CN107894823A - Immersion liquid-cooling heat radiator and method - Google Patents
Immersion liquid-cooling heat radiator and method Download PDFInfo
- Publication number
- CN107894823A CN107894823A CN201711396976.5A CN201711396976A CN107894823A CN 107894823 A CN107894823 A CN 107894823A CN 201711396976 A CN201711396976 A CN 201711396976A CN 107894823 A CN107894823 A CN 107894823A
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- Prior art keywords
- component
- thermal component
- thermal
- diversion
- immersion liquid
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The invention discloses a kind of immersion liquid-cooling heat radiator and method, the immersion liquid-cooling heat radiator includes：First thermal component, the first thermal component wrap up the first heater members on mainboard；Second thermal component, the second thermal component wrap up the second heater members on mainboard, wherein the first thermal component and the second thermal component are transpiration-cooled thermal component, and the second thermal component is located at the top of the first thermal component；And diversion component, between the first thermal component and the second thermal component, diversion component is used to carry out water conservancy diversion to bubble stream caused by the first thermal component, its bubble stream caused by with the second thermal component is not converged.The present invention avoids influence of the bubble stream caused by the thermal component of lower section heater members to the thermal component boiling situation of its top heater members by installing diversion component.Compared with traditional liquid phase-change immersion cooling, the heat exchange efficiency of fluid is improved, simple in construction, easily controllable and realization.
Description
Technical field
The present invention relates to heat abstractor technical field, it particularly relates to a kind of immersion liquid-cooling heat radiator and method.
Background technology
Common computer depends on greatly cold air and gives machine cooling, and water cooling or liquid is cold two big benefits：First, its handle
Cooling agent is directly directed to thermal source, rather than the indirect refrigeration as air-cooled；Second, compared with air-cooled, what per unit volume was transmitted
Heat is that radiating efficiency is up to 3500 times.Water-filled radiator appeared in the server such as market, Hewlett-Packard, IBM at 2008 or so
The company of giant and some other absorbed data center's technology all successively released water-cooling product.
Evaporation cooling is to take away heat using latent heat of vaporization during fluid boiling from calorifics principle.It is this to be boiled using fluid
The type of cooling of latent heat of vaporization when rising just is called " evaporation cooling ".Because the latent heat of vaporization of fluid is bigger than the specific heat of fluid very
It is more, so transpiration-cooled cooling effect is more notable.
In the system of liquid-cooling heat radiation is carried out to mainboards such as CPU, GPU, immersion mainly takes away heat using liquid phase-change
Amount, process are difficult to control, and technical requirements are higher.
In direct-type liquid cooling system, i.e., when carrying out immersion cooling using refrigerant, fin and fan are eliminated, only with system
The phase transformation of cryogen is exchanged heat to cool down CPU.And the processing method of heat exchange area, surface roughness, material property and new and old
Degree can influence the power of boiling heat transfer.For same liquid in boiling heat transfer on polishing wall, its ratio of heat transfer coefficient is coarse
Low during boiling heat transfer on face, this is mainly due to the less reason of core that gasifies on smooth finish surface.At present, existing CPU on the market
The shroud surface of chip is smooth, is not likely to produce bubble, and boiling performance is not good enough, therefore CPU temperature rises quickly after powering,
Steady temperature is higher, it is easy to reaches CPU limiting temperature so that most of server producers for liquid refrigeration technique hope and
Step.
In addition, regardless of whether to CPU surfaces using boiling processing method is strengthened, when the CPU on mainboard or GPU is vertical up and down
During arrangement, after the bubble stream rising on lower section CPU surfaces, it can rise and be mixed with caused bubble stream on the CPU surfaces of top, once
Bubble coalescence merges, and if forming air film on CPU covers surface, can have a negative impact to boiling so that diabatic process deteriorates.
For the above mentioned problem in correlation technique, effective solution is not yet proposed at present.
The content of the invention
For the above mentioned problem in correlation technique, the present invention proposes a kind of immersion liquid-cooling heat radiator and method, passed through
Liquid flow direction is controlled, is radiated in a manner of taking away heat to be flowed using single-phase liquid.
