CN105071011B - A kind of coldplate for active phase array antenna - Google Patents
A kind of coldplate for active phase array antenna Download PDFInfo
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- CN105071011B CN105071011B CN201510589070.XA CN201510589070A CN105071011B CN 105071011 B CN105071011 B CN 105071011B CN 201510589070 A CN201510589070 A CN 201510589070A CN 105071011 B CN105071011 B CN 105071011B
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- coldplate
- runner
- array antenna
- slot
- active phase
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Abstract
The present invention relates to a kind of Connectors for Active Phased Array Radar apparatus field, more particularly to a kind of coldplate for active phase array antenna.And, the more than one slot being arranged on coldplate body surface, the slot is used for grafting heat transfer unit (HTU) including, coldplate body；At least two through holes are additionally provided with the coldplate body, the through hole is used for the passage as KK connectors；The coldplate body interior is provided with a runner at the same time, and the runner includes runner body, and the runner body is located at coldplate body interior and by all slots around surrounding, for the heat transfer unit (HTU) cooling to be plugged in the slot.Radiated provided by the present invention for the coldplate of active phase array antenna by setting around the runner for being plugged with heat transfer unit (HTU) to T/R modules, due to the presence of runner, the heat dissipation of the various ways increase coldplate such as the optional liquid phase of the present invention, gas phase or filling phase-change material, so as to improve the service life of active phase array antenna.
Description
Technical field
It is more particularly to a kind of for active phase array antenna the present invention relates to a kind of Connectors for Active Phased Array Radar apparatus field
Coldplate.
Background technology
Substantial amounts of closeness very high T/R modules are installed, since T/R modules include in Connectors for Active Phased Array Radar antenna
Miniature microwave integrated circuit, therefore it can produce substantial amounts of heat at work so that module self-temperature drastically increases, and
Excessive temperature can undoubtedly influence the performance and service life of Phased Array Radar Antenna in itself, and therefore, heat dissipation design is active
Seem in phased array antenna and become more and more important.It is mostly at present to rely on coldplate sheet applied to the radiating mode on active phase array antenna
Body thermal capacitance ensures to radiate or simply use peripheral hardware formula radiating mode, such as the open air cooling system of use, but this heat dissipation side
The energy force difference of formula anti-adverse environment, it is impossible to the dust-proof of active phase array antenna, waterproof, salt spray proof are realized, in addition using outer facility
Radiating mode can increase equipment volume and quality, it is impossible to meet the trend of Connectors for Active Phased Array Radar volume reductionization, and rely on cold
But plate thermal capacitance itself ensures that the mode of heat dissipation cannot meet the radiating requirements that T/R modules increasingly increase again.
The content of the invention
It is an object of the invention to overcome in the prior art by coldplate thermal capacitance itself or using peripheral hardware formula heat dissipation side
Formula, it is impossible to the problem of meeting phased array antenna radiating requirements.Heat dissipation can be improved again by providing a kind of increase peripheral hardware formula device that is not required to
The coldplate for active phase array antenna of efficiency.In order to realize foregoing invention purpose, the present invention provides following technical side
Case：
A kind of coldplate for active phase array antenna, including coldplate body and, be arranged on coldplate this body surface
More than one slot on face, the slot are used for grafting heat transfer unit (HTU)（Such as temperature-uniforming plate）, the heat transfer unit (HTU) is used for will be with
The heat of its T/R module connected is conducted to the coldplate；At least two through holes, institute are additionally provided with the coldplate body
The both sides that through hole is arranged on slot are stated, for the passage as KK connectors；Meanwhile the coldplate body interior is provided with one
Runner, the runner include runner body, and the runner body, which is located at coldplate body interior and surround all slots, to be surrounded,
For the heat transfer unit (HTU) cooling to be plugged in the slot.
Further, phase-change material is filled with the runner body, the phase-change material is used to absorb heat.
In some embodiments, the runner body is arranged on the coldplate body interior to be completely enclosed.
In other embodiment, the runner includes flow channel entry point, the runner for being arranged at described this body side surface of coldplate
Outlet.
Further, phase-change material is filled with the runner body, the phase-change material is used to absorb heat；The stream
The runner exit in road and inlet are provided with the cover board of closed flow, compared with some embodiments, in actual use by coldplate
The empty dress of runner body way, filling phase-change material can greatly improve the heat dissipation of coldplate.Even, when the phase transformation of selection
When material heat radiator efficiency is much higher than coldplate bulk material, it can further increase the space of the runner body, make
The heat dissipation for obtaining coldplate further improves.
Further, the runner exit of the flow channel entry point of the runner and the runner is located at the coldplate body respectively
Not ipsilateral.
Preferably, the runner exit of the flow channel entry point of the runner and the runner is symmetrically positioned in the coldplate body
Not ipsilateral.
