 321 facilitates the connection between the evaporation section 31 and the straight pipe 320 and the connection between the straight pipe 320 and the condensation section 33 by bending.

Alternatively, the tube diameter of the straight tube 320 is smaller than the gap between the adjacent fins 20, and the straight tube 320 passes through the gap between the fins 20. In this way, the straight tube 320 can be cooled by the airflow in the gaps between the fins 20.

Alternatively, the tube diameter of the straight tube 320 is larger than the gap between the adjacent fins 20. The straight tube 320 passes through the fins 20 and the gaps between the fins 20. In this way, heat can be dissipated by the airflow in the gaps between the fins 20 and the fins 20 as the straight tubes 320.

As shown in fig. 2 and 3, optionally, the tube diameter of the straight tube 320 is larger than the gap between the adjacent fins 20, the adjacent fins 20 are provided with guide grooves 21 for the straight tube 320 to pass through, the straight tube 320 is disposed near the first side of the substrate 10, and the guide grooves 21 are disposed from the first fin 20 closest to the first side of the substrate 10 to the fins 20 gradually away from the first side. Thus, the air flow can enter the fin 20 space through the guide groove 21 and the fin 20 gap, and the straight tube 320 can be sufficiently radiated.

As shown in fig. 4, optionally, the first fin 20 closest to the first side of the base plate 10 is a complete fin 20 without the guide groove 21, and the fins 20 adjacent to the first fin 20 and the plurality of fins 20 gradually far from the first fin 20 are provided with the guide grooves 21. Thus, the heat pipe is not exposed from the first fin 20, and the heat pipe can be protected to some extent.

In some embodiments, the evaporation section 31 and the condensation section 33 are perpendicular to the plane of the fins 20. The fins 20 extend away from the heat dissipating surface 11 and extend from the high heat generating portions 110 to the low heat generating portions 111 of the heat dissipating surface 11, and the evaporation section 31 is perpendicular to the plane of the fins 20, and can pass through the regions of the high heat generating portions 110 as much as possible, thereby sufficiently absorbing the heat of the high heat generating portions 110. Furthermore, the evaporation section 31 penetrates through the plurality of fins 20, and can be radiated by the plurality of fins 20, thereby improving the heat radiation effect on the evaporation section 31. The condensing section 33 is perpendicular to the plane of the fins 20, so that the condensing section 33 can penetrate through the plurality of fins 20, and the plurality of fins 20 are used for dissipating heat, so that the refrigerant can fully release heat in the condensing section 33. And, because the condensing section 33 is located obliquely above the evaporating section 31, the heat density between the fins 20 and the fins 20 is smaller than that in the vicinity of the evaporating section 31, and therefore the heat radiation effect on the condensing section 33 is stronger than that on the evaporating section 31.

In some embodiments, the heat dissipating surface 11 further includes a low-heat generating portion 111, and the condensing section 33 is disposed in a space corresponding to the low-heat generating portion 111 to release heat in the space corresponding to the low-heat generating portion 111. The space corresponding to the low-heat generation portion 111 is a space in which the fins 20 and the fins 20 form a fin 20 space, and the fin 20 space is a partial space corresponding to the low-heat generation portion 111. The condensing section 33 is disposed in a partial space corresponding to the low heat generating portion 111, and the heat density around the condensing section 33 is small, which is favorable for sufficient condensation and heat dissipation of the refrigerant in the condensing section 33.

The evaporation section 31 and the condensation section 33 of the heat pipe of the embodiment of the present disclosure are respectively located in the high heat generating portion 110 and the space corresponding to the low heat generating portion 111 of the heat dissipation surface 11, so that the heat of the high heat generating portion 110 can be transferred to the space corresponding to the low heat generating portion 111 through the heat pipe, and the temperature of the high heat generating portion 110 can be rapidly reduced.

