CN217608178U

CN217608178U - Liquid cooling system

Info

Publication number: CN217608178U
Application number: CN202221038518.0U
Authority: CN
Inventors: 李明聪; 叶记廷
Original assignee: Sunonwealth Electric Machine Industry Co Ltd
Current assignee: Sunonwealth Electric Machine Industry Co Ltd
Priority date: 2022-04-26
Filing date: 2022-04-29
Publication date: 2022-10-18
Anticipated expiration: 2032-04-29
Also published as: CN116997135A; TW202344177A

Abstract

The utility model provides a liquid cooling system for solve the problem that current submergence formula cooling device use cost is difficult to descend. The method comprises the following steps: a sealing groove having an accommodating space; a circulating layer formed by a working liquid filled in the accommodating space; and the cooling module is positioned in the accommodating space and is provided with a phase change fluid groove and a pump, the phase change fluid groove is used for being thermally connected with a heating source, the phase change fluid groove is not contacted with the circulating layer, the phase change fluid groove is provided with an evaporation port communicated with the accommodating space, a liquid inlet of the pump is communicated with the circulating layer, and a liquid outlet of the pump is communicated with the inside of the phase change fluid groove.

Description

Liquid cooling system

Technical Field

The utility model discloses a heat abstractor, especially a liquid cooling system.

Background

Immersion cooling (Immersion cooling) is to immerse an electrical unit (such as a motherboard of a server or a computer) in a non-conductive liquid, so that high-temperature heat energy generated during the operation of the electrical unit can be directly absorbed by the non-conductive liquid, and the electrical unit can maintain a proper operating temperature to achieve an expected operating efficiency and a service life.

A conventional immersion cooling apparatus generally includes a cooling tank filled with a liquid non-conductive liquid, and a condenser disposed above the liquid non-conductive liquid. The electric unit needing cooling is immersed in the liquid non-conductive liquid, and due to the fact that the boiling point of the non-conductive liquid is low, after the working heat energy of the electric unit is absorbed, part of the non-conductive liquid can be converted into a gas state, so that bubbles are formed in the liquid non-conductive liquid and float upwards until the bubbles leave the surface layer of the liquid non-conductive liquid, and then the bubbles condense back to the liquid state again when contacting the condenser and drop downwards.

However, in the above conventional immersion type cooling apparatus, in order to sufficiently wet each electrical unit with the non-conductive liquid, the amount of the non-conductive liquid in the cooling tank is generally required to be large, and the non-conductive liquid is expensive, so that the use cost of the entire immersion type cooling apparatus is difficult to be reduced.

In view of the above, there is a need for an improved immersion cooling apparatus.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present invention provides a liquid cooling system, which can reduce the use cost.

The utility model discloses a next purpose provides a liquid cooling system, can increase the radiating efficiency.

It is yet another object of the present invention to provide a liquid cooling system that can be easily assembled.

In the present invention, the directions or the similar terms thereof, such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc., refer to the directions of the drawings, and the directions or the similar terms thereof are only used to assist the explanation and understanding of the embodiments of the present invention, but not to limit the present invention.

The components and members described throughout the present invention use the wording "one" or "one" only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.

The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device, which can be used for manufacturing a semiconductor device, and a semiconductor device manufactured by the method.

The utility model discloses a liquid cooling system, include: a sealing groove having an accommodating space; a circulation layer formed by a working liquid filled in the containing space; and the cooling module is positioned in the accommodating space and is provided with a phase change fluid groove and a pump, the phase change fluid groove is used for being thermally connected with a heating source, the phase change fluid groove is not contacted with the circulating layer, the phase change fluid groove is provided with an evaporation port communicated with the accommodating space, a liquid inlet of the pump is communicated with the circulating layer, and a liquid outlet of the pump is communicated with the inside of the phase change fluid groove.

