WO2019015321A1 - Appareil de refroidissement par liquide de type immergé, serveur de type lame et serveur de type châssis - Google Patents

Appareil de refroidissement par liquide de type immergé, serveur de type lame et serveur de type châssis Download PDF

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Publication number
WO2019015321A1
WO2019015321A1 PCT/CN2018/076744 CN2018076744W WO2019015321A1 WO 2019015321 A1 WO2019015321 A1 WO 2019015321A1 CN 2018076744 W CN2018076744 W CN 2018076744W WO 2019015321 A1 WO2019015321 A1 WO 2019015321A1
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WO
WIPO (PCT)
Prior art keywords
liquid
housing
cooling
coolant
casing
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Application number
PCT/CN2018/076744
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English (en)
Chinese (zh)
Inventor
胡航空
姚希栋
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华为技术有限公司
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Filing date
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Publication of WO2019015321A1 publication Critical patent/WO2019015321A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Definitions

  • the present application relates to the field of electronic component cooling devices, and more particularly to a submerged liquid cooling device.
  • liquid cooling Liquid cooling technology as a kind of Efficient cooling has been applied in the IT field.
  • the commonly used liquid cooling methods are plate-level liquid cooling and immersion liquid cooling.
  • board-level liquid cooling means that the electronic components inside the electronic device first conduct heat to the heat-dissipating block, and then contact the whole-plate thermal pad through the heat-dissipating block.
  • the thermal pad conducts heat to the upper cover of the electronic device, and then the upper cover transfers heat to the outside of the electronic device through the water to achieve heat dissipation.
  • Immersion liquid cooling refers to immersing an electronic device as a whole in a closed container with a cooling liquid, and conducting heat of the electronic device through the flow of the cooling liquid.
  • the immersion liquid cooling method needs to first take out the electronic device from the cooling liquid first, and then disassemble the faulty module.
  • the whole device is covered with the cooling liquid, which is difficult to perform the disassembly operation and maintenance.
  • the maximum heat dissipation efficiency of the plate-level liquid cooling method can only reach 80%.
  • the maximum heat dissipation efficiency of the submerged liquid cooling method can reach 100%. Therefore, the heat dissipation of electronic equipment is increasingly inclined to adopt submerged cooling.
  • the above-mentioned submerged liquid cooling method has problems such as inconvenience in maintenance and deployment of electronic components, high cost, and the like, and cannot meet the demand for scale application.
  • the application provides an immersion liquid cooling device to solve the problems of low heat dissipation efficiency, high production cost or high operation cost, and inconvenient maintenance of electronic components of the liquid cooling system.
  • the present application provides the following aspects:
  • an immersion liquid cooling device comprising a housing and an external refrigerating device connected to the housing, wherein one or more flow passages are opened inside the housing, the flow passage and the outer portion
  • the refrigeration device forms a circuit, the circuit is filled with a second cooling liquid, and the external cooling device is used for cooling the second cooling liquid and providing circulating power to the second cooling liquid, and the first cooling liquid is filled in the closed cavity, in the flow path a closed circuit formed with the refrigeration device is filled with a second cooling liquid, and a second cooling liquid circulates between the flow path and the refrigerating device, and the first cooling liquid is conducted to be dissipated through the sealed cavity.
  • the heat of the electronic components is discharged outside the casing, thereby dissipating heat from the electronic components to be dissipated.
  • the electronic components to be dissipated are fixedly disposed on the printed circuit board (PCB board) to form a device board, and the device board is fixedly mounted in the housing, so that the electronic components to be dissipated Set inside the closed cavity.
  • PCB board printed circuit board
  • the housing includes a hollow shell body, a bottom plate sealingly coupled to the bottom end of the shell body, and a top plate sealingly coupled to the top end of the body, wherein the bottom plate and the bottom plate At least one of the top plates is detachably coupled to the casing body to form a detachable casing.
  • a seal is provided at the connection of the shell body to the top panel and/or the bottom panel that is detachably connected.
  • a connector is further disposed on the device board for electrically connecting with the backboard or other electronic components, and the connector protrudes from the outside of the housing or is embedded in the housing body.
  • the connector is used to electrically connect to a backplane or other electronic component.
  • the flow channel is disposed in one or more of an interior of the casing body, an interior of the ceiling body, and an interior of the floor body.
  • the flow channel includes a main flow channel and a flow dividing channel, and the partial flow channel is in communication with the main flow channel.
  • the two ports of the flow channel on the housing are respectively the housing inlet port and the housing outlet port, and are disposed on the external cooling device.