In some embodiments, the heat dissipating surface 11 further includes a transition portion 112, the transition portion 112 is disposed between the high heat generating portion 110 and the low heat generating portion 111, and the connecting section 32 is disposed in a space corresponding to the transition portion 112. The space corresponding to the transition portion 112 is a space where the fins 20 and the gaps between the fins 20 constitute a fin 20 space, and the fin 20 space is a partial space corresponding to the low heat generation portion 111. The transition portion 112 is interposed between the high heat generation portion 110 and the low heat generation portion 111, and its heat generation degree is also interposed between the high heat generation portion 110 and the low heat generation portion 111. By passing the connecting section 32 through the transition portion 112, the refrigerant therein can release part of the heat at the transition portion 112, so as to facilitate the heat pipe to fully release the residual heat at the low-heat-generating portion 111, thereby enhancing the heat dissipation effect of the heat pipe. In addition, the refrigerant releases partial heat when the connection section 32 passes through the transition portion 112, which is beneficial to more uniform temperature distribution of the heat dissipation surface 11 and effectively avoid the over-high temperature of the high heat generation portion 110.

In some embodiments, the heat sink further includes a second heat pipe 40, the second heat pipe 40 includes an evaporation portion 41, a connection portion 42 and a condensation portion 43 which are sequentially communicated, the evaporation portion 41 is disposed on the high heat generation portion 110 of the heat dissipation surface 11, the connection portion 42 extends obliquely upward of the evaporation portion 41 through the fin 20 and/or the gap between the fins 20, and the connection portion 42 is disposed above the connection section 32 of the first heat pipe 30; so that the heat of the high heat generating portion 110 is conducted to the obliquely upper side of the evaporation portion 41 through the evaporation portion 41, the connection portion 42, and the condensation portion 43.

The heat sink is provided with the second heat pipe 40 in addition to the first heat pipe 30, and the evaporation portion 41 of the second heat pipe 40 is also provided in the high heat generation portion 110 of the heat radiation surface 11, so that the evaporation section 31 of the first heat pipe 30 and the evaporation portion 41 of the second heat pipe 40 absorb the heat of the high heat generation portion 110 together, thereby enhancing the heat radiation effect to the high heat generation portion 110. The connection portion 42 of the second heat pipe 40 is located above the connection section 32 of the first heat pipe 30, so that the connection portion 42 can transfer heat to the condensation portion 43 and avoid spatial interference with the connection section 32.

Alternatively, the connecting section 32 and the connecting portion 42 are both disposed obliquely and parallel to each other. This makes it possible to extend both the condensation section 33 and the condensation section 43 obliquely upward of the high heat generating section 110 and avoid spatial interference between the connection section 32 and the connection section 42.

In some embodiments, the condensation portion 43 is disposed in a space corresponding to the transition portion 112 of the heat radiating surface 11 to release heat in the space corresponding to the transition portion 112. The space corresponding to the transition portion 112 is a partial space corresponding to the transition portion 112 in the space where the fin 20 and the fin 20 are spaced. By adopting the heat sink provided by the embodiment of the present disclosure, the extending length of the condensing portion 43 is shorter than that of the condensing portion 33, and only extends to the space corresponding to the transition portion 112, so that the heat of the condensing portion 43 is mainly released in the space corresponding to the transition portion 112, thereby reducing the influence on the heat release of the condensing portion 33 of the first heat pipe 30, enabling both the condensing portion 33 and the condensing portion 43 to dissipate heat quickly, and reducing the temperature.

Furthermore, when the plurality of fins 20 having the same height and being perpendicular to the heat dissipating surface 11 are disposed on the heat dissipating surface 11, the plurality of fins 20 may form a rectangular parallelepiped space on one side of the heat dissipating surface 11, the condensing section 33 and the condensing portion 43 are disposed in an inclined manner and are parallel to each other, the condensing portion 43 is located above the condensing section 33, and when the first heat pipe 30 and the second heat pipe 40 extend in an inclined manner from the high heat generating portion 110 to the space corresponding to the low heat generating portion 111, the condensing section 33 may extend to one corner of the rectangular parallelepiped space, and the condensing portion 43 extends to a position close to the top of the rectangular parallelepiped space. Thus, the condensing section 33 and the condensing portion 43 can be close to the external environment of the rectangular parallelepiped space, which is favorable for heat dissipation of the condensing section 33 and the condensing portion 43.

