CN104754921A - Microchannel radiator with uniform heat source surface temperature - Google Patents
Microchannel radiator with uniform heat source surface temperature Download PDFInfo
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- CN104754921A CN104754921A CN201510101132.8A CN201510101132A CN104754921A CN 104754921 A CN104754921 A CN 104754921A CN 201510101132 A CN201510101132 A CN 201510101132A CN 104754921 A CN104754921 A CN 104754921A
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- major trough
- thermal source
- heat sink
- surface temperature
- cover plate
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Abstract
The invention discloses a microchannel radiator with a uniform heat source surface temperature, which is mainly used for solving the problem that the heat source surface temperature of an existing microchannel radiator is not uniform. The microchannel radiator comprises a substrate (1) and a cover plate (2), wherein a runner structure (3) consisting of an inlet primary slot (31), an outlet primary slot (32) and a parallel channel (31) is arranged in the substrate (1); the outlet primary slot (32) and the inlet primary slot (31) are rectangular structures; the depth and the length of the inlet primary slot (31) are the same as those of the outlet primary slot (32), and the width is in the form of steps which are gradually reduced; the parallel channel (33) consists of a plurality of parallel rectangular channels; each rectangular channel is in the form of a right trapezoid which is gradually reduced in depth along the section in the liquid flowing direction; the cover plate (1) is fixed on the base plate (2), so that a sealed channel is formed in the runner structure (3). According to the microchannel radiator, the temperature uniformity of the whole heat source surface is improved, and the performances of the electronic product are ensured.
Description
Technical field
The invention belongs to microchannel technical field of heat dissipation, be specifically related to a kind of microchannel heat sink, can be used for the uniformity improving microchannel heat sink thermal source surface temperature in microelectronic product.
Background technology
At present, along with the integrated level of electronic product is more and more higher, the radiating effect of electronic product is had higher requirement.Radiating effect, except will ensureing that the temperature of electronic product is lower, also needs to reduce the temperature difference between each device of electronic product.Microchannel is embedded in electronic product, microchannel heat sink can be formed, this radiator has good heat-sinking capability, but there is the problem that temperature distributing disproportionation is even, as Xu Shanglong etc. was published in 2011 the parallel microchannels radiator mentioned in the document " chip cooling technique microchannel radiator structure thermal-fluid coupled field numerically modeling " of China Mechanical Engineering, as Fig. 1, its flow passage structure is made up of two major troughs and row's straight parallel passage, the coolant rate that cooling fluid distributes to each passage from entrance major trough is unequal, cause the flow velocity in passage unequal, thus make microchannel heat sink thermal source surface temperature skewness, this will directly affect the performance of electronic product, the stability of work and useful life, especially in high power electronic product, this problem is more outstanding, need solution badly.
Summary of the invention
The object of the invention is to the deficiency for above-mentioned prior art, propose the uniform microchannel heat sink structure of a kind of thermal source surface temperature, to improve the uniformity of thermal source surface temperature distribution, and then ensure the performance of electronic product, the stability of work and useful life.
In order to realize above-mentioned target, the uniform microchannel heat sink of thermal source surface temperature of the present invention is primarily of substrate and cover plate composition, and be provided with flow passage structure in substrate, flow passage structure comprises entrance major trough, outlet major trough and parallel channels, this outlet major trough and entrance major trough all adopt rectangular structure; Cover plate is loaded with thermal source, and the heat distribution that thermal source produces on the cover board, is lowered the temperature by the liquid circulation flowing in substrate inner flow passage structure, be it is characterized in that:
The degree of depth, the length of the degree of depth of entrance major trough, length and outlet major trough are identical, and width is successively decrease step by step stepped;
Parallel channels is made up of several rectangular channels arranged in parallel, and each rectangular channel is the right-angled trapezium shape that the degree of depth reduces gradually along the cross section of liquid flow direction.
As preferably, described substrate and cover plate are rectangle plate body, and cover plate is fixed on substrate, make flow passage structure between substrate and cover plate, form airtight passage.
As preferably, the two ends of described parallel channels respectively with entrance major trough with export major trough and be connected, and coolant flow direction in parallel channels is vertical with the length direction exporting major trough with entrance major trough.
As preferably, described entrance major trough step number is identical with the number of parallel channels.
