TWM456524U - Liquid cooling heat sink with monitoring and control panel - Google Patents

Description

Liquid cooled heat sink with monitoring panel

This creation relates to liquid-cooled heat sinks, and in particular to a liquid-cooled heat sink with a monitoring panel.

With the development of technology, today's computers not only operate faster and faster, but also become more powerful. In addition, in order to meet the trend of becoming thinner and lighter, the requirements for heat dissipation efficiency must be relatively increased. Therefore, for the heat dissipation of high heat sources, the conventional air forced cooling is no longer sufficient, and a liquid cooling system is replaced.

The general liquid cooling system is installed in the computer mainframe. The liquid cooling system includes a cold plate, a pump, and a heat dissipator, and the three are connected to each other to form a circulation line. The circulation pipeline is filled with a working fluid (generally water), the water-cooling head contacts the heat source, and the heat energy generated by the heat source is taken away from the heat source by heat conduction. Then, the water in the pump-driven circulation line circulates, flows through the water-cooling head and exchanges heat with the water-cooling head, and finally transfers the heat energy of the belt to the heat-dissipating row to escape to the outside air.

However, due to the above-mentioned liquid-cooled long-term use, the working fluid may be reduced by evaporation, resulting in a decrease in heat dissipation efficiency. Furthermore, if the liquid cooling system fails, the electronic components inside the computer may be overheated and damaged. Therefore, how to know the working state of the liquid cooling system is an important issue.

In view of this, the creator has made great efforts to solve the above problems by focusing on the above-mentioned prior art, and has devoted himself to the application of the theory, that is, the goal of the creator's improvement.

The purpose of the present invention is to provide a liquid-cooled heat sink with a monitoring panel to achieve the purpose of monitoring the operation of the heat sink, and to maintain heat dissipation efficiency, preventing electronic components from overheating and damaging.

In order to achieve the above purpose, the present invention provides a liquid-cooled heat sink with a monitoring panel for cooling a heating element on a circuit board, the heat sink comprising a water-cooling head, a liquid pump, a control circuit board, and a monitoring panel. And a plurality of LED chips. The water-cooling head thermally connects the heating element, and the water-cooling head comprises a first outer casing, and the first outer casing has a first pipe joint and a first opening. The liquid pump is vertically stacked on the water cooling head, the liquid pump comprises a second outer casing, the second outer casing is internally provided with an impeller and a driving coil group surrounding the impeller, and the second outer casing has a second pipe joint and a second port communicating with each other, and second The pipe joint is connected to the first pipe joint. The control circuit board is located between the water cooling head and the liquid pump, and the control circuit board is electrically connected to the driving coil group. The monitoring panel has a display that can display status data of the heat sink, and the monitoring panel is electrically connected to the control circuit board and disposed outside the first housing. The plurality of LED chips are LED chips of different colors, and the LED chips are disposed on the monitoring panel and emit light sources of different colors according to the value of the state data.

Compared with the prior art, the liquid cooling device of the present invention is provided with a monitoring panel. The monitoring panel can be disposed on the top surface of the first outer casing or embedded on the casing, thereby knowing the working state or controlling operation of the liquid-cooled heat sink, thereby maintaining heat dissipation efficiency and preventing the electronic components from overheating and being damaged.

1‧‧‧heating device

2‧‧‧ boards

3‧‧‧heating components

4‧‧‧Shell

10‧‧‧Water-cooled head

11‧‧‧ first shell

111‧‧‧First pipe joint

112‧‧‧ first port

12‧‧‧Hot exchange runner

13‧‧‧Baffle

20‧‧‧Liquid pump

21‧‧‧ second casing

211‧‧‧Second pipe joint

212‧‧‧second port

22‧‧‧ Impeller

23‧‧‧Drive coil set

25‧‧‧Waterproof gasket

30‧‧‧Control Board

40‧‧‧Monitor panel

41‧‧‧ display

42‧‧‧ button

43‧‧‧LED chip

50‧‧‧ heat sink

60‧‧‧fan

70‧‧‧Connecting tube

80‧‧‧Shell

The first picture shows the stereoscopic appearance of the liquid-cooled heat sink with the monitoring panel of the present invention;

The second picture is a schematic view of the three-dimensional appearance of the water-cooled head and the liquid pump of the present invention;

The third picture is one of the three-dimensional exploded schematic diagrams of the water-cooled head and the liquid pump of the present invention;

The fourth picture is the two-dimensional exploded schematic diagram of the water-cooled head and the liquid pump of the present invention;

The fifth drawing is a schematic view of another embodiment of the liquid-cooled heat sink with a monitoring panel according to a preferred embodiment of the present invention.

