CN105491849A - Cooling device and electronic product having cooling device - Google Patents
Cooling device and electronic product having cooling device Download PDFInfo
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- CN105491849A CN105491849A CN201410475350.3A CN201410475350A CN105491849A CN 105491849 A CN105491849 A CN 105491849A CN 201410475350 A CN201410475350 A CN 201410475350A CN 105491849 A CN105491849 A CN 105491849A
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- air bag
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Abstract
The invention provides an electronic product immersion type cooling device based on an air bag exhaust valve and an electronic product having the cooling device. An immersion type cooling device according to a preferred embodiment of the invention includes a box body, a nonconducting liquid-cooling working medium and an air exhausting device. The nonconducting liquid-cooling working medium is accommodated in the box body, and a heat generation component of an electronic product that needs to be cooled can be immersed in the liquid-cooling working medium so as to be cooled; and an air exhausting device which includes an air bag and an exhaust valve connected on the air bag, wherein the air bag is accommodated in the box body, and the exhaust valve enables gas inside the air bag and gas outside the box body to intercommunicate. The air exhausting device cooperates with the box body, so as to enable the box body to become an airtight box body to prevent a working medium in a liquid state and/or steam state inside the box body from being leaked to the outside of the box body.
Description
Technical field
The present invention relates to the cooling device for electronic product and the electronic product with cooling device.
Background technology
Along with the integrated level of electronic product and density of heat flow rate more and more higher, the electronic product radiating technology of traditional with air is medium is more and more awkward, seek more highdensity Cooling Solution extremely urgent, the one as liquid cooling is extremely conceived, and immersion cooling starts the visual field entering people.Immersion cools, and is immersed in non-conductive liquid dispels the heat by pyrotoxin a part or whole part.Relative to traditional wind-cooling heat dissipating technology, because the heat convection ability of flowing fluid ratio air is high a lot, therefore immersion dispel the heat soluble density of heat flow rate can be high a lot.Therefore, the immersion liquid cooling apparatus for electronic product arises at the historic moment in recent years.
But, for immersion liquid cooling apparatus, after the non-conductive working medium of the thermogenesis component for cool electronic product in immersion liquid cooling apparatus absorbs heat, temperature will raise, volume can expand, and the immersion cooling especially utilizing low boiling working fluid to carry out, also can produce with steam.Therefore, for immersion liquid cooling apparatus, on the one hand need to prevent liquid boiling or evaporation from bringing the leakage of working medium, the problem that gas in container and/or vapour volume expand and bring, the destruction that the high pressure produced to prevent internal tank produces equipment must be considered simultaneously.
In order to solve the problem, in the prior art, two kinds of typical immersion liquid cooling apparatus are proposed.
The first, see Fig. 1, it illustrates according to of the prior art one typical immersion liquid cooling apparatus.This immersion liquid cooling apparatus comprises: casing 1; And nonconducting liquid cooling working medium 2, it is contained in this casing 1, the thermogenesis component 3 of the needs cooling of electronic product, and such as circuit board is immersed in this liquid cooling working medium 2 with cooled.In order to prevent liquid cooling refrigerant leakage, casing 1 needs to be fabricated to airtight.But, after liquid cooling working medium 2 absorbs the heat of thermogenesis component 3 generation, its volume can expand, thus the gas that can compress in the space above liquid cooling working medium 2 and casing 1 internal pressure is raised, simultaneously, also can produce a certain amount of steam 22 after liquid cooling working medium 2 is heated, this steam can be evaporated in the space (space namely in figure above liquid-vaqor interface 21) above liquid cooling working medium 2, thus increases the internal pressure of casing 1 further.In addition, the gas that in the space above liquid cooling working medium 2, exists such as air itself also can expanded by heating and increase box house pressure.If this pressure can not get release, it may cause casing to destroy, or this pressure can react on liquid cooling working medium 2, and then the parts 3 being delivered to the electronic product in liquid cooling working medium 2 cause parts damages.For this reason, industry is provided with vent valve 4 on casing 1, for discharging pressure too high in casing 1.But for such structure, although which solve the problem of box house high pressure, the pressure relief device of exhaust valve type inevitably causes expensive non-conductive working medium to leak as a vapor, both uneconomical, also not environmentally.