Tool of the present invention has the following advantages:
1. the present invention is owing to by the width design of entrance major trough being successively decrease step by step stepped, entrance major trough can be made to shunt to the flow of each passage equal, ensures thermal source face homogeneous temperature on the length direction of outlet major trough;
2. the present invention is the right-angled trapezium shape that the degree of depth reduces gradually owing to being designed to along the cross section of liquid flow direction by each rectangular channel of parallel channels, makes homogeneous temperature in the coolant flow direction of thermal source face in parallel channels;
3. the present invention compares existing parallel microchannels radiator, identical at microchannel heat sink material, loads thermal source density of heat flow rate identical, when the kind of entrance major trough cooling fluid is identical with flow, improves the uniformity of whole thermal source surface temperature.
Accompanying drawing explanation
Fig. 1 is existing microchannel heat sink structure chart;
Fig. 2 is existing microchannel heat sink thermal source surface temperature cloud atlas;
Fig. 3 is microchannel heat sink structure chart of the present invention;
Fig. 4 entrance major trough of the present invention is perpendicular to the sectional view on entrance major trough depth direction;
Fig. 5 is the Optimizing Flow figure of entrance major trough stairstepping size of the present invention;
Fig. 6 parallel channels of the present invention is along the sectional view of liquid flow direction;
Fig. 7 microchannel heat sink structure of the present invention thermal source surface temperature cloud atlas.
Embodiment
With reference to Fig. 1, existing microchannel heat sink structure, comprises substrate 1 and cover plate 2, and substrate 1 and cover plate 2 are rectangle plate body, are made up of LTCC LTCC material, and cover plate 2 is fixing on substrate 1, forms airtight flow passage structure 3 between substrate 1 and cover plate 2; Flow passage structure 3 comprises entrance major trough 31, and outlet major trough 32 and parallel channels 33, parallel channels 33 is made up of arranged in parallel 8 rectangular channels.Each rectangular channel size identical, the length that Fig. 1 example gets each rectangular channel is 40.5mm, and width is 1mm, and the degree of depth is 0.6mm.Parallel channels 33 two ends respectively with entrance major trough 31 with export major trough 32 and be connected, and coolant flow direction in parallel channels 33 is vertical with the length direction exporting major trough 32 with entrance major trough 31.Entrance major trough 31 and outlet major trough 32 all adopt rectangular structure, and both are measure-alike, and the cuboid length of Fig. 1 example is 42mm, and width is 2.2mm, and the degree of depth is 0.6mm.Described entrance major trough 31, outlet major trough 32 and parallel channels 33 pipe are built with deionized water cooling fluid, according to the restriction of the maximum temperature that electronic product can bear, the too small meeting of flow causes thermal source surface temperature too high, affect the normal work of electronic product, this example gets the flow 0.5L/min of cooling fluid, water temperature 20 DEG C; Cover plate 2 is loaded with 62 thermals source 21, according to the power of current electronic product, the density of heat flow rate of Fig. 1 example thermal source is 56.25W/cm
2, the heat that thermal source 21 produces is distributed on cover plate 2, is lowered the temperature by the liquid circulation flowing in substrate 1 inner flow passage structure 3.
The thermal source surface temperature cloud atlas of this microchannel heat sink as shown in Figure 2.
Can be obtained by Fig. 2, temperature on No. 2 passages from bottom to top and No. 3 passages is the highest, particularly be partial to passage rear, and the temperature of No. 1 passage and No. 8 passages is minimum, temperature contrast is obvious, and source center position, 62, face, heat-obtaining source obtains existing microchannel heat sink structure thermal source surface temperature standard deviation sigma
1as follows:
for the mean temperature in existing microchannel heat sink structure thermal source face, y
ifor the temperature i=1 of corresponding i-th source center position, 2..., 62.Calculate:
σ
1=4.6420K.
In order to reduce existing microchannel heat sink structure thermal source surface temperature standard deviation sigma
1, technology crux of the present invention improves the entrance major trough structure of existing microchannel heat sink and the structure of parallel channels, to reduce thermal source surface temperature standard deviation.
