JP2008004667A - Cooling structure, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that, since the manufacturing method of a micro channel consisting of fine fins and fin pitch is limited, the accuracy of dimension in thickness direction of the fin is hard to be assured, so, when the micro channel is stored in a chamber, a gap occurs between the outside fin and chamber, and a wanted cooling performance cannot be assured if a coolant flows as a bypass flow through the gap. <P>SOLUTION: Relating to a micro channel (3), the accuracy of dimension in lengthwise direction (Y direction) of a fin is relatively easily assured. Objects (4 and 5) are set in the upper stream direction (reversal to Y direction) or lower stream direction (Y direction), when viewed from a gap (24) between an outside fin (31) and a chamber (1), to prevent a coolant from flowing the gap (24). By integrally forming the objects (4 and 5) and shell materials (12 and 14) of the chamber (1), an assembly process becomes efficient to reduce a cost. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cooling structure for cooling an electronic component such as an integrated circuit and a manufacturing method thereof, and more particularly to a liquid cooling type cooling structure and a manufacturing method thereof.

  LSIs used in computers increase in the degree of integration at every generation. Along with this, the calorific value of LSI is also increasing with each generation. In order to operate an LSI at high speed, it is necessary to control the operating temperature of the LSI to a certain temperature or lower. Therefore, a cooling structure corresponding to the heat generation amount is attached to the LSI.

  On the other hand, in recent years, not only improving the calculation speed of an LSI but also improving the signal transmission speed between a peripheral portion such as a memory and the LSI is important for speeding up a computer. In order to improve the signal transmission speed, it is necessary to shorten the length of the wiring connecting the LSI and the memory. Therefore, it is difficult to secure a sufficient free space in the computer casing. Therefore, in order to cope with an increase in the heat generation amount of the LSI, it is necessary to increase its cooling capacity so as not to increase the size of the cooling structure.

  Therefore, microchannel cooling has been proposed in which fine radiating fins are provided on an LSI and cooling water is passed between the radiating fins to cool the LSI.

  Patent document 1 is disclosing the method of forming a microchannel using wire processing.

  Patent Document 2 discloses a cooling plate having microchannels. The cooling plate is composed of a corrugated fin and an outer plate surrounding the corrugated fin.

  Patent Document 3 discloses a method for manufacturing a finned heat transfer body, which includes a step of forming a curved fin with a fine pitch by performing skive cutting on the heat transfer body.

  Patent Document 4 discloses a semiconductor having a parallel flow path composed of a large number of fine flow paths, a first header that distributes the refrigerant to each flow path, and a second header where the refrigerant that has flowed out of the parallel flow paths merges. An element cooler is disclosed.

Patent Document 5 discloses a heat sink including an introduction path for introducing a refrigerant and a plurality of fine flow paths provided inside.
JP 2002-151640 A JP 2005-085887 A JP 2002-329820 A JP 2001-035981 A JP 2003-318343 A

  An object of the present invention is to provide a cooling structure with excellent cooling performance and a method for manufacturing the same.

  Another object of the present invention is to provide a cooling structure that is easy to manufacture and a method for easily manufacturing the cooling structure.

  Hereinafter, means for solving the problem will be described using the numbers used in (Best Mode for Carrying Out the Invention). These numbers are added to clarify the correspondence between the description of (Claims) and (Best Mode for Carrying Out the Invention). However, these numbers should not be used to interpret the technical scope of the invention described in (Claims).

  The cooling structure according to the present invention is provided in a chamber (1) having an internal space (2), a plurality of fins (31, 32, 33) for radiating heat generated by the electronic component (99), and the internal space. And (4, 5). The plurality of fins are juxtaposed in the internal space. The liquid flowing into the internal space from the outside of the chamber flows through the inter-fin flow path (23) between the plurality of fins and then flows out of the chamber. The plurality of fins include an outer fin (31) located on the outermost side. The chamber includes an inner wall surface (14a) facing the outer fin. A first direction (Y direction) in which the liquid flows through the inter-fin flow path and a second direction as the opposite direction are defined. The object is disposed in one of the first direction and the second direction as viewed from a first space (24) in which the liquid is sandwiched between the outer fin and the inner wall surface.