In order to reduce steam leakage further, industry proposes further improvement project, continue with reference to Fig. 1, condenser 5 has been set up in space above liquid cooling working medium 2, coolant passes into from the upper inlet 5 of condenser 5, export H from below to discharge, thus the steam 22 of cooling liquid cooling working medium 2, so that steam condensation is as much as possible reclaimed.But for such modified node method, it can not all steam of total condensation, and therefore, the leakage problem of liquid cooling working medium 2 does not thoroughly solve, and condenser 5 makes whole cooling device structure more complicated, and cost also rises thereupon.
In order to thoroughly solve the problem of refrigerant leakage, can also solve the problem of box house high pressure, industry proposes the typical immersion liquid cooling apparatus of the second in recent years simultaneously.See Fig. 2, liquid cooling working medium 2 ' fill the completely airtight casing 1 ' of cooling device, the thermogenesis component 3 ' of the needs cooling of electronic product is immersed in liquid cooling working medium 2 ' in.Because casing 1 ' is completely airtight, therefore thoroughly solve liquid cooling working medium 2 ' problem of leaking.Further, in order to avoid the hypertonia in casing 1 ', be provided with multiple air bag 6 ' in casing 1 ', these air bags 6 ' have compressibility.The volume that ' after expanded by heating, air bag 6 ' is compressed, thus absorb liquid cooling working medium 2 ' brings like this when liquid cooling working medium 2 increases, and then keeps total pressure in casing 1 ' in suitable scope.
But, for the second immersion liquid cooling apparatus so as above, the compressible volume of air bag is limited, because, on the one hand, along with liquid cooling working medium 2 ' itself heated, gas in air bag 6 ' also can be heated, the volume of air bag can be caused to increase for it or pressure raises, on the other hand, and the excess compression of air bag volume, its pressure can be caused to raise, this pressure can react on liquid cooling working medium, thus the internal pressure of casing 1 ' is raised, and then may destroy the thermogenesis component 3 ' of the electronic product in casing or casing.Therefore, although such liquid cooling apparatus solves the problem of liquid cooling refrigerant leakage, it solves the limited in one's ability of casing inner high voltage, and then affects its cooling capacity.
Further, solve the ability of casing inner high voltage to improve above-mentioned cooling device, industry proposes industry and proposes as temperature control equipment set up by air bag, thus can be realized the increase of its compressible volume by the temperature of the gas such as reducing inside air bag.But, set up the complexity that temperature control equipment inevitably increases whole cooling device, and bring the rising of cost.
Can find out, according to these immersion cooling devices above-mentioned of prior art, structure relative complex, cost is higher, and, or thoroughly can not solve the problem of liquid cooling refrigerant leakage, or the high-voltage problem in the casing of cooling device can not be solved well.
Therefore, there is a kind of demand, namely the immersion cooling device of part or all in a kind of can solving the problem is provided, and correspondingly, provide the electronic product with such immersion cooling device.
Summary of the invention
According to above-mentioned shortcoming and defect, the object of the invention is at least to solve part or all of the above-mentioned problems in the prior art.
According to a preferred embodiment of the invention, provide a kind of immersion cooling device for electronic product, described cooling device comprises: casing; Be contained in the nonconducting liquid cooling working medium in this casing, the thermogenesis component of the needs cooling of electronic product can be immersed in this liquid cooling working medium with cooled; Exhaust apparatus, this exhaust apparatus comprises air bag and is connected to the vent valve on this air bag, described air bag is contained in described casing, described vent valve makes the gas of the gas of described inside air bag and described casing outside can intercommunication, wherein, described exhaust apparatus coordinates with described casing, becomes containment housing to prevent the refrigerant leakage of liquid state in described casing and/or steam state to outside casing to make described casing.Thus, according to this embodiment of the invention, by means of coordinating of exhaust apparatus and casing, seal up liquid cooling working medium dexterously, thus thoroughly avoid the leakage of liquid cooling working medium; Further, by means of vent valve, by exhaust, air bag can be compressed largely, thus efficiently solve because the be heated liquid volume that causes of liquid cooling working medium expands and liquid evaporates the problem of the box house pressure rising brought, and, be air in air bag or gas due to what discharged by vent valve, instead of discharge of the prior art as shown in Figure 1 is working substance steam, therefore cooling device of the present invention not only economy but also environmental protection.
