WO2019015321A1 - Immersed type liquid cooling apparatus, blade type server and frame type server - Google Patents
Immersed type liquid cooling apparatus, blade type server and frame type server Download PDFInfo
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- WO2019015321A1 WO2019015321A1 PCT/CN2018/076744 CN2018076744W WO2019015321A1 WO 2019015321 A1 WO2019015321 A1 WO 2019015321A1 CN 2018076744 W CN2018076744 W CN 2018076744W WO 2019015321 A1 WO2019015321 A1 WO 2019015321A1
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- liquid
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- coolant
- casing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
Definitions
- the present application relates to the field of electronic component cooling devices, and more particularly to a submerged liquid cooling device.
- liquid cooling Liquid cooling technology as a kind of Efficient cooling has been applied in the IT field.
- the commonly used liquid cooling methods are plate-level liquid cooling and immersion liquid cooling.
- board-level liquid cooling means that the electronic components inside the electronic device first conduct heat to the heat-dissipating block, and then contact the whole-plate thermal pad through the heat-dissipating block.
- the thermal pad conducts heat to the upper cover of the electronic device, and then the upper cover transfers heat to the outside of the electronic device through the water to achieve heat dissipation.
- Immersion liquid cooling refers to immersing an electronic device as a whole in a closed container with a cooling liquid, and conducting heat of the electronic device through the flow of the cooling liquid.
- the immersion liquid cooling method needs to first take out the electronic device from the cooling liquid first, and then disassemble the faulty module.
- the whole device is covered with the cooling liquid, which is difficult to perform the disassembly operation and maintenance.
- the maximum heat dissipation efficiency of the plate-level liquid cooling method can only reach 80%.
- the maximum heat dissipation efficiency of the submerged liquid cooling method can reach 100%. Therefore, the heat dissipation of electronic equipment is increasingly inclined to adopt submerged cooling.
- the above-mentioned submerged liquid cooling method has problems such as inconvenience in maintenance and deployment of electronic components, high cost, and the like, and cannot meet the demand for scale application.
- the application provides an immersion liquid cooling device to solve the problems of low heat dissipation efficiency, high production cost or high operation cost, and inconvenient maintenance of electronic components of the liquid cooling system.
- the present application provides the following aspects:
- an immersion liquid cooling device comprising a housing and an external refrigerating device connected to the housing, wherein one or more flow passages are opened inside the housing, the flow passage and the outer portion
- the refrigeration device forms a circuit, the circuit is filled with a second cooling liquid, and the external cooling device is used for cooling the second cooling liquid and providing circulating power to the second cooling liquid, and the first cooling liquid is filled in the closed cavity, in the flow path a closed circuit formed with the refrigeration device is filled with a second cooling liquid, and a second cooling liquid circulates between the flow path and the refrigerating device, and the first cooling liquid is conducted to be dissipated through the sealed cavity.
- the heat of the electronic components is discharged outside the casing, thereby dissipating heat from the electronic components to be dissipated.
- the electronic components to be dissipated are fixedly disposed on the printed circuit board (PCB board) to form a device board, and the device board is fixedly mounted in the housing, so that the electronic components to be dissipated Set inside the closed cavity.
- PCB board printed circuit board
- the housing includes a hollow shell body, a bottom plate sealingly coupled to the bottom end of the shell body, and a top plate sealingly coupled to the top end of the body, wherein the bottom plate and the bottom plate At least one of the top plates is detachably coupled to the casing body to form a detachable casing.
- a seal is provided at the connection of the shell body to the top panel and/or the bottom panel that is detachably connected.
- a connector is further disposed on the device board for electrically connecting with the backboard or other electronic components, and the connector protrudes from the outside of the housing or is embedded in the housing body.
- the connector is used to electrically connect to a backplane or other electronic component.
- the flow channel is disposed in one or more of an interior of the casing body, an interior of the ceiling body, and an interior of the floor body.
- the flow channel includes a main flow channel and a flow dividing channel, and the partial flow channel is in communication with the main flow channel.
- the two ports of the flow channel on the housing are respectively the housing inlet port and the housing outlet port, and are disposed on the external cooling device.
- a cooling inlet port and a cooling outlet port wherein two ports on the casing and the refrigerating liquid inlet port on the external refrigerating device and the refrigerating liquid outlet port form a sealed passage for the
- the second coolant circulates between the flow passage and the cooling device, wherein a casing inlet quick connector is disposed on the casing inlet, and the casing outlet is disposed at the casing a housing outlet quick connector, wherein a cooling liquid inlet quick connector matched with the housing liquid outlet quick connector is disposed on the cooling liquid inlet, and a liquid inlet with the housing is disposed on the cooling liquid outlet A quick connector-matched refrigeration outlet quick connector, the liquid inlet quick connector and the liquid outlet quick connector are used to seal the second coolant.
- a power device for driving the second coolant circulation and a purification device for purifying the second coolant are further connected between the housing and the external refrigeration device.
- the first cooling liquid is a silicon mineral oil and/or a fluorinating liquid; and the second cooling liquid is a combination of water and/or an additive and water.
- the immersion liquid cooling device disclosed in the present application encapsulates an electronic component to be dissipated into a metal sealed casing filled with a first coolant, and a body connected to the external cooling device is opened on the body of the sealed casing.
- a flow passage filled in the flow passage with a second coolant for circulating between the sealed housing body and the external cooling device the heat generated by the electronic component during operation is directly transmitted to the first coolant, and the first coolant is passed through
- the sealed casing made of metal transfers heat to the second cooling liquid at a low temperature to complete heat exchange between the electronic components and the outside, and the first coolant directly in contact with the electronic components in the sealed casing is used in a small amount, and each sealed casing is used.
- the second coolant circulating between the closed chamber and the external cooling device can use inexpensive water or other inexpensive cooling medium, it is solved that the full immersion or node liquid cooling requires a large amount of expensive coolant. , reducing the cost of the liquid cooling system. Moreover, the heat dissipation efficiency of the liquid cooling system is improved by the design of the position and number of the flow path.
- the present application further provides a blade server provided with a liquid cooling device, wherein the blade server is provided with the immersion liquid cooling device according to the first aspect and the first aspect of any possible implementation manner.
- Providing at least one housing and at least one external cooling device in the blade server that is, one housing may be disposed in the blade server, or a plurality of housings may be disposed, and the plurality of housings may share an external cooling device,
- An external refrigeration unit can be configured for each housing.
- the present application further provides a rack server provided with a liquid cooling device, wherein the rack server is provided with the immersion liquid as described in the first aspect and the first aspect of any possible implementation manner.
- Cold device At least one housing and at least one external cooling device are disposed in the rack server, that is, one housing may be disposed in the blade server, or a plurality of housings may be disposed, and the plurality of housings may share an external cooling device. It is also possible to configure an external refrigeration device for each housing.
- FIG. 1 is a longitudinal sectional structural view of a submerged liquid cooling device provided by the present application.
- FIG. 2 is a longitudinal sectional structural view of another submerged liquid cooling device provided by the present application.
- FIG. 3 is a longitudinal sectional structural view of another submerged liquid cooling device provided by the present application.
- FIG. 4 is a schematic exploded view of a housing provided by the present application.
- FIG. 4a is a schematic exploded view of another housing provided by the present application.
- Figure 5 is a top plan view of a top plate provided by the present application.
- Figure 6 is a top plan view of another top plate provided by the present application.
- Figure 7 is a top plan view of the top panel of Figure 6 provided by the present application.
- FIG. 8 is a schematic perspective view of a top plate having a main channel and a runner according to the present application.
- FIG. 9 is a schematic structural diagram of a liquid-cooled blade server provided by the present application.
- FIG. 10 is a schematic structural diagram of a liquid-cooled rack server provided by the present application.
- FIG. 1 is a schematic longitudinal sectional view of a liquid cooling device provided by the present application.
- the liquid cooling device comprises a housing and an external refrigeration device (2).
- Figure 4 further illustrates an exploded configuration of the housing, as shown in Figure 4, the housing including a hollow housing body (12), a bottom plate (13) and a top plate (14), which are sealed to form a closed cavity ( 11)
- a flow path (6) is opened on the body of the top plate (14).
- the housing includes a closed cavity (11) in which an electronic component (7) to be dissipated is mounted.
- the first coolant is filled in the closed cavity (11) and filled with the closed cavity (11) in direct contact with the electronic component (7) to be dissipated.
- the flow path (6) is not in communication with the closed cavity (11), but is in communication with an external cooling device, and is formed in the flow path (6) and the external refrigeration device (2).
- the circuit is filled with a second coolant.
- the external refrigerating device (2) is for cooling the second coolant and providing circulating power to the second coolant.
- the second coolant carrying the heat flows into the external refrigerating device, and after being cooled by the external refrigerating device, the second cooling liquid that flows out of the low temperature flows out, and exchanges heat with the first cooling liquid encapsulated in the casing to dissipate the electronic components to be dissipated. Cool down.
- the external refrigeration device may be a cold well, a cooling tower, or the like equipped with a power device.
- body refers to the tangible entity that constitutes the component itself, for example, the body of the top plate refers to the panel itself that constitutes the top panel.
- a separate power device (3) may be connected in the circuit formed by the housing and the external refrigeration device (2) for providing circulating power to the second coolant to increase the second coolant in the circuit.
- the rate of circulation thereby increasing heat transfer efficiency.
- a purification device (4), a flow rate monitoring device (16), and a pressure monitoring device (17) may be connected to the circuit formed by the housing and the external refrigeration device (2).
- the power device (3) is configured to provide circulating power to the second coolant, so that the second coolant continuously circulates between the casing and the external refrigeration device (2), such as a circulation pump, Pressure pump, etc.
- the purifying device (4) is used for purifying the second cooling liquid, removing mechanical impurities which may exist in the second cooling liquid or impurities such as microorganisms generated by the second cooling liquid, and preventing impurities in the second cooling liquid from causing damage to other equipment in the circuit.
- the purification device (4) such as a filter membrane, a line filter, and the like.
- a flow rate monitoring device (16) is used to monitor a second coolant flow rate, such as a flow meter or the like.
- a pressure monitoring device is used to monitor the second coolant pressure, such as a hydraulic gauge or the like.
- one housing can be connected to one or more external refrigeration devices.
- an external refrigeration device may be cooled only for one housing, or may be cooled for multiple housings at the same time, and the plurality of housings may be connected in series or in parallel, in the following description of the present application,
- the housing is connected to an external cooling device as an example for description.