  The cooling structure according to the present invention has excellent cooling performance because the object prevents the liquid refrigerant from flowing through the first space in parallel relation with the inter-fin flow path.

  Further, it is relatively easy for the plurality of fins to ensure dimensional accuracy in a direction parallel to the first direction. The cooling structure according to the present invention is easy to manufacture because the object is arranged in the first direction or the second direction when viewed from the first space.

  In the cooling structure according to the present invention, the outer fin includes an edge (31a, 31b) on the one side. The distance (D) in the first direction between the edge and the object is preferably narrower than the fin pitch (P) of the plurality of fins.

  The cooling structure according to the present invention preferably includes other objects (4, 5) provided in the internal space. The other object is arranged in the other of the first direction or the second direction when viewed from the first space.

  In the cooling structure according to the present invention, the internal space is located on the one side when viewed from the plurality of fins and includes partial spaces (21, 22) through which the liquid flows. It is preferable that the object has an inclined surface (4b, 5b) that faces the partial space and is inclined with respect to the inner wall surface. The interval between the inner wall surface and the inclined surface is wide on the side close to the first space and narrow on the side far from the first space.

  The manufacturing method of the cooling structure according to the present invention includes a chamber (1) having an internal space (2), a plurality of fins (31, 32, 33) for radiating heat generated by the electronic component (99), and the internal space. This is a method of manufacturing a cooling structure including the objects (4, 5) provided on the surface. The plurality of fins are juxtaposed in the internal space. The liquid flowing into the internal space from the outside of the chamber flows through the inter-fin flow path (23) between the plurality of fins and then flows out of the chamber. The plurality of fins include an outer fin (31) located on the outermost side. The chamber includes an inner wall surface (14a) facing the outer fin. A first direction (Y direction) in which the liquid flows through the inter-fin flow path and a second direction as the opposite direction are defined. The object is disposed in one of the first direction and the second direction as viewed from a first space (24) in which the liquid is sandwiched between the outer fin and the inner wall surface.

  In the method for manufacturing a cooling structure according to the present invention, the chamber includes a chamber bottom plate (11) and a chamber side wall (14). The method for manufacturing a cooling structure according to the present invention includes a step of integrally forming the chamber sidewall and the object, the chamber sidewall integrally formed with the object, and the chamber bottom plate to which the plurality of fins are fixed. And assembling the cooling structure using

  In the method for manufacturing a cooling structure according to the present invention, the chamber includes a chamber upper lid (12) and a chamber bottom plate (11). The method for manufacturing a cooling structure according to the present invention includes a step of integrally forming the chamber upper lid and the object, the chamber upper lid integrally formed with the object, and the chamber bottom plate to which the plurality of fins are fixed. And assembling the cooling structure using

  ADVANTAGE OF THE INVENTION According to this invention, the cooling structure excellent in cooling performance and its manufacturing method are provided.

  The present invention also provides a cooling structure that is easy to manufacture and a method for easily manufacturing the cooling structure.

  The best mode for carrying out a cooling structure according to the present invention will be described below with reference to the accompanying drawings.

