CN106163232A - A kind of radiator - Google Patents
A kind of radiator Download PDFInfo
- Publication number
- CN106163232A CN106163232A CN201610584526.8A CN201610584526A CN106163232A CN 106163232 A CN106163232 A CN 106163232A CN 201610584526 A CN201610584526 A CN 201610584526A CN 106163232 A CN106163232 A CN 106163232A
- Authority
- CN
- China
- Prior art keywords
- radiator
- media port
- dissipation channel
- heat dissipation
- radiating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
A kind of radiator disclosed in the embodiment of the present invention, including heat sink, enter media port and go out media port, wherein, the end face of described heat sink is provided with installing the installed surface treating radiating element, when described be arranged on described installed surface until radiating element time, described treat that radiating element and described heat sink form the heat dissipation channel closed, described in enter media port with described go out media port be connected with described heat dissipation channel.Owing to using the radiator in the embodiment of the present invention, treat that radiating element directly contacts with the heat eliminating medium in heat dissipation channel, and heat is directly passed to heat eliminating medium, therefore, it is possible to improve the radiating efficiency of radiator, and, use the radiator in the present invention, add and only need to process heat dissipation channel man-hour, enter media port and go out media port, compared with prior art significantly simplify the structure of radiator, reduce difficulty of processing.
Description
Technical field
The present invention relates to treat radiating element technical field of heat dissipation, more particularly, it relates to a kind of radiator.
Background technology
In electron trade, radiator is widely used in the heat radiation treating radiating element.Radiator common on market mostly is
Aluminium sheet embeds copper pipe structure, treats that radiating element is installed on a heat sink, contact with copper pipe, in copper pipe, have the heat radiation of flowing to be situated between
Matter, treats that heat is passed to copper pipe by radiating element, and copper pipe passes to heat eliminating medium again, and heat is pulled away.But the heat radiation of this kind
Though device can reach the effect of heat radiation, but, the processing of radiator is complex, and radiator half slot to be processed, in groove
Put into insulation medium, then copper pipe is pressed in groove；
Therefore, how to simplify the structure of radiator, become the technical problem that those skilled in the art are urgently to be resolved hurrily.
Summary of the invention
In view of this, first purpose of the present invention is to provide a kind of radiator, to simplify the structure of radiator.
For achieving the above object, the present invention provides following technical scheme:
A kind of radiator, including heat sink, enters media port and goes out media port, and wherein, the end face of described heat sink is provided with
The installed surface treating radiating element can be installed, when described be arranged on described installed surface until radiating element time, described in treat radiating element
With described heat sink formed close heat dissipation channel, described in enter media port with described go out media port be connected with described heat dissipation channel
Logical.
Preferably, in above-mentioned radiator, also include that sealing ring, described sealing ring are arranged on described installed surface.
Preferably, in above-mentioned radiator, described heat dissipation channel is rectangle or circle.
Preferably, in above-mentioned radiator, described heat dissipation channel is blind hole.
Preferably, in above-mentioned radiator, two end faces that described heat sink is relative are provided with to install to be waited to dispel the heat
The installed surface of device, each end face of described heat sink is provided with described blind hole.
Preferably, in above-mentioned radiator, the described blind hole being positioned at two end faces each enters medium to having described in one group
Outlet and described go out media port, or enter media outlet described in corresponding one group of the described blind hole being positioned at two end faces and described go out to be situated between
Matter mouth.
Preferably, in above-mentioned radiator, the described heat dissipation channel being positioned at two end faces is through hole.
Preferably, in above-mentioned radiator, described heat sink is aluminium sheet or copper coin.
From above-mentioned technical scheme it can be seen that use the radiator the present invention can will treat that radiating element is mounted directly
On the installed surface of heat sink so that heat sink and the heat dissipation channel treating that radiating element formation is closed, will dissipate by entering media port
Thermal medium is passed through to heat dissipation channel, and discharges heat dissipation channel by going out media port, owing to using dissipating in the embodiment of the present invention
Hot device, treats that radiating element directly contacts with the heat eliminating medium in heat dissipation channel, and heat is directly passed to heat eliminating medium, reduces
Heat transfer process accelerates heat radiation, therefore, it is possible to improve the radiating efficiency of radiator, and, use the radiator in the present invention, add
Only need to process heat dissipation channel man-hour, enter media port and go out media port, compared with prior art significantly simplify the structure of radiator,
Reduce difficulty of processing.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
In having technology to describe, the required accompanying drawing used is briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to
Other accompanying drawing is obtained according to these accompanying drawings.
