CN106785694A - A kind of high-power high density high-frequency transmission structure of integrated form - Google Patents
A kind of high-power high density high-frequency transmission structure of integrated form Download PDFInfo
- Publication number
- CN106785694A CN106785694A CN201611031146.8A CN201611031146A CN106785694A CN 106785694 A CN106785694 A CN 106785694A CN 201611031146 A CN201611031146 A CN 201611031146A CN 106785694 A CN106785694 A CN 106785694A
- Authority
- CN
- China
- Prior art keywords
- module
- cold plate
- integrated form
- frequency transmission
- transmission structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/70—Insulation of connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
Abstract
The present invention discloses a kind of high-power high density high-frequency transmission structure of integrated form, and the structure is included:T/R module and Anneta module;Cold plate module, it is fixedly connected between T/R module and Anneta module, and the runner of transmission coolant is provided with cold plate module;Hair button, its distribution is arranged in cold plate module, and communication connection respectively transmits the high-frequency signal between T/R module and Anneta module positioned at the T/R module and Anneta module of cold plate module both sides.The present invention realizes a kind of high-power high density high-frequency transmission scheme of integrated form, has the advantages that compact conformation, lightweight, small volume, loss are small.
Description
Technical field
The present invention relates to high-frequency transmission technology, and in particular to the high-power high density high-frequency transmission structure of integrated form.
Background technology
With extensive use of the high-power gallium nitride chip in T/R module, the reliability of T/R module is realized in the confined space
Radiating, effective transmission of high-frequency signal turn into study hotspot.
The high-density arrangement of T/R module, heat flow density is big, commonly uses liquid cooling plate radiating.The transmission of T/R module high-frequency signal is conventional
SMP or SSMP series, the series connector has that small volume, lightweight, frequency of use are high, vibration resistance is strong, working frequency is wide, permits
Perhaps there is certain amount of mismatch on axially and radially.
Hair button is a kind of new interconnected method.Hair button is formed by weaving according to a certain method by gold-plated elastic metallic yarn,
Can be with axially compressed, there is certain outside elastic force at two ends after compression.Hair button can both transmit high-frequency signal, low frequency signal,
High speed signal and high current, are that intermodule vertically interconnects preferable scheme.Compared to SMP or SSMP series, hair button has volume
Smaller, weight is lighter.Meanwhile, hair button has interconnection convenient, using flexible distinguishing feature.
The content of the invention
The present invention provides a kind of high-power high density high-frequency transmission structure of integrated form, compact conformation, lightweight, small volume,
Loss is small.
To achieve the above object, the invention discloses a kind of high-power high density high-frequency transmission structure of integrated form, its feature
It is that the structure is included:
T/R module and Anneta module;
Cold plate module, it is fixedly connected between T/R module and Anneta module, and the runner of transmission coolant is provided with cold plate module;
Hair button, its distribution is arranged in cold plate module, respectively T/R module and antenna of the communication connection positioned at cold plate module both sides
Module, the high-frequency signal between transmission T/R module and Anneta module.
Above-mentioned runner two ends are provided with coolant inlet and cooling liquid outlet, path and the hair button interval setting of runner.
Above-mentioned hair button is arranged in cold plate module in the matrix form, forms hair button matrix.
Above-mentioned runner is set to S types, and the interval of the path of runner between each row or column of hair button matrix extends, mistake
The interval for being bent during last mao of button that each row or column is extended to and being entered between next line or row.
The section of above-mentioned runner is set to rectangle.
Above-mentioned hair button and its inner wire run through cold plate module, by cold plate module connection T/R module the electrical UNICOM of one side extremely
Cold plate module connects the one side of Anneta module.
Above-mentioned hair button has dielectric except the portion envelops being electrically connected with addition to the end of Anneta module and T/R module, insulate
Medium electrically isolates cold plate module with hair button.
Above-mentioned T/R module and Anneta module near and fixed with cold plate module, hair button is axially compressed to original volume
15% to 30%.
Above-mentioned cold plate module is close to T/R module.
Compared to the prior art a kind of high-power high density high-frequency transmission structure of integrated form of the present invention, the advantage is that, this
A kind of high-power high density high-frequency transmission scheme of integrated form is realized in invention, is damaged with compact conformation, lightweight, small volume, transmission
The small advantage of consumption.
Brief description of the drawings
Fig. 1 is the side view of the T/R module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Fig. 2 is the top view of the T/R module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Fig. 3 is the upward view of the cold plate module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Fig. 4 is the side view of the cold plate module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Fig. 5 is the top view of the cold plate module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Fig. 6 is the sectional view of the cold plate module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Fig. 7 is the sectional view of the cold plate module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Fig. 8 is the side view of the Anneta module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Fig. 9 is the upward view of the Anneta module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Figure 10 is the side view of the Anneta module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Figure 11 is the installation diagram of the Anneta module of the high-power high density high-frequency transmission structure of integrated form of the present invention;
Figure 12 is the sectional view in A-A faces in Figure 11.