(First embodiment)
FIG. 1 shows a cooling structure 100 according to a first embodiment of the present invention. An X direction, a Y direction, and a Z direction are defined for the cooling structure 100. The X direction, the Y direction, and the Z direction are orthogonal to each other. The cooling structure 100 includes a chamber 1 having an internal space 2, a finned structure 3, and block-shaped objects 4 and 5. The finned structure 3 and the objects 4 and 5 are provided in the internal space 2. The outer shape of the chamber 1 is a flat plate shape. The chamber 1 includes a chamber bottom plate 11, a plate-shaped chamber upper lid 12, and a chamber frame 13. The chamber bottom plate 11 closes one opening of the chamber frame 13, and the chamber upper cover 12 closes the other opening of the chamber frame 13. The chamber bottom plate 11 and the chamber upper lid 12 are opposed to each other in the Z direction. The chamber frame 13 includes a chamber upstream side wall 16 disposed in a direction opposite to the Y direction as viewed from the finned structure 3, a chamber downstream side wall 17 disposed in the Y direction as viewed from the finned structure 3, and fins And two chamber side walls 14 facing each other in the X direction across the attached structure 3. The chamber upstream side wall 16 and the chamber downstream side wall 17 face each other in the Y direction. Two objects 4 and two objects 5 are arranged at the four corners of the chamber frame 13. That is, the object 4 is arranged at the corner formed by the chamber side wall 14 and the chamber upstream side wall 16, and the object 5 is arranged at the corner formed by the chamber side wall 14 and the chamber downstream side wall 17. The upstream space 21 is a space located upstream of the finned structure 3, and is surrounded by the chamber upstream side wall 16, the finned structure 3, and the two objects 4. The downstream space 22 is a space located downstream of the finned structure 3, and is surrounded by the finned structure 3, the chamber downstream side wall 17, and the two objects 5. Each of the upstream space 21 and the downstream space 22 is a part of the internal space 2. The chamber upstream side wall 16 is provided with an inlet 18 for allowing the liquid refrigerant to flow into the upstream space 21, and the chamber downstream side wall 17 is provided with an outlet 19 for allowing the liquid refrigerant to flow out from the downstream space 22. ing.

  The inlet 18 may be provided on the chamber side wall 14 or the chamber upper lid 12 as long as the liquid refrigerant can flow into the upstream space 21. The outflow port 19 may also be provided on the chamber side wall 14 or the chamber upper lid 12 as long as the liquid refrigerant can flow out from the downstream space 22.

  FIG. 2 is a cross-sectional view of the cooling structure 100 according to the first embodiment, taken along a plane perpendicular to the Y direction. Two inner wall surfaces 14a of the two chamber side walls 14 are opposed to each other in the Y direction with the finned structure 3 interposed therebetween. The inner side surface 11a of the chamber bottom plate 11 and the inner side surface 12a of the chamber top cover 12 are opposed to each other in the Z direction with the finned structure 3 interposed therebetween. The chamber bottom plate 11 has an outer surface 11b on the opposite side of the inner surface 11a. The outer side surface 11b and the inner side surface 11a face in opposite directions. The outer side surface 11 b is in close contact with the upper surface 99 a of the electronic component 99. The electronic component 99 is, for example, an integrated circuit such as an arithmetic device provided in the computer, and is disposed in the direction opposite to the Z direction when viewed from the cooling structure 100. The electronic component 99 is attached to a wiring board (not shown). The wiring board is arranged in the direction opposite to the Z direction when viewed from the electronic component 99. The finned structure 3 includes a plate-shaped base 30 and a plurality of fins provided on the base 30, for example, fins 31 to 33. The base 30 includes a fin placement surface 30a and a joint surface 30b. The fin arrangement surface 30a and the bonding surface 30b are disposed on the opposite side of the base portion 30 and face in opposite directions. The joining surface 30b is in close contact with the inner side surface 11a. A plurality of fins including the fins 31 to 33 are arranged in parallel to each other. It is fixed to the fin arrangement surface 30a. The height direction of each fin is parallel to the Z direction. The thickness direction of each fin is parallel to the X direction. The longitudinal direction of each fin is parallel to the Y direction.