Preferably, one slot above is is arranged in parallel, while the through hole and the slot are arranged in parallel simultaneously
It is arranged at the slot both sides.
Compared with prior art, beneficial effects of the present invention：Provided by the present invention for the cooling of active phase array antenna
Plate radiates T/R modules around the runner for being plugged with heat transfer unit (HTU) by setting, since the presence of runner, the present invention are optional
Increase the heat dissipation of coldplate with various ways such as liquid phase, gas phase or filling phase-change materials, so as to improve active phased array day
The service life of line.
Brief description of the drawings：
Fig. 1 is schematic structural view of the invention.
Fig. 2 is 1 structural solid figure of the embodiment of the present invention（Cover plate）.
Fig. 3 is runner body shape schematic diagram of the present invention.
Fig. 4 is plate structure of cooling schematic diagram in embodiment 3（Without flow channel entry point, runner exit）.
Fig. 5 is the heat transfer unit (HTU) with T/R modules in the present invention and coldplate grafting schematic diagram.
Marked in figure：1- slots, 2- through holes, 3- runners, 31- runner bodies, 32- flow channel entry points, 33- runner exits, 4-
Coldplate body, 41- cover boards, 5- heat transfer unit (HTU)s, 6-T/R modules.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment the present invention is described in further detail.But this should not be interpreted as to this
The scope for inventing above-mentioned theme is only limitted to following embodiment, all to belong to the present invention based on the technology that present invention is realized
Scope.
Embodiment 1：As shown in Figure 1, Figure 2, Figure 5, the present embodiment provides a kind of coldplate for active phase array antenna,
It is used for including coldplate body 4 and the more than one slot 1 being arranged on 4 surface of coldplate body, the slot 1
Grafting heat transfer unit (HTU), in some embodiments, the heat transfer unit (HTU) uses temperature-uniforming plate, and described temperature-uniforming plate one end and the slot 1 are tight
Close grafting, the other end are fitted closely with T/R moulds heating part in the block, it is used to pass the heat of connected T/R modules
It is directed at the coldplate；As shown in Figure 1,8 slots are provided with 4 surface of coldplate body described in the present embodiment.
The coldplate body 4 is additionally provided with least two through holes 2, and the through hole 2 is arranged on the both sides of slot 1, is used for
Passage as KK connectors；The quantity of the through hole 2 is set according to the needs with the corresponding T/R modules of corresponding slot 1.
Meanwhile a runner 3 is additionally provided with inside the coldplate body 4, as shown in Fig. 2, the runner 3（Dotted line in Fig. 3
Part）Including the runner body 31 being arranged inside the coldplate body 4, the runner body 31 and the coldplate body
4 upper and lower surface is parallel, and by all slots 1 around surrounding, it is used for the temperature-uniforming plate cooling to be plugged in the slot 1.
In this implementation, the runner 3, which further includes, to be arranged at flow channel entry point 32, the runner of 4 side of coldplate body and goes out
Mouth 33, can cause user to use liquid phase or vapor mode to cool down for coldplate, liquid phase or gas phase cooling method refer to pass through institute
It is logical to the runner body 31 conveying cooling liquid or gas, the cooling liquid or gas from runner body 31 to state flow channel entry point 32
The heat of the out-of-date temperature-uniforming plate by slot is taken away, and is flowed out from runner exit 33；Generally, equipped with the active of coldplate of the present invention
Phased array antenna is cooled down in test using the above method.And formal in use, liquid phase or gas phase cooling method can be selected,
Also it can use filling phase-change material in runner body 31, and will closing stream be set at the runner exit 33 and flow channel entry point 32
The cover board 41 in road, makes the phase-change material be used for the heat for absorbing the temperature-uniforming plate, covert using being filled in runner body 31
The method of material can cause the cooling procedure of coldplate to completely disengage peripheral apparatus；And include the coldplate phase of phase-change material
Coldplate compared with material without phase-change can greatly improve cooling capacity.
Further, one slot 1 above is is arranged in parallel, while the through hole 2 and the slot parallel
Arrange and be arranged at 1 both sides of slot for the passage as KK connectors.
In the present embodiment, the flow channel entry point 32 and the runner exit 33 are symmetrically positioned in the coldplate body 4 not
Ipsilateral.
On the surface of the coldplate body 4, the fixed heat transfer dress is separately provided at the both ends of the slot 1
The screw hole put.
Embodiment 2：In the present embodiment, it is with 1 difference of embodiment, the flow channel entry point 32 and the runner exit 33
Positioned at the same side of the coldplate body 4.
Embodiment 3：As shown in figure 4, in the present embodiment, it is with 1 difference of embodiment, the runner 3 is not provided with flowing
Road entrance 32 or runner exit 33, it is only to be arranged at runner body 31 inside the coldplate body 4, itself and the cooling
The upper and lower surface of plate is parallel, and by all slots 1 around surrounding, so as to be the temperature-uniforming plate cooling being plugged in the slot 1.