In above preferred embodiment of the present invention, further preferably, a part for described air bag and the wall of described casing are tightly connected, to make there is not any gap between this part of described air bag and described casing, make described air bag and described casing jointly cross a confined space thus, described liquid cooling working medium is sealed in this confined space.In actual applications, casing itself is easy to be fabricated to airtight, but box body wall must reserve an opening to install vent valve, and thus, working medium may spill via the assemblage gap between vent valve and casing.In this embodiment of the invention, a part for air bag is tightly connected and such as bonds on box body wall, thus, by means of the airtight of air bag or barriering effect, working medium can not flow to the gap (even if there is this space) between vent valve and box body wall at all, therefore naturally achieve the airtight of casing, prevent refrigerant leakage.
In above-mentioned arbitrary preferred embodiment of the present invention, further preferably, the neighboring of described vent valve and the wall of described casing are tightly connected, and to make there is not any gap between described casing and described vent valve, make described casing become containment housing thus.As previously mentioned, the approach that working medium uniquely may leak into casing outside is spilt by the gap between vent valve and casing, in this embodiment of the invention, is installed on casing exhaust valve sealing, such as can install sealing ring additional between vent valve and casing, thus prevent refrigerant leakage.More preferably, the vent valve in the present embodiment can be combined with the mode be tightly connected between air bag and box body wall in the mode be tightly connected between casing and previous embodiment, to realize double sealing effect.
In above-mentioned arbitrary preferred embodiment of the present invention, further preferably, described vent valve is bi-directional venting valve, to make the gas of the gas of described inside air bag and described casing outside can two-way intercommunication.Or, described exhaust apparatus has multiple vent valve, and described multiple vent valve comprises and the gas of described inside air bag can be made to be discharged to the one-way exhaust valve outside described casing and the gas of described casing outside can be made to enter into the one-way exhaust valve of described inside air bag.It should be noted that; the design concept of vent valve of the present invention is to ensure being interconnected of air bag and the casing external world; therefore, all modes of texturing based on this design concept can be considered as the equivalent embodiments of vent valve of the present invention, drop within protection scope of the present invention.
In above-mentioned arbitrary preferred embodiment of the present invention, further preferably, described cooling device has multiple described air bag, and each air bag has described vent valve.Thus, by means of multiple air bags of band vent valve, box house high pressure resolution ability can be increased, and in design can be more flexible, by the combination of multiple air bag, go for the casing of various shape.
In above-mentioned arbitrary preferred embodiment of the present invention, further preferably, described cooling device also comprises the heat exchanger being positioned at described box house, for cooling described liquid cooling working medium and/or this liquid cooling working medium by the steam formed after thermal evaporation.Thus, by means of heat exchanger, the cooling capacity of cooling device can be improved further.
In aforementioned preferred embodiments of the present invention, further preferably, described heat exchanger is be arranged in the condenser in the space between described liquid cooling working medium and described air bag, for the cold working medium of condensate recovery liquid by the steam formed after thermal evaporation.Thus, by condenser cooling working medium steam, compared to the working medium of direct cooling liquid state, can more effectively reduce box house pressure, thus further increase the ability that cooling device solves high pressure.This execution mode of the present invention is particularly useful for lower boiling liquid cooling working medium, because lower boiling working medium is easy to produce a large amount of steam in the course of the work.
In above-mentioned arbitrary preferred embodiment of the present invention, further preferably, the thermogenesis component of the needs cooling of described electronic product is circuit board.Thus, cooling device of the present invention is particularly suitable for the immersion cooling of circuit board, the circuit board of particularly high-power height heat radiation, the circuit board of such as base station.
In addition, the present invention also provides a kind of electronic product, and this electronic product comprises cooling device as in the foregoing embodiment.
Will be appreciated that, foregoing description is only used to exemplary object, instead of will limit the scope of the invention.