The technical proposal of the invention is realized in this way：
According to an aspect of the invention, there is provided a kind of immersion liquid-cooling heat radiator, including：
First thermal component, the first thermal component wrap up the first heater members on mainboard；
Second thermal component, the second thermal component parcel mainboard on the second heater members, wherein the first thermal component and
Second thermal component is transpiration-cooled thermal component, and the second thermal component is located at the top of the first thermal component；And
Diversion component, between the first thermal component and the second thermal component, diversion component is used for the first radiating part
Bubble stream caused by part carries out water conservancy diversion, its bubble stream caused by with the second thermal component is not converged.
Preferably, the surface of the first thermal component and the surface of the second thermal component are sintered copper particle surface.
In certain embodiments, the distance between diversion component and the first thermal component are less than diversion component and the second radiating
The distance between part.
In one embodiment, diversion component includes：First component, perpendicular to mainboard surface, and along the first radiating part
The edge extension of the top margin of part；Wherein, the length of first component is more than the length of the top margin of the first thermal component
In one embodiment, diversion component also includes：Second component, one end of second component are connected to first component
One end；And third member, one end of third member are connected to the other end of first component；Wherein, second component and the 3rd
Part is each perpendicular to mainboard surface, and second component and third member are to the inclined downward of first component.
In one embodiment, diversion component has the first height relative to mainboard surface；The surface of second thermal component
There is the second height with mainboard surface；Wherein, the second height is not less than the first height.
In one embodiment, diversion component is kuppe.
In certain embodiments, the first heater members are central processor CPU or graphics processor GPU；And second hair
Thermal device is CPU or GPU.
According to another aspect of the present invention, there is provided a kind of immersion liquid-cooling heat radiation method, including：
First thermal component is wrapped up into the first heater members on mainboard, and the second thermal component is wrapped up to the on mainboard
Two heater members, wherein the first thermal component and the second thermal component are transpiration-cooled thermal component, and the second radiating part
Part is located at the top of the first thermal component；And
Water conservancy diversion is carried out to bubble stream caused by the first thermal component, its bubble stream caused by with the second thermal component is not sent out
Life converges.
In one embodiment, in addition to：Burn on the surface on surface and the second thermal component to the first thermal component
Knot strengthens boiling processing to form sintered copper particle surface.
The present invention avoids bubble stream caused by the thermal component of lower section heater members to thereon by installing diversion component
The influence of the thermal component boiling situation of square heater members.Compared with traditional liquid phase-change immersion cooling, fluid is improved
Heat exchange efficiency, it is simple in construction, it is easily controllable and realize.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 a are the side views of immersion liquid-cooling heat radiator according to embodiments of the present invention；
Fig. 1 b are the front views of immersion liquid-cooling heat radiator according to embodiments of the present invention；
Fig. 2 is the figure of the thermal component of immersion liquid-cooling heat radiator according to embodiments of the present invention；
Fig. 3 is the flow chart of immersion liquid-cooling heat radiation method according to embodiments of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained, belong to what the present invention protected
Scope.
According to an embodiment of the invention, there is provided a kind of immersion liquid-cooling heat radiator.
As illustrated in figs. 1A and ib, immersion liquid-cooling heat radiator 100 according to embodiments of the present invention includes：
First thermal component 120, the first thermal component 120 wrap up the first heater members on mainboard 110；
Second thermal component 130, the second thermal component 130 wrap up the second heater members on mainboard 110, wherein first dissipates
The thermal component 130 of thermal part 120 and second is transpiration-cooled thermal component, and the second thermal component 130 dissipates positioned at first
The top of thermal part 120；
Diversion component 140, diversion component 140 is between the first thermal component 120 and the second thermal component 130, water conservancy diversion
Part 140 to caused by the first thermal component 120 bubble stream carry out water conservancy diversion, make bubble stream caused by the first thermal component 120 with
Bubble stream caused by second thermal component 130 is not converged.
The above-mentioned technical proposal of the present invention, by installing diversion component 140, avoid the thermal component of lower section heater members
Influence of the caused bubble stream to the thermal component boiling situation of its top heater members.It is cold with traditional liquid phase-change immersion
But compare, improve the heat exchange efficiency of fluid, simple in construction, easily controllable and realization.