  FIG. 3 is a plan view showing the internal structure of the cooling structure 100 according to the first embodiment. The fin 32 and the fin 33 are adjacent to each other with the inter-fin passage 23 interposed therebetween. The finned structure 3 is provided with a plurality of inter-fin passages such as inter-fin passages 23. These inter-fin flow paths are in parallel with each other. Of the plurality of fins, the fin 31 located on the outermost side and the inner wall surface 14a face each other in the X direction with the gap space 24 therebetween. The gap space 24 and the inter-fin passage 23 have a parallel relationship.

  The liquid refrigerant that has flowed into the upstream space 21 from the outside of the cooling structure 100 through the inlet 18 passes through one of a plurality of inter-fin flow paths provided in the finned structure 3, for example, the inter-fin flow path 23. Then, the gas flows into the downstream space 22 and then flows out of the cooling structure 100 through the outlet 19. Therefore, the heat generated in the electronic component 99 and moved to the fins such as the fins 31 to 33 via the chamber bottom plate 11 and the base 30 is radiated from there to the liquid refrigerant flowing in the Y-direction in the Y-direction. And is carried out of the cooling structure 100 by the liquid refrigerant.

  In order to efficiently cool the electronic component 99, it is important to increase the flow rate of the liquid refrigerant flowing in the inter-fin flow path, for example, the inter-fin flow path 23, located directly above the electronic component 99 (Z direction). is there. Here, since the attachment margin for attaching the finned structure 3 to the chamber 1 is necessary, the width W24 of the gap space 24 cannot be made zero. The width W24 is defined as the distance between the inner wall surface 14a and the fin 31. Since the gap space 24 and the inter-fin flow path 23 are in a parallel relationship, when the width W24 is larger than the fin pitch P of the finned structure 3, the liquid refrigerant is prevented from flowing through the gap space 24 by any means. Otherwise, the liquid refrigerant flows through the gap space 24 where the pressure loss is small, and the flow rate of the liquid refrigerant flowing through the inter-fin flow path 23 becomes slow.

  In the cooling structure 100, the object 4 and the object 5 are provided so as to prevent the liquid refrigerant flowing into the upstream space 21 from reaching the downstream space 22 through the gap space 24. Therefore, the liquid refrigerant is prevented from bypassing the gap space 24, and the liquid refrigerant surely flows through the inter-fin flow path such as the inter-fin flow path 23. Therefore, the cooling efficiency of the cooling structure 100 is excellent.

  Here, in the structure 3 with a fin, since the fin easily falls down in the thickness direction, the dimensional accuracy in the X direction is inferior to the dimensional accuracy in the Y direction. Therefore, if the object 4 and the object 5 are not arranged in the gap space 24, and the object 4 and the object 5 are arranged in the reverse direction of the Y direction and the Y direction as seen from the gap space 24, the cooling structure 100 is assembled. Becomes easier. The object 4 includes a first surface 4 a facing the gap space 24, and the object 5 includes a first surface 5 a facing the gap space 24. The first surface 4a faces the Y direction, and the first surface 5a faces the opposite direction to the Y direction. The first surface 4 a and the first surface 5 a are disposed on an extension line in the longitudinal direction of the fin 31. The fin 31 includes an end edge 31a on the upstream side (opposite direction in the Y direction) and an end edge 31b on the downstream side (Y direction side). When the liquid refrigerant flows through the gap space 24, the liquid refrigerant passes through the gap between the first surface 4a and the edge 31a, then bends vertically and flows through the gap space 24, and then bends vertically again to the first surface 5a and the end. It must pass through the gap with the edge 31b. For this reason, the pressure loss of the flow path reaching the downstream space 22 from the upstream space 21 through the clearance space 24 is increased, and the liquid refrigerant is reliably prevented from bypassing the clearance space 24.