In the present embodiment, the phase-change material in runner body 31 is directly encapsulated in coldplate by the coldplate when making
It is when either testing or formal in use, adding the phase in runner 3 in itself using coldplate in the runner 3 set in body 4
The thermal capacitance for becoming material cools down T/R modules, and without using peripheral hardware heat sink convection current in test as in Example 1
Road body carries out liquid phase or gas phase cooling..
In all of above embodiment, 2 position of through hole is overlapped with the runner body 3 without any.
Claims (8)
1. a kind of coldplate for active phase array antenna, it is characterised in that and, be arranged on cold including, coldplate body
But the more than one slot on plate body surface, the slot are used for grafting heat transfer unit (HTU), and the heat transfer unit (HTU) is used for will be with
The heat of its T/R module connected is conducted to the coldplate；At least two through holes, institute are additionally provided with the coldplate body
The both sides that through hole is arranged on slot are stated, for the passage as KK connectors；Meanwhile the coldplate body interior is provided with one
Runner, the runner include runner body, and the runner body, which is located at coldplate body interior and surround all slots, to be surrounded,
For the heat transfer unit (HTU) cooling to be plugged in the slot.
2. it is used for the coldplate of active phase array antenna as claimed in claim 1, it is characterised in that filled out in the runner body
Filled with phase-change material, the phase-change material is used to absorb heat.
3. it is used for the coldplate of active phase array antenna as claimed in claim 2, it is characterised in that the runner body has been
It is totally-enclosed to be arranged at the coldplate body interior.
4. it is used for the coldplate of active phase array antenna as claimed in claim 1, it is characterised in that the runner includes setting
In the flow channel entry point, runner exit of described this body side surface of coldplate.
5. it is used for the coldplate of active phase array antenna as claimed in claim 4, it is characterised in that filled out in the runner body
Filled with phase-change material, the phase-change material is used to absorb heat；The runner exit and flow passage entry are provided with closed flow
Cover board.
6. it is used for the coldplate of active phase array antenna as described in claim 4 or 5, it is characterised in that the stream of the runner
The runner exit of road entrance and the runner is located at the not ipsilateral of the coldplate body respectively.
7. it is used for the coldplate of active phase array antenna as claimed in claim 6, it is characterised in that the runner of the runner enters
The runner exit of mouth and the runner is symmetrically positioned in the not ipsilateral of the coldplate body.
8. it is used for the coldplate of active phase array antenna as claimed in claim 1, it is characterised in that inserting more than one
Groove is is arranged in parallel, while the through hole is arranged in parallel with the slot and is arranged at the slot both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510589070.XA CN105071011B (en) | 2015-09-16 | 2015-09-16 | A kind of coldplate for active phase array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510589070.XA CN105071011B (en) | 2015-09-16 | 2015-09-16 | A kind of coldplate for active phase array antenna |
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| CN105071011A CN105071011A (en) | 2015-11-18 |
| CN105071011B true CN105071011B (en) | 2018-05-08 |
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| CN201510589070.XA Active CN105071011B (en) | 2015-09-16 | 2015-09-16 | A kind of coldplate for active phase array antenna |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106785694A (en) * | 2016-11-22 | 2017-05-31 | 上海无线电设备研究所 | A kind of high-power high density high-frequency transmission structure of integrated form |
| CN109687089B (en) * | 2018-11-06 | 2021-08-27 | 湖北三江航天险峰电子信息有限公司 | High-efficient compound thermal control device |
| CN109786924B (en) * | 2019-03-05 | 2021-11-16 | 成都雷电微力科技股份有限公司 | Self-heat-dissipation TR module and phased array antenna adopting same |
| US11539109B2 (en) * | 2020-03-26 | 2022-12-27 | Hamilton Sundstrand Corporation | Heat exchanger rib for multi-function aperture |
| CN112201918A (en) * | 2020-11-10 | 2021-01-08 | 中国电子科技集团公司第二十研究所 | Liquid cooling plate for active phased array radar antenna array surface |
| CN112635952B (en) * | 2020-12-25 | 2023-01-06 | 北京华航无线电测量研究所 | Liquid-cooled phased array antenna and cooling method thereof |
| CN114325590B (en) * | 2021-12-27 | 2023-05-30 | 北京微焓科技有限公司 | Phased array radar cold plate and phased array radar |
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Address after: 610041 Shiyang Industrial Park, No.288, Yixin Avenue, hi tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu lightning Micro Power Technology Co., Ltd Address before: 610041 Shiyang Industrial Park, hi tech Zone, Chengdu, Sichuan Patentee before: RML TECHNOLOGY Co.,Ltd. |
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