The perspective view of the radiator that Fig. 1 is provided by the embodiment of the present invention one；
The radiator that Fig. 2 is provided by the embodiment of the present invention one is installed and is needed the detonation configuration schematic diagram of radiating element；
The radiator that Fig. 3 is provided by the embodiment of the present invention two is installed and is needed the detonation configuration schematic diagram of radiating element；
The radiator that Fig. 4 is provided by the embodiment of the present invention two is installed and is needed radiating element sectional structure schematic diagram.
Wherein, 100 for heat sink, 101 for heat dissipation channel, 102 for enter media port, 103 for go out media port, 104 for install
Face, 200 be sealing ring, 300 be joint, 400 for treating radiating element.
Detailed description of the invention
The core of the present invention is to provide a kind of radiator, to simplify the structure of radiator.
Hereinafter, referring to the drawings embodiment is illustrated.Additionally, embodiments illustrated below is not to described in claim
Summary of the invention play any restriction effect.It addition, the full content of the composition represented by example below is not limited to as right
Necessary to the solution of the invention described in requirement.
Refer to the perspective view of the radiator that Fig. 1 to Fig. 2, Fig. 1 are provided by the embodiment of the present invention one；Fig. 2
The radiator provided by the embodiment of the present invention one is installed and is needed the detonation configuration schematic diagram of radiating element.
The radiator that the embodiment of the present invention provides includes heat sink 100, enters media port 102 and go out media port 103, wherein,
The end face of heat sink 100 is provided with installing the installed surface 104 treating radiating element 400, when treating that radiating element 400 is arranged on peace
During dress face 104, treat that radiating element 400 forms, with heat sink 100, the heat dissipation channel 101 closed, enter media port 102 and go out media port
103 are connected with heat dissipation channel 101.
Use the radiator in the present invention can will treat that radiating element 400 is directly installed on the installed surface 104 of heat sink 100
On so that heat sink 100 and the heat dissipation channel 101 treating that radiating element 400 formation is closed, by entering media port 102, heat radiation is situated between
Matter is passed through to heat dissipation channel 101, and discharges heat dissipation channel 101 by going out media port 103, owing to using in the embodiment of the present invention
Radiator, treat that radiating element 400 directly contacts with the heat eliminating medium in heat dissipation channel 101, and be directly passed to dissipate by heat
Thermal medium, reduces heat transfer process and accelerates heat radiation, therefore, it is possible to improve the radiating efficiency of radiator, and, use in the present invention
Radiator, add and only need to process heat dissipation channel 101 man-hour, enter media port 102 and go out media port 103, the brightest
The aobvious structure simplifying radiator, reduces the difficulty of processing of radiator.
In the embodiment of the present invention, enter media port 102 and go out media port 103 can directly and medium cooling system enter medium tube
Connect with row's medium tube.
In order to simplify the difficulty of processing of radiator further, this radiator also includes joint 300, enters media port 102 and goes out
Media port 103 is provided with joint 300.Joint 300 need not additional processing for profiled part, it is only necessary to is entering media port 102
Processing is for the screwed hole of erection joint 300 with going out at media port 103, wherein, in order to improve into media port 102 and joint 300
Sealing effectiveness, and go out the sealing effectiveness of media port 103 and joint 300, enter media port 102 and go out media port 103 and processed
Screwed hole for seal screwed hole.
Treat that radiating element 400 can be adhered directly on installed surface 104, wherein, in order to ensure that its installation process is waited to dispel the heat
Device 400 and the sealing effectiveness of installed surface 104, this binding agent uses the binding agent with anti-medium effect.Or treat radiator
Part 400 is arranged on installed surface 104 by screw, now, installed surface 104 is additionally provided with and treats radiating element 400 for installation
Installing hole, screw matches with installing hole.
In order to ensure sealing effectiveness, installed surface 104 is additionally provided with sealing ring 200, treats that radiating element 400 is arranged on installation
Time on face 104, sealing ring 200 deform upon closely with installed surface 104 and treat that radiating element 400 fits.
In order to prevent treating that in radiating element 400 installation process, sealing ring 200 dislocation affects sealing effectiveness, on installed surface 104
Being additionally provided with mounting groove, sealing ring 200 is arranged in mounting groove.
The structure of above-mentioned heat dissipation channel 101 can be the certain law shapes such as rectangle, circle, ellipse, it is also possible to is one
A little erratic shapes, wherein the shape of heat dissipation channel 101 can be consistent with the shape of installed surface 104, i.e. works as installed surface
104 when being rectangular configuration, and heat dissipation channel 101 is also rectangular configuration, and when installed surface 104 is circular configuration, heat dissipation channel 101 is also
For circular configuration, it is arranged such and can simplify processing；Certainly heat dissipation channel 101 can also be inconsistent with the shape of installed surface 104.