- the first coolant may be selected from at least one of a silicon mineral oil or a fluorinated liquid, for example, OptiCool 87252 UV manufactured by Liquid Cool Solution Co., Ltd., or Novec TM 649 manufactured by 3M Company.
- the second cooling liquid may be selected from at least one of water or a composition formed of an additive and water.
- the additive is a substance which is soluble in water or miscible with water, such as ethylene glycol, etc., and the composition of ethylene glycol and water has a condensation point of less than -20 ° C. Therefore, under the same conditions, the low condensation
- the second coolant at the point can exchange more heat with the first coolant.
- the addition of ethylene glycol to the water can effectively inhibit the growth of microorganisms in the water, thereby facilitating equipment maintenance and maintenance.
- a composition in which a second cooling liquid is used as an additive and water is described in further detail as an example.
- the immersion liquid cooling device of the embodiment has the working principle that: after the electronic component to be dissipated heats up, the first coolant overflowing around it absorbs the heat emitted by the electronic component to be dissipated, and passes through the first The coolant is conducted to the surface of the closed cavity, and then transmitted to the external refrigeration device through the second coolant flowing in the flow channel, thereby achieving continuous heat dissipation of the electronic component to be dissipated, and the external cooling device circulating in the second coolant The circulation power is provided for the second coolant.
- the housing shown in Figure 1 is made of a thermally conductive material, such as a metal-made housing or a ceramic-made housing.
- a thermally conductive material such as a metal-made housing or a ceramic-made housing.
- the metal shell is convenient for the thickness of the shell, and the density is small.
- the shell can maintain the physical structure stability without the destructive deformation such as chipping, which is convenient. Used and maintained in electronic equipment.
- the structure of the housing can adopt any one of the following structures:
- Structure 1 The top plate, the bottom plate and the shell body can be removed.
- FIG. 4 is a schematic structural view of a housing provided by the present application.
- the housing includes a hollow housing body (12), a bottom plate (13) sealingly coupled to the bottom end of the housing body (12), and a top plate (14) sealingly coupled to the top end of the housing body (12), the bottom plate (13) And the top plate (14) and the casing body (12) are detachably connected, so that the equipment veneer (81) is installed in the sealed casing, so that the inside of the casing forms a closed cavity (11).
- a flow path (6) is opened in the body of the top plate (14).
- the bottom plate (13) is a flat plate so that the casing is stably installed in the whole machine.
- a seal member (91) is provided at a joint of the case main body (12) with the detachably attached top plate (14) and the bottom plate (13) for preventing the inside of the closed cavity (11)
- the first cooling liquid seeps out of the casing.
- the sealing member (91) may be any one of parts for sealing, such as a sealing ring, a sealing strip or the like.
- the device board (81) can be clamped between the shell body (12) and the bottom plate (13), that is, the top plate (14), the shell body (12), the device board (81) and the bottom plate (13) are sequentially stacked. .
- the device board (81) can also be clamped between the top board (14) and the shell body (12), that is, the top board (14), the equipment board (81), the shell body (12) and the bottom board ( 13) Stack settings in sequence.
- the bottom plate (13) and the main body (12) are fastened by fasteners such as screws or the like, or are fixedly connected by a snap.
- Structure 2 The bottom plate and the shell body are detachable, and the top plate and the shell body are not detachable.
- FIG. 4a is a schematic structural view of another housing provided by the present application, and the difference from FIG. 4 is that the top plate (14) is integrally formed with the main body (12), and only the bottom plate and the main body are detachable, thereby adding a closed cavity. (11) Sealability.
- the device board (81) is clamped between the shell body (12) and the bottom plate (13), that is, the top plate (14), the shell body (12), the device veneer (81), and the bottom plate (13). ) Cascade settings in sequence.
- the bottom plate (13) is integrally formed with the shell body (12), and only the top plate and the shell body are detachable, which increases the sealing property of the closed cavity (1).
- the equipment board (81) is clamped between the top board (14) and the shell body (12), that is, the top board (14), the equipment board (81), the shell body (12) and the bottom board (13). ) Cascade settings in sequence.
- At least one electronic component (7) to be dissipated is included in the sealed cavity (11) of the housing.
- the electronic component to be dissipated includes a CPU, a memory or a network card, and the electronic component (7) to be cooled is mounted on a printed circuit board (PCB board) according to a preset position and connection manner to form a device board. (81).
- the device board (81) is fixed in the closed cavity (11).
- the electronic components to be dissipated in the electronic device may be the same or different, and the application is not limited. As shown in Figure 1, the electronic device includes two different electronic components.
- a connector (8) is also mounted on the device board (81) for electrically connecting to the backplane (9) or other electronic components.
- the number of connectors (8) on the device board (81) may be one or more.
- the connector (8) may be disposed outside the housing or may be embedded in the housing body. For example, two connectors (8) are mounted on the device board (81) shown in Fig. 1, and the connector (8) is disposed outside the casing.
- the backplane (9) is a circuit board that is used for electrical connection between the electronic components (7) to be dissipated and other electronic components, wherein the other electronic components are electronic components disposed outside the casing.
- FIG. 2 is a schematic longitudinal sectional view of another submerged liquid cooling device provided by the present application.
- the difference from FIG. 1 is that the right side connector of the device board (81) in the immersion liquid cooling apparatus shown in FIG. 2 is electrically connected to other electronic components.
- the channel connecting the housing to the external cooling device (2) may pass through the backboard (9) according to service requirements, or may not pass through the backplane (9), which is not limited in the application.
- connection path of the housing to the external refrigeration unit (2) passes through the backing plate (9).
- the shape of the casing in the submerged liquid cooling apparatus may also vary.
- the shape of the casing may be a rectangular parallelepiped structure as shown in FIG.
- the shape of the housing matches the shape of the electronic component (7) to be dissipated. Since the device board (81) is provided with a plurality of different electronic components (2), the physical shapes of the electronic components are different, and the height difference is large. Therefore, the shape of the housing can follow the electronic components. The shape changes, as the shape of the housing changes as the height of the electronic component changes. On the one hand, the volume of the whole machine is reduced, and on the other hand, the volume of the cavity inside the casing is reduced, thereby reducing the amount of the first coolant, thereby reducing the cooling cost.
- the top plate (14) may be a flat plate or a curved plate, which is adapted to the outer shape of the casing to form a closed cavity (11).
- one housing may be provided for each electronic component to be cooled, or one housing may be provided for two or more electronic components to be cooled.
- At least one flow channel (6) may be opened in each of the housing bodies, each of which is in communication with an external refrigeration device (2).
- FIG. 5 is a cross-sectional top view of a flow channel top plate provided by the present application.
- a linear flow path (6) is formed on the body of the top plate (14).
- the flow path of the linear coolant (6) to the second coolant is small, and therefore, the flow rate of the second coolant is fast, the heat exchange efficiency is high, and the linear flow path is easy to open.
- FIG. 6 is a top plan view of a cross section of a flow passage top plate provided by the present application. As shown in FIG. 6, two curved flow passages (6) are formed on the body of the top plate (14). The two flow passages (6) are connected in parallel to the same external refrigeration device (2) such that the second coolant in each flow passage (6) discharges the heat conducted by the first coolant to the outside of the electronic device, thereby Improve heat dissipation efficiency.
- the plurality of flow channels can be connected to reduce the number of closed loops and facilitate the cooling of the second coolant.
- the plurality of flow channels may be disconnected to form a plurality of closed loops for the second coolant circulation, that is, multiple paths are simultaneously
- the liquid cooling device provides a second cooling liquid at a low temperature to improve heat dissipation efficiency.
- the flow channel (6) in the present application is opened inside the casing body, that is, may be opened inside the body of at least one of the casing body (12), the top plate (14) or the bottom plate (13).
- the flow channel (6) is opened in the body of the top plate (14), so that the first coolant heated by the heat is cooled at the top of the casing, and the first coolant after cooling and cooling is naturally lowered. Thereby, heat convection is formed inside the casing, thereby continuously dissipating heat to the electronic component (2).
- FIG. 3 is a schematic longitudinal sectional view of another submerged liquid cooling device provided by the present application.
- a flow path (6) is respectively opened in the body of the top plate (14) and the body of the casing body (12), and the two flow paths are connected, that is, two flow paths ( 6) Connecting in series with the same external refrigeration device (2) to form a closed loop for circulating the second cooling liquid, increasing the heat exchange area of the first coolant and the second coolant, thereby improving heat dissipation efficiency.
- a flow channel (6) is respectively disposed in the body of the top plate (14) and the body of the shell body (12), the two flow channels are not connected, and are respectively connected in parallel with the refrigeration device (5) to form two cycles.
- a closed circuit of the cooling liquid the first coolant heated by the heat is cooled at the top of the casing, and the first coolant after the cooling and cooling is naturally lowered, thereby forming a heat convection inside the casing, and the second cooling is performed at a low temperature.
- the liquid further cools the descending first cooling liquid through a flow path disposed on the shell body (12), thereby speeding up the speed of the heat convection cycle, and on the other hand, cooling the first coolant more fully, thereby improving Heat dissipation efficiency of electronic components (2).
- the shape of the flow path (6) may be a linear distribution, a curved distribution or a spiral distribution.
- the curved profile refers to at least one bend of the flow channel (6), such as a serpentine distribution, a zigzag distribution, a U-shaped distribution, etc.
- the spiral distribution refers to a spiral extension of the flow channel.
- the linear distribution means that the flow path (6) is linear, that is, a straight line between the housing inlet (61) and the housing outlet (62). Shaped channel.
- the different flow paths (6) can be divided into a main flow path and a main flow path.
- the shunt channel is connected to the main flow channel, and the main flow channel includes a main flow channel for the liquid inlet and an optional main flow channel, and the shunt channel is a flow channel which is branched from the main flow path branch to the main flow channel of the liquid discharge, or is a liquid inlet channel.
- FIG. 8 is a schematic diagram of a three-dimensional structure of a top plate capable of realizing a main channel and a bypass channel according to the present application.
- the flow channel (6) includes a linear liquid inlet main channel (63) and a strip.
- the linear outlet main flow channel (64) and the plurality of U-shaped shunt passages (65), the ports of the liquid inlet main flow path (63) and the ports of the liquid discharge main flow path (64) are respectively opened on the surface of the top plate (14), and the outside Connected, the second coolant flows into the top plate (14) by the liquid inlet main channel (63) disposed in the lower layer, passes through the branching channel (65), and then flows out through the top plate through the main flow channel (64) of the liquid outlet 14 disposed in the upper layer ( 14), cycle to the external cooling equipment (2).