Therefore, the utility model discloses a liquid cooling system, this accommodation space only needs to fill a small amount of working fluid and forms this circulation layer, and order about this working fluid that is located this circulation layer through this pump and get into this phase change fluid inslot portion, the inside working fluid of this phase change fluid inslot portion can follow liquid absorption heat energy and evaporate into the gaseous state, the working fluid that forms the gaseous state can upwards evaporate the back via this evapotranspiration mouth, recondenstion returns liquid state and downwards drips in this circulation layer or this phase change fluid inslot portion, and then make this working fluid can absorb the heat energy of this source of generating heat, therefore, can reduce this working fluid's quantity, the efficiency that has reduction use cost.

The sealing groove may have a groove cover coupled to a groove body, and at least one condensing unit of the sealing groove may be coupled to an outer surface of the groove cover. Therefore, the condensation unit can take away the heat energy in the sealing groove, and the effect of increasing the heat dissipation efficiency is achieved.

The cover can have at least one basket void portion communicating with the accommodating space, and the at least one condensing unit can cover the basket void portion. Thus, the gaseous working liquid can contact the condensing unit through the basket empty part, and the heat dissipation effect is improved.

Wherein, the evaporation port can align the condensing unit. Therefore, the working liquid which is evaporated upwards can directly transfer heat energy to the condensing unit, and the heat dissipation effect is improved.

Wherein, this cooling module can have a liquid inlet pipe, and this liquid inlet pipe can communicate this income liquid mouth and this circulation layer. Therefore, the structure is simple and convenient to assemble, and has the effect of convenient assembly.

The cooling module can be provided with a liquid outlet pipe, and the liquid outlet pipe can be communicated with the liquid outlet and the interior of the phase change fluid tank. Therefore, the structure is simple and convenient to assemble, and has the effect of convenient assembly.

The cooling module may have at least two phase change fluid tanks, the at least two phase change fluid tanks may be located at different heights, and the liquid outlet pipe may have at least two branch pipe portions connected to the at least two phase change fluid tanks, respectively. Therefore, the pump can drive the working liquid positioned on the circulating layer to enter the phase change fluid tanks through the at least two shunt pipe parts respectively, and the pump has the effect of enabling the working liquid to flow smoothly.

The utility model discloses a liquid cooling system can include in addition that one extends the cover, and this cooling module can have two at least phase change fluid grooves, and these two at least phase change fluid grooves are located not co-altitude, should extend the cover and can combine to be located this phase change fluid groove of lower department, should extend the cover inside and can communicate this evapotranspire mouthful. Therefore, the liquid level of the working liquid in the at least two phase change fluid tanks can be aligned to the at least two heating sources, and the phase change fluid tank has the effect of good heat dissipation efficiency.

The extending cover can be provided with an upper port, and the upper port can be not lower than the heating source corresponding to the phase change fluid tank positioned at the highest position. Therefore, the at least two heating sources can be partially or completely covered by the working liquid, and the heat dissipation device has the effect of good heat dissipation efficiency.

The number of the phase change fluid grooves and the number of the pumps can be respectively multiple, and the liquid outlets of the pumps are communicated with the insides of the phase change fluid grooves. Therefore, each pump drives the working liquid positioned on the circulating layer to enter each phase change fluid groove, so that the working liquid in each phase change fluid groove can respectively absorb the heat energy of different heating sources, and the heat dissipation effect is improved.

The utility model discloses a liquid cooling system can include an at least electric unit in addition, and this electric unit can have an at least source of generating heat, and this source of generating heat can be connected the face to a heat source that is located this phase change fluid groove. Therefore, the electric unit can be cooled down really, and the electric unit has the effect of stable operation.

The utility model discloses a liquid cooling system can include a guide in addition, and this guide is located a capping below of this seal groove, and this guide can guide the working fluid flow that condenses back to liquid state to this electrical unit. Therefore, the condensed working liquid can flush and spray a plurality of electronic parts on the electric unit, so that the plurality of electronic parts can be cooled, and the heat dissipation efficiency is improved.

The sealing groove may have a groove cover combined with a groove body, and the electrical unit may be connected to a carrier plate in the groove body. Therefore, the structure is simple and convenient to assemble, and has the effect of convenient assembly.