And the shape of installed surface 104 and the structure treating radiating element 400 match, treat radiating element 400 for different, can use
Difform installed surface 104.
In embodiments of the present invention, heat dissipation channel 101 is blind hole, and the quantity that heat sink 100 arranges heat dissipation channel 101 can
Thinking that one can also be multiple, when for multiple heat dissipation channel 101, multiple heat dissipation channels 101 are each to one group should be had to enter to be situated between
Matter mouth 102 and go out media port 103, or multiple heat dissipation channel 101 is to one group should be had to enter media port 102 and go out media port 103.
When for time multiple, can single arrange, it is possible to double layout.Preferably use single layout, and each heat radiation is led to
Entering media port 102 and going out media port 103 and be oppositely arranged of road 101 correspondence, is arranged such and can significantly improve radiating efficiency.
In last each technical scheme, an end face of heat sink 100 is provided with for installing the peace treating radiating element 400
Dress face 104, wherein, this end face is provided with one or more installed surface 104 and treats radiating element 400 in order to install, and each peace
All to there being a heat dissipation channel 101 on dress face 104.
In an alternative embodiment of the invention, heat dissipation channel 101 is blind hole.On heat sink 100 on two relative end faces all
It is provided with for installing the installed surface 104 treating radiating element 400, refer to Fig. 3 to Fig. 4, wherein, each end face of heat sink 100
It is provided with blind hole, is positioned at the blind hole on two end faces each to one group should be had to enter media port 102 and go out media port 103；Or
The blind hole being positioned on two end faces is entered media port 102 and goes out media port 103 should there be one group.
The blind hole being positioned at two end faces is interconnected or separate.
Or, the heat dissipation channel 101 being positioned at two end faces is through hole.
Each end face is provided with an installed surface 104, and the installed surface 104 being positioned on two end faces is positioned opposite, Mei Gean
One can be provided with on dress face 104 and treat radiating element 400.Or, each end face is provided with each and every one installed surfaces 104 many, is positioned at
Installed surface 104 on two end faces is positioned opposite, each installed surface 104 can be provided with one and treat radiating element 400, other
Structure is referred to above-mentioned each technical scheme.
In order to optimize radiating efficiency further, heat sink 100 is aluminium sheet or copper coin.In the embodiment of the present invention, radiator is adopted
Material more single, it is simple to process and install.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention.
Multiple amendment to these embodiments will be apparent from for those skilled in the art, as defined herein
General Principle can realize without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein and features of novelty phase one
The widest scope caused.
Claims (8)
1. a radiator, it is characterised in that include heat sink (100), enter media port (102) and go out media port (103), its
In, the end face of described heat sink (100) is provided with installation and treats the installed surface (104) of radiating element (400), when described waiting dissipates
When thermal device (400) is arranged on described installed surface (104), described in treat shape between radiating element (400) and described heat sink (100)
Become the heat dissipation channel (101) closed, described in enter media port (102) and described go out media port (103) and described heat dissipation channel (101)
It is connected.
2. radiator as claimed in claim 1, it is characterised in that also including sealing ring (200), described sealing ring is arranged on institute
State installed surface (104).
3. radiator as claimed in claim 1, it is characterised in that described heat dissipation channel (101) is rectangle or circle.
4. radiator as claimed in claim 1, it is characterised in that described heat dissipation channel (101) is blind hole.
5. radiator as claimed in claim 4, it is characterised in that two end faces that described heat sink (100) is relative are respectively provided with
Having and can install the installed surface (104) treating radiating element (400), described heat sink (100) each end face is provided with described blind
Hole.
6. radiator as claimed in claim 5, it is characterised in that be positioned at the described blind hole of two end faces each to there being a group
Described enter media outlet (102) and described go out media port (103), or described in corresponding one group of the described blind hole being positioned at two end faces
Enter media outlet (102) and described go out media port (103).
7. radiator as claimed in claim 1, it is characterised in that described heat dissipation channel (101) is through hole.