In some embodiments, the heat sink further includes a third heat pipe 50, and the third heat pipe 50 is attached to the heat dissipation surface 11 of the substrate 10 to exchange heat with the heat dissipation surface 11. The radiator is provided with the third heat pipe 50, and the third heat pipe 50 is attached to the radiating surface 11, so that the heat of the radiating surface 11 can be absorbed, and the heat is transferred from the evaporation end to the condensation end of the third heat pipe 50, and thus, the temperature of each area of the radiating surface 11 can be more balanced, the local over-high temperature can be avoided, and the temperature of the high-heating part 110 can be effectively reduced.

Alternatively, the evaporation end of the third heat pipe 50 is disposed at the high heat generation portion 110. In this way, the third heat pipe 50 can absorb heat generated by the high heat generation part 110.

In some embodiments, the condensation end of the third heat pipe 50 is disposed on the low heat generating portion 111 of the heat dissipating surface 11, and is used for releasing heat at the low heat generating portion 111. Thus, the refrigerant can transfer the heat of the high-heating part 110 to the low-heating part 111 through the circulating flow between the evaporation end and the condensation end of the third heat pipe 50, so that the temperature of the heat dissipation surface 11 is more balanced, the heat dissipation effect on the high-heating part 110 of the heat dissipation surface 11 is enhanced, the heat dissipation efficiency on the part with higher heat productivity of the computer board is improved, and the computer board is prevented from being burnt or the performance of the capability of limiting the whole air conditioner due to the higher local heat productivity is avoided.

The embodiment of the present disclosure further provides a heat sink for an air-conditioning computer board, including: the heat pipe comprises a substrate 10, a plurality of fins 20, a first heat pipe 30, a second heat pipe 40 and a third heat pipe 50, wherein the substrate 10 comprises a heat conducting surface and a heat radiating surface 11, the heat conducting surface is in contact with a computer board, and the heat radiating surface 11 is arranged opposite to the heat conducting surface and comprises a high heat generating part 110; the plurality of fins 20 are arranged on the heat dissipation surface 11 and extend away from the heat dissipation surface 11; the first heat pipe 30 includes an evaporation section 31, a connection section 32 and a condensation section 33 which are sequentially communicated, the evaporation section 31 is disposed on the high heat generation portion 110 of the heat dissipation surface 11, and the connection section 32 and the condensation section 33 pass through the fin 20 and/or the gap between the fins 20 and extend obliquely upward of the evaporation section 31; the second heat pipe 40 includes an evaporation portion 41, a connection portion 42 and a condensation portion 43 which are sequentially communicated, the evaporation portion 41 is disposed on the high heat generation portion 110 of the heat dissipation surface 11, the connection portion 42 passes through the fin 20 and/or the gap of the fin 20 and extends obliquely upward of the evaporation portion 41, and the connection portion 42 is disposed above the connection section 32 of the first heat pipe 30; the third heat pipe 50 is attached to the heat dissipating surface 11 of the substrate 10, and an evaporation end of the third heat pipe 50 is disposed at the high heat generating portion 110 and a condensation end thereof is disposed at the low heat generating portion 111 of the heat dissipating surface 11.

By adopting the heat sink provided by the embodiment of the present disclosure, part of the heat of the high heat generating portion 110 can be transferred to the space where the fin 20 away from the high heat generating portion 110 is located through the fin 20, the first heat pipe 30 and the second heat pipe 40, so as to improve the heat dissipation efficiency of the high heat generating portion 110, and part of the heat of the high heat generating portion 110 can be transferred to the low heat generating portion 111 through the third heat pipe 50, so that the surface temperature of the heat dissipation surface 11 is more balanced, and under the combined action of the first, second and third heat pipes and the fin 20, the heat dissipation efficiency of the high heat generating portion 110 is improved, thereby preventing the computer board from being burned down due to a high local heat generation amount or limiting the performance of the whole air conditioner.