The sealing groove can be provided with a groove cover combined with a groove body, the number of the electric units can be multiple, and the electric units can be respectively connected with a series connection plate in the groove body. Therefore, the plurality of electric units can be easily arranged in the accommodating space, and the effect of matching with the arrangement requirements of various installation spaces is achieved.

Drawings

FIG. 1: the utility model discloses an exploded perspective view of a first embodiment;

FIG. 2: the utility model discloses the combined section view of the first embodiment;

FIG. 3: base:Sub>A cross-sectional view taken along line A-A of FIG. 2;

FIG. 4: a use case diagram as shown in fig. 3;

FIG. 5 is a schematic view of: the utility model discloses the combined section view of the second embodiment;

FIG. 6: an exploded perspective view of a third embodiment of the present invention;

FIG. 7: a combined cross-sectional view of a third embodiment of the present invention;

FIG. 8: a use case diagram as shown in fig. 7;

FIG. 9: the utility model discloses the combination section view of fourth embodiment.

Description of the reference numerals

[ the utility model ] to provide a medicine

1 sealing groove

11: groove body

111 opening

12: groove cover

121: basket empty part

13 condensation unit

2 circulating layer

3 cooling module

Phase change fluid tank 31

31a heat source connection surface

32: pump

32a liquid inlet

32b liquid outlet

33: liquid inlet pipe

34 liquid outlet pipe

34a branch pipe part

4: extension cover

4a upper port

5, a guide part

B1 carrier plate

B2, a series connection plate

E electric unit

E1 electronic component

H heating source

L working fluid

S is a containing space

Q is a steaming and dispersing port.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below; in addition, the same reference numerals are used in the different drawings to designate the same elements, and description thereof will be omitted.

Please refer to fig. 2, which shows a first embodiment of the liquid cooling system of the present invention, including a sealing groove 1, a circulation layer 2 and a cooling module 3, wherein the sealing groove 1 has a receiving space S, and the circulation layer 2 and the cooling module 3 are located in the receiving space S.

Referring to fig. 1, the form of the sealing groove 1 is not limited in the present invention, in this embodiment, the sealing groove 1 may have a groove body 11 and a groove cover 12, the accommodating space S is located inside the groove body 11, the groove body 11 may have an opening 111 communicating with the accommodating space S, and the opening 111 may be used to input liquid into the accommodating space S or take and place an object to be cooled; the cover 12 can cover the opening 111, and the periphery of the cover 12 can be airtight with the tank body 11, for example, by a rubber ring, so as to ensure that the gas or liquid in the accommodating space S does not leak from the periphery of the cover 12 to the outside. Wherein, the utility model discloses the casing of electronic equipment such as computer, industrial computer, server or network communication equipment can be competed at the electricity to seal groove 1 of liquid cooling system, perhaps, the utility model discloses the liquid cooling system also can be whole to be set up in the electricity and compete the inside of electronic equipment such as computer, industrial computer, server or network communication equipment, the utility model discloses all not restrict.

Referring to fig. 1 and 2, the cover 12 may have at least one basket void 121, the basket void 121 may communicate with the accommodating space S, the sealing slot 1 may further have at least one condensation unit 13, the condensation unit 13 may be combined with the outer surface of the cover 12 and cover the basket void 121, the present invention is not limited to the type of the condensation unit 13, the condensation unit 13 may be at least one heat dissipation fin, for example, and the condensation unit 13 may be made of a metal material with a high thermal conductivity.

The circulation layer 2 is formed by a working liquid L filled in the accommodating space S, and the working liquid L may be selected as a non-conductive liquid.

Referring to fig. 1 and 3, the cooling module 3 has a phase change fluid tank 31, the phase change fluid tank 31 is not in contact with the circulation layer 2 (i.e. the phase change fluid tank 31 may be higher than the circulation layer 2), the phase change fluid tank 31 has an evaporation port Q communicating with the receiving space S, specifically, the phase change fluid tank 31 has no top cover, so that the evaporation port Q is formed at the opening of the phase change fluid tank 31, the evaporation port Q may face the tank cover 12, and the evaporation port Q may preferably be aligned with the basket empty portion 121. Wherein, this phase change fluid groove 31 can have a heat source connection face 31a, and this heat source connection face 31a is used for a thermal connection heat source H, and this phase change fluid groove 31 can be made by metal material of high thermal conductivity such as copper or aluminium for example, or, this phase change fluid groove 31 also can only select the position (i.e. heat source connection face 31 a) that contacts with this heat source H to be made by metal material of high thermal conductivity such as copper or aluminium, the mode of formation of this phase change fluid groove 31, the utility model discloses not limit, for example: the phase change fluid tank 31 may be formed by stamping, which simplifies the process.