  Further, the width W3 in the X direction of the portion of the finned structure 3 where the fins are provided is larger than the width W99 in the X direction of the electronic component 99, and is defined as the upstream distance defined between the two objects 4 in the X direction. It is preferable that the width W21 and the width W99 of the side space 21 coincide with each other, and the width W22 and the width W99 of the downstream space 22 defined as the distance between the two objects 5 in the X direction coincide with each other. In this case, even if the shape of the fin included in the finned structure 3 is not a flat plate shape as shown in FIG. 1 but a curved shape described later, the dimensional accuracy of the finned structure 3 The liquid refrigerant can be easily prevented from bypassing the gap space 24 even if it is not finely defined.

  The interval D between the first surface 4a and the end edge 31a may be larger than the fin pitch P, but the interval D is preferably smaller than the fin pitch P. When the distance D is smaller than the fin pitch P, the effect of preventing the bypass flow is enhanced. The same applies to the distance between the first surface 5a and the end edge 31b. It is easy to manufacture the cooling structure 100 so as to have such dimensions because the dimensional accuracy in the longitudinal direction of the fins of the finned structure 3 is high.

  Here, when the fin pitch P is 1 mm or less, the inter-fin flow path such as the inter-fin flow path 23 is called a microchannel. In this case, since the fins are thinned, the outer fins such as the fins 31 are liable to fall down in the thickness direction, and it is necessary to secure a sufficient mounting space between the fins 31 and the chamber side wall 14. W24 will be two to three times the fin pitch P. When the width W24 is 2 to 3 times the fin pitch P, the cooling performance degradation due to the liquid refrigerant bypassing the gap space 24 may be 20% or more. Therefore, when the fin pitch P is small, it is particularly important to prevent the liquid refrigerant from bypassing the gap space 24.

  A method for manufacturing the cooling structure 100 according to the first embodiment will be described below. In the following description, the case where the fin pitch P is 1 mm or less will be described. However, a method for manufacturing the cooling structure 100 in which the fin pitch P of the finned structure 3 is greater than 1 mm is apparent from the following description and the technical level. It is.

  First, the finned structure 3 is manufactured. The finned structure 3 is manufactured by forming fine fins by wire cutting on a metal material having high thermal conductivity such as aluminum or copper. The finned structure 3 can be manufactured by press working.

  Next, the finned structure 3 is fixed in close contact with the chamber bottom plate 11. The finned structure 3 is fixed to the chamber bottom plate 11 by brazing or bonding with a heat conductive adhesive. Note that the material of the chamber bottom plate 11 is preferably a metal having high thermal conductivity.

  The finned structure 3 and the chamber bottom plate 11 may be manufactured as one component. In this case, the finned structure 3 and the chamber bottom plate 11 are integrally manufactured by processing a common base material.

  Next, cooling is performed using the chamber bottom plate 11 to which the finned structure 3 is fixed, the chamber top lid 12, the chamber side wall 14, the chamber upstream side wall 16, the chamber downstream side wall 17, the object 4 and the object 5. Assemble the structure 100. At this time, the chamber 1 is sealed with brazing or an O-ring so that the liquid refrigerant does not leak out of the chamber 1. The object 4 and the object 5 do not require high thermal conductivity, and may be formed of a material other than metal. However, when the object 4 and the object 5 are fixed to the chamber 1 by brazing, they are formed of the same metal material as the chamber 1. It is preferable that

  FIG. 4 shows a manufacturing method of the cooling structure 100 and one manufacturing method for improving productivity. In FIG. 4, the chamber upper cover 12 is omitted.

  In this method, the object 4 and the object 5 are previously formed integrally with the chamber side wall 14, the chamber side wall 14 on which the object 4 and the object 5 are formed, the chamber bottom plate 11 to which the finned structure 3 is fixed, the chamber The cooling structure 100 is assembled using the upper lid 12, the chamber upstream side wall 16, and the chamber downstream side wall 17. The chamber side wall 14 is brazed to the chamber bottom plate 11 when the cooling structure 100 is assembled. In this method, the object 4 and the object 5 and the chamber side wall 14 can be integrally formed by pressing or extrusion, which is advantageous in terms of cost and productivity. Since the finned structure 3 has high dimensional accuracy in the longitudinal direction of the fins, positioning of the object 4 or the object 5 and the finned structure 3 when the cooling structure 100 is assembled is easy.