In certain embodiments, the first heater members can be central processor CPU or graphics processor GPU；Second heating
Device can be CPU or GPU.It should be appreciated that the first heater members and the second heater members are not limited to CPU or GPU, other are any
Heater members within protection scope of the present invention.
In certain embodiments, diversion component 140 is kuppe.It should be noted that the diversion component 140 can be appointed
What can carry out the structure of water conservancy diversion to bubble stream caused by the first thermal component 120, and the present invention does not make restriction to this.
In certain embodiments, the first thermal component 120 and/or the second thermal component 130 are the first heater members/or the
The outer cover of one heater members.For example, in the embodiment shown in Fig. 1 a and Fig. 1 b, first the second heater members of heater members are
CPU, the first thermal component 120 and the second thermal component 130 respectively the first CPU outer covers and the 2nd CPU outer covers, and diversion division
Part 140 is kuppe.When wherein, in order to prevent that two CPU on mainboard 110 are arranged vertically up and down, the first CPU outer covers of lower section
The bubble stream on surface is to harmful effect caused by the boiling of the 2nd CPU shroud surfaces and heat transfer of top, outside the first CPU of lower section
The top installation kuppe of cover.So that bubble caused by the CPU outer covers of lower section the first first collects, around rising again after kuppe, with
The parallel rising of bubble stream caused by the CPU outer covers of top the 2nd, rather than converge rising, so as to avoid to the CPU outer covers of top the 2nd
The influence of boiling situation.
Preferably, the surface of the first thermal component 120 and the surface of the second thermal component 130 are sintered copper particle table
Face.Sinter and refer to granular material to be changed into dense body, powder is that one kind is more by sintering obtained dense body after overmolding
Brilliant material, its microstructure are made up of crystal, vitreum and stomata.Sintering process directly affects the crystal grain chi in microstructure
Very little, pore size and grain-boundary shape and distribution, and then influence the performance of material.Fig. 2 non-exclusively shows the one of thermal component
Individual embodiment, in the present embodiment, thermal component are CPU outer covers 210.Because the material of CPU outer covers is copper, surface is coated with one layer
Nickel, and copper nickel plating surface is smooth, is unfavorable for gasifying.Therefore, by carrying out strengthening boiling processing formation sintering to CPU shroud surfaces
Copper particle surface, by increasing capacitance it is possible to increase the nucleus of boiling on surface, enhanced boiling heat transfer.
Referring again to shown in Fig. 1 a and Fig. 1 b, in one embodiment, the thermal component 120 of diversion component 140 and first it
Between distance be less than the distance between thermal component 130 of diversion component 140 and second.
In one embodiment, diversion component 140 includes：First component 142, perpendicular to the surface of mainboard 110, and along
The edge extension of the top margin of one thermal component 120；Wherein, the length of first component 142 is more than the first thermal component 120
The length of top margin.
Further, diversion component 140 may also include：Second component 144, one end of second component 144 are connected to first
One end of part 142；And third member 146, one end of third member 146 are connected to the other end of first component 142；Its
In, second component 144 and third member 146 are each perpendicular to the surface of mainboard 110, and second component 144 and third member 146 to
The inclined downward of first component 142.
In one embodiment, diversion component 140 with relative to the surface of mainboard 110 with first height；Second radiating
The surface of part 130 has the second height with the surface of mainboard 110；Wherein, the second height is not less than the first height.
As shown in figure 3, according to an embodiment of the invention, a kind of immersion liquid-cooling heat radiation method is additionally provided, including it is following
Step：
S310, the first thermal component is wrapped up into the first heater members on mainboard, and the second thermal component is wrapped up into mainboard
On the second heater members, wherein the first thermal component and the second thermal component are transpiration-cooled thermal component, and second
Thermal component is located at the top of the first thermal component；And
S320, water conservancy diversion is carried out to bubble stream caused by the first thermal component, make its bubble caused by with the second thermal component
Stream does not converge.