Accompanying drawing explanation
Above-mentioned and the further feature of exemplary embodiment of the present invention and advantage will become more obvious from detailed description with the accompanying drawing below, and this description and accompanying drawing are only for exemplary purpose instead of limit the scope of the invention by any way, wherein:
Fig. 1 illustrates the schematic diagram according to of the prior art one typical immersion liquid cooling apparatus;
Fig. 2 illustrates the schematic diagram according to another typical immersion liquid cooling apparatus of the prior art;
Fig. 3 is the schematic diagram of the immersion liquid cooling apparatus illustrated according to a preferred embodiment of the invention; And
Fig. 4 is the schematic diagram that the embodiment improved further on the embodiment basis shown in Fig. 3 of the present invention is shown.
Embodiment
Aforementioned and other technology contents, feature and effect for the present invention, at following cooperation reference accompanying drawing in the detailed description of embodiment, can clearly present.The direction term mentioned in following examples such as: upper and lower, left and right, front or rear etc., is only the direction with reference to accompanying drawing.Therefore, the direction term of use is used to illustrate and is not used for limiting the present invention, and in addition, in whole embodiment, identical drawing reference numeral represents same or similar element.
Each exemplary embodiment of the present invention is described below with reference to accompanying drawings.
First with reference to Fig. 3, it is the schematic diagram of the immersion liquid cooling apparatus illustrated according to a preferred embodiment of the invention.The immersion cooling device for electronic product according to the preferred embodiment comprises: casing 10; Be contained in the nonconducting liquid cooling working medium 20 in this casing, the thermogenesis component 30 (being exemplarily illustrated as a circuit board in figure 3) of the needs cooling of electronic product can be immersed in this liquid cooling working medium with cooled; Exhaust apparatus, this exhaust apparatus comprises air bag 60 and is connected to the vent valve 40 on this air bag 60, and air bag 40 is contained in casing 10, and vent valve 40 makes the gas of the gas of air bag 60 inside and casing 10 outside can intercommunication.
In the embodiment shown in fig. 3, the top of air bag 60 and the roof of casing 10 are tightly connected, assemblage gap place between the uniquely possible leakage point of casing and the wall of vent valve 40 and casing 10 can not be flow to make working medium, thus, in fact make the diapire of air bag 60 and casing 10 and sidewall jointly cross a confined space, liquid cooling working medium 20 is sealed in this confined space.Further, in the preferred embodiment shown in Fig. 3, the neighboring of vent valve 40 and the wall of casing 10 are tightly connected, to make also there is not any gap between casing and vent valve, this embodiment indeed achieves the dual-seal of working medium thus, can play the function of good anti-leak.
Further, in the preferred embodiment shown in Fig. 3, vent valve 40 is a two-way vent valve, to make the gas of the gas of inside air bag and casing outside can two-way intercommunication.
At work, after liquid cooling working medium 20 absorbs the heat of thermogenesis component 30 generation of electronic product, the volume of liquid cooling working medium 20 can expand, and the liquid cooling working medium 20 of liquid state also inevitably can produce a certain amount of steam 202, thus make above working medium 20, namely above liquid-vaqor interface 201, space in pressure raise.But the volume of air bag 60 can be compressed due to the compressibility of its internal gas, alleviate the aforementioned pressure rising that box house is formed thus.If thermogenesis component 30 continues to produce more heat, the pressure of box house can be made to continue to raise, when this pressure to be delivered on air bag 60 and the pressure threshold making the internal pressure of air bag 60 higher than vent valve 40 time, vent valve 40 is opened, thus the portion gas in air bag 60 is discharged, thus, the volume-diminished of air bag 60, thus the space above by the space between air bag 60 and working medium 20 and liquid-vaqor interface 201 is increased, the internal pressure can alleviating casing 10 thus further raises problem.Visible, compared to scheme of the prior art, cooling device of the present invention has the ability of better leakage prevention capability and stronger solution internal high pressure problem.
On the other hand, after thermogenesis component 30 quits work, working medium 20 is also slowly lowered the temperature thereupon, makes box house pressure reduce thus, even forms negative pressure, and in this case, ambient atmos can come back in air bag 60 via vent valve 40.