An embodiment of the present disclosure further provides an air conditioner, including: a computer board and a heat sink as provided in any of the above embodiments, the heat sink being connected to the computer board.

By arranging the heat sink, the evaporation section 31 of the first heat pipe 30 can be arranged on the high-heat-generating part 110 of the substrate 10 by the action of the substrate 10 and the first heat pipe 30 and used for absorbing heat generated by the high-heat-generating part 110, the connecting section 32 and the condensation section 33 of the first heat pipe 30 pass through the gap between the fins 20 and/or the fins 20 and extend to the obliquely upper part of the evaporation section 31, so that a refrigerant flows to the connecting section 32 and the condensation section 33 from the evaporation section 31 to the obliquely upper part, the heat is released to a region with lower heat density, the heat dissipation effect on the high-heat-generating part 110 of the substrate 10 is enhanced, and the heat dissipation efficiency of a region with higher heat generation on a computer board is further improved.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A heat sink for an air conditioning computer board, comprising:

the base plate comprises a heat conduction surface and a heat dissipation surface, and the heat conduction surface is contacted with the computer board so as to lead in heat generated by the computer board; the heat dissipation surface is arranged opposite to the heat conduction surface and comprises a high-heating part;

the fins are arranged on the heat dissipation surface and extend back to the heat dissipation surface;

the first heat pipe comprises an evaporation section, a connecting section and a condensation section which are sequentially communicated, wherein the evaporation section is arranged on a high-heating part of the heat dissipation surface, the connecting section and the condensation section penetrate through the fins and/or the fin gaps extend to the inclined upper part of the evaporation section, so that the heat of the high-heating part is conducted to the inclined upper part of the evaporation section through the evaporation section of the first heat pipe.

2. The heat sink of claim 1, wherein the connection section comprises:

a straight tube parallel to the fin;

and the bent pipe is communicated with the evaporation section, the straight pipe and the condensation section, so that the condensation section and the plane where the fins are located form a set included angle.

3. The heat sink of claim 2, wherein the evaporation section and the condensation section are perpendicular to a plane in which the fins are located.

4. The heat sink as claimed in claim 1, wherein the heat dissipating surface further includes a low heat generating portion, and the condensing section is disposed in a space corresponding to the low heat generating portion to release heat in the space corresponding to the low heat generating portion.

5. The heat sink according to claim 4, wherein the heat dissipating surface further includes a transition portion provided between the high heat generating portion and the low heat generating portion, and the connection section is provided in a space corresponding to the transition portion.

6. The heat sink according to any one of claims 1 to 5, further comprising:

the second heat pipe comprises an evaporation part, a connecting part and a condensation part which are sequentially communicated, the evaporation part is arranged on a high-heating part of the heat dissipation surface, the connecting part penetrates through the fins and/or the gaps of the fins and extends to the obliquely upper part of the evaporation part, and the connecting part is arranged above the connecting section of the first heat pipe; so that the heat of the high heat generating portion is conducted to an obliquely upper side of the evaporation portion through the evaporation portion, the connection portion, and the condensation portion.

7. The heat sink according to claim 6, wherein the condensation portion is provided in a space corresponding to a transition portion of the heat radiating surface to release heat in the space corresponding to the transition portion.

8. The heat sink according to any one of claims 1 to 5, further comprising:

and the third heat pipe is attached to the radiating surface of the substrate so as to exchange heat with the radiating surface.

9. The heat sink according to claim 8, wherein the condensation end of the third heat pipe is disposed at a low heat generation portion of the heat dissipation surface, so that the condensation end releases heat at the low heat generation portion.

10. An air conditioner, comprising:

a computer board; and

the heat sink of any of claims 1-9, wherein the heat sink is coupled to the computer board.

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