Specific embodiment
Below in conjunction with accompanying drawing, specific embodiment of the invention is further illustrated.
The invention discloses a kind of high-power high density high-frequency transmission structure of integrated form, comprising T/R module, Anneta module, cold
Plate module and hair button.
Such as Fig. 1 is simultaneously combined shown in Fig. 2, is a kind of embodiment of T/R module 110, and the top of T/R module 110 is provided with two first
Positioning screw 111 and four the first screw fastening tieholens 112.Two the first Positioning screws 111 are respectively close to the top of T/R module 110 two
A pair diagonal positions in diagonal are set, this two apertures of the first Positioning screw 111 are different, for when mounted first by TR
Module 110 is positioned with cold plate module.Four the first screw fastening tieholens 112 are respectively symmetrically near four tops at the top of T/R module 110
Angle Position is set, and screw is set so that T/R module 110 is connected with cold plate module locking for going here and there.
Such as Fig. 3 is simultaneously combined shown in Fig. 4, Fig. 5, is the embodiment of a kind of cold plate module 210 and hair button 220, cold plate module
210 is rectangular plate-like structure, is arranged between T/R module and Anneta module.
Cold plate module 210 towards T/R module or Anneta module simultaneously, be provided near a pair of respective point midways of opposite side
The coolant inlet 211 and cooling liquid outlet 212 connected by the inside fluid path of cold plate module 210.
Cold plate module 210 towards T/R module simultaneously, near this pair where coolant inlet 211 and cooling liquid outlet 212
The position of opposite side is provided with a pair first alignment pin nail 213, the set location and T/R module of the first alignment pin of this pair nail 213
110 a pair first Positioning screws 111 are correspondingly arranged, and two apertures of the first alignment pin nail 213 are different, for aperture not
The same Corresponding matching of the first Positioning screw 111, when realizing that cold plate module 210 is installed with T/R module 110, the first Positioning screw 111
String is set into the first alignment pin nail 213 respectively, makes first to complete positioning before cold plate module 210 is fixed with the installation of T/R module 110.
Near it is another to opposite side at, be provided with some the second screw fastening tieholens through cold plate module 210 along opposite side respectively
215, each edge is correspondingly provided with four the second screw fastening tieholens 215 in the present embodiment, lock-screw is set for going here and there, with Anneta module
Locking connection.
Four the first screw fastening tieholens 112 1 with T/R module 110 are respectively equipped with four drift angles of cold plate module 210
One corresponding 3rd screw fastening tieholen 216, lock is set for the string in the first screw fastening tieholen 112 and the 3rd screw fastening tieholen 216
Tight screw, makes cold plate module 210 be connected with the locking of T/R module 110.
Cold plate module 210 towards Anneta module simultaneously, this pair of opposite side where water inlet 211 and delivery port 212
Position is provided with a pair second alignment pin nail 214, and two apertures of the second alignment pin nail 214 are different, for cold plate module 210 with
Anneta module is installed before fixing and first completes positioning.
Hair button 220 is arranged be arranged in cold plate module 210 in the matrix form, forms hair button matrix.In the present embodiment
64 hair buttons 220 are provided with altogether, and the hair button matrix of 8*8 is formed in cold plate module 210.Each mao of button 220 runs through cold drawing
Module 210, contact point 221 is formed in the top and bottom of cold plate module 210, for communicating to connect respectively positioned at 210 liang of cold plate module
The T/R module and Anneta module of side, the high-frequency signal between transmission T/R module and Anneta module.
As shown in fig. 6, being provided with transmission coolant in cold plate module 210(Such as water)Runner 217.The two ends of runner 217 set
There are coolant inlet 211 and cooling liquid outlet 212, path and the interval setting of hair button 220 of runner 217.
In the present embodiment, runner 217 is set to S types, between each row or column of the path of runner 217 along hair button matrix
Interval extend, bent during last mao of button 220 that excessively each row or column is extended to and enters next line or arrange between
Every extension.
As shown in fig. 7, the section of runner 217 is set to rectangle, side long and the hair button 220 of the square-section of runner 217
It is arranged in an axially parallel mode.
Hair button 220 and its inner wire 221 run through cold plate module 210, and the one side electricity of T/R module is connected by cold plate module 210
Property UNICOM to cold plate module 210 connect Anneta module one side.
