TWI550394B - Liquid cooling system and liquid cooling method - Google Patents

Description

Liquid cooling system and liquid cooling method

The present invention relates to a display device. More specifically, the present invention relates to a display device having a translucent retroreflective element.

In order to make the computer operate in the most stable state, the operating parameters of each component in the computer are usually set to a preset value to ensure that the components do not exceed the load. In other words, the components in the computer are not fully efficient. .

Therefore, in order to improve the processing efficiency of the computer, the user can raise the clock rate of the central processing unit (CPU) to a value higher than a preset value, that is, overclocking. Because the clock speed is increased, the central processor will generate a lot of heat. In order to enable the central processing unit to work stably with the clock speed higher than the preset value, a heat sink must be used to generate a large amount of heat. Take it away and keep the central processor at a low temperature to prevent it from overheating and failing to operate.

There are many ways to dissipate heat (air cooling, water cooling, compressors, liquid nitrogen, etc.), and extreme overclockers usually use liquid nitrogen (LN2) to dissipate heat. However, liquid nitrogen rapidly volatizes to nitrogen at normal temperature, so manual addition of liquid nitrogen residues is required for manual addition and manual addition is required from time to time. Furthermore, adding too much liquid nitrogen can cause the CPU to be too cold, which can also disable the central processor. Therefore, how to enable the central processor to maintain an appropriate temperature at high clocks has become an important issue.

In order to solve the above problems, the present invention provides a liquid cooling system for reducing the temperature of an electronic component. The liquid cooling system includes a storage component, a coolant contained in the storage component, a receiving component, and a a switching element, and a control unit. The receiving component is disposed on the electronic component and contacts the storage component. The switching component is disposed between the storage component and the receiving component, and the control unit electrically connects the switching component and receives temperature information of one of the electronic components. When the temperature of the electronic component is higher than a first temperature, the control unit transmits a first signal to the switching component to turn the switching component into an open state, and the cooling fluid flows through the switching component and enters the receiving component to lower the temperature of the electronic component. When the temperature of the electronic component is lower than the first temperature, the control unit transmits a second signal to the switching component to switch the switching component from an open state to a closed state to block the coolant from entering the receiving component.

In an embodiment of the invention, the cooling liquid comprises liquid nitrogen, liquid helium or a coolant between -100 and -300 degrees.

In an embodiment of the invention, the control unit further receives load information of one of the electronic components. When the load is higher than a predetermined value for a predetermined time, the control unit transmits the first signal to the switching component, so that the switching component is Open state.

In an embodiment of the invention, the load information includes current magnitude, usage rate, or information such as a Serial Power Identification (SVID).

In an embodiment of the invention, the liquid cooling system further includes a detecting component disposed in the receiving component and electrically connected to the control unit when the coolant contacts When detecting the component, the control unit transmits the second signal to the switching component to switch the switching component from the on state to the off state.

In an embodiment of the invention, the liquid cooling system further includes an input component and a display component, and is electrically connected to the control unit.

In an embodiment of the invention, the liquid cooling system further includes a temperature sensing component that connects the electronic component and is electrically connected to the control unit to transmit temperature information of the electronic component to the control unit.

The invention further provides a liquid cooling method for reducing the temperature of an electronic component. The liquid cooling method includes providing a cooling liquid, providing a receiving member disposed on the electronic component, providing a solenoid valve for connecting the receiving component, setting a first temperature, and opening when the temperature of the electronic component is higher than the first temperature. The solenoid valve causes the coolant to flow through the solenoid valve and into the receiving member to lower the temperature of the electronic component, and when the temperature of the electronic component is lower than the first temperature, close the solenoid valve to block the coolant from entering the receiving member.

In an embodiment of the invention, the liquid cooling method further includes opening the electromagnetic valve when the load thereof is higher than a predetermined value for a predetermined time.

In an embodiment of the invention, the liquid cooling method further includes closing the electromagnetic valve when the coolant in the receiving member exceeds a certain volume.

100‧‧‧Storage components

200‧‧‧ Containing components

210‧‧‧ accommodating space

220‧‧‧ openings

300‧‧‧Switching elements

400‧‧‧Control unit

500‧‧‧ input components

600‧‧‧ display components

700‧‧‧Temperature sensing components

800‧‧‧Detection components

B‧‧‧Board

E‧‧‧Electronic components

L‧‧‧ Coolant

S101~S107‧‧‧Steps

T‧‧‧ pipeline

W‧‧‧ wire

Fig. 1A is a schematic view showing a liquid cooling system according to an embodiment of the present invention.

Fig. 1B is a partial cross-sectional view showing a housing member, a piping, an electronic component, and a circuit board.

Fig. 2 is a schematic view showing the flow of the coolant into the accommodating member via the pipe.

Figure 3 is a schematic view showing a liquid cooling system according to another embodiment of the present invention.

4A and 4B are views showing the arrangement of the detecting element in the accommodating member in another embodiment of the present invention.

Figure 5 is a flow chart showing a liquid cooling method according to an embodiment of the present invention.