But it should be noted that the embodiment shown in Fig. 3 is highly preferred embodiment of the present invention, the present invention must be embodied as shown in Figure 3.Such as, immersion cooling device of the present invention can have such as two one-way exhaust valves instead of an independent bi-directional venting valve, the gas that one of them vent valve is provided for inside air bag is discharged to outside casing, and the gas that another vent valve is provided for casing outside enters into inside air bag.Again such as, immersion cooling device of the present invention can not have foregoing dual-seal, but can only have the sealing formed between air bag and box body wall, or only there is the sealing formed between vent valve and casing, or even other sealing means, as long as the position that can prevent working medium from namely installing vent valve 40 from leakage point is leaked.
In addition, the immersion cooling device based on air bags valve of the present invention can also have multiple air bag, and each air bag has vent valve.Thus, such as, for the body structure of non-regular shape, can design multiple different but meet the air bag of the respective inner shape of casing various piece.Moreover owing to there is multiple air bag, even if an airbag fails, other air bag still can normally work, thus make cooling device performance of the present invention more stable, and maintenance cost also can reduce, because the air bag of inefficacy only can be changed.
It should be noted that, core idea of the present invention is to utilize the exhaust apparatus be made up of vent valve and air bag to be exhausted decompression dexterously, avoid refrigerant leakage problem of the prior art on the one hand, avoid on the other hand and of the prior artly directly the working substance steam in casing is discharged to the problem of environmental pollution that may cause outside casing, on this basis, those skilled in the art can carry out various modifications and variations.
Describe further modified embodiment of the present invention referring to Fig. 4, wherein Fig. 4 is the schematic diagram that the embodiment improved further on the embodiment basis shown in Fig. 3 of the present invention is shown.With reference to Fig. 4, the cooling device of this embodiment also comprises the heat exchanger being positioned at casing 10 inside, more specifically, comprise the condenser 50 in the space be arranged between liquid cooling working medium 20 and air bag 60, cooling fluid passes into from the upper inlet C of condenser 50, export H place from below to discharge, for condensation liquid cooling working medium by the steam 202 formed after thermal evaporation, and be recovered in liquid working medium 20.Thus, by means of the recovery of condenser to working substance steam, the pressure of box house can be reduced further, thus make cooling device of the present invention can have stronger cooling capacity, the heat radiation of the electronic product of larger caloric value can be applied to.
For can carry out with cooling device of the present invention the device that cools or part extent very wide, such as, can be the mainboard etc. of the powerful circuit board of base station, the band CPU of some electronic products, as long as these devices or parts are suitable for being immersed in partially or entirely in liquid cooling working medium.
Certainly, correspondingly, the present invention also provides a kind of electronic product with cooling device as above, and the thermogenesis component of this electronic product is immersed in the liquid cooling working medium of cooling device.
Finally, although on the basis with reference to the embodiment shown in Fig. 3 and 4, the present invention has been described in the description and has been illustrated in the accompanying drawings, but, it will be appreciated by those skilled in the art that, above mentioned all embodiments are all only preferred embodiment, and some technical characteristic in embodiment may not be required for the specific technical problem of solution, thus not or can omit these technical characteristics and the solution of non-influence technique problem or the formation of technical scheme; And the feature of an embodiment, key element and/or function suitably mutually can combine, combine or coordinate with the feature of other one or more embodiment, key element and/or function, unless this combination, combination or coordinate obviously can not be implemented.
Claims (10)
1., for an immersion cooling device for electronic product, described cooling device comprises:
Casing;
Be contained in the nonconducting liquid cooling working medium in this casing, the thermogenesis component of the needs cooling of electronic product can be immersed in this liquid cooling working medium with cooled;
Exhaust apparatus, this exhaust apparatus comprises air bag and is connected to vent valve on this air bag, and described air bag is contained in described casing, and described vent valve makes the gas of the gas of described inside air bag and described casing outside can intercommunication,
Wherein, described exhaust apparatus coordinates with described casing, becomes containment housing to prevent the refrigerant leakage of liquid state in described casing and/or steam state to outside casing to make described casing.