In one embodiment, in addition to：Burn on the surface on surface and the second thermal component to the first thermal component
Knot strengthens boiling processing to form sintered copper particle surface.The step can be carried out before step S310, can also be in step
Carried out after S310.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (10)
- A kind of 1. immersion liquid-cooling heat radiator, it is characterised in that including：First thermal component, first thermal component wrap up the first heater members on mainboard；Second thermal component, second thermal component wrap up the second heater members on the mainboard, wherein described first dissipates Thermal part and second thermal component are transpiration-cooled thermal component, and second thermal component is located at described first The top of thermal component；AndDiversion component, between first thermal component and second thermal component, the diversion component is used for the Bubble stream caused by one thermal component carries out water conservancy diversion, its bubble stream caused by with the second thermal component is not converged.
- 2. immersion liquid-cooling heat radiator according to claim 1, it is characterised in thatThe surface of first thermal component and the surface of the second thermal component are sintered copper particle surface.
- 3. immersion liquid-cooling heat radiator according to claim 1, it is characterised in thatThe distance between the diversion component and first thermal component are less than the diversion component and second radiating part The distance between part.
- 4. immersion liquid-cooling heat radiator according to claim 1, it is characterised in that the diversion component includes：First component, perpendicular to mainboard surface, and the edge of the top margin along the first thermal component extends；Wherein, the length of the first component is more than the length of the top margin of first thermal component.
- 5. immersion liquid-cooling heat radiator according to claim 4, it is characterised in that the diversion component also includes：Second component, one end of second component are connected to one end of first component；AndThird member, one end of third member are connected to the other end of first component；Wherein, second component and the third member are each perpendicular to the mainboard surface, and second component and third member to The inclined downward of the first component.
- 6. immersion liquid-cooling heat radiator according to claim 1, it is characterised in thatThe diversion component has the first height relative to the mainboard surface；The surface of second thermal component has the second height with mainboard surface；Wherein, second height is not less than the described first height.
- 7. immersion liquid-cooling heat radiator according to claim 1, it is characterised in that the diversion component is kuppe.
- 8. immersion liquid-cooling heat radiator according to claim 1, it is characterised in thatFirst heater members are central processor CPU or graphics processor GPU；AndSecond heater members are CPU or GPU.
- A kind of 9. immersion liquid-cooling heat radiation method, it is characterised in that including：First thermal component is wrapped up into the first heater members on mainboard, and the second thermal component is wrapped up to the on the mainboard Two heater members, wherein first thermal component and second thermal component are transpiration-cooled thermal component, and institute State the top that the second thermal component is located at first thermal component；AndWater conservancy diversion is carried out to bubble stream caused by the first thermal component, its bubble stream caused by with the second thermal component is not converged Close.
- 10. immersion liquid-cooling heat radiation method according to claim 9, it is characterised in that also include：The surface on surface and the second thermal component to the first thermal component is sintered reinforcing boiling processing to form sintered copper Particle surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711396976.5A CN107894823A (en) | 2017-12-21 | 2017-12-21 | Immersion liquid-cooling heat radiator and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711396976.5A CN107894823A (en) | 2017-12-21 | 2017-12-21 | Immersion liquid-cooling heat radiator and method |
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| Publication Number | Publication Date |
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| CN107894823A true CN107894823A (en) | 2018-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711396976.5A Pending CN107894823A (en) | 2017-12-21 | 2017-12-21 | Immersion liquid-cooling heat radiator and method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109372590A (en) * | 2018-08-17 | 2019-02-22 | 曙光信息产业(北京)有限公司 | Dissipated heat recovery device and method |
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3406244A (en) * | 1966-06-07 | 1968-10-15 | Ibm | Multi-liquid heat transfer |
| US20140218859A1 (en) * | 2013-02-01 | 2014-08-07 | Dell Products L.P. | System for Cooling Hard Disk Drives Using Vapor Momentum Driven By Boiling of Dielectric Liquid |
| US20140218861A1 (en) * | 2013-02-01 | 2014-08-07 | Dell Products L.P. | Vertically-Oriented Immersion Server with Vapor Bubble Deflector |
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| CN106455446A (en) * | 2016-10-28 | 2017-02-22 | 曙光信息产业(北京)有限公司 | Heating element cooling device and manufacturing method thereof |
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| CN109372590A (en) * | 2018-08-17 | 2019-02-22 | 曙光信息产业(北京)有限公司 | Dissipated heat recovery device and method |
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Application publication date: 20180410 |