WO2016124077A1

WO2016124077A1 - Water-cooled radiating case

Info

Publication number: WO2016124077A1
Application number: PCT/CN2016/071307
Authority: WO
Inventors: 徐思
Original assignee: 徐思
Priority date: 2015-02-03
Filing date: 2016-01-19
Publication date: 2016-08-11
Also published as: CN204406296U

Abstract

A water-cooled radiating case comprises a case. The shell of the case is provided with a number of channel structures. The channel structure is composed of several inner-cavity-type pipes (2) and the pipes are provided with several water openings (21) connecting with the outside. The obtained water-cooled radiating case provides the case with some or all of the functions of a water-cooled system. Water-cooled parts in the case are simplified. The water-cooled system is easier to assemble, the maintenance is more convenient, the requirement for space is reduced, and better radiating performance and more beautiful appearance are achieved.

Description

Water cooling chassis

Technical field

The utility model relates to a chassis, in particular to a water-cooling heat dissipation chassis.

Background technique

With the development of computer technology, the processing speed of computer processors is getting faster and faster, but the power consumption is getting higher and higher, which is accompanied by higher and higher temperatures, which requires more powerful heat dissipation equipment to dissipate heat for the computer. However, the large volume, high noise and low efficiency of the traditional air-cooling technology can no longer meet people's needs. The emergence of computer water cooling technology has solved these problems.

After years of development, computer water cooling technology has produced many water-cooled components such as radiators, heat absorbers and water pumps specially developed for water-cooled computers. However, they are independent products that need to be purchased by users and then assembled into a computer water cooling system. It also requires a large enough chassis to accommodate the water-cooled components while holding the necessary computer hardware such as the motherboard, processor, power supply, graphics card, memory, and hard disk. Especially when building complex multi-channel series-parallel water-cooling systems, water-cooled components will occupy a large amount of internal space of the chassis, making the installation and maintenance of the water-cooling system very difficult, and some complicated waterway planning cannot be completed due to the limitation of the chassis structure. Wind resistance inside the large chassis, affecting heat dissipation and reducing aesthetics.

Utility model content

The purpose of the utility model is to solve the above-mentioned deficiencies of the prior art and provide a water-cooling heat-dissipating chassis capable of being easy to install and maintain, saving the internal space of the chassis and quickly forming a water-cooling system.

In order to achieve the above object, a water-cooling heat dissipating chassis designed by the present invention includes a chassis, wherein the casing is provided with a plurality of channel structures, and the channel structure is composed of a plurality of inner cavity type pipes. The pipeline is provided with a plurality of nozzles connected to the outside.

Preferably, the casing is provided with a plurality of radiators, each of which is provided with a water outlet and a water inlet, and the radiator is connected to the nozzle of the pipeline through the water outlet and the water inlet.

Preferably, the cabinet is provided with a plurality of heat absorbers, each of which is provided with a water outlet and a water inlet, and the heat absorber is connected to the water outlet of the pipeline through the water outlet and the water inlet.

Preferably, the water tank is provided with a plurality of water pumps, each water pump is provided with a water outlet and a water inlet, and the water pump is connected to the water outlet of the pipeline through the water outlet and the water inlet.

Preferably, the radiator, the heat absorber, and the water pump are all connected in series or in series through the pipeline, or are sequentially connected by the pipeline.

The water-cooling heat dissipating device obtained by the utility model is a closed liquid circulation device, and the power generated by the pump pushes the liquid circulation in the closed system, and the heat generated by the chipset absorbed by the heat absorber passes through the circulation of the liquid. , take a larger radiator, heat dissipation, and the cooled liquid is returned to the heat absorber again, so that it reciprocates. The circulating liquid can be water or other liquid capable of transferring heat. In order to cope with a computer with multiple heat-generating chips, multiple heat sinks can be connected in parallel or in series on the chipset to absorb heat in the system; for better heat dissipation, multiple heat sinks can be connected in parallel or in series to better. The heat in the system is released; in order to cope with the water flow resistance in the circulation pipeline, multiple water cooling may be used in parallel or in series to provide greater water flow force; in order to connect a plurality of water cooling parts Parts, the chassis shell can be set up with multiple pipes to meet the needs of the connection.

For the purpose of cost control and waterway planning, the water-cooling heat dissipation chassis obtained by the utility model can integrate at least one of four water-cooling components, such as a pipeline, a radiator, a heat absorber and a water pump, on the casing of the casing, and other water-cooled components. The existing water-cooled components on the market are placed inside the chassis. The water-cooled parts on the chassis are provided with corresponding water outlets and water inlets. The number of water outlets and water inlets can be multiple to achieve complex series or parallel water connections. The channel structural components on the enclosure enclosure can be directly connected to the water-cooled components inside the enclosure or indirectly connected to the built-in water-cooled components via built-in piping. The water-cooling component includes one of a radiator, a heat absorber, and a water pump, or a combination of two or more.

In this way, the chassis has some or all of the functions of the water cooling system, simplifies some or all of the water cooling components in the chassis, makes the water cooling system easier to set up, is easier to install and maintain, reduces the space requirement of the chassis, and has better heat dissipation performance. More beautiful.

DRAWINGS

Figure 1 is a schematic view of the overall structure of the present invention;

Figure 2 is a left side view of Figure 1;

3 is a schematic diagram of the principle of a water-cooled heat dissipation chassis;

Figure 4 is a schematic diagram of one embodiment of a channel structure;

Figure 5 is a schematic diagram of one embodiment of a channel structure;

Figure 6 is a schematic diagram of one embodiment of a channel structure;

Figure 7 is a schematic diagram of one embodiment of a channel structure;

Figure 8 is a schematic diagram of one embodiment of a channel structure;

Figure 9 is one of the schematic diagrams of the channel structure.

