CN106774741A - Cooling system and immersion liquid-cooled suit business device for server - Google Patents

Cooling system and immersion liquid-cooled suit business device for server Download PDF

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Publication number
CN106774741A
CN106774741A CN201611185250.2A CN201611185250A CN106774741A CN 106774741 A CN106774741 A CN 106774741A CN 201611185250 A CN201611185250 A CN 201611185250A CN 106774741 A CN106774741 A CN 106774741A
Authority
CN
China
Prior art keywords
cavity portion
cooling system
cavity
server
refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611185250.2A
Other languages
Chinese (zh)
Inventor
沈卫东
王晨
吴宏杰
孙振
李星
彭晶楠
宋景亮
崔新涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dawning Information Industry Beijing Co Ltd
Original Assignee
Dawning Information Industry Beijing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dawning Information Industry Beijing Co Ltd filed Critical Dawning Information Industry Beijing Co Ltd
Priority to CN201611185250.2A priority Critical patent/CN106774741A/en
Publication of CN106774741A publication Critical patent/CN106774741A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means

Abstract

The invention provides a kind of cooling system for server, including:Cavity (12), cavity (12) is including communicating with each other and integrally formed first cavity portion (14) and the second cavity portion (16), wherein, refrigerant is accommodated in first cavity portion (14), and the mainboard (18) of server is arranged in the first cavity portion (14) and submerges in the refrigerant.It is an object of the invention to provide a kind of integrally formed cooling system and immersion liquid-cooled suit business device for server.