- the two ports of the flow passage (6) on the housing body are a housing inlet (61) and a housing outlet (62), respectively, for the second coolant inflow passage (6).
- the outflow channel (6) such that the second coolant circulates between the flow channel (6) and the external refrigeration device (5).
- the housing inlet port ( 61 ) is disposed adjacent to the housing outlet port ( 62 ) to facilitate communication between the flow channel ( 6 ) and the refrigeration device ( 5 ). Reduce the occupation of space.
- a housing liquid inlet quick connector (611) is disposed on the housing inlet port (61).
- the quick connector is used alone, the liquid outflow in the pipeline can be stopped, and after the two quick connectors are docked, The pipeline forms a passage, and the liquid can flow in the formed passage. After the two docked quick joints are separated, the pipeline can be immediately sealed to stop the outflow of the liquid in the pipeline.
- a housing outlet quick connector (621) is disposed at the housing outlet port (62), and a quick connector for discharging the housing is provided on the cooling liquid inlet (51).
- 621) A matched refrigerant inlet quick connector (511), on which a refrigerant outlet quick connector (521) matching the housing inlet quick connector (611) is disposed.
- the housing liquid inlet quick connector (611) is in fixed communication with the corresponding refrigerant outlet quick connector (521), and the refrigeration liquid inlet quick connector (511) is in fixed communication with the corresponding housing outlet quick connector (621).
- the flow passage (6) communicates with the cooling liquid outlet (52) through the housing inlet (61), and the housing outlet (62) communicates with the cooling inlet (51) to make the flow passage (6) and the cooling
- the device (5) forms a closed loop.
- the second coolant flows into the flow channel (6) from one end of the electronic component (7) to be dissipated, and flows out from one end of the electronic component (7) to be cooled.
- the flow channel (6) causes the second cooling liquid at a low temperature to first contact the high temperature casing to exchange heat with the heat sink, thereby improving the heat dissipation efficiency of the electronic component to be dissipated.
- the liquid cooling device encapsulates the electronic component to be dissipated into a metal sealed casing filled with the first cooling liquid, and is provided with external cooling on the body of the sealed casing.
- a flow passage connected to the device, the flow channel is filled with a second coolant for circulating between the sealed casing body and the external cooling device, and the heat generated by the electronic component during operation is directly transmitted to the first coolant, the first cooling
- the liquid then transfers the heat to the second cooling liquid through the sealed casing of the metal to complete the heat exchange between the electronic component and the outside, and the first coolant directly in contact with the electronic component in the sealed casing is used in a small amount, and each The sealed housings are independent of each other, facilitating the maintenance of electronic components and improving maintenance efficiency.
- the second coolant circulating between the closed chamber and the external cooling device can use inexpensive water or other inexpensive cooling medium, it is solved that the full immersion or node liquid cooling requires a large amount of expensive coolant. , reducing the cost of the liquid cooling system. Moreover, the heat dissipation efficiency of the liquid cooling system is improved by the design of the position and number of the flow path.
- FIG. 9 is a schematic structural diagram of a liquid-cooled blade server provided by the present application.
- the blade server includes four blade servers, and each blade server is separately installed in one shell, 4
- the housings share an external refrigeration unit to form a set of submerged coolant units.
- multiple blade servers are connected by a backplane (9).
- the structure of the immersion cooling device is the same as that described in FIGS. 1 to 8 and will not be described again.
- the rack server group includes four rack servers (C). Wherein, each rack server is installed in one housing, and four housings share an external cooling device to form the above-mentioned submerged liquid cooling device. In this mode, only between the housing and the external refrigerating device Set power equipment and purification equipment without setting up flow rate monitoring equipment or pressure monitoring equipment.
- the structure of the immersion cooling device is the same as that described in FIG. 1 to FIG. 8 and will not be described herein.
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Abstract
Disclosed in the invention are an immersed type liquid cooling apparatus, a blade type server and a frame type server. The liquid cooling apparatus comprises a housing and an external cooling device, wherein an enclosed cavity is arranged in the housing. Electronic components to be cooled are installed in the enclosed cavity, which is filled with a first liquid coolant. At least one channel is arranged in the body of the housing, and the channel and the external cooling device form a loop which is filled with a second liquid coolant. The external cooling device is used to cool the second liquid coolant and provides circulation power for the second liquid coolant. The second liquid coolant discharges heat of the electronic components to be cooled conducted by the first liquid coolant through the enclosed cavity outside the housing, so as to cool the electronic components to be cooled. The problems that a liquid cooling system is low in heat radiation efficiency and high in production cost or operation cost, and the electronic components are inconvenient to maintain can be solved.
Description
本申请涉及电子元器件冷却装置领域,尤其涉及一种浸没式液冷装置。The present application relates to the field of electronic component cooling devices, and more particularly to a submerged liquid cooling device.
在电子设备中,随着硬件集成度的提升,电子元器件的功耗显著增大,以往风冷散热的散热效果已无法满足电子设备的散热需求,液体冷却(简称液冷)技术作为一种高效冷却方式,已经在IT领域得到初步应用。In electronic equipment, with the increase of hardware integration, the power consumption of electronic components has increased significantly. The heat dissipation effect of air-cooling and heat dissipation has not been able to meet the heat dissipation requirements of electronic equipment. Liquid cooling (referred to as liquid cooling) technology as a kind of Efficient cooling has been applied in the IT field.
常用的液体冷却方式为板级液冷和浸没式液冷,其中,板级液冷是指电子设备内部电子元器件先将热量传导到散热块上,然后通过散热块与整板导热垫接触,导热垫将热量传导至电子设备的上盖,然后,上盖再通过水将热量传导到电子设备外部,以此达到散热的目的。浸没式液冷是指将电子设备整体沉浸在带有冷却液的密闭容器中,通过冷却液的流动传导电子设备的热量。但是,浸没式液冷该方式在设备维护时,需要首先将电子设备整体从冷却液内取出,再拆卸故障模块,而此时设备整体沾满冷却液,不易进行拆卸操作和维护。现有技术中,板级液冷方式的最大散热效率仅能达到80%。而浸没式液冷方式的最大散热效率却能够达到100%,因此,对电子设备的散热越来越倾向采用浸没式冷却。但是,上述浸没式液冷方式存在着电子元器件的维护和部署不方便、成本较高等问题,无法满足规模应用的需求。亟需开发一种便于电子元器件维护和部署,成本低而且散热率高的液冷装置。The commonly used liquid cooling methods are plate-level liquid cooling and immersion liquid cooling. Among them, board-level liquid cooling means that the electronic components inside the electronic device first conduct heat to the heat-dissipating block, and then contact the whole-plate thermal pad through the heat-dissipating block. The thermal pad conducts heat to the upper cover of the electronic device, and then the upper cover transfers heat to the outside of the electronic device through the water to achieve heat dissipation. Immersion liquid cooling refers to immersing an electronic device as a whole in a closed container with a cooling liquid, and conducting heat of the electronic device through the flow of the cooling liquid. However, the immersion liquid cooling method needs to first take out the electronic device from the cooling liquid first, and then disassemble the faulty module. At this time, the whole device is covered with the cooling liquid, which is difficult to perform the disassembly operation and maintenance. In the prior art, the maximum heat dissipation efficiency of the plate-level liquid cooling method can only reach 80%. The maximum heat dissipation efficiency of the submerged liquid cooling method can reach 100%. Therefore, the heat dissipation of electronic equipment is increasingly inclined to adopt submerged cooling. However, the above-mentioned submerged liquid cooling method has problems such as inconvenience in maintenance and deployment of electronic components, high cost, and the like, and cannot meet the demand for scale application. There is an urgent need to develop a liquid cooling device that is easy to maintain and deploy electronic components, has low cost, and has a high heat dissipation rate.
发明内容Summary of the invention
本申请提供了一种浸没式液冷装置,以解决液冷系统散热效率低、生产成本或者运行成本高、电子元器件维护不便等问题。The application provides an immersion liquid cooling device to solve the problems of low heat dissipation efficiency, high production cost or high operation cost, and inconvenient maintenance of electronic components of the liquid cooling system.
为了解决上述技术问题,本申请提供了如下几方面:In order to solve the above technical problems, the present application provides the following aspects:
第一方面,提供一种浸没式液冷装置,该液冷装置包括壳体和与所述壳体相连接的外部制冷设备,在壳体内部开设有一条或者多条流道,流道与外部制冷设备形成回路,回路中填充有第二冷却液,外部制冷设备用于冷却第二冷却液并且为第二冷却液提供循环动力,第一冷却液填充于密闭腔体中,在所述流道与所述制冷设备形成的闭合回路中填充有第二冷却液,第二冷却液在所述流道和所述制冷设备之间循环流动,通过与密闭腔体将第一冷却液传导的待散热的电子元器件的热量排出壳体外部,以此实现对待散热的电子元器件散热。In a first aspect, an immersion liquid cooling device is provided, the liquid cooling device comprising a housing and an external refrigerating device connected to the housing, wherein one or more flow passages are opened inside the housing, the flow passage and the outer portion The refrigeration device forms a circuit, the circuit is filled with a second cooling liquid, and the external cooling device is used for cooling the second cooling liquid and providing circulating power to the second cooling liquid, and the first cooling liquid is filled in the closed cavity, in the flow path a closed circuit formed with the refrigeration device is filled with a second cooling liquid, and a second cooling liquid circulates between the flow path and the refrigerating device, and the first cooling liquid is conducted to be dissipated through the sealed cavity. The heat of the electronic components is discharged outside the casing, thereby dissipating heat from the electronic components to be dissipated.
在一种可能的实现方式中,待散热的电子元器件固定设置于印制电路板(PCB板)上形成设备单板上,设备单板固定安装在壳体中,使得待散热的电子元器件设置于密闭腔体内部。In a possible implementation manner, the electronic components to be dissipated are fixedly disposed on the printed circuit board (PCB board) to form a device board, and the device board is fixedly mounted in the housing, so that the electronic components to be dissipated Set inside the closed cavity.
在另一种可能的实现方式中,所述壳体包括中空的壳主体、与所述壳主体底端密封连接的底板和与所述主体顶端密封连接的顶板,其中,所述底板和所述顶板中至少一个与所述壳主体为可拆卸连接,构成可拆卸的壳体。In another possible implementation, the housing includes a hollow shell body, a bottom plate sealingly coupled to the bottom end of the shell body, and a top plate sealingly coupled to the top end of the body, wherein the bottom plate and the bottom plate At least one of the top plates is detachably coupled to the casing body to form a detachable casing.