The cooling module 3 has a pump 32, and the pump 32 may not contact the circulation layer 2, or may be entirely immersed in the circulation layer 2, or may also make a part of the pump 32 contact the circulation layer 2, which is not limited by the present invention. In this embodiment, the pump 32 is not in contact with the circulation layer 2, and the pump 32 may be located between the phase change fluid tank 31 and the circulation layer 2. The pump 32 has a liquid inlet 32a and a liquid outlet 32b, the liquid inlet 32a is communicated with the circulation layer 2, and the liquid outlet 32b is communicated with the inside of the phase change fluid tank 31, so that the pump 32 can drive the working liquid L located in the circulation layer 2 to enter the inside of the phase change fluid tank 31. Preferably, the cooling module 3 may have a liquid inlet pipe 33 and a liquid outlet pipe 34, the liquid inlet pipe 33 connects the liquid inlet 32a and the circulation layer 2, and the liquid outlet pipe 34 connects the liquid outlet 32b and the interior of the phase change fluid tank 31.

The utility model discloses submergence formula cooling system can also include an at least electric unit E in addition, this electric unit E is the object that needs the cooling, this electric unit E can be for example devices such as mainboard, communication interface board, display adapter or data storage board, this electric unit E can connect a support plate B1 in this groove body 11, this electric unit E can have an at least source of heat H, this source of heat H can be to lieing in this phase change fluid groove 31's heat source connection face 31a, make this heat source connection face 31a can directly or indirectly thermal connection this source of heat H.

Referring to fig. 2 and 4, when the liquid cooling system is in operation, the heat source connection surface 31a of the phase change fluid tank 31 can be thermally connected to the heat source H, the pump 32 can drive the working liquid L located in the circulation layer 2 to flow, the working liquid L can sequentially enter the phase change fluid tank 31 through the liquid inlet pipe 33 and the liquid outlet pipe 34, and the working liquid L in the phase change fluid tank 31 can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the working liquid L can fully absorb the heat energy of the heat source H; the working liquid L forming a gaseous state can evaporate upwards through the evaporation opening Q, further passes through the basket vacancy 121 to contact the condensation unit 13, and after transferring heat energy to the condensation unit 13, condenses back to a liquid state again and drops downwards into the circulation layer 2 or the phase change fluid tank 31, and then the pump 32 drives the working liquid L into the phase change fluid tank 31 again, so as to continuously circulate, thereby continuously absorbing the heat energy of the heat source H. Therefore, the accommodating space S only needs to be filled with a small amount of working liquid L to form the circulation layer 2, and the pump 32 drives the working liquid L on the circulation layer 2 to enter the phase change fluid tank 31, so that the working liquid L in the phase change fluid tank 31 can absorb the heat energy of the heat source H, thereby reducing the usage amount of the working liquid L and reducing the usage cost.