In the figure: water pump 1, pipeline 2, heat sink 3, heat sink 4, chipset 5, nozzle 21.

detailed description

The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

Example:

As shown in FIG. 1 to FIG. 9 , the utility model provides a method for quickly dissipating heat generated during operation in a computer case, and also protects the computer host from dust damage and noise, so as to keep it quiet and A water-cooled heat-dissipating chassis for a safe working environment, comprising a chassis, wherein the chassis is provided with a plurality of channel structures, the channel structure consisting of a plurality of inner-cavity-type pipes 2, the pipe 2 being provided with a plurality of connections The external nozzle 21, the passage structure is formed into a circulation passage by series or parallel connection, and the water passage is connected to the built-in water-cooling component to form a circulation passage. The line 2 contains liquid, and the circulating liquid can be water or other liquid capable of transferring heat.

Further, the chassis is provided with a plurality of radiators 4, each of which is provided with a water outlet and a water inlet, and the radiator is connected with the water inlet through the water outlet and the water inlet to form a circulation loop. For better heat dissipation, multiple water-cooled heat sinks can be used in parallel or in series to better release heat from the system.

Further, the chassis is provided with a plurality of heat absorbers 3, each of which has a water outlet and a water inlet, and the heat absorber is installed on the chipset in the chassis and passes through the water outlet and The water inlet is connected with the above-mentioned nozzle to form a circulation loop; in order to cope with a computer having a plurality of heat generating chips, a plurality of heat absorbers may be connected in parallel or in series on the chipset to absorb heat in the system.

Further, the water tank 1 is provided with a plurality of water pumps 1 , and the water pump 1 is provided with a water outlet and a water inlet, and the water pump is cyclically connected to the water outlet 21 of the pipeline through the water outlet and the water inlet.

In order to cope with water flow resistance in complex circulation lines, multiple pumps can be used in parallel or in series to provide greater water flow.

Further, a plurality of water pumps 1, a radiator 4, a heat absorber 2, and a water pump 1 on the chassis are sequentially cyclically connected through the nozzle 21 of the pipeline 2.

The water-cooling heat dissipating device obtained by the utility model is a closed liquid circulation device, and the power generated by the water pump 1 pushes the liquid circulation in the closed system, and the heat generated by the chipset absorbed by the heat absorber passes through the liquid. The circulation is carried to the water-cooling radiator 4 having a larger area to dissipate heat, and the cooled liquid is again returned to the heat absorber 3, so that the cycle is repeated.

For the purpose of cost control and waterway planning, the water-cooling heat dissipation chassis obtained by the utility model can integrate at least one of the four water-cooling components of the pipeline 2, the radiator 4, the heat absorber 3 and the water pump 1 on the casing of the casing. Other water-cooled components are placed inside the chassis using existing water-cooled products on the market. The water-cooled components on the chassis are provided with corresponding water outlets and water inlets; the number of water outlets and water inlets can be multiple to achieve complex series or parallel water connections. The channel structure on the chassis enclosure can be directly connected to the water-cooled components inside the enclosure or indirectly via built-in piping to the built-in water-cooled components.

The water-cooling heat-dissipating case obtained by the utility model is further explained: water cooling is also called liquid cooling, and its heat dissipation efficiency is high, the heat conductivity is several times that of the conventional air-cooling mode, and the high noise without air-cooling heat dissipation can solve the problem well. For cooling and noise reduction problems, the water-cooling heat sink can be roughly divided into four parts: water pump 1, pipeline 2, heat sink and water-cooled radiator. The principle of water-cooling heat dissipation is shown in Figure 3: the water-cooling heat sink is a closed liquid. The circulation device, through the power generated by the water pump 1, pushes the liquid circulation of the circulation flow line 2 in the closed system, and the heat generated by the chip set 5 absorbed by the heat absorber is transferred to the radiator with a larger area by the circulation of the liquid 4 The heat is dissipated, and the liquid cooled by the radiator is again returned to the heat absorber 4 via the water pump 1 so as to reciprocate.

For those skilled in the art to which the present invention pertains, the architectural form can be flexibly changed without departing from the concept of the present invention, and only a few simple deductions or replacements should be considered as belonging to the present invention. The scope of patent protection as determined by the claims filed.

Claims

A water-cooling heat-dissipating chassis includes a chassis, wherein: the chassis casing is provided with a plurality of channel structures, and the channel structure is composed of a plurality of inner cavity-type pipes, and the pipeline is provided with a plurality of nozzles connected to the outside. .
The water-cooling heat dissipation chassis according to claim 1, wherein the chassis is provided with a plurality of heat radiators, each of which has a water outlet and a water inlet, and the radiator passes through the water outlet and the water inlet. The nozzle of the pipe is connected.
The water-cooling heat dissipating chassis according to claim 1, wherein the chassis is provided with a plurality of heat absorbers, each of the heat absorbers is provided with a water outlet and a water inlet, and the heat absorber passes through the water outlet and into the water inlet. The nozzle is connected to the nozzle of the above-mentioned pipe.
The water-cooling heat dissipation cabinet according to claim 1, wherein the chassis is provided with a plurality of water pumps, each of which is provided with a water outlet and a water inlet, and the water pump passes through the water outlet, the water inlet and the pipeline. The nozzle is connected.
The water-cooling heat dissipating chassis according to claim 2, 3 or 4, wherein the radiator, the heat absorber, and the water pump are all connected in parallel or in series through the pipeline, or through the tube. The roads are connected in turn.