在另一种可能的实现方式中,在所述壳主体与可拆卸连接的所述顶板和/或所述底板连接处设置有密封件。In another possible implementation, a seal is provided at the connection of the shell body to the top panel and/or the bottom panel that is detachably connected.
在另一种可能的实现方式中,在设备单板上还设置有连接器,用于与背板或者其它电子元器件电连接,所述连接器伸出壳体外部或者卡嵌于壳体本体上,所述连接器用于与背板或者其它电子元器件电连接。In another possible implementation, a connector is further disposed on the device board for electrically connecting with the backboard or other electronic components, and the connector protrudes from the outside of the housing or is embedded in the housing body. The connector is used to electrically connect to a backplane or other electronic component.
在另一种可能的实现方式中,流道设置于壳主体本体的内部、顶板本体的内部和底板本体的内部中的一种或者多种。In another possible implementation, the flow channel is disposed in one or more of an interior of the casing body, an interior of the ceiling body, and an interior of the floor body.
在另一种可能的实现方式中,所述流道包括主流道和分流道,所述分流道与所述主流道连通。In another possible implementation manner, the flow channel includes a main flow channel and a flow dividing channel, and the partial flow channel is in communication with the main flow channel.
在另一种可能的实现方式中,所述流道在所述壳体上的两个端口分别为所述壳体进液口和所述壳体出液口,在所述外部制冷设备上设置有制冷进液口和制冷出液口,所述壳体上的两个端口和所述外部制冷设备上的所述制冷进液口和所述制冷出液口之间形成密封通道,用于所述第二冷却液在所述流道与所述冷却设备冷却之间循环,其中,在所述壳体进液口上设置有壳体进液快速接头,在所述壳体出液口设置有所述壳体出液快速接头,在所述制冷进液口上设置有与所述壳体出液快速接头匹配的制冷进液快速接头,在所述制冷出液口上设置有与所述壳体进液快速接头匹配的制冷出液快速接头,所述进液快速接头和所述出液快速接头用于密封所述第二冷却液。In another possible implementation manner, the two ports of the flow channel on the housing are respectively the housing inlet port and the housing outlet port, and are disposed on the external cooling device. a cooling inlet port and a cooling outlet port, wherein two ports on the casing and the refrigerating liquid inlet port on the external refrigerating device and the refrigerating liquid outlet port form a sealed passage for the The second coolant circulates between the flow passage and the cooling device, wherein a casing inlet quick connector is disposed on the casing inlet, and the casing outlet is disposed at the casing a housing outlet quick connector, wherein a cooling liquid inlet quick connector matched with the housing liquid outlet quick connector is disposed on the cooling liquid inlet, and a liquid inlet with the housing is disposed on the cooling liquid outlet A quick connector-matched refrigeration outlet quick connector, the liquid inlet quick connector and the liquid outlet quick connector are used to seal the second coolant.
在另一种可能的实现方式中,在所述壳体与所述外部制冷设备之间,还连通有用于驱动所述第二冷却液循环的动力设备和用于净化第二冷却液的净化设备。In another possible implementation, a power device for driving the second coolant circulation and a purification device for purifying the second coolant are further connected between the housing and the external refrigeration device. .
在另一种可能的实现方式中,所述第一冷却液为硅矿物油和/或氟化液;所述第二冷却液为水和/或添加剂与水形成的组合物。In another possible implementation, the first cooling liquid is a silicon mineral oil and/or a fluorinating liquid; and the second cooling liquid is a combination of water and/or an additive and water.
本申请公开的浸没式液冷装置,将待散热的电子元器件封装于填充有第一冷却液的金属制密封壳体中,在所述密封壳体的本体上开设有与外部冷却设备连通的流道,在流道中充满用于在密封壳体本体和外部冷却设备之间循环的第二冷却液,电子元器件在运行时产生的热量直接传递给第一冷却液,第一冷却液再通过金属制的密封壳体将热量传递给低温的第二冷却液,完成电子元器件与外界的热交换,密封壳体内直接与电子元器件接触的第一冷却液使用量小,而且各个密封壳体之间相互独立,便于对电子元器件的维护,提升了维护效率。另一方面,由于循环于密闭腔体与外部冷却设备之间的第二冷却液可以使用廉价的水或者其它廉价冷却介质,从而解决了全浸没式或者节点式液体冷却需要消耗大量昂贵的冷却液,降低了液冷系统的成本。而且通过流道位置和数量的设计,提升了液冷系统的散热效率。The immersion liquid cooling device disclosed in the present application encapsulates an electronic component to be dissipated into a metal sealed casing filled with a first coolant, and a body connected to the external cooling device is opened on the body of the sealed casing. a flow passage filled in the flow passage with a second coolant for circulating between the sealed housing body and the external cooling device, the heat generated by the electronic component during operation is directly transmitted to the first coolant, and the first coolant is passed through The sealed casing made of metal transfers heat to the second cooling liquid at a low temperature to complete heat exchange between the electronic components and the outside, and the first coolant directly in contact with the electronic components in the sealed casing is used in a small amount, and each sealed casing is used. They are independent of each other, which facilitates the maintenance of electronic components and improves maintenance efficiency. On the other hand, since the second coolant circulating between the closed chamber and the external cooling device can use inexpensive water or other inexpensive cooling medium, it is solved that the full immersion or node liquid cooling requires a large amount of expensive coolant. , reducing the cost of the liquid cooling system. Moreover, the heat dissipation efficiency of the liquid cooling system is improved by the design of the position and number of the flow path.
第二方面,本申请还提供一种设置有液冷装置的刀片式服务器,所述刀片式服务器中设置有如第一方面及第一方面任意一种可能实现方式中所述的浸没式液冷装置。在刀片式服务器中设置至少一个壳体和至少一个外部制冷设备,即,在刀片式服务器中可以设置一个壳体,也可以设置多个壳体,多个壳体可以共用一个外部制冷设备,也可以每个壳体分别配置一个外部制冷设备。In a second aspect, the present application further provides a blade server provided with a liquid cooling device, wherein the blade server is provided with the immersion liquid cooling device according to the first aspect and the first aspect of any possible implementation manner. . Providing at least one housing and at least one external cooling device in the blade server, that is, one housing may be disposed in the blade server, or a plurality of housings may be disposed, and the plurality of housings may share an external cooling device, An external refrigeration unit can be configured for each housing.
第三方面,本申请还提供一种设置有液冷装置的机架式服务器,所述机架式服务器中设置有如第一方面及第一方面任意一种可能实现方式中所述的浸没式液冷装置。在机架式服务器中设置至少一个壳体和至少一个外部制冷设备,即,在刀片式服务器中可以设置一个壳体,也可以设置多个壳体,多个壳体可以共用一个外部制冷设备,也可以每个壳体分别配置一个外部制冷设备。In a third aspect, the present application further provides a rack server provided with a liquid cooling device, wherein the rack server is provided with the immersion liquid as described in the first aspect and the first aspect of any possible implementation manner. Cold device. At least one housing and at least one external cooling device are disposed in the rack server, that is, one housing may be disposed in the blade server, or a plurality of housings may be disposed, and the plurality of housings may share an external cooling device. It is also possible to configure an external refrigeration device for each housing.
为了更清楚地说明本发明实施例的技术方案,下面将对本发明实施例中所需要使用的附图作简单地介绍。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings to be used in the embodiments of the present invention will be briefly described below.
图1为本申请提供的一种浸没式液冷装置的纵剖结构示意图;1 is a longitudinal sectional structural view of a submerged liquid cooling device provided by the present application;
图2为本申请提供的另一种浸没式液冷装置的纵剖结构示意图;2 is a longitudinal sectional structural view of another submerged liquid cooling device provided by the present application;
图3为本申请提供的另一种浸没式液冷装置的纵剖结构示意图;3 is a longitudinal sectional structural view of another submerged liquid cooling device provided by the present application;
图4为本申请提供的一种壳体的分解结构示意图;4 is a schematic exploded view of a housing provided by the present application;
图4a为本申请提供的另一种壳体的分解结构示意图;4a is a schematic exploded view of another housing provided by the present application;
图5为本申请提供的一种顶板横剖俯视图;Figure 5 is a top plan view of a top plate provided by the present application;
图6为本申请提供的另一种顶板横面俯视图;Figure 6 is a top plan view of another top plate provided by the present application;
图7为本申请提供的图6示出的顶板纵面俯视图;Figure 7 is a top plan view of the top panel of Figure 6 provided by the present application;
图8为本申请提供的一种具有主流道和分流道的顶板立体结构示意图;FIG. 8 is a schematic perspective view of a top plate having a main channel and a runner according to the present application; FIG.
图9为本申请提供的一种液冷式刀片式服务器的结构示意图;9 is a schematic structural diagram of a liquid-cooled blade server provided by the present application;
图10为本申请提供的一种液冷式机架式服务器的结构示意图。FIG. 10 is a schematic structural diagram of a liquid-cooled rack server provided by the present application.
图1为本申请提供的一种液冷装置的纵剖结构示意图。如图1所示,所述液冷装置包括壳体和外部制冷设备(2)。图4进一步示出了壳体的分解结构,如图4所示,所述壳体包括中空的壳主体(12)、底板(13)和顶板(14),三者密封连接形成密闭腔体(11),在顶板(14)的本体上开设有流道(6)。1 is a schematic longitudinal sectional view of a liquid cooling device provided by the present application. As shown in Figure 1, the liquid cooling device comprises a housing and an external refrigeration device (2). Figure 4 further illustrates an exploded configuration of the housing, as shown in Figure 4, the housing including a hollow housing body (12), a bottom plate (13) and a top plate (14), which are sealed to form a closed cavity ( 11) A flow path (6) is opened on the body of the top plate (14).