Referring to fig. 5, the second embodiment of the liquid cooling system of the present invention is substantially the same as the first embodiment, in the second embodiment, the number of the phase change fluid tanks 31 and the number of the pumps 32 may be plural, the heat source connecting surface 31a of each phase change fluid tank 31 may be thermally connected to the heat sources H of the plurality of electric units E, the liquid inlets 32a of the pumps 32 are connected to the circulation layer 2, and the liquid outlets 32b of the pumps 32 are connected to the inside of each phase change fluid tank 31. The electrical units E can be connected to a serial connection board B2 in the tank body 11, so that the electrical units E can be easily disposed in the accommodating space S, and the electrical units E can be arranged side by side. Thus, each pump 32 can drive the working liquid L in the circulation layer 2 to enter each phase change fluid tank 31, and the working liquid L in each phase change fluid tank 31 can absorb heat energy from a liquid state and evaporate into a gaseous state, so that the working liquid L can fully absorb the heat energy of the heat source H; the working liquid L forming a gaseous state can evaporate upwards through the evaporation opening Q, further passes through the basket vacancy 121 to contact the condensation unit 13, and after transferring heat energy to the condensation unit 13, condenses back to a liquid state again and drops downwards into the circulation layer 2 or the phase change fluid tank 31, and then each pump 32 drives the working liquid L into each phase change fluid tank 31 again, so as to continuously circulate, thereby continuously absorbing the heat energy of the heat source H.

Referring to fig. 6 and 7, a third embodiment of the liquid cooling system of the present invention is substantially the same as the first embodiment, in the third embodiment, the number of the basket empty part 121 and the number of the condensation unit 13 are two, the two condensation units 13 cover the two basket empty parts 121 respectively, the cooling module 3 may have at least two phase change fluid tanks 31, the at least two phase change fluid tanks 31 may be located at different heights, in the present embodiment, the number of the phase change fluid tanks 31 is described as two, that is, one of the phase change fluid tanks 31 is adjacent to the pump 32 than the other phase change fluid tank 31, so that the heat source connection surface 31a of the two phase change fluid tanks 31 can be thermally connected to the heat source H located at different heights, the liquid outlet pipe 34 may have at least two branch pipe parts 34a, the two branch pipe parts 34a can be connected to the two phase change fluid tanks 31 respectively, so that the liquid outlet pipe 34 can be communicated with the insides of the two phase change fluid tanks 31, and in the present embodiment, the liquid outlet pipe 34 may preferably have a Y-shaped shape. The pump 32 may be entirely immersed in the circulation layer 2, so that the liquid inlet 32a of the pump 32 may be directly connected to the circulation layer 2, and the pump 32 may drive the working liquid L in the circulation layer 2 into the respective phase change fluid tanks 31 through the two branch pipe portions 34 a.

Referring to fig. 7 and 8, in addition, the liquid cooling system of the present invention may further include an extension cover 4, the extension cover 4 is combined with the phase change fluid tank 31 located at a lower position, the extension cover 4 is internally communicated with the evaporation port Q, the extension cover 4 may have an upper port 4a, the upper port 4a may be preferably equal to the phase change fluid tank 31 located at a highest position, and the upper port 4a may not be lower than the heat source H corresponding to the phase change fluid tank 31 located at the highest position, i.e., the upper port 4a of the extension cover 4 may be higher than the heat source H located at the highest position or equal to the heat source H located at a higher position, so that the liquid levels of the working fluid L in the two phase change fluid tanks 31 may be aligned to the two heat sources H according to the communicating pipe principle (i.e., the same liquid, any two points of the same horizontal plane, etc.), so as to ensure that the two heat sources H may be partially or completely covered by the working fluid L, and the two working fluids may be effectively evaporated into the heat energy L from the gaseous working fluid L, so that the two heat sources H may be evaporated into the heat energy L; the working liquid L in the gaseous state can evaporate upwards, and then passes through the two baskets 121 to contact the two condensing units 13, and after transferring the heat energy to the two condensing units 13, the working liquid L condenses back to the liquid state again and drops downwards into the circulating layer 2 or the two phase change fluid tanks 31, thereby achieving the effect of providing good heat dissipation efficiency. Specifically, when the number of the phase change fluid tanks 31 is three or more, the upper port 4a of the extension hood 4 is not lower than the heat generation source H corresponding to the phase change fluid tank 31 located at the highest position.