Description

Cooling system and immersion liquid-cooled suit business device for server
Technical field
The present invention relates to a kind of cooling system for server and immersion liquid-cooled suit business device.
Background technology
The computer for being used at present depends on greatly cold air and gives machine cooling, but in data center, only by it is air-cooled It is insufficient for the cooling requirements of high heat flux server.Traditional air-cooled pattern is entered by the way of mediate contact cooling OK, it is complicated in diabatic process, there is thermal contact resistance and heat convection thermal resistance, thermal resistance summation is big, and heat exchange efficiency is relatively low, heat transfer process The temperature difference is larger, it is necessary to relatively low outdoor low-temperature heat source guiding heat transfer process is carried out between height temperature-heat-source.
The cold medium i.e. by the use of working fluid as middle heat transmission of liquid, heat is delivered to by hot-zone to be carried out again at a distance Cooling.Because liquid is more much larger than the specific heat of air, radiating rate is also far longer than air, therefore refrigerating efficiency far above air-cooled Radiating.Water-cooled or liquid is cold two big benefits:One is that refrigerant is directly directed to thermal source by it, is made indirectly rather than as air-cooled It is cold;Two are compared with air-cooled, and the heat that per unit volume is transmitted i.e. radiating efficiency is up to 3500 times.
The characteristics of liquid cooling heat radiation system is maximum has two:Heat and the low noise work of balanced CPU.Due to the specific heat of liquid Hold super large, therefore, it is possible to absorb substantial amounts of heat and keeping temperature will not significantly change, the temperature of CPU can in liquid cooling system The control for obtaining, the operation of burst is all without causing CPU internal temperature moments significantly to change.Due to the surface of heat exchanger Product is very big, so the fan for only needing to the slow-speed of revolution is radiated to it can just play good effect, therefore the cold most collocation of liquid The relatively low fan of rotating speed.Additionally, the work noise of pump typically also will not be it is obvious that so overall cooling system and air cooling system Compared to just very quiet.
Evaporation cooling is that latent heat of vaporization when being seethed with excitement using refrigerant takes away heat from calorifics principle.Due to liquid The latent heat of vaporization is more much bigger than specific heat, therefore transpiration-cooled cooling effect is more notable.
In the immersion liquid-cooled suit business device for thering is phase transformation to occur, if refrigerant vapour is derived into what the external world was condensed Words, if using the parts such as joint, valve in gas connecting cavity, because these connection members have certain resistance, such as Pressure difference in fruit evaporation cavity and gas piping is not enough to overcome part resistance, and may result in steam cannot in time discharge the external world, steams The speed that vapour is produced exceeds derived speed so that submergence inside cavity pressure rise so that produce a series of problems and Serious consequence.And not yet occur immersion phase transformation liquid-cooled suit business device on the market at present, so also without the pressure release for this problem Gas storage method.
The content of the invention
It is integrally formed for server it is an object of the invention to provide one kind for problem present in correlation technique Cooling system and immersion liquid-cooled suit business device.
A kind of embodiments in accordance with the present invention, there is provided cooling system for server, including:Cavity, cavity includes Communicate with each other and integrally formed first cavity portion and the second cavity portion, wherein, refrigeration is accommodated in the first cavity portion Agent, and server mainboard be arranged in the first cavity portion and submergence in the refrigerant.
Embodiments in accordance with the present invention, the second cavity portion is divided into upper strata gas collector part and lower floor's knockout part, its In, upper strata gas collector part and lower floor's knockout part are connected to gas piping and liquid line, and lower floor's knockout Part selectively connects with the first cavity portion.
Embodiments in accordance with the present invention, the gear between the first cavity portion and the second cavity portion by that can open or close Plate communicates with each other or isolates.
Embodiments in accordance with the present invention, form gas phase zone on the liquid level of the refrigerant in the first cavity portion, and First cavity portion is also connected via valve with exterior airbag, wherein, it is provided with gas phase zone and is connected to control valve with valve The pressure sensor of the switch of door.
Embodiments in accordance with the present invention, the outlet of gas piping is connected to refrigerant cooler, and is communicated to via pump The entrance of liquid line.
Embodiments in accordance with the present invention, additionally provide a kind of immersion liquid-cooled suit business device, including cooling system as described above System.
Advantageous Effects of the invention are:
In the cooling system for server of the invention, the cavity of cooling system is made including communicating with each other and one Body formed the first cavity portion and the second cavity portion, is engaged in device hence for this immersion liquid-cooled suit for having a phase transformation of the present invention For, the gas collector part of the gas phase zone of top half in the first cavity portion and the second cavity portion top half is directly connected It is logical, the devices such as snap joint are eliminated, so as to reduce resistance and cost weight.
Brief description of the drawings
Fig. 1 is structure of the present invention for one embodiment of cooling system and immersion liquid-cooled suit the business device of server Schematic diagram.
Specific embodiment
The cooling system for server of the invention and immersion liquid-cooled suit business device are described referring now to accompanying drawing. As shown in figure 1, the invention provides the cooling system for server and immersion liquid-cooled suit business device.
As illustrated, cooling system 10 includes cavity 12, further, cavity 12 includes communicating with each other and integrally formed the One cavity portion 14 and the second cavity portion 16.Accommodate refrigerant in the first cavity portion 14, and server mainboard 18 are arranged in the first cavity portion 14 and submerged in the refrigerant, so as to be cooled down using refrigerant.
With continued reference to Fig. 1, in an embodiment of the present invention, the second 16 points of cavity portion is upper strata gas collector part 20 with Layer knockout part 22.Wherein, upper strata gas collector part 20 and lower floor's knockout part 22 are connected to the He of gas piping 24 Liquid line 26, and lower floor's knockout part 22 selectively connects with the first cavity portion 14.
In addition in a preferred embodiment, can be by energy between the first cavity portion 14 and the second cavity portion 16 The baffle plate 28 for enough opening or closing communicates with each other or isolates.Specifically, the liquid level of the refrigerant in the first cavity portion 14 it Upper formation gas phase zone 30, and the first cavity portion 14 also connects via valve with exterior airbag, wherein, set in gas phase zone 30 It is equipped with and is connected with the pressure sensor of the switch of control valve with valve.
Additionally, the outlet of gas piping 24 is connected to refrigerant cooler, and liquid line 26 is communicated to via pump Entrance.
Specifically, in cooling system of the invention 10, server master board 18 is directly immersed in full of refrigerant In cavity (that is, the first cavity portion 14), high density server heat dissipation problem is solved using phase-change heat-exchange technology.Specially use Body structure, built with server master board, all mainboards are submerged in refrigerant girff, and ullage is gas phase zone 30.When When mainboard 18 starts, heating element heating thereon so that the refrigerant boiling of surrounding, as refrigerant vapour.On steam Rise, the refrigerant vapour in girff in all blades collects into the gas collector portion of the second cavity portion 16 positioned at girff rear portion Divide in 20, gas collector part 20 is directly connected to gas piping 24, the refrigerant vapour submitting external world be cooled into liquid refrigerant, And under the pressurization of pump being delivered back into knockout part 22 by liquid line 26, knockout part 22 is by refrigerant average mark With in each blade cavity sent into the girff.
In the present invention, cooling system 10 eliminates the snap joint of gas collector connection or other portions in single blade and girff Part, by being made of one of girff, eliminates the design of knife shell, cavity one by one will be divided into girff, and is got through in rear end, makes Obtain each cavity and directly connect gas collector part 20, refrigerant vapour is transported to the external world by gas collector part 20 by pipeline.
In the present invention, mainboard is plugged during maintenance, rather than blade server.Cabin is equipped with the front end of each cavity Door, first discharges the refrigerant in cavity during maintenance, then open hatch door and take out mainboard.
The place being connected with gas collector in blade server cavity is provided with baffle plate, too low when cavity internal pressure is detected When, close baffle plate, with the carrying out of boiling, the pressure of cabinet inside can continue to raise, when pressure reaches preset value, you can with gram When taking pipe resistance, baffle plate is opened, and continues to output refrigerant vapour.
In the present invention, pressure sensor is set in the gas phase zone part of submergence girff, when pressure reaches certain preset value, Valve opening, refrigerant vapour is entered in air bag, when cavity internal pressure resumes work pressure, valve closing.So that chamber Internal portion pressure remained steady, maintains service pressure.
It is corresponding with the above, in immersion liquid-cooled suit of the invention business device, by the server includes as above institute The cooling system 10 stated, therefore the server also possesses above-described all advantages.
The preferred embodiments of the present invention are the foregoing is only, is not intended to limit the invention, for the skill of this area For art personnel, the present invention can have various modifications and variations.It is all within the spirit and principles in the present invention, made any repair Change, equivalent, improvement etc., should be included within the scope of the present invention.