壳体中包括密闭腔体(11),在密闭腔体(11)中安装有待散热的电子元器件(7)。第一冷却液填充在密闭腔体(11)中,并且充满密闭腔体(11),与待散热的电子元器件(7)直接接触。在图1所示的液冷装置中,流道(6)与密闭腔体(11)不相连通,但与外部冷却设备相连通,在流道(6)与外部制冷设备(2)形成的回路中填充有第二冷却液。外部制冷设备(2)用于冷却第二冷却液,并且为第二冷却液提供循环动力。例如,携带热量的第二冷却液流入外部制冷设备,经过外部制冷设备冷却后,流出低温的第二冷却液,通过与封装于壳体内部的第一冷却液热交换,对待散热的电子元器件进行散热。该外部制冷设备可以为配置有动力设备的冷井、冷却塔等。本申请中所述“本体”是指构成该部件的有形实体本身,例如,顶板的本体是指构成顶板的板材本身。The housing includes a closed cavity (11) in which an electronic component (7) to be dissipated is mounted. The first coolant is filled in the closed cavity (11) and filled with the closed cavity (11) in direct contact with the electronic component (7) to be dissipated. In the liquid cooling apparatus shown in Fig. 1, the flow path (6) is not in communication with the closed cavity (11), but is in communication with an external cooling device, and is formed in the flow path (6) and the external refrigeration device (2). The circuit is filled with a second coolant. The external refrigerating device (2) is for cooling the second coolant and providing circulating power to the second coolant. For example, the second coolant carrying the heat flows into the external refrigerating device, and after being cooled by the external refrigerating device, the second cooling liquid that flows out of the low temperature flows out, and exchanges heat with the first cooling liquid encapsulated in the casing to dissipate the electronic components to be dissipated. Cool down. The external refrigeration device may be a cold well, a cooling tower, or the like equipped with a power device. As used herein, "body" refers to the tangible entity that constitutes the component itself, for example, the body of the top plate refers to the panel itself that constitutes the top panel.
可选地,在壳体和外部制冷设备(2)形成的回路中还可以连通有独立的动力设备(3),用于为第二冷却液提供循环动力,以增加第二冷却液在回路中循环的速率,从而提高换热效率。Optionally, a separate power device (3) may be connected in the circuit formed by the housing and the external refrigeration device (2) for providing circulating power to the second coolant to increase the second coolant in the circuit. The rate of circulation, thereby increasing heat transfer efficiency.
可选地,在壳体和外部制冷设备(2)形成的回路中还可以连通有净化设备(4)、流速监测设备(16)和压力监测设备(17)。其中,动力设备(3)用于为第二冷却液提供循环动力,使第二冷却液在壳体与外部制冷设备(2)之间持续循环流动,该动力设备(3)如循环泵、增压泵等。净化设备(4)用于净化第二冷却液,除去第二冷却液中可能存在的机械杂质或者第二冷却液产生的微生物等杂质,避免第二冷却液中的杂质对回路中其它设备造成损伤,该净化设备(4)如滤膜、管路过滤器等。流速监测设备(16)用于监测第二冷却液流速,该流速监测设备如流量计等。压力监测设备用于监测第二冷却液压力,该压力监测设备如液压计等。Optionally, a purification device (4), a flow rate monitoring device (16), and a pressure monitoring device (17) may be connected to the circuit formed by the housing and the external refrigeration device (2). Wherein, the power device (3) is configured to provide circulating power to the second coolant, so that the second coolant continuously circulates between the casing and the external refrigeration device (2), such as a circulation pump, Pressure pump, etc. The purifying device (4) is used for purifying the second cooling liquid, removing mechanical impurities which may exist in the second cooling liquid or impurities such as microorganisms generated by the second cooling liquid, and preventing impurities in the second cooling liquid from causing damage to other equipment in the circuit. The purification device (4) such as a filter membrane, a line filter, and the like. A flow rate monitoring device (16) is used to monitor a second coolant flow rate, such as a flow meter or the like. A pressure monitoring device is used to monitor the second coolant pressure, such as a hydraulic gauge or the like.
值得说明的是,一个壳体可以与一个或多个外部制冷设备连接。同样地,一个外部制冷设备可以仅为一个壳体制冷,也可以同时为多个壳体制冷,多个壳体之间可以为串联连通,也可以为并联连通,在本申请的以下描述中,以壳体与一个外部制冷设备连接为例进行描述。It is worth noting that one housing can be connected to one or more external refrigeration devices. Similarly, an external refrigeration device may be cooled only for one housing, or may be cooled for multiple housings at the same time, and the plurality of housings may be connected in series or in parallel, in the following description of the present application, The housing is connected to an external cooling device as an example for description.
第一冷却液可以选自硅矿物油或者氟化液中的至少一种,例如,Liquid Cool Solution公司生产的OptiCool87252UV,或者3M公司生产的Novec
TM649。
The first coolant may be selected from at least one of a silicon mineral oil or a fluorinated liquid, for example, OptiCool 87252 UV manufactured by Liquid Cool Solution Co., Ltd., or Novec TM 649 manufactured by 3M Company.
第二冷却液可以选自水或者添加剂与水形成的组合物中的至少一种。该添加剂为能够溶解于水或者与水互溶的物质,如乙二醇等,乙二醇与水形成的组合物的冷凝点低于-20℃,因此,在同种条件下,这种低冷凝点的第二冷却液能够与第一冷却液交换更多的热量,此外,在水中添加乙二醇后能够有效抑制水中微生物滋生,从而便于设备保养和维护。在本申请的以下描述中,以第二冷却液为添加剂与水形成的组合物为例进行进一步详细描述。The second cooling liquid may be selected from at least one of water or a composition formed of an additive and water. The additive is a substance which is soluble in water or miscible with water, such as ethylene glycol, etc., and the composition of ethylene glycol and water has a condensation point of less than -20 ° C. Therefore, under the same conditions, the low condensation The second coolant at the point can exchange more heat with the first coolant. In addition, the addition of ethylene glycol to the water can effectively inhibit the growth of microorganisms in the water, thereby facilitating equipment maintenance and maintenance. In the following description of the present application, a composition in which a second cooling liquid is used as an additive and water is described in further detail as an example.
本实施例的浸没式液冷装置,其工作原理为:待散热的电子元器件运行发热后,充斥于其周围的第一冷却液吸收待散热的电子元器件所散发出的热量,通过第一冷却液传导到密闭腔体表面,再通过流道中流动的第二冷却液传导至外部制冷设备中,从而实现对待散热的电子元器件的持续散热,外部制冷设备在第二冷却液循环流动的过程中为第二冷却液提供循环动力。The immersion liquid cooling device of the embodiment has the working principle that: after the electronic component to be dissipated heats up, the first coolant overflowing around it absorbs the heat emitted by the electronic component to be dissipated, and passes through the first The coolant is conducted to the surface of the closed cavity, and then transmitted to the external refrigeration device through the second coolant flowing in the flow channel, thereby achieving continuous heat dissipation of the electronic component to be dissipated, and the external cooling device circulating in the second coolant The circulation power is provided for the second coolant.
接下来,结合附图进一步介绍本申请提供的浸没式液冷装置如何实现电子器件的散热。Next, how the immersion liquid cooling device provided by the present application realizes heat dissipation of the electronic device will be further described with reference to the accompanying drawings.
图1所示壳体为导热材料所制成,例如金属制造的壳体或者陶瓷制造的壳体。相比于陶瓷壳体,金属制壳体便于壳体厚度,并且密度较小,在两侧温差较大时,壳体也能够保持物理结构稳定,而不发生碎裂等破坏性形变,便于在电子设备中使用和维护。The housing shown in Figure 1 is made of a thermally conductive material, such as a metal-made housing or a ceramic-made housing. Compared with the ceramic shell, the metal shell is convenient for the thickness of the shell, and the density is small. When the temperature difference between the two sides is large, the shell can maintain the physical structure stability without the destructive deformation such as chipping, which is convenient. Used and maintained in electronic equipment.
其中,壳体的结构可以采用以下结构中任意一种:Wherein, the structure of the housing can adopt any one of the following structures:
结构一:顶板、底板与壳主体之间均可拆卸。Structure 1: The top plate, the bottom plate and the shell body can be removed.
图4为本申请提供的一种壳体的结构示意图。如图所示,壳体包括中空的壳主体(12)、与壳主体(12)底端密封连接的底板(13)和与壳主体(12)顶端密封连接的顶板(14),底板(13)和顶板(14)与壳主体(12)均为可拆卸连接,以便设备单板(81)安装于密封壳体中,从而使所述壳体内部形成密闭腔体(11)。在顶板(14)本体中开设有流道(6)。所述底板(13)为平面板,以便所述壳体在整机中稳定安装。另外,在上述壳体的结构中,壳主体(12)与可拆卸连接的顶板(14)和底板(13) 的连接处设置有密封件(91),用于防止密闭腔体(11)内部的第一冷却液渗出壳体,具体地,如图1所示,所述密封件(91)可以为任意一种用于密封的零件,如密封圈、密封条等。FIG. 4 is a schematic structural view of a housing provided by the present application. As shown, the housing includes a hollow housing body (12), a bottom plate (13) sealingly coupled to the bottom end of the housing body (12), and a top plate (14) sealingly coupled to the top end of the housing body (12), the bottom plate (13) And the top plate (14) and the casing body (12) are detachably connected, so that the equipment veneer (81) is installed in the sealed casing, so that the inside of the casing forms a closed cavity (11). A flow path (6) is opened in the body of the top plate (14). The bottom plate (13) is a flat plate so that the casing is stably installed in the whole machine. Further, in the structure of the above casing, a seal member (91) is provided at a joint of the case main body (12) with the detachably attached top plate (14) and the bottom plate (13) for preventing the inside of the closed cavity (11) The first cooling liquid seeps out of the casing. Specifically, as shown in FIG. 1, the sealing member (91) may be any one of parts for sealing, such as a sealing ring, a sealing strip or the like.
设备单板(81)可以卡夹于壳主体(12)与底板(13)之间,即,顶板(14)、壳主体(12)、设备单板(81)和底板(13)依次层叠设置。The device board (81) can be clamped between the shell body (12) and the bottom plate (13), that is, the top plate (14), the shell body (12), the device board (81) and the bottom plate (13) are sequentially stacked. .
可选地,设备单板(81)还可以卡夹于顶板(14)与壳主体(12)之间,即,顶板(14)、设备单板(81)、壳主体(12)和底板(13)依次层叠设置。Optionally, the device board (81) can also be clamped between the top board (14) and the shell body (12), that is, the top board (14), the equipment board (81), the shell body (12) and the bottom board ( 13) Stack settings in sequence.
可选地,底板(13)与壳主体(12)通过紧固件,如螺钉等紧固连接,或者通过卡扣固定连接。Optionally, the bottom plate (13) and the main body (12) are fastened by fasteners such as screws or the like, or are fixedly connected by a snap.
结构二:底板与壳主体之间可拆卸,顶板与壳主体之间不可拆卸。Structure 2: The bottom plate and the shell body are detachable, and the top plate and the shell body are not detachable.