Referring to the first figure, the stereoscopic appearance of the liquid-cooled heat sink of the present invention with a monitoring panel is shown. The liquid-cooled heat sink 1 of the present invention has a monitoring panel for cooling the heat generating component 3 on a circuit board 2. The heat sink 1 includes a cold plate 10, a liquid pump 20, a control circuit board 30, a monitoring panel 40, and a heat sink 50.

Please refer to the second to fourth figures, which are respectively a schematic view of the three-dimensional appearance of the water-cooled head and the liquid pump, and a two-dimensional exploded view. The water-cooling head 10 is thermally coupled to the heating element 3 (as shown in the first figure). The water cooling head 10 includes a first outer casing 11, a heat exchange flow passage 12, and a deflector 13.

The first outer casing 11 is preferably flat, and the first outer casing 11 has a first pipe joint 111 and a first through hole 112. The heat exchange passage 12 and the deflector 13 are disposed in the first outer casing 11. The heat exchange channel structure 12 is a parallel flow path formed by a plurality of fins arranged in parallel, but is not limited thereto. The first pipe joint 111 is preferably a rigid pipe that communicates with the inside of the first casing 11. One end of the baffle 13 is adjacent to the first port 112.

The liquid pump 20 is vertically stacked on the water-cooling head 10. The liquid pump includes a second outer casing 21, and an inner impeller 22 and a drive coil assembly 23 surrounding the impeller 22 are disposed inside the second outer casing 21. The second outer casing 21 has a second pipe joint 211 and a second through port 212 that communicate with each other. When the liquid pump 20 is assembled on the upper portion of the water-cooling head 10, the second pipe joint 211 is tightly sleeved with the first pipe joint 111, and the second pipe joint 211 is connected to the first pipe joint 111. Preferably, a waterproof gasket 25 is disposed between the first pipe joint 111 and the second pipe joint 211 to provide waterproof performance.

The control circuit board 30 is located between the water cooling head and the liquid pump, and the control circuit board 30 is electrically connected to the driving coil group 23 to control the rotation speed of the impeller 22.

The monitoring panel 40 has a display 41, a plurality of buttons 42 and a plurality of LED chips 43 of different colors, which can display the status data of the heat sink 1. The monitoring panel 40 is electrically connected to the control circuit board 30 and disposed outside the first housing 11. The monitoring panel 40 is further electrically connected to the circuit board 2, so that the display 41 displays the state information of the heat sink 1, such as the temperature of the heat generating component 3. Moreover, the LED chips 43 are used to provide the light source required for the display 41, and emit light sources of different colors according to the value of the state data. For example, when the temperature value displayed by the display 41 is higher than a certain value, a red backlight color is displayed. On the other hand, when the temperature value displayed by the display 41 is lower than a certain value, it is displayed as a backlight color of green or blue.

As shown in the first figure, the liquid-cooled heat sink 1 further includes a fan 60 and two connecting tubes 70 and a casing 80. The fan 60 is disposed on the heat dissipation row 50. The heat dissipation block 50 communicates with the water cooling head 10 and the liquid pump 20 through the two connection pipes 70 to form a closed circulation line. The circulation line is filled with working fluid, and the working fluid is preferably water, but the creation is not limited to water, and may be alcohol or other liquid. In the embodiment, the heat dissipation row 50 is connected to the first port 112 of the first casing 11 and the second port 212 of the second casing 21 .