With reference to Fig. 3, microchannel heat sink primary structure of the present invention is identical with the existing microchannel heat sink described in Fig. 1, its difference is: parallel channels 33 is made up of arranged in parallel 8 rectangular channels, each rectangular channel is the right-angled trapezium shape that the degree of depth reduces gradually along the cross section of liquid flow direction, its size is identical, and it is 40.5mm that this example gets each rectangular channel length, and width is 1mm, entry depth is 0.6mm, and the outlet degree of depth is 0.4mm; Taking mouth major trough 31 and outlet major trough 32 degree of depth are 0.6mm, and length is 42mm, and the width of outlet major trough 32 is 2.2mm, and the width of entrance major trough 31 is successively decrease step by step stepped, and step number is identical with the number of parallel channels 33;
With reference to Fig. 4, described entrance major trough 31, its cross sectional shape perpendicular to depth direction is stepped, the principle identical with ladder quantity according to the parallel access volume of microchannel heat sink, the parallel channels of this example is set to 8 passages, but is not limited to 8, so entrance major trough has 8 ladders, each ladder has different width, and namely the width of the first ladder is x
1, the width of the second ladder is x
2, the width of the 3rd ladder is x
3, the width of four-step is x
4, the width of the 5th ladder is x
5, the width of the 6th ladder is x
6, the width of the 7th ladder is x
7, the width of the 8th ladder is x
8, the width of these 8 ladders is different, and directly affects the cooling liquid speed in corresponding parallel channels 33.
For making the cooling liquid speed in 8 described parallel channels consistent, improving thermal source surface temperature uniformity, needing the width x to these 8 ladders
1, x
2, x
3, x
4, x
5, x
6, x
7, x
8be optimized.Its prioritization scheme is as follows:
(1) the mean flow rate v in single parallel channels is tried to achieve
m:
v
m＝Q/(8*a*b)，
Wherein, Q is the total flow entering entrance major trough, and Q=0.5L/min, a are that single parallel channels is wide, and a=1mm, b are the single parallel channels degree of depth, b=0.6mm; By Q, a, b, the formula brought into above obtains v
m=1.741335m/s;
(2) the cooling liquid speed v in i-th parallel channels is calculated
i, i=1,2,3,4,5,6,7,8:
v
i＝f
i(x
1,x
2,x
3,x
4,x
5,x
6,x
7,x
8)，
F
ifor v
iwith the width x of 8 ladders
1, x
2, x
3, x
4, x
5, x
6, x
7, x
8relation
(3) the variance D (v) calculating cooling liquid speed in 8 parallel channels is:
The calculating of D (v) is to 8 ladder width value x by existing software
1, x
2, x
3, x
4, x
5, x
6, x
7, x
8repeatedly optimize and carry out, identical with cooling liquid speed in 8 parallel channels ensureing its correspondence.
With reference to Fig. 5, as follows to the width Optimizing Flow of 8 ladders:
(3.1) call 3 d modeling software Pro/Engineer by Optimization Software Isight integrated platform, grid division software I CEMCFD, flow analysis numerical simulation software Ansyscfx, and utilize the foundation of Pro/Engineer software about the width x of 8 ladders
1, x
2, x
3, x
4, x
5, x
6, x
7, x
8microchannel heat sink model; ICEMCFD software is utilized to carry out stress and strain model to microchannel heat sink model;
(3.2) Ansyscfx software is utilized to solve cooling liquid speed v in each parallel channels of microchannel heat sink model
iand the variance D (v) of flow velocity:
(3.2a) under initial situation, the width value of 8 ladders is made to be 2.2mm, microchannel heat sink model under utilizing Pro/Engineer software to set up this initial situation, utilizes microchannel heat sink Model Transfer that Pro/Engineer software is set up by Isight software to ICEMCFD software;
(3.2b) utilize ICEMCFD software to carry out stress and strain model to the microchannel heat sink model that Pro/Engineer software in (3.2a) is set up, and the destination file obtained is passed to Ansyscfx software by Isight software;
(3.2c) Ansyscfx software is utilized to solve cooling liquid speed in each parallel channels of (3.2b) microchannel heat sink model, then calculate cooling liquid speed variance D (v) in parallel channels by Ansyscfx software, obtain D (v)=0.5105 under initial condition;
(3.2d) to 8 ladder width x of the microchannel heat sink model set up in Pro/Engineer software
1, x
2, x
3, x
4, x
5, x
6, x
7, x
8value again, then repeat (3.2a) to (3.2c), the value of D (v) is reduced, until the width of obtain when D (v) converges on 0.007 8 ladders is the parameter that final optimization pass is determined, i.e. x
1=0.1mm, x
2=2.5mm, x
3=2.2mm, x
4=2.0mm, x
5=1.5mm, x
6=1.4mm, x
7=0.65mm, x
8=0.5mm.