图4a为本申请提供的另一种壳体的结构示意图,与图4的区别在于:顶板(14)与壳主体(12)一体成型,只有底板与壳主体可拆卸,从而增加了密闭腔体(11)的密封性。4a is a schematic structural view of another housing provided by the present application, and the difference from FIG. 4 is that the top plate (14) is integrally formed with the main body (12), and only the bottom plate and the main body are detachable, thereby adding a closed cavity. (11) Sealability.
在本方式中,设备单板(81)卡夹于壳主体(12)与底板(13)之间,即,顶板(14)、壳主体(12)、设备单板(81)和底板(13)依次层叠设置。In this mode, the device board (81) is clamped between the shell body (12) and the bottom plate (13), that is, the top plate (14), the shell body (12), the device veneer (81), and the bottom plate (13). ) Cascade settings in sequence.
结构三,顶板与壳主体之间可拆卸,底板与壳主体之间不可拆卸(图4和图4a中未示出)。 Structure 3, the top plate and the shell body are detachable, and the bottom plate and the shell body are not detachable (not shown in Figures 4 and 4a).
与图4a所示结构二类似,底板(13)与壳主体(12)一体成型,只有顶板与壳主体可拆卸,增加了密闭腔体(1)的密封性。Similar to the structure 2 shown in Fig. 4a, the bottom plate (13) is integrally formed with the shell body (12), and only the top plate and the shell body are detachable, which increases the sealing property of the closed cavity (1).
在结构三中,设备单板(81)卡夹于顶板(14)与壳主体(12)之间,即,顶板(14)、设备单板(81)、壳主体(12)和底板(13)依次层叠设置。In the third structure, the equipment board (81) is clamped between the top board (14) and the shell body (12), that is, the top board (14), the equipment board (81), the shell body (12) and the bottom board (13). ) Cascade settings in sequence.
进一步地,如图1所示的液冷装置中,在壳体的密闭腔体(11)中包括至少一个待散热的电子元器件(7)。该待散热的电子元器件包括CPU、内存或者网卡等,待散热的电子元器件(7)按照预设的位置和连接方式安装于印制电路板(printed circuitboard,PCB板)上形成设备单板(81)。设备单板(81)固定于密闭腔体(11)中。另外,电子设备中待散热的电子元器件可以相同,也可以不同,本申请不作限制。如图1所示,电子设备中包括两个不同的电子元器件。Further, in the liquid cooling device shown in FIG. 1, at least one electronic component (7) to be dissipated is included in the sealed cavity (11) of the housing. The electronic component to be dissipated includes a CPU, a memory or a network card, and the electronic component (7) to be cooled is mounted on a printed circuit board (PCB board) according to a preset position and connection manner to form a device board. (81). The device board (81) is fixed in the closed cavity (11). In addition, the electronic components to be dissipated in the electronic device may be the same or different, and the application is not limited. As shown in Figure 1, the electronic device includes two different electronic components.
在设备单板(81)上还安装有连接器(8),该连接器(8)用于与背板(9)或者其它电子元器件电连接。其中,设备单板(81)上连接器(8)的个数可以为一个或多个。该连接器(8)可以设置于壳体外部,也可以卡嵌于壳体本体上。例如,图1所示设备单板(81)上安装有2个连接器(8),而且,连接器(8)设置于壳体外部。背板(9)为一种电路板,用作待散热的电子元器件(7)与其它电子元器件电连接,其中,其它电子元器件为设置在壳体之外的电子元器件。A connector (8) is also mounted on the device board (81) for electrically connecting to the backplane (9) or other electronic components. The number of connectors (8) on the device board (81) may be one or more. The connector (8) may be disposed outside the housing or may be embedded in the housing body. For example, two connectors (8) are mounted on the device board (81) shown in Fig. 1, and the connector (8) is disposed outside the casing. The backplane (9) is a circuit board that is used for electrical connection between the electronic components (7) to be dissipated and other electronic components, wherein the other electronic components are electronic components disposed outside the casing.
可选地,图2为本申请提供的另一种浸没式液冷装置的纵剖结构示意图。与图1的区别在于,图2所示浸没式液冷装置中设备单板(81)右侧连接器与其他电子元器件电连接。其中,壳体与外部制冷设备(2)的连接的通道可以根据业务需求穿过背板(9),也可以不穿过背板(9),本申请不作限制。Optionally, FIG. 2 is a schematic longitudinal sectional view of another submerged liquid cooling device provided by the present application. The difference from FIG. 1 is that the right side connector of the device board (81) in the immersion liquid cooling apparatus shown in FIG. 2 is electrically connected to other electronic components. The channel connecting the housing to the external cooling device (2) may pass through the backboard (9) according to service requirements, or may not pass through the backplane (9), which is not limited in the application.
示例地,如图2所示,壳体与外部制冷设备(2)的连接通道穿过背板(9)。By way of example, as shown in Figure 2, the connection path of the housing to the external refrigeration unit (2) passes through the backing plate (9).
更进一步地,结合待散热的电子元器件的形状不同,本申请提供的浸没式液冷装 置中壳体的形状也可以随之变化。Further, in combination with the shape of the electronic component to be dissipated, the shape of the casing in the submerged liquid cooling apparatus provided by the present application may also vary.
壳体的形状可以如图1所示为长方体结构。也可以参见图3,壳体的形状与所述待散热的电子元器件(7)的形状匹配。由于设备单板(81)上设置有多个不同的电子元器件(2),这些电子元器件的物理形状不尽相同,其高度差别较大,因此,壳体的形状可以随电子元器件的外形的变化而变化,如壳体的形状随电子元器件的高度变化而变化。一方面减小整机体积,另一方面减小所述壳体内部空腔的体积,从而减少第一冷却液的用量,进而降低冷却成本。相应地,所述顶板(14)可以为平面板,也可以为曲面板,与壳体的外形适配,形成密闭腔体(11)。The shape of the casing may be a rectangular parallelepiped structure as shown in FIG. Referring also to Figure 3, the shape of the housing matches the shape of the electronic component (7) to be dissipated. Since the device board (81) is provided with a plurality of different electronic components (2), the physical shapes of the electronic components are different, and the height difference is large. Therefore, the shape of the housing can follow the electronic components. The shape changes, as the shape of the housing changes as the height of the electronic component changes. On the one hand, the volume of the whole machine is reduced, and on the other hand, the volume of the cavity inside the casing is reduced, thereby reducing the amount of the first coolant, thereby reducing the cooling cost. Correspondingly, the top plate (14) may be a flat plate or a curved plate, which is adapted to the outer shape of the casing to form a closed cavity (11).
值得说明的是,对于同一电子设备,可以针对每个待散热的电子元器件设置一个壳体,也可以针对两个或两个以上待散热的电子元器件设置一个壳体。It should be noted that, for the same electronic device, one housing may be provided for each electronic component to be cooled, or one housing may be provided for two or more electronic components to be cooled.
在每个壳体本体上可以开设至少一条流道(6),每条流道均与外部制冷设备(2)连通。At least one flow channel (6) may be opened in each of the housing bodies, each of which is in communication with an external refrigeration device (2).
具体地,图5为本申请提供的一种流道顶板横剖俯视图,如图5所示,顶板(14)本体上开设有一条直线形流道(6)。直线形流道(6)对第二冷却液的流动阻力小,因此,第二冷却液的流动速度快,换热效率高,而且直线形流道便于开设。Specifically, FIG. 5 is a cross-sectional top view of a flow channel top plate provided by the present application. As shown in FIG. 5, a linear flow path (6) is formed on the body of the top plate (14). The flow path of the linear coolant (6) to the second coolant is small, and therefore, the flow rate of the second coolant is fast, the heat exchange efficiency is high, and the linear flow path is easy to open.
图6为本申请提供的一种流道顶板横面俯视图,如图6所示,顶板(14)本体上开设有两条曲线形流道(6)。两条流道(6)以并联的方式与同一个外部制冷设备(2)连通,使得每条流道(6)中的第二冷却液将第一冷却液传导的热量排出电子设备外部,从而提高散热效率。6 is a top plan view of a cross section of a flow passage top plate provided by the present application. As shown in FIG. 6, two curved flow passages (6) are formed on the body of the top plate (14). The two flow passages (6) are connected in parallel to the same external refrigeration device (2) such that the second coolant in each flow passage (6) discharges the heat conducted by the first coolant to the outside of the electronic device, thereby Improve heat dissipation efficiency.
当电子元器件的功耗较小,对散热需求低时,多个流道之间可以为连通的,以减少闭合回路的数量,便于对第二冷却液的制冷。当电子元器件的功耗较大,对散热需求高时,多个流道之间可以为不连通的,以形成多条用于第二冷却液循环的闭合回路,即,同时多条路径向所述液冷装置提供低温的第二冷却液,以此提高散热效率。When the power consumption of the electronic component is small and the heat dissipation requirement is low, the plurality of flow channels can be connected to reduce the number of closed loops and facilitate the cooling of the second coolant. When the power consumption of the electronic component is large and the heat dissipation requirement is high, the plurality of flow channels may be disconnected to form a plurality of closed loops for the second coolant circulation, that is, multiple paths are simultaneously The liquid cooling device provides a second cooling liquid at a low temperature to improve heat dissipation efficiency.
作为一个可能的实现方式,本申请中流道(6)开设于壳体本体内部,即,可以开设于壳主体(12)、顶板(14)或者底板(13)中至少一种的本体内部。As a possible implementation manner, the flow channel (6) in the present application is opened inside the casing body, that is, may be opened inside the body of at least one of the casing body (12), the top plate (14) or the bottom plate (13).
具体地,如图1所示,流道(6)开设于顶板(14)本体中,使得受热上升的第一冷却液在所述壳体的顶部冷却,冷却降温后的第一冷却液自然下降,从而在所述壳体内部形成热对流,进而对所述电子元器件(2)持续散热。Specifically, as shown in FIG. 1, the flow channel (6) is opened in the body of the top plate (14), so that the first coolant heated by the heat is cooled at the top of the casing, and the first coolant after cooling and cooling is naturally lowered. Thereby, heat convection is formed inside the casing, thereby continuously dissipating heat to the electronic component (2).
图3为本申请提供的另一种浸没式液冷装置的纵剖结构示意图。参见图3,与图1的区别在于:在顶板(14)本体和壳主体(12)本体中分别开设流道(6),并且,所述两条流道连通,即,两条流道(6)串联,与同一个外部制冷设备(2)连通,形成一条循环第二冷却液体的闭合回路,增加了第一冷却液与第二冷却液的换热面积,从而提高散热效率。FIG. 3 is a schematic longitudinal sectional view of another submerged liquid cooling device provided by the present application. Referring to FIG. 3, the difference from FIG. 1 is that a flow path (6) is respectively opened in the body of the top plate (14) and the body of the casing body (12), and the two flow paths are connected, that is, two flow paths ( 6) Connecting in series with the same external refrigeration device (2) to form a closed loop for circulating the second cooling liquid, increasing the heat exchange area of the first coolant and the second coolant, thereby improving heat dissipation efficiency.