2. cooling device as claimed in claim 1, it is characterized in that, a part for described air bag and the wall of described casing are tightly connected, to make there is not any gap between this part of described air bag and described casing, make described air bag and described casing jointly cross a confined space thus, described liquid cooling working medium is sealed in this confined space.
3. cooling device as claimed in claim 1, it is characterized in that, the neighboring of described vent valve and the wall of described casing are tightly connected, and to make there is not any gap between described casing and described vent valve, make described casing become containment housing thus.
4. the cooling device as described in one of claim 1-3, is characterized in that, described vent valve is bi-directional venting valve, to make the gas of the gas of described inside air bag and described casing outside can two-way intercommunication.
5. the cooling device as described in one of claim 1-3, it is characterized in that, described exhaust apparatus has multiple vent valve, and described multiple vent valve comprises and the gas of described inside air bag can be made to be discharged to the one-way exhaust valve outside described casing and the gas of described casing outside can be made to enter into the one-way exhaust valve of described inside air bag.
6. the cooling device as described in one of claim 1-3, is characterized in that, described cooling device has multiple described air bag, and each air bag has described vent valve.
7. the cooling device as described in one of claim 1-3, is characterized in that, described cooling device also comprises the heat exchanger being positioned at described box house, for cooling described liquid cooling working medium and/or this liquid cooling working medium by the steam formed after thermal evaporation.
8. cooling device as claimed in claim 7, it is characterized in that, described heat exchanger is be arranged in the condenser in the space between described liquid cooling working medium and described air bag, for the cold working medium of condensate recovery liquid by the steam formed after thermal evaporation.
9. the cooling device as described in one of claim 1-3, is characterized in that, the thermogenesis component of the needs cooling of described electronic product is circuit board.
10. an electronic product, is characterized in that, this electronic product comprises the cooling device as described in one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410475350.3A CN105491849A (en) | 2014-09-17 | 2014-09-17 | Cooling device and electronic product having cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410475350.3A CN105491849A (en) | 2014-09-17 | 2014-09-17 | Cooling device and electronic product having cooling device |
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| CN105491849A true CN105491849A (en) | 2016-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410475350.3A Pending CN105491849A (en) | 2014-09-17 | 2014-09-17 | Cooling device and electronic product having cooling device |
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| CN108538212A (en) * | 2018-05-31 | 2018-09-14 | 重庆雄富光电科技有限公司 | A kind of led display screens |
| WO2019015321A1 (en) * | 2017-07-17 | 2019-01-24 | 华为技术有限公司 | Immersed type liquid cooling apparatus, blade type server and frame type server |
| CN109643885A (en) * | 2016-08-30 | 2019-04-16 | 株式会社自动网络技术研究所 | Electric connection box |
| US10405459B2 (en) | 2016-08-04 | 2019-09-03 | Hamilton Sundstrand Corporation | Actuated immersion cooled electronic assemblies |
| CN110958806A (en) * | 2018-09-27 | 2020-04-03 | 慧与发展有限责任合伙企业 | Liquid chamber housing |
| CN111268088A (en) * | 2020-03-13 | 2020-06-12 | 中国科学院理化技术研究所 | Volume-controllable air bag device and multi-air-bag airship system |
| CN112309184A (en) * | 2020-11-13 | 2021-02-02 | 湖北理工学院 | Demonstration instrument for teaching outline of Chinese near-current era |
| CN114216299A (en) * | 2021-11-25 | 2022-03-22 | 邢万存 | Part cooling device for machining |
| TWI807318B (en) * | 2021-05-07 | 2023-07-01 | 緯穎科技服務股份有限公司 | Electronic apparatus having immersion cooling system and operating method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10405459B2 (en) | 2016-08-04 | 2019-09-03 | Hamilton Sundstrand Corporation | Actuated immersion cooled electronic assemblies |
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| CN112309184A (en) * | 2020-11-13 | 2021-02-02 | 湖北理工学院 | Demonstration instrument for teaching outline of Chinese near-current era |
| TWI807318B (en) * | 2021-05-07 | 2023-07-01 | 緯穎科技服務股份有限公司 | Electronic apparatus having immersion cooling system and operating method thereof |
| CN114216299A (en) * | 2021-11-25 | 2022-03-22 | 邢万存 | Part cooling device for machining |
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