8. radiator as claimed in claim 1, it is characterised in that described heat sink (100) is aluminium sheet or copper coin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610584526.8A CN106163232A (en) | 2016-07-22 | 2016-07-22 | A kind of radiator |
| PCT/CN2017/079897 WO2018014596A1 (en) | 2016-07-22 | 2017-04-10 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610584526.8A CN106163232A (en) | 2016-07-22 | 2016-07-22 | A kind of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106163232A true CN106163232A (en) | 2016-11-23 |
Family
ID=58060684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610584526.8A Pending CN106163232A (en) | 2016-07-22 | 2016-07-22 | A kind of radiator |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106163232A (en) |
| WO (1) | WO2018014596A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018014599A1 (en) * | 2016-07-22 | 2018-01-25 | 珠海格力电器股份有限公司 | Radiator |
| WO2018014596A1 (en) * | 2016-07-22 | 2018-01-25 | 珠海格力电器股份有限公司 | Radiator |
| CN108697029A (en) * | 2017-04-07 | 2018-10-23 | 株式会社认知显示 | Heat dissipation board fabrication method for showing equipment |
| CN112020271A (en) * | 2017-07-17 | 2020-12-01 | 华为技术有限公司 | Liquid cooling device and server including the same |
| CN112423153A (en) * | 2020-10-27 | 2021-02-26 | 深圳市迈腾电子有限公司 | Liquid submergence cooling formula switch and exchange unit |
| CN117388587A (en) * | 2023-12-07 | 2024-01-12 | 南京捷希科技有限公司 | High low temperature terminal test darkroom |
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| JP2006216906A (en) * | 2005-02-07 | 2006-08-17 | Sony Corp | Liquid-cooing system and electronic device having the same |
| CN101167182A (en) * | 2005-03-22 | 2008-04-23 | 布哈拉特强电有限公司 | Selectively grooved cold plate for electronics cooling |
| US20100175857A1 (en) * | 2009-01-15 | 2010-07-15 | General Electric Company | Millichannel heat sink, and stack and apparatus using the same |
| CN201994285U (en) * | 2011-03-04 | 2011-09-28 | 阿尔特(中国)汽车技术有限公司 | Radiator of isolated gate bipolar transistor and transistor radiator component thereof |
| CN202309489U (en) * | 2011-11-10 | 2012-07-04 | 中冶赛迪电气技术有限公司 | Novel liquid immersion type radiator |
| CN205987664U (en) * | 2016-07-22 | 2017-02-22 | 珠海格力电器股份有限公司 | Heat dissipation device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106061207A (en) * | 2016-07-22 | 2016-10-26 | 珠海格力电器股份有限公司 | Radiator |
| CN106163232A (en) * | 2016-07-22 | 2016-11-23 | 珠海格力电器股份有限公司 | A kind of radiator |
-
2016
- 2016-07-22 CN CN201610584526.8A patent/CN106163232A/en active Pending
-
2017
- 2017-04-10 WO PCT/CN2017/079897 patent/WO2018014596A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2006216906A (en) * | 2005-02-07 | 2006-08-17 | Sony Corp | Liquid-cooing system and electronic device having the same |
| CN101167182A (en) * | 2005-03-22 | 2008-04-23 | 布哈拉特强电有限公司 | Selectively grooved cold plate for electronics cooling |
| US20100175857A1 (en) * | 2009-01-15 | 2010-07-15 | General Electric Company | Millichannel heat sink, and stack and apparatus using the same |
| CN201994285U (en) * | 2011-03-04 | 2011-09-28 | 阿尔特(中国)汽车技术有限公司 | Radiator of isolated gate bipolar transistor and transistor radiator component thereof |
| CN202309489U (en) * | 2011-11-10 | 2012-07-04 | 中冶赛迪电气技术有限公司 | Novel liquid immersion type radiator |
| CN205987664U (en) * | 2016-07-22 | 2017-02-22 | 珠海格力电器股份有限公司 | Heat dissipation device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018014599A1 (en) * | 2016-07-22 | 2018-01-25 | 珠海格力电器股份有限公司 | Radiator |
| WO2018014596A1 (en) * | 2016-07-22 | 2018-01-25 | 珠海格力电器股份有限公司 | Radiator |
| CN108697029A (en) * | 2017-04-07 | 2018-10-23 | 株式会社认知显示 | Heat dissipation board fabrication method for showing equipment |
| CN112020271A (en) * | 2017-07-17 | 2020-12-01 | 华为技术有限公司 | Liquid cooling device and server including the same |
| CN112020271B (en) * | 2017-07-17 | 2022-04-22 | 华为技术有限公司 | Liquid cooling device and server including the same |
| CN112423153A (en) * | 2020-10-27 | 2021-02-26 | 深圳市迈腾电子有限公司 | Liquid submergence cooling formula switch and exchange unit |
| CN112423153B (en) * | 2020-10-27 | 2021-08-06 | 深圳市迈腾电子有限公司 | Liquid submergence cooling formula switch and exchange unit |
| CN117388587A (en) * | 2023-12-07 | 2024-01-12 | 南京捷希科技有限公司 | High low temperature terminal test darkroom |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018014596A1 (en) | 2018-01-25 |
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Application publication date: 20161123 |