可选地,在顶板(14)本体和壳主体(12)本体中分别开设流道(6),所述两条流道不连通,分别与制冷设备(5)并联连通,形成两条循环第二冷却液体的闭合回路,受热上升的第一冷却液在所述壳体的顶部冷却,冷却降温后的第一冷却液自然下降,在从而在所述壳体内部形成热对流,低温第二冷却液通过设置于所述壳主体(12)上的流道对下降的第一冷却液进一步冷却,一方面加快了热对流循环的速度,另一方面使第一冷却液降温更为充分,从而提高对电子元器件(2)的散热效率。Optionally, a flow channel (6) is respectively disposed in the body of the top plate (14) and the body of the shell body (12), the two flow channels are not connected, and are respectively connected in parallel with the refrigeration device (5) to form two cycles. a closed circuit of the cooling liquid, the first coolant heated by the heat is cooled at the top of the casing, and the first coolant after the cooling and cooling is naturally lowered, thereby forming a heat convection inside the casing, and the second cooling is performed at a low temperature. The liquid further cools the descending first cooling liquid through a flow path disposed on the shell body (12), thereby speeding up the speed of the heat convection cycle, and on the other hand, cooling the first coolant more fully, thereby improving Heat dissipation efficiency of electronic components (2).
流道(6)的形状可以为直线形分布、曲线形分布或者螺旋形分布。其中,所述曲线形分布是指流道(6)存在至少一处弯折,如蛇形分布,之字形分布,U形分布等,所述螺旋形分布是指流道螺旋延伸。The shape of the flow path (6) may be a linear distribution, a curved distribution or a spiral distribution. Wherein, the curved profile refers to at least one bend of the flow channel (6), such as a serpentine distribution, a zigzag distribution, a U-shaped distribution, etc., and the spiral distribution refers to a spiral extension of the flow channel.
示例地,如图5所示,所述直线形分布是指所述流道(6)为直线形,即,壳体进液口(61)和壳体出液口(62)之间为直线形通道。For example, as shown in FIG. 5, the linear distribution means that the flow path (6) is linear, that is, a straight line between the housing inlet (61) and the housing outlet (62). Shaped channel.
对于壳体中包括多条流道(6)的情况,不同流道(6)之间可以区分为主流道和分流道。分流道与主流道连通,主流道包括用于进液主流道和任选的出液主流道,分流道为由进液主流道分支再汇聚至出液主流道的流道,或者为由进液主流道分支后不再汇聚而直接与外部制冷设备(2)连通的流道。For the case where the plurality of flow paths (6) are included in the housing, the different flow paths (6) can be divided into a main flow path and a main flow path. The shunt channel is connected to the main flow channel, and the main flow channel includes a main flow channel for the liquid inlet and an optional main flow channel, and the shunt channel is a flow channel which is branched from the main flow path branch to the main flow channel of the liquid discharge, or is a liquid inlet channel. A flow channel that is no longer converged after the main stream branch and is directly connected to the external refrigeration device (2).
具体地,图8为本申请提供的一种可实现具有主流道和分流道的顶板立体结构示意图,如图8所示,流道(6)包括一条直线形进液主流道(63)、一条直线形出液主流道(64)和多条U形分流道(65),进液主流道(63)的端口和出液主流道(64)的端口分别开设于顶板(14)表面,与外界连通,第二冷却液由设置于下层的进液主流道(63)流入所述顶板(14),经过分流道(65)后,通过设置于上层的出液14主流道(64)流出顶板(14),循环至外部制冷设备(2)。Specifically, FIG. 8 is a schematic diagram of a three-dimensional structure of a top plate capable of realizing a main channel and a bypass channel according to the present application. As shown in FIG. 8, the flow channel (6) includes a linear liquid inlet main channel (63) and a strip. The linear outlet main flow channel (64) and the plurality of U-shaped shunt passages (65), the ports of the liquid inlet main flow path (63) and the ports of the liquid discharge main flow path (64) are respectively opened on the surface of the top plate (14), and the outside Connected, the second coolant flows into the top plate (14) by the liquid inlet main channel (63) disposed in the lower layer, passes through the branching channel (65), and then flows out through the top plate through the main flow channel (64) of the liquid outlet 14 disposed in the upper layer ( 14), cycle to the external cooling equipment (2).
参见图1,流道(6)在壳体本体上的两个端口分别为壳体进液口(61)和壳体出液口(62),分别用于第二冷却液流入流道(6)和流出流道(6),使得第二冷却液在流道(6)与外部制冷设备(5)之间循环流动。Referring to Figure 1, the two ports of the flow passage (6) on the housing body are a housing inlet (61) and a housing outlet (62), respectively, for the second coolant inflow passage (6). And the outflow channel (6) such that the second coolant circulates between the flow channel (6) and the external refrigeration device (5).
可选地,如图1所示,壳体进液口(61)与壳体出液口(62)相邻设置,便于所述流道(6)与所述制冷设备(5)的连通,减小空间的占用。Optionally, as shown in FIG. 1 , the housing inlet port ( 61 ) is disposed adjacent to the housing outlet port ( 62 ) to facilitate communication between the flow channel ( 6 ) and the refrigeration device ( 5 ). Reduce the occupation of space.
参见图1,在所述壳体进液口(61)上设置有壳体进液快速接头(611),快速接头单独使用时,能够止住管路中的液体外流,两个快速接头对接后,管路形成通路,液体能够在形成的通路中流动,两个已对接的快速接头分离后,能够立即密闭管路,止住管路中的液体外流。Referring to FIG. 1, a housing liquid inlet quick connector (611) is disposed on the housing inlet port (61). When the quick connector is used alone, the liquid outflow in the pipeline can be stopped, and after the two quick connectors are docked, The pipeline forms a passage, and the liquid can flow in the formed passage. After the two docked quick joints are separated, the pipeline can be immediately sealed to stop the outflow of the liquid in the pipeline.
如图1所示,在所述壳体出液口(62)设置有壳体出液快速接头(621),在所述制冷进液口(51)上设置有与壳体出液快速接头(621)匹配的制冷进液快速接头(511),在所述制冷出液口(52)上设置有与所述壳体进液快速接头(611)匹配的制冷出液快速接头(521)。As shown in FIG. 1, a housing outlet quick connector (621) is disposed at the housing outlet port (62), and a quick connector for discharging the housing is provided on the cooling liquid inlet (51). 621) A matched refrigerant inlet quick connector (511), on which a refrigerant outlet quick connector (521) matching the housing inlet quick connector (611) is disposed.
可选地,壳体进液快速接头(611)与相应的制冷出液快速接头(521)固定连通,制冷进液快速接头(511)与相应的壳体出液快速接头(621)固定连通。Optionally, the housing liquid inlet quick connector (611) is in fixed communication with the corresponding refrigerant outlet quick connector (521), and the refrigeration liquid inlet quick connector (511) is in fixed communication with the corresponding housing outlet quick connector (621).
流道(6)通过壳体进液口(61)与制冷出液口(52)连通,壳体出液口(62)与制冷进液口(51)连通,使流道(6)与制冷设备(5)形成闭合回路。The flow passage (6) communicates with the cooling liquid outlet (52) through the housing inlet (61), and the housing outlet (62) communicates with the cooling inlet (51) to make the flow passage (6) and the cooling The device (5) forms a closed loop.
可选地,如图1所示,第二冷却液由靠近待散热的电子元器件(7)的一端流入所述流道(6),由远离待散热的电子元器件(7)的一端流出所述流道(6),使低温的第二冷却液首先接触高温壳体,与其进行热交换,从而提高对待散热的电子元器件的散热效率。Optionally, as shown in FIG. 1, the second coolant flows into the flow channel (6) from one end of the electronic component (7) to be dissipated, and flows out from one end of the electronic component (7) to be cooled. The flow channel (6) causes the second cooling liquid at a low temperature to first contact the high temperature casing to exchange heat with the heat sink, thereby improving the heat dissipation efficiency of the electronic component to be dissipated.
通过上述内容的描述,本申请提供的液冷装置将待散热的电子元器件封装于填充有第一冷却液的金属制密封壳体中,在所述密封壳体的本体上开设有与外部冷却设备连通的流道,在流道中充满用于在密封壳体本体和外部冷却设备之间循环的第二冷却 液,电子元器件在运行时产生的热量直接传递给第一冷却液,第一冷却液再通过金属制的密封壳体将热量传递给低温的第二冷却液,完成电子元器件与外界的热交换,密封壳体内直接与电子元器件接触的第一冷却液使用量小,而且各个密封壳体之间相互独立,便于对电子元器件的维护,提升了维护效率。另一方面,由于循环于密闭腔体与外部冷却设备之间的第二冷却液可以使用廉价的水或者其它廉价冷却介质,从而解决了全浸没式或者节点式液体冷却需要消耗大量昂贵的冷却液,降低了液冷系统的成本。而且通过流道位置和数量的设计,提升了液冷系统的散热效率。Through the above description, the liquid cooling device provided by the present application encapsulates the electronic component to be dissipated into a metal sealed casing filled with the first cooling liquid, and is provided with external cooling on the body of the sealed casing. a flow passage connected to the device, the flow channel is filled with a second coolant for circulating between the sealed casing body and the external cooling device, and the heat generated by the electronic component during operation is directly transmitted to the first coolant, the first cooling The liquid then transfers the heat to the second cooling liquid through the sealed casing of the metal to complete the heat exchange between the electronic component and the outside, and the first coolant directly in contact with the electronic component in the sealed casing is used in a small amount, and each The sealed housings are independent of each other, facilitating the maintenance of electronic components and improving maintenance efficiency. On the other hand, since the second coolant circulating between the closed chamber and the external cooling device can use inexpensive water or other inexpensive cooling medium, it is solved that the full immersion or node liquid cooling requires a large amount of expensive coolant. , reducing the cost of the liquid cooling system. Moreover, the heat dissipation efficiency of the liquid cooling system is improved by the design of the position and number of the flow path.