The liquid cooling system and the liquid cooling method of the embodiment of the present invention will be described below. However, it will be readily understood that the embodiments of the present invention are susceptible to many specific embodiments of the invention and can The specific embodiments disclosed are merely illustrative of the invention, and are not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning It will be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the context or context of the present disclosure, and should not be in an idealized or overly formal manner. Interpretation, unless specifically defined herein.

Referring first to FIG. 1A, a liquid cooling system according to an embodiment of the present invention mainly includes a storage component 100, a receiving component 200, a switching component 300, a control unit 400, an input component 500, and a display component 600. The storage element 100 houses the coolant L and communicates with the accommodating element 200 via a line T. The switching element 300 is disposed on the pipeline T, and the control unit 400 is electrically connected to the circuit board B, the switching element 300, the input component 500, and the display component 600 by wires W, respectively.

Please refer to FIG. 1A and FIG. 1B together. In this embodiment, the receiving component 200 is disposed on an electronic component E. Coolant L can be passed from storage element 100 The pipe T flows into the accommodating space 210 of the accommodating member 200, so that the coolant L contacts the electronic component E via the accommodating member 200 to lower the temperature of the electronic component E. In addition, the receiving member 200 further has an opening 220 connected to the external environment. Since the cooling liquid L is usually a volatile liquid (for example, liquid nitrogen, liquid helium or a coolant between -100 and 300 degrees), The coolant L is vaporized and discharged directly into the external environment through the opening 220, and does not accumulate in the accommodating space 210, so that the coolant L cannot flow.

As shown in FIG. 1A, in the embodiment, the electronic component E is electrically connected to the control unit 400 via a wire W and a circuit board B, for example, a central processing unit (CPU) or a graphics processing unit (GPU). During operation, it continuously supplies its own temperature information to the control unit 400.

The user can set a first temperature via the input component 500 when the electronic component E starts to operate or before the operation. After the electronic component E starts to operate, the display component 600 will simultaneously display the current temperature of the electronic component E and the first temperature. When the temperature of the electronic component E is higher than the first temperature, the control unit 400 transmits a first signal to the switching component 300, causing the switching component 300 to be in an open state, and the cooling liquid L in the storage component 100 is thus allowed to flow through the switching component. 300 enters the accommodating space 210 of the accommodating component 200 to dissipate heat from the electronic component E (as shown in FIG. 2). In this way, the electronic component E can operate at a proper temperature (generally, a first temperature, for example, -10 ° C to -150 ° C), thereby improving its performance.

Since the temperature of the coolant L (for example, -196 ° C for liquid nitrogen and -275 ° C for liquid helium) is usually much lower than the first temperature, the electronic component E may not be able to start or operate in the case of excessively low temperature, so The temperature of the electronic component E is lower than The first temperature indicates that there is sufficient coolant L in the current receiving component 200. At this time, the control unit 400 transmits a second signal to the switching component 300 to switch the switching component 300 from the on state to the off state. The coolant L in the blocking storage element 100 continues to enter the receiving element 200.

In the embodiment, the switching element 300 is, for example, a solenoid valve, and the input element 500 is, for example, a keyboard, and the display element 600 is, for example, an organic light emitting diode display (OLED) or a liquid crystal display (LCD). In some embodiments, input component 500 and display component 600 are integrated, such as a touch screen.

Referring to FIG. 3, the liquid cooling system of another embodiment of the present invention further includes a temperature sensing component 700 electrically connected to the control unit 400 via a wire W, because some electronic components E are unable to provide their own temperature information. The temperature of the electronic component E is sensed and its temperature information is transmitted to the control unit 400. The control unit 400 can transmit the first or second signal to the switching component 300 according to the temperature information and the first temperature input by the user.

When the electronic component E is used at a higher rate and the temperature is always greater than the first temperature, the coolant L continues to flow from the storage element 100 through the switching element 300 into the accommodating member 200, which may cause an overflow. Therefore, as shown in FIG. 4A, in another embodiment of the present invention, the liquid cooling system further includes a detecting component 800 disposed on the inner wall of the receiving component 200 and electrically connected to the control unit 400. When the cooling liquid L in the accommodating space 210 reaches a certain volume, the cooling liquid L contacts the detecting component 800 (as shown in FIG. 4B), and the detecting component 800 transmits a signal to the control unit 400 to control Unit 400 transmits a second signal to switching element 300 to block coolant L from continuing into receiving element 200. In some embodiments The detecting component 800 can also detect the liquid level by ultrasonic waves to determine whether to transmit the signal to the control unit 400.

In another embodiment of the present invention, the control unit 400 can further receive load information (eg, current magnitude, usage rate, or power management protocol: SVID) of the electronic component E. When the load is higher than a predetermined value for a predetermined time, the control unit 400 may transmit the first signal to the switching element 300 to cause the cooling liquid L to flow into the accommodating element 200 and lower the temperature of the electronic component E. For example, the aforementioned predetermined time may be 5 to 10 seconds.