Hair button 220 has dielectric 230 except the portion envelops being electrically connected with addition to the end of Anneta module and T/R module, absolutely
Edge medium 230 electrically isolates cold plate module 210 with hair button 220.
As shown in Fig. 8 and set Fig. 9, Anneta module 310 is rectangular plate-like structure, and its four drift angle is provided with breach, for keeping away
Open the 3rd screw fastening tieholen 216 of cold plate module 210.
At a pair of opposite side of Anneta module 310, each pair opposite side corresponds to the second screw fastening tieholen 215 of cold plate module,
One-to-one corresponding is provided with four the 4th screw fastening tieholens 312, and the second screw fastening tieholen 215 sets with the string of the 4th screw fastening tieholen 312
Lock-screw, for Anneta module 310 to be connected with cold plate module locking.
Anneta module 310 towards cold plate module one side, corresponding to a pair second alignment pin nail 214 pairs of cold plate module
A pair second Positioning screws 311 should be provided with, for before Anneta module 310 is connected with cold plate module locking, spiral shell being positioned by second
The string of nail 311 is set into the second alignment pin nail 214, makes first to complete to be accurately positioned between Anneta module 310 and cold plate module.
As shown in Figure 10, it is a kind of embodiment of the high-power high density high-frequency transmission structure of integrated form disclosed by the invention,
The high-power high density high-frequency transmission structure of the integrated form is included and passes sequentially through T/R module 110 that lock-screw 400 is fixedly connected, cold
Plate module 210 and Anneta module 310.
Such as Figure 11 is simultaneously combined shown in Figure 12 and Figure 10, and cold plate module 210 is reference for installation, simultaneously installs Anneta module 310,
T/R module 110 is simultaneously installed.Locked by lock-screw respectively between Anneta module 310, cold plate module 210 and T/R module 110
Connection.
When this Anneta module 310, locking connection between cold plate module 210 and T/R module 110, the two ends of hair button 220 point
Do not contacted with Anneta module 310 and T/R module 110, and because Anneta module 310 and T/R module 110 are to the pressure of hair button 220,
Make mao button 220 axially compressed to the 15% to 30% of original volume, may be implemented in the reliability of high-frequency signal under complex vibration environment
Transmission.
Preferably, cold plate module 210 is close to T/R module 110, is capable of achieving the secure heat dissipation of T/R module 110, can extend TR moulds
The working time of block 110.
Although present disclosure is discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read the above, for of the invention
Various modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (9)
1. the high-power high density high-frequency transmission structure of a kind of integrated form, it is characterised in that the structure is included:
T/R module and Anneta module;
Cold plate module, it is fixedly connected between T/R module and Anneta module, and the runner of transmission coolant is provided with cold plate module;
Hair button, its distribution is arranged in cold plate module, respectively T/R module and antenna of the communication connection positioned at cold plate module both sides
Module, the high-frequency signal between transmission T/R module and Anneta module.
2. the high-power high density high-frequency transmission structure of integrated form as claimed in claim 1, it is characterised in that described runner two
End is provided with coolant inlet and cooling liquid outlet, path and the hair button interval setting of runner.
3. the high-power high density high-frequency transmission structure of integrated form as claimed in claim 1 or 2, it is characterised in that described hair
Button is arranged in cold plate module in the matrix form, forms hair button matrix.
4. the high-power high density high-frequency transmission structure of integrated form as claimed in claim 3, it is characterised in that described runner sets
It is S types, the interval of the path of runner between each row or column of hair button matrix extends, and excessively each row or column is extended to most
The interval for being bent during latter hair button and being entered between next line or row.
5. the high-power high density high-frequency transmission structure of integrated form as claimed in claim 1, it is characterised in that the runner cuts
Face is set to rectangle.
6. the high-power high density high-frequency transmission structure of integrated form as claimed in claim 1, it is characterised in that the hair button and
Its inner wire runs through cold plate module, and Anneta module is connected by the electrical UNICOM of one side to the cold plate module of cold plate module connection T/R module
One side.
7. the high-power high density high-frequency transmission structure of integrated form as claimed in claim 1, it is characterised in that the hair button is removed
The portion envelops being electrically connected with outside the end of Anneta module and T/R module have a dielectric, and dielectric is by cold plate module and hair knob
Button is electrically isolated.
8. the high-power high density high-frequency transmission structure of integrated form as claimed in claim 1, it is characterised in that the T/R module and
Anneta module is close to and is fixed with cold plate module, and hair button is axially compressed to the 15% to 30% of original volume.