  In the manufacturing method shown in FIG. 4, in advance, the object 4 is formed integrally with the chamber upstream side wall 16, the object 5 is formed integrally with the chamber downstream side wall 17, and then the finned structure 3 is fixed to the chamber bottom plate. 11, the chamber upper lid 12, the chamber side wall 14, the chamber upstream side wall 16 in which the object 4 is formed, and the chamber downstream side wall 17 in which the object 5 is formed may be used to assemble the cooling structure 100. The chamber upstream side wall 16 and the chamber downstream side wall 17 are brazed to the chamber bottom plate 11 when the cooling structure 100 is assembled. In this case as well, the object 4 and the chamber upstream side wall 16 can be integrally formed by pressing or extruding, and the object 5 and the chamber downstream side wall 17 can be integrally formed by pressing or extruding. It is advantageous in terms of cost and productivity.

  Further, the object 4 and the object 5 and the chamber frame 13 may be integrally formed by pressing or extrusion.

  FIG. 5 shows a manufacturing method of the cooling structure 100 and shows another manufacturing method for improving productivity.

  In this manufacturing method, the object 4 and the object 5 and the chamber upper lid 12 are integrally formed in advance by pressing or extrusion, and the chamber bottom plate 11 to which the finned structure 3 is fixed, the object 4 and the object 5 are formed. The cooling structure 100 is assembled using the chamber top lid 12, the chamber side wall 14, the chamber upstream side wall 16, and the chamber downstream side wall 17.

  The chamber upper lid 12 may be brazed to the chamber frame 13 or may be screwed to the chamber frame 13 via a sealing material such as an O-ring. In the case of screwing, the chamber upper lid 12 formed integrally with the object 4 and the object 5 does not need to be a metal, and may be a resin material.

(Second Embodiment)
A cooling structure 100 according to the second embodiment of the present invention includes a chamber 1 having an internal space 2, a finned structure 3 shown in FIG. 6, an object 4, and an object 5. In the cooling structure 100 according to the second embodiment, the finned structure 3 shown in FIG. 1 is replaced with the finned structure 3 shown in FIG. 6 in the cooling structure 100 according to the first embodiment. Is. The finned structure 3 includes curved fins, for example, fins 31 to 33, instead of the flat fins. The curved concave surface of each fin faces the X direction.

  FIG. 7 shows a cross-sectional view of the cooling structure 100 according to the second embodiment taken along a plane perpendicular to the Y direction. In the cooling structure 100 according to the second embodiment, each fin is curved, and on the other hand, the chamber side wall 14 has a flat plate shape, so that the cross-sectional area of the gap space 24 is the flow path of the inter-fin flow path 23. It tends to be larger than the cross-sectional area. Therefore, in the cooling structure 100 according to the second embodiment, there is a high need to prevent the liquid refrigerant from bypassing the gap space 24, but the liquid refrigerant passes through the gap space 24 by the objects 4 and 5. Bypassing is effectively prevented.

  The finned structure 3 according to the second embodiment is manufactured by performing a skive cutting process on a metal material having a high thermal conductivity such as aluminum or copper to form fine curved fins.

  The manufacturing method of the cooling structure 100 according to the second embodiment is the same as the manufacturing method of the cooling structure 100 according to the first embodiment, except for the step of manufacturing the finned structure 3.

(Third embodiment)
FIG. 8 shows a cooling structure 100 according to a third embodiment of the present invention. In FIG. 8, the chamber upper cover 12 is omitted. The cooling structure 100 according to the third embodiment includes a chamber 1 having an internal space 2, a finned structure 3, an object 4, and an object 5. In the cooling structure 100 according to the third embodiment, the objects 4 and 5 shown in FIG. 1 are replaced with the objects 4 and 5 shown in FIG. 8 in the cooling structure 100 according to the first embodiment. Is. While the object 4 and the object 5 according to the first embodiment have a block shape, the object 4 and the object 5 according to the third embodiment have a plate shape.