Referring to FIG. 5, the present invention further provides a liquid cooling method for reducing the temperature of an electronic component. First, a coolant, a receiving member, and a solenoid valve (preset to be closed) may be provided (step S101), wherein the coolant is housed in the storage member and the solenoid valve is coupled to the receiving member. Then, the user can set a first temperature (step S102).

Next, it is judged whether or not the coolant in the accommodating element exceeds a volume (step S103), and if so, the solenoid valve is closed (step S104), so that the coolant cannot enter the accommodating element; if not, step S105 is performed. Step S105 is to determine whether the temperature of the electronic component exceeds the first temperature, and if so, the solenoid valve is opened (step S106), and the coolant is introduced into the housing member to cool the electronic component; if not, step S107 is performed.

Step S107 is to determine whether the load is higher than a predetermined value within a predetermined time, and if so, the solenoid valve is opened (step S106); if not, the solenoid valve is closed (step S104). After step S104 and S106 are performed, step S103 is re-executed to maintain the electronic components at an appropriate temperature range and to prevent coolant from overflowing the receiving member.

In summary, the present invention provides a liquid cooling system and a liquid cooling method. The control unit transmits the first and second signals to the switching element (solenoid valve) according to the temperature information of the electronic component and the load information, so that the switching element is turned on or The closed state can effectively control the coolant to enter the receiving member to lower the temperature of the electronic component and maintain the temperature of the electronic component within an appropriate range.

Although the embodiments of the present invention and its advantages are disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. In addition, the scope of the present invention is not limited to the processes, machines, manufacture, compositions, devices, methods, and steps in the specific embodiments described in the specification. Any one of ordinary skill in the art can. The processes, machines, fabrications, compositions, devices, methods, and procedures that are presently or in the future are understood to be used in accordance with the present invention as long as they can perform substantially the same function or achieve substantially the same results in the embodiments described herein. Accordingly, the scope of the invention includes the above-described processes, machines, manufactures, compositions, devices, methods, and steps. In addition, the scope of each of the claims constitutes an individual embodiment, and the scope of the invention also includes the combination of the scope of the application and the embodiments.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. In addition, each patent application scope is constructed as a separate embodiment, and various combinations of patents and combinations of embodiments are within the scope of the invention.

100‧‧‧Storage components

200‧‧‧ Containing components

300‧‧‧Switching elements

400‧‧‧Control unit

500‧‧‧ input components

600‧‧‧ display components

B‧‧‧Board

E‧‧‧Electronic components

L‧‧‧ Coolant

T‧‧‧ pipeline

W‧‧‧ wire

Claims (8)

A liquid cooling system for reducing the temperature of an electronic component, the liquid cooling system comprising: a storage component; a coolant contained in the storage component; a receiving component disposed on the electronic component and contacting the a storage element; a switching element disposed between the storage element and the receiving element; and a control unit electrically connected to the switching element and receiving temperature information and a load information of the electronic component, when the temperature of the electronic component When the temperature is higher than a first temperature, the control unit transmits a first signal to the switching element, so that the switching element is in an open state, and the cooling liquid flows through the switching element and enters the receiving component to reduce the temperature of the electronic component. When the temperature of the electronic component is lower than the first temperature, the control unit transmits a second signal to the switching component to switch the switching component from the open state to a closed state to block the coolant from entering the receiving component. An element, and when the load of the electronic component is higher than a predetermined value for a predetermined time, the control unit transmits the first signal to the switch element So that the switching element into the on state. The liquid cooling system of claim 1, wherein the cooling liquid comprises liquid nitrogen, liquid helium or a coolant between -100 and -300 degrees. The liquid cooling system of claim 1, wherein the load information includes a current magnitude, a usage rate, or a power management communication protocol (SVID). The liquid cooling system of claim 1, wherein the liquid cooling system further comprises a detecting component disposed in the receiving component and electrically connected to the control unit when the coolant contacts the detecting component The control unit transmits the second signal to the switching element to cause the switching element to transition from the on state to the off state. The liquid cooling system of claim 1, wherein the liquid cooling system further comprises an input component and a display component, and is electrically connected to the control unit. The liquid cooling system of claim 1, wherein the liquid cooling system further comprises a temperature sensing component, contacting the electronic component and electrically connecting the control unit to transmit temperature information of the electronic component to the control unit. A liquid cooling method for reducing the temperature of an electronic component, the liquid cooling method comprising: providing a cooling liquid: providing a receiving component disposed on the electronic component; providing a solenoid valve to connect the receiving component; setting one a first temperature; when the temperature of the electronic component is higher than the first temperature, opening the solenoid valve, causing the coolant to flow through the solenoid valve and into the receiving component to lower the temperature of the electronic component; When the temperature is lower than the first temperature, the solenoid valve is closed to block the coolant from entering the receiving member; and when the load of the electronic component is higher than a predetermined value for a predetermined time, the solenoid valve is opened. The liquid cooling method according to claim 7, wherein the liquid cooling method further comprises: closing the electromagnetic valve when the cooling liquid in the accommodating member exceeds a certain volume.