9. the high-power high density high-frequency transmission structure of integrated form as claimed in claim 1, it is characterised in that the cold plate module
It is close to T/R module.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611031146.8A CN106785694A (en) | 2016-11-22 | 2016-11-22 | A kind of high-power high density high-frequency transmission structure of integrated form |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611031146.8A CN106785694A (en) | 2016-11-22 | 2016-11-22 | A kind of high-power high density high-frequency transmission structure of integrated form |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106785694A true CN106785694A (en) | 2017-05-31 |
Family
ID=58970966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201611031146.8A Pending CN106785694A (en) | 2016-11-22 | 2016-11-22 | A kind of high-power high density high-frequency transmission structure of integrated form |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106785694A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110518326A (en) * | 2019-09-23 | 2019-11-29 | 中国科学院微小卫星创新研究院 | A kind of spaceborne phased array and microchannel cold plates of integrated design |
CN111934078A (en) * | 2020-06-30 | 2020-11-13 | 中国人民解放军63921部队 | Temperature equalization control device for millimeter wave phased array antenna |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5327152A (en) * | 1991-10-25 | 1994-07-05 | Itt Corporation | Support apparatus for an active aperture radar antenna |
KR100987075B1 (en) * | 2009-09-17 | 2010-10-11 | 삼성탈레스 주식회사 | Radio frequency board assembly |
CN105071011A (en) * | 2015-09-16 | 2015-11-18 | 成都雷电微力科技有限公司 | Cooling plate used for active phased array antenna |
CN205429219U (en) * | 2015-11-03 | 2016-08-03 | 吕永锋 | Hair button inter -plate radio frequency connector |
CN105958214A (en) * | 2016-05-09 | 2016-09-21 | 中国电子科技集团公司第三十八研究所 | Extensible highly-integrated active phased array antenna |
-
2016
- 2016-11-22 CN CN201611031146.8A patent/CN106785694A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5327152A (en) * | 1991-10-25 | 1994-07-05 | Itt Corporation | Support apparatus for an active aperture radar antenna |
KR100987075B1 (en) * | 2009-09-17 | 2010-10-11 | 삼성탈레스 주식회사 | Radio frequency board assembly |
CN105071011A (en) * | 2015-09-16 | 2015-11-18 | 成都雷电微力科技有限公司 | Cooling plate used for active phased array antenna |
CN205429219U (en) * | 2015-11-03 | 2016-08-03 | 吕永锋 | Hair button inter -plate radio frequency connector |
CN105958214A (en) * | 2016-05-09 | 2016-09-21 | 中国电子科技集团公司第三十八研究所 | Extensible highly-integrated active phased array antenna |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110518326A (en) * | 2019-09-23 | 2019-11-29 | 中国科学院微小卫星创新研究院 | A kind of spaceborne phased array and microchannel cold plates of integrated design |
CN111934078A (en) * | 2020-06-30 | 2020-11-13 | 中国人民解放军63921部队 | Temperature equalization control device for millimeter wave phased array antenna |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9241428B1 (en) | Inverter assembly | |
CN101901638B (en) | Busbar assembly, vehicle inverter module and method for cooling the inverter module | |
CN108990368B (en) | Electric element cooling module | |
CN106785694A (en) | A kind of high-power high density high-frequency transmission structure of integrated form | |
KR20010052179A (en) | A cooling element for a power electronic device, and a power electronic device comprising same | |
EP2034521A3 (en) | Fluid cooled semiconductor power module having double-sided cooling | |
WO1986007193A1 (en) | Cooled stack of electrically isolated semiconductors | |
US11218080B2 (en) | Inverter AC bus bar assembly | |
CN106030896A (en) | Battery module | |
CN106783766A (en) | A kind of IGBT power modules of high integration | |
US10135355B2 (en) | Inverter DC bus bar assembly | |
CN206948169U (en) | A kind of frequency converter and its power cell | |
CN103489837A (en) | Thyristor | |
CN219456389U (en) | Temperature control device for chip high-low temperature test | |
CN108270054A (en) | C-band minimizes low-loss microwave hilted broadsword four-throw solid-state switch | |
CN206628462U (en) | Electric semiconductor cooling device | |
CN213519929U (en) | Novel cooling plate and device using same | |
CN107665007A (en) | Temperature control module, temperature conditioning unit and incubator | |
CN107946900A (en) | A kind of semiconductor laser module | |
CN209730003U (en) | Battery case | |
CN209045731U (en) | A kind of power synthesizer | |
CN106373716A (en) | Self-cooling transformer | |
CN206743196U (en) | One side quartz fin line double diode Terahertz balanced type secondary frequency multiplication circuit | |
JP2022526554A (en) | Cooling system | |
CN210665807U (en) | Test board for flip-chip bonding packaging process |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
|
RJ01 | Rejection of invention patent application after publication |