  The object 4 and the object 5 may have an intermediate shape between that shown in FIG. 1 and that shown in FIG.

  The manufacturing method of the cooling structure 100 according to the third embodiment is the same as the manufacturing method of the cooling structure 100 according to the first embodiment.

  Moreover, the cooling structure 100 according to the third embodiment may include the finned structure 3 shown in FIG. 6 instead of the finned structure 3 shown in FIG. 1. The manufacturing method of the cooling structure 100 according to the third embodiment in this case is the same as the manufacturing method of the cooling structure 100 according to the second embodiment.

(Fourth embodiment)
FIG. 9 shows a cooling structure 100 according to a fourth embodiment of the present invention. In FIG. 9, the chamber upper cover 12 is omitted. The cooling structure 100 according to the fourth embodiment includes a chamber 1 having an internal space 2, a finned structure 3, an object 4, and an object 5. In the cooling structure 100 according to the fourth embodiment, the object 4 and the object 5 illustrated in FIG. 1 are replaced with the object 4 and the object 5 illustrated in FIG. 9 in the cooling structure 100 according to the first embodiment. Is. The objects 4 and 5 according to the first embodiment have a block shape, whereas the objects 4 and 5 according to the fourth embodiment have a triangular prism shape.

  The object 4 according to the fourth embodiment includes a second surface 4b. The second surface 4b faces the upstream space 21 and is parallel to the Z direction. The second surface 4 b is inclined with respect to the inner wall surface 14 a so that the distance between the inner wall surface 14 a and the second surface 4 b is wide on the side close to the gap space 24 and narrow on the side far from the gap space 24. Similarly, the object 5 according to the fourth embodiment includes a second surface 5b. The second surface 5b faces the downstream space 22 and is parallel to the Z direction. The second surface 5 b is inclined with respect to the inner wall surface 14 a so that the distance between the inner wall surface 14 a and the second surface 5 b is wide on the side close to the gap space 24 and narrow on the side far from the gap space 24. Therefore, in the cooling structure 100 according to the fourth embodiment, the liquid refrigerant flows smoothly.

  Note that the object 4 and the object 5 according to the fourth embodiment may have a columnar shape with a trapezoidal bottom surface.

  The method for manufacturing the cooling structure 100 according to the fourth embodiment is the same as the method for manufacturing the cooling structure 100 according to the first embodiment.

  Moreover, the cooling structure 100 according to the fourth embodiment may include the finned structure 3 shown in FIG. 6 instead of the finned structure 3 shown in FIG. 1. The manufacturing method of the cooling structure 100 according to the fourth embodiment in this case is the same as the manufacturing method of the cooling structure 100 according to the second embodiment.

  In addition, although it is preferable that the cooling structure 100 according to each of the above embodiments includes both the object 4 and the object 5, even when only one of the object 4 and the object 5 is included, the liquid refrigerant may be a gap. Bypassing the space 24 is prevented.

  Since the cooling structure 100 according to each of the above embodiments is easy to downsize and has excellent cooling performance, the calculation speed of the computer can be improved.

  Further, the cooling structure 100 according to each of the above embodiments can be used not only for a computer but also for cooling various electronic devices.