Preferably, the monitoring panel 40 is electrically connected to the fan 60 so that the display 41 can display the number of revolutions of the fan 60. In addition, the monitoring panel 40 can also control the operation of the fan 60. The monitoring panel 40 can control the number of revolutions of the fan 60 through the buttons 42. Moreover, the buttons 42 can also be used to control the drive coil assembly 23. In actual use, the user controls the number of revolutions of the impeller 22 by operating the button 42 of the monitoring panel 40.

Furthermore, the casing 80 covers the outside of the first casing 11 and the second casing 21, and the water-cooling head 10, the liquid pump 20, and the control circuit board 30 form an integrated heat sink. In an embodiment of the present invention, the monitoring panel 40 is embedded on the top surface of the casing 80 to facilitate the user to monitor the state of use of the heat sink 1.

It is worth mentioning that, because the display 41 can also display the number of revolutions of the fan 60, the LED chips 43 on the monitoring panel 40 can also emit light sources of different colors according to the number of revolutions of the fan 60. Please also refer to the fifth figure, another application embodiment of the liquid-cooled heat sink with the monitoring panel of the present invention. In the embodiment, the heat dissipating device 1 is disposed in a casing 4. The monitoring panel 40 is exposed on one side of the casing 4 for the user to monitor the operating state of the heat dissipating device 1 for cooling the heating element 3 on the circuit board 2.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the patents of the present invention. Other equivalent variations of the patent spirit using the present invention are all within the scope of the patent.

1‧‧‧heating device

2‧‧‧ boards

3‧‧‧heating components

10‧‧‧Water-cooled head

112‧‧‧ first port

20‧‧‧Liquid pump

212‧‧‧second port

30‧‧‧Control Board

40‧‧‧Monitor panel

50‧‧‧ heat sink

60‧‧‧fan

70‧‧‧Connecting tube

80‧‧‧Shell

Claims (9)

A liquid-cooled heat sink with a monitoring panel for cooling a heat generating component on a circuit board, the heat sink comprising:
a water-cooling head, thermally connecting the heating element, the water-cooling head comprises a first outer casing, the first outer casing has a first pipe joint and a first opening;
a liquid pump vertically stacked on the water-cooling head, the liquid pump comprising a second outer casing, the second outer casing is internally provided with an impeller and a driving coil group surrounding the impeller, the second outer casing having a second communicating with each other a pipe joint and a second port, the second pipe joint is connected to the first pipe joint;
a control circuit board is located between the water cooling head and the liquid pump, the control circuit board is electrically connected to the driving coil set;
a monitoring panel having a display capable of displaying status data of the heat sink, the monitoring panel being electrically connected to the control circuit board and disposed outside the first housing; and a plurality of LED chips for LED chips of different colors The LED chips are disposed on the monitoring panel and emit light sources of different colors according to the value of the state data of the heat sink. The liquid-cooled heat sink with a monitoring panel according to claim 1, further comprising a casing covering the outer sides of the first casing and the second casing. The liquid-cooled heat sink with a monitoring panel according to claim 2, wherein the monitoring panel is embedded on a top surface of the casing. The liquid-cooled heat sink of the monitoring panel of claim 2, further comprising a heat dissipation row and a fan, the heat dissipation row communicating with the first port of the first housing and the second port of the second housing The fan is disposed on the heat dissipation row. The liquid-cooled heat sink of the monitoring panel of claim 4, wherein the monitoring panel is electrically connected to the fan, and the display indicates the number of revolutions of the fan. The liquid-cooled heat sink of the monitoring panel of claim 5, wherein the monitoring panel further comprises a plurality of buttons, wherein the buttons control the number of revolutions of the fan. The liquid-cooled heat sink of the monitoring panel of claim 1, wherein the monitoring panel further comprises a plurality of buttons, wherein the buttons control the driving coil set. The liquid-cooled heat sink with a monitoring panel according to claim 1, wherein the monitoring panel is electrically connected to the circuit board, and the display indicates the temperature of the heat generating component. The liquid-cooled heat sink with a monitoring panel according to claim 1, wherein the heat sink is disposed in a casing, and the monitoring panel is exposed on the casing.