上文结合图1至图8详细介绍了本申请提供的液冷装置的结构,接下来,结合图9和图10进一步介绍应用本申请中液冷装置的刀片式服务器和机架式服务器。The structure of the liquid cooling device provided by the present application is described in detail above with reference to FIGS. 1 to 8. Next, the blade server and the rack server to which the liquid cooling device of the present application is applied will be further described with reference to FIGS. 9 and 10.
图9为本申请提供的一种液冷式刀片式服务器的结构示意图,如图所示,该刀片式服务器中包括4个刀片式服务器,每个刀片式服务器分别安装于一个壳体中,4个壳体共用一个外部制冷设备形成一套上述浸没式冷却液装置。其中,多个刀片式服务器之间通过背板(9)相连。浸没式冷却装置的结构与图1至图8所述结构相同,在此不再赘述。FIG. 9 is a schematic structural diagram of a liquid-cooled blade server provided by the present application. As shown in the figure, the blade server includes four blade servers, and each blade server is separately installed in one shell, 4 The housings share an external refrigeration unit to form a set of submerged coolant units. Among them, multiple blade servers are connected by a backplane (9). The structure of the immersion cooling device is the same as that described in FIGS. 1 to 8 and will not be described again.
图10为本申请提供的一种可实现的液冷式机架式服务器组的结构示意图,如图所示,所述机架式服务器组包括4个机架式服务器(C)。其中,每个机架式服务器分别安装在一个壳体中,4个壳体与共用一个外部制冷设备,形成上述浸没式液冷装置,在本方式中,在壳体与外部制冷设备之间仅设置动力设备和净化设备,而不设置流速监测设备或者压力监测设备。其中,浸没式冷却装置的结构与图1至图8所述结构相同,在此不再赘述。10 is a schematic structural diagram of an achievable liquid-cooled rack server group provided by the present application. As shown, the rack server group includes four rack servers (C). Wherein, each rack server is installed in one housing, and four housings share an external cooling device to form the above-mentioned submerged liquid cooling device. In this mode, only between the housing and the external refrigerating device Set power equipment and purification equipment without setting up flow rate monitoring equipment or pressure monitoring equipment. The structure of the immersion cooling device is the same as that described in FIG. 1 to FIG. 8 and will not be described herein.
值得说明的是,在图9所示的刀片式服务器和图10所示的机架式服务器中,不同电子设备可以通过同一个外部制冷设备实现第二冷却液的制冷,以此将第一冷却液产生的热量传导到刀片服务器/机架服务器外部。不同电子设备也可以通过多个外部制冷设备实现第二冷却液的制冷,以此提高刀片是服务器/机架服务器的散热效率。It should be noted that in the blade server shown in FIG. 9 and the rack server shown in FIG. 10, different electronic devices can realize the cooling of the second coolant through the same external cooling device, thereby performing the first cooling. The heat generated by the liquid is transferred to the outside of the blade server/rack server. Different electronic devices can also achieve the cooling of the second coolant through a plurality of external cooling devices, thereby improving the heat dissipation efficiency of the server/rack server.
以上结合具体实施方式和范例性实例对本申请进行了详细说明,不过这些说明并不能理解为对本申请的限制。本领域技术人员理解,在不偏离本申请精神和范围的情况下,可以对本申请技术方案及其实施方式进行多种等价替换、修饰或改进,这些均落入本申请的范围内。本申请的保护范围以所附权利要求为准。The present application has been described in detail above with reference to the specific embodiments and exemplary embodiments, but these are not to be construed as limiting. It will be understood by those skilled in the art that various equivalents, modifications, and improvements may be made without departing from the spirit and scope of the invention. The scope of protection of the application is subject to the appended claims.
Claims (12)
- 一种浸没式液冷装置,其特征在于,所述液冷装置包括壳体和外部制冷设备,An immersion liquid cooling device, characterized in that the liquid cooling device comprises a casing and an external refrigeration device,所述壳体内部包括密闭腔体,在所述密闭腔体中安装有待散热的电子元器件,并且填充有第一冷却液;The interior of the housing includes a closed cavity in which an electronic component to be dissipated is mounted and filled with a first cooling liquid;在所述壳体的本体内部开设有至少一条流道;所述流道与所述外部制冷设备形成回路,所述回路中填充有第二冷却液,所述外部制冷设备用于冷却所述第二冷却液,以及为所述第二冷却液提供循环动力;Opening at least one flow channel inside the body of the casing; the flow channel forms a circuit with the external refrigeration device, the circuit is filled with a second cooling liquid, and the external refrigeration device is used to cool the first Two coolants, and providing circulating power to the second coolant;所述第二冷却液通过所述密闭腔体将所述第一冷却液传导的待散热的电子元器件的热量排出所述壳体外部。The second coolant passes the heat of the electronic component to be dissipated by the first coolant to the outside of the casing through the sealed cavity.
- 根据权利要求1所述的液冷装置,其特征在于,所述待散热的电子元器件按照预设的位置和连接方式安装于印制电路板PCB上形成设备单板上,并且通过所述设备单板固定于所述密闭腔体中。The liquid cooling device according to claim 1, wherein the electronic component to be dissipated is mounted on the printed circuit board PCB in a predetermined position and connection manner to form a device board, and the device is passed through the device. The veneer is fixed in the closed cavity.
- 根据权利要求1至2中任一所述的液冷装置,其特征在于,所述壳体包括中空的壳主体、与所述壳主体底端密封连接的底板和与所述主体顶端密封连接的顶板,其中,所述底板和所述顶板中至少一个与所述壳主体为可拆卸连接,构成可拆卸的壳体。A liquid cooling apparatus according to any one of claims 1 to 2, wherein said housing comprises a hollow casing body, a bottom plate sealingly coupled to a bottom end of said casing body, and a sealing connection with said body top end a top plate, wherein at least one of the bottom plate and the top plate is detachably coupled to the case body to constitute a detachable case.
- 根据权利要求1至2中任一所述液冷装置,其特征在于,在所述壳主体与可拆卸连接的所述顶板和/或所述底板连接处设置有密封件。A liquid cooling apparatus according to any one of claims 1 to 2, wherein a seal member is provided at a joint of said case main body with said detachably connected top plate and/or said bottom plate.
- 根据权利要求1至4中任一所述的液冷装置,其特征在于,在所述设备单板上安装有连接器,所述连接器伸出壳体外部或者卡嵌于壳体本体上,所述连接器用于与背板或者其它电子元器件电连接。The liquid cooling device according to any one of claims 1 to 4, wherein a connector is mounted on the device board, and the connector protrudes from the outside of the housing or is embedded in the housing body. The connector is for electrical connection to a backplane or other electronic component.
- 根据权利要求1至5中任一所述的液冷装置,其特征在于,所述流道开设于顶板本体内部、壳主体本体内部、或底板本体内部中的至少一种。The liquid cooling device according to any one of claims 1 to 5, wherein the flow path is opened in at least one of a inside of the top plate body, a inside of the case main body, or an inside of the bottom plate body.
- 根据权利要求1至6中任一所述的液冷装置,其特征在于,所述流道包括主流道和分流道,所述分流道与所述主流道连通。The liquid cooling apparatus according to any one of claims 1 to 6, wherein the flow path includes a main flow path and a bypass flow, and the flow separation path is in communication with the main flow path.
- 根据权利要求1至7中任一所述的液冷装置,其特征在于,所述流道在所述壳体本体上的两个端口分别为所述壳体进液口和所述壳体出液口,在所述外部制冷设备上设置有制冷进液口和制冷出液口,所述壳体本体上的两个端口和所述外部制冷设备上的所述制冷进液口和所述制冷出液口之间形成密封通道,用于所述第二冷却液在所述流道与所述冷却设备冷却之间循环,其中,在所述壳体进液口上设置有壳体进液快速接头,在所述壳体出液口设置有所述壳体出液快速接头,在所述制冷进液口上设置有与所述壳体出液快速接头匹配的制冷进液快速接头,在所述制冷出液口上设置有与所述壳体进液快速接头匹配的制冷出液快速接头,所述进液快速接头和所述出液快速接头用于密封所述第二冷却液。The liquid cooling device according to any one of claims 1 to 7, wherein the two ports of the flow path on the housing body are respectively the housing inlet port and the housing outlet a liquid port on which a refrigerating liquid inlet and a refrigerating liquid outlet are provided, two ports on the casing body and the refrigerating liquid inlet on the external refrigerating device and the refrigerating Forming a sealed passage between the liquid outlets for circulating the second coolant between the flow passage and the cooling device, wherein a housing inlet quick connector is disposed on the housing inlet Providing the housing liquid outlet quick joint at the liquid outlet of the casing, and a cooling liquid inlet quick joint matched with the liquid outlet quick joint of the casing is disposed on the cooling liquid inlet, in the cooling A refrigerant outlet quick connector that matches the housing inlet quick connector is disposed on the liquid outlet, and the liquid inlet quick connector and the liquid outlet quick connector are used to seal the second coolant.
- 根据权利要求1至8中任一所述的液冷装置,其特征在于,在所述壳体与所述外部制冷设备之间,还连通有用于驱动所述第二冷却液循环的动力设备和用于净化第二冷却液的净化设备。A liquid cooling apparatus according to any one of claims 1 to 8, wherein a power device for driving said second coolant circulation is further communicated between said casing and said external refrigerating apparatus A purification device for purifying the second coolant.
- 根据权利要求1至9中任一所述的液冷装置,其特征在于,所述第一冷却液为硅矿物油和/或氟化液;所述第二冷却液为水和/或添加剂与水形成的组合物。The liquid cooling device according to any one of claims 1 to 9, wherein the first cooling liquid is a silicon mineral oil and/or a fluorinating liquid; and the second cooling liquid is water and/or an additive A composition formed by water.
- 一种设置有液冷装置的刀片式服务器,其特征在于,所述刀片式服务器中设 置有权利要求1至10中任一所述的浸没式液冷装置。A blade server provided with a liquid cooling device, characterized in that the blade server is provided with the submerged liquid cooling device according to any one of claims 1 to 10.
- 一种设置有液冷装置的机架式服务器,其特征在于,所述机架式服务器中设置有权利要求1至10中任一所述的浸没式液冷装置。A rack type server provided with a liquid cooling device, characterized in that the rack type server is provided with the submerged liquid cooling device according to any one of claims 1 to 10.
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Also Published As
Publication number | Publication date |
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CN111918527A (en) | 2020-11-10 |
CN107484387A (en) | 2017-12-15 |
CN111918527B (en) | 2024-05-17 |
CN112020271B (en) | 2022-04-22 |
CN112020271A (en) | 2020-12-01 |
CN107484387B (en) | 2020-08-07 |
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