It is a perspective view of the cooling structure which concerns on the 1st Embodiment of this invention. It is sectional drawing of the cooling structure which concerns on the 1st Embodiment of this invention. It is a top view of the cooling structure concerning a 1st embodiment of the present invention. It is a perspective view for demonstrating one method of manufacturing the cooling structure which concerns on the 1st Embodiment of this invention. It is a perspective view for demonstrating the other method of manufacturing the cooling structure which concerns on the 1st Embodiment of this invention. It is a perspective view of the structure with a fin concerning a 2nd embodiment of the present invention. It is sectional drawing of the cooling structure which concerns on the 2nd Embodiment of this invention. It is a perspective view of the cooling structure which concerns on the 3rd Embodiment of this invention. It is a perspective view of the cooling structure which concerns on the 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Chamber 11 ... Chamber bottom plate 11a ... Inner side surface 11b ... Outer side surface 12 ... Chamber upper cover 12a ... Inner side surface 13 ... Chamber frame 14 ... Chamber side wall 14a ... Inner wall surface 16 ... Chamber upstream side wall 17 ... Chamber downstream side wall 18 ... Inlet DESCRIPTION OF SYMBOLS 19 ... Outlet 2 ... Internal space 21 ... Upstream side space 22 ... Downstream side space 23 ... Channel between fins 24 ... Gap space (bypass channel)
DESCRIPTION OF SYMBOLS 3 ... Fin structure 30 ... Base 30a ... Fin arrangement | positioning surface 30b ... Joint surface 31-33 ... Fin 31a, 31b ... Edge 4, 5 ... Object 4a, 5a ... 1st surface 4b, 5b ... 2nd surface 99 ... Electronic component 99a ... Top surface 100 ... Cooling structure

Claims (7)

A chamber having an internal space;
A plurality of fins that dissipate heat generated by electronic components;
An object provided in the internal space,
The plurality of fins are juxtaposed in the internal space,
The liquid flowing into the internal space from the outside of the chamber flows out of the chamber after flowing through the inter-fin flow path between the plurality of fins,
The plurality of fins include outermost fins located on the outermost side,
The chamber includes an inner wall facing the outer fin;
A first direction in which the liquid flows through the inter-fin flow path and a second direction as the opposite direction are defined,
The cooling structure, wherein the object is disposed in one of the first direction and the second direction when viewed from a first space where the liquid is sandwiched between the outer fin and the inner wall surface. The outer fin has an edge on the one side,
The cooling structure according to claim 1, wherein an interval between the edge and the object in the first direction is narrower than a fin pitch of the plurality of fins. Comprising other objects provided in the internal space,
The cooling structure according to claim 1 or 2, wherein the other object is disposed in the other of the first direction and the second direction when viewed from the first space. The internal space is located on the one side when viewed from the plurality of fins, and includes a partial space through which the liquid flows,
The object includes an inclined surface facing the partial space and inclined with respect to the inner wall surface,
The cooling structure according to claim 1 or 2, wherein a distance between the inner wall surface and the inclined surface is wide on a side close to the first space and narrow on a side far from the first space. A chamber having an internal space;
A plurality of fins that dissipate heat generated by electronic components;
An object provided in the internal space,
The plurality of fins are juxtaposed in the internal space,
The liquid flowing into the internal space from the outside of the chamber flows out of the chamber after flowing through the inter-fin flow path between the plurality of fins,
The plurality of fins include outermost fins located on the outermost side,
The chamber includes an inner wall facing the outer fin;
A first direction in which the liquid flows through the inter-fin flow path and a second direction as the opposite direction are defined,
The method for manufacturing a cooling structure, wherein the object is disposed in one of the first direction and the second direction as viewed from a first space in which the liquid is sandwiched between the outer fin and the inner wall surface. The chamber includes a chamber bottom plate and a chamber side wall,
Forming the chamber side wall and the object integrally;
The method for manufacturing a cooling structure according to claim 5, further comprising: assembling the cooling structure using the chamber side wall integrally formed with the object and the chamber bottom plate to which the plurality of fins are fixed. The chamber includes a chamber top lid and a chamber bottom plate,
Integrally forming the chamber top lid and the object;
The method for manufacturing a cooling structure according to claim 5, comprising the step of assembling the cooling structure using the chamber top cover in which the object is integrally formed and the chamber bottom plate to which the plurality of fins are fixed.

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