Please refer to fig. 9, which shows a fourth embodiment of the liquid cooling system of the present invention, the fourth embodiment is substantially the same as the third embodiment, in the fourth embodiment, the liquid cooling system may further include a guiding member 5, the guiding member 5 is located below the tank cover 12, and the guiding member 5 may be disposed in an inclined manner, the guiding member 5 is inclined downward from the inner wall of the tank body 11 toward the electrical unit E, the lower portion of the guiding member 5 may be connected to the electrical unit E, the guiding member 5 may be an inclined plate or a funnel, in this embodiment, the guiding member 5 may be an inclined plate, so that the condensed liquid working fluid L may drip downward on the guiding member 5, the guiding member 5 may guide the condensed liquid working fluid L to flow to the electrical unit E, so that the condensed liquid working fluid L may flush and spray the plurality of electronic components E1 on the electrical unit E, thereby the plurality of electronic components E1 may be cooled, and have an effect of increasing heat dissipation efficiency.

To sum up, the utility model discloses a liquid cooling system, this accommodation space only needs to fill a small amount of working fluid and forms this circulation layer, and order about this working fluid that is located this circulation layer through this pump and get into this phase change fluid inslot portion, the inside working fluid of this phase change fluid inslot portion can follow liquid absorption heat energy and evaporate into the gaseous state, the working fluid that forms the gaseous state can upwards evaporate the back through this evapotranspiration mouth, recondenstion returns liquid state and downwards drips in this circulation layer or this phase change fluid inslot portion, and then make this working fluid can absorb the heat energy of this source of generating heat, therefore, can reduce the quantity of this working fluid, the efficiency that has reduction use cost.

Claims

1. A liquid cooling system, comprising:

a sealing groove having an accommodating space;

a circulation layer formed by a working fluid filled in the accommodating space; and

a cooling module is located this accommodation space, and this cooling module has a phase change fluid groove and a pump, and this phase change fluid groove is used for a thermal connection source that generates heat, and this phase change fluid groove does not contact this circulation layer, and this phase change fluid groove has this accommodation space of an evaporation mouth intercommunication, and this circulation layer of income liquid mouth intercommunication of this pump, inside this phase change fluid groove of a liquid outlet intercommunication of this pump.

2. The liquid cooling system of claim 1, wherein the seal groove has a groove cover coupled to a groove body, the at least one condensing unit of the seal groove being coupled to an outer surface of the groove cover.

3. The liquid cooling system of claim 2, wherein the cover includes at least one basket void portion in communication with the receiving space, the at least one condensing unit covering the basket void portion.

4. The liquid cooling system of claim 3, wherein the evapotranspiration port is aligned with the condensing unit.

5. The liquid cooling system of claim 1, wherein the cooling module has a liquid inlet pipe, the liquid inlet pipe connecting the liquid inlet and the circulating layer.

6. The liquid cooling system of claim 1, wherein the cooling module has a drain tube that communicates the drain port with an interior of the phase change fluid tank.

7. The liquid cooling system of claim 6, wherein the cooling module comprises at least two phase change fluid tanks located at different heights, and the outlet pipe comprises at least two branch pipe portions respectively connected to the at least two phase change fluid tanks.

8. The liquid cooling system of claim 6, further comprising an extension housing, wherein the cooling module has at least two phase change fluid tanks located at different heights, the extension housing is coupled to the lower phase change fluid tank, and the extension housing is internally connected to the evapotranspiration port.

9. The liquid cooling system of claim 8, wherein the extension cover has an upper port that is not lower than the heat source corresponding to the uppermost phase change fluid tank.

10. The liquid cooling system as claimed in claim 1, wherein the number of the phase-change fluid tanks and the number of the pumps are respectively plural, and the liquid outlet of each pump communicates with the inside of each phase-change fluid tank.

11. The liquid cooling system of claim 1, further comprising at least one electrical unit having at least one heat source coupled to a heat source connection surface of the phase change fluid tank.

12. The liquid cooling system of claim 11, further comprising a guide located below a slot cover of the seal slot, the guide guiding the flow of the working liquid condensed back to a liquid state to the electrical unit.

13. The liquid cooling system of claim 11, wherein the seal groove has a groove cover in combination with a groove body, the electrical unit being connected to a carrier plate within the groove body.

14. The liquid cooling system of claim 11, wherein the seal groove has a groove cover coupled to a groove body, the number of the electrical units is plural, and the plural electrical units are respectively connected to a series connection plate in the groove body.