Claims (6)

1. a kind of cooling system for server, it is characterised in that including:Cavity (12), the cavity (12) is including each other Connection and integrally formed first cavity portion (14) and the second cavity portion (16),
Wherein, refrigerant is accommodated in first cavity portion (14), and the mainboard (18) of the server is arranged on institute State in the first cavity portion (14) and be immersed in the refrigerant.
2. cooling system according to claim 1, it is characterised in that second cavity portion (16) is divided into upper strata gas collection Device part (20) and lower floor's knockout part (22), wherein, the upper strata gas collector part (20) and lower floor's knockout portion Point (22) are connected to gas piping (24) and liquid line (26), and lower floor's knockout part (22) and described the One cavity portion (14) is selectively connected.
3. cooling system according to claim 2, it is characterised in that first cavity portion (14) and second chamber Baffle plate (28) between body portion (16) by that can open or close communicates with each other or isolates.
4. cooling system according to claim 2, it is characterised in that the system in first cavity portion (14) Gas phase zone (30) are formed on the liquid level of cryogen, and first cavity portion (14) also connects via valve and exterior airbag It is logical, wherein, it is provided with the gas phase zone (30) and is connected to control the pressure sensing of the switch of the valve with the valve Device.
5. cooling system according to claim 2, it is characterised in that the outlet of the gas piping (24) is connected to refrigeration Agent cooling device, and the entrance of the liquid line (26) is communicated to via pump.
6. a kind of immersion liquid-cooled suit business device, it is characterised in that including the cooling system any one of claim 1 to 5.
CN201611185250.2A 2016-12-20 2016-12-20 Cooling system and immersion liquid-cooled suit business device for server Pending CN106774741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611185250.2A CN106774741A (en) 2016-12-20 2016-12-20 Cooling system and immersion liquid-cooled suit business device for server

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611185250.2A CN106774741A (en) 2016-12-20 2016-12-20 Cooling system and immersion liquid-cooled suit business device for server

Publications (1)

Publication Number Publication Date
CN106774741A true CN106774741A (en) 2017-05-31

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107894823A (en) * 2017-12-21 2018-04-10 曙光节能技术(北京)股份有限公司 Immersion liquid-cooling heat radiator and method
CN109195424A (en) * 2018-11-06 2019-01-11 北京中热信息科技有限公司 A kind of heat pipe exchanging type electronic equipment liquid cooling system
CN111918527A (en) * 2017-07-17 2020-11-10 华为技术有限公司 Liquid cooling device and server including the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104363742A (en) * 2014-11-13 2015-02-18 曙光信息产业(北京)有限公司 Liquid cooling server
CN104484019A (en) * 2014-11-25 2015-04-01 曙光信息产业(北京)有限公司 Liquid cooling server
CN104519722A (en) * 2014-12-11 2015-04-15 吕梁市军民融合协同创新研究院 Liquid cooling device and server with same
JP2015201547A (en) * 2014-04-08 2015-11-12 Next Innovation合同会社 cooling structure
CN105487624A (en) * 2014-10-10 2016-04-13 汤金菊 High-density server liquid immersion cooling cabinet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015201547A (en) * 2014-04-08 2015-11-12 Next Innovation合同会社 cooling structure
CN105487624A (en) * 2014-10-10 2016-04-13 汤金菊 High-density server liquid immersion cooling cabinet
CN104363742A (en) * 2014-11-13 2015-02-18 曙光信息产业(北京)有限公司 Liquid cooling server
CN104484019A (en) * 2014-11-25 2015-04-01 曙光信息产业(北京)有限公司 Liquid cooling server
CN104519722A (en) * 2014-12-11 2015-04-15 吕梁市军民融合协同创新研究院 Liquid cooling device and server with same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111918527A (en) * 2017-07-17 2020-11-10 华为技术有限公司 Liquid cooling device and server including the same
CN107894823A (en) * 2017-12-21 2018-04-10 曙光节能技术(北京)股份有限公司 Immersion liquid-cooling heat radiator and method
CN109195424A (en) * 2018-11-06 2019-01-11 北京中热信息科技有限公司 A kind of heat pipe exchanging type electronic equipment liquid cooling system

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Application publication date: 20170531

RJ01 Rejection of invention patent application after publication