By the entrance major trough of microchannel heat sink in the direction of the width according to above-mentioned be designed and sized to stepped, on the basis of this structure, being designed to by parallel channels along the cross section of liquid flow direction is the right-angled trapezium shape that the degree of depth reduces gradually, and as shown in Figure 6, the entry depth of parallel channels is h
1, h
1=0.6mm, the outlet degree of depth is h
2, h
2=0.4mm.
Hot simulation analysis is carried out to microchannel heat sink under this configuration, calculates microchannel heat sink thermal source surface temperature standard deviation:
Wherein, y
ifor the temperature of corresponding i-th source center position, i=1,2...62;
for thermal source face mean temperature under this microchannel heat sink structure,
By y
i,
bring formula into and obtain standard deviation formula, obtain σ
3=0.8847K.Compare the thermal source surface temperature standard deviation sigma of existing microchannel heat sink
1=4.6420K, microchannel heat sink thermal source face of the present invention standard deviation reduces 4 times, thermal source surface temperature uniformity obtains good improvement, as shown in Figure 7, in Fig. 7, the color in thermal source face is red and yellow, temperature scale can be found out the red and yellow temperature close represented on the left of Fig. 7, thermal source surface temperature distributes very evenly.
In sum, the width design of the entrance major trough of microchannel heat sink is successively decrease step by step stepped by the present invention, being designed to by each rectangular channel of microchannel heat sink parallel channels along the cross section of liquid flow direction is the right-angled trapezium shape that the degree of depth reduces gradually, compared to existing microchannel heat sink structure, microchannel heat sink thermal source surface temperature distribution of the present invention is more even, ensures the performance of electronic product, the stability of work and useful life.
Claims (4)
1. the uniform microchannel heat sink of thermal source surface temperature, primarily of substrate (1) and cover plate (2) composition, flow passage structure (3) is provided with in substrate (1), flow passage structure (3) comprises entrance major trough (31), outlet major trough (32) and parallel channels (33), this outlet major trough (32) and entrance major trough (31) all adopt rectangular structure; Cover plate is loaded with thermal source (21), the heat that thermal source (21) produces is distributed on cover plate (2), lowered the temperature by the liquid circulation flowing in substrate (1) inner flow passage structure (3), it is characterized in that:
The degree of depth, the length of the degree of depth of entrance major trough (31), length and outlet major trough (32) are identical, and width is successively decrease step by step stepped;
Parallel channels (33) is made up of several rectangular channels arranged in parallel, and each rectangular channel is the right-angled trapezium shape that the degree of depth reduces gradually along the cross section of liquid flow direction.
2. the uniform microchannel heat sink of thermal source surface temperature according to claim 1, it is characterized in that: substrate (1) and cover plate (2) are rectangle plate body, cover plate (1) is fixed on substrate (2), makes flow passage structure (3) form airtight passage between substrate (1) and cover plate (2).
3. the uniform microchannel heat sink of thermal source surface temperature according to claim 1, it is characterized in that: the two ends of parallel channels (33) respectively with entrance major trough (31) with export major trough (32) and be connected, and coolant flow direction in parallel channels (33) is vertical with the length direction exporting major trough (32) with entrance major trough (31).
4. the uniform microchannel heat sink of thermal source surface temperature according to claim 1, is characterized in that: entrance major trough (31) step number is identical with the number of parallel channels (33).
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Cited By (3)
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| CN105071011A (en) * | 2015-09-16 | 2015-11-18 | 成都雷电微力科技有限公司 | Cooling plate used for active phased array antenna |
| CN111295078A (en) * | 2019-12-20 | 2020-06-16 | 杭州中豪电动科技有限公司 | Motor control system cooling water route reposition of redundant personnel structure |
| CN114449863A (en) * | 2022-02-15 | 2022-05-06 | 珠海格力电器股份有限公司 | Substrate directional heat conduction radiator based on heat source |
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| CN114449863A (en) * | 2022-02-15 | 2022-05-06 | 珠海格力电器股份有限公司 | Substrate directional heat conduction radiator based on heat source |
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