  • a cooling inlet port and a cooling outlet port wherein two ports on the casing and the refrigerating liquid inlet port on the external refrigerating device and the refrigerating liquid outlet port form a sealed passage for the
  • the second coolant circulates between the flow passage and the cooling device, wherein a casing inlet quick connector is disposed on the casing inlet, and the casing outlet is disposed at the casing a housing outlet quick connector, wherein a cooling liquid inlet quick connector matched with the housing liquid outlet quick connector is disposed on the cooling liquid inlet, and a liquid inlet with the housing is disposed on the cooling liquid outlet A quick connector-matched refrigeration outlet quick connector, the liquid inlet quick connector and the liquid outlet quick connector are used to seal the second coolant.
  • a power device for driving the second coolant circulation and a purification device for purifying the second coolant are further connected between the housing and the external refrigeration device.
  • the first cooling liquid is a silicon mineral oil and/or a fluorinating liquid; and the second cooling liquid is a combination of water and/or an additive and water.
  • the immersion liquid cooling device disclosed in the present application encapsulates an electronic component to be dissipated into a metal sealed casing filled with a first coolant, and a body connected to the external cooling device is opened on the body of the sealed casing.
  • a flow passage filled in the flow passage with a second coolant for circulating between the sealed housing body and the external cooling device the heat generated by the electronic component during operation is directly transmitted to the first coolant, and the first coolant is passed through
  • the sealed casing made of metal transfers heat to the second cooling liquid at a low temperature to complete heat exchange between the electronic components and the outside, and the first coolant directly in contact with the electronic components in the sealed casing is used in a small amount, and each sealed casing is used.
  • the second coolant circulating between the closed chamber and the external cooling device can use inexpensive water or other inexpensive cooling medium, it is solved that the full immersion or node liquid cooling requires a large amount of expensive coolant. , reducing the cost of the liquid cooling system. Moreover, the heat dissipation efficiency of the liquid cooling system is improved by the design of the position and number of the flow path.
  • the present application further provides a blade server provided with a liquid cooling device, wherein the blade server is provided with the immersion liquid cooling device according to the first aspect and the first aspect of any possible implementation manner.
  • Providing at least one housing and at least one external cooling device in the blade server that is, one housing may be disposed in the blade server, or a plurality of housings may be disposed, and the plurality of housings may share an external cooling device,
  • An external refrigeration unit can be configured for each housing.
  • the present application further provides a rack server provided with a liquid cooling device, wherein the rack server is provided with the immersion liquid as described in the first aspect and the first aspect of any possible implementation manner.
  • Cold device At least one housing and at least one external cooling device are disposed in the rack server, that is, one housing may be disposed in the blade server, or a plurality of housings may be disposed, and the plurality of housings may share an external cooling device. It is also possible to configure an external refrigeration device for each housing.
  • FIG. 1 is a longitudinal sectional structural view of a submerged liquid cooling device provided by the present application.
  • FIG. 2 is a longitudinal sectional structural view of another submerged liquid cooling device provided by the present application.
  • FIG. 3 is a longitudinal sectional structural view of another submerged liquid cooling device provided by the present application.
  • FIG. 4 is a schematic exploded view of a housing provided by the present application.
  • FIG. 4a is a schematic exploded view of another housing provided by the present application.
  • Figure 5 is a top plan view of a top plate provided by the present application.
  • Figure 6 is a top plan view of another top plate provided by the present application.
  • Figure 7 is a top plan view of the top panel of Figure 6 provided by the present application.
  • FIG. 8 is a schematic perspective view of a top plate having a main channel and a runner according to the present application.
  • FIG. 9 is a schematic structural diagram of a liquid-cooled blade server provided by the present application.
  • FIG. 10 is a schematic structural diagram of a liquid-cooled rack server provided by the present application.
  • FIG. 1 is a schematic longitudinal sectional view of a liquid cooling device provided by the present application.
  • the liquid cooling device comprises a housing and an external refrigeration device (2).
  • Figure 4 further illustrates an exploded configuration of the housing, as shown in Figure 4, the housing including a hollow housing body (12), a bottom plate (13) and a top plate (14), which are sealed to form a closed cavity ( 11)
  • a flow path (6) is opened on the body of the top plate (14).
  • the housing includes a closed cavity (11) in which an electronic component (7) to be dissipated is mounted.
  • the first coolant is filled in the closed cavity (11) and filled with the closed cavity (11) in direct contact with the electronic component (7) to be dissipated.
  • the flow path (6) is not in communication with the closed cavity (11), but is in communication with an external cooling device, and is formed in the flow path (6) and the external refrigeration device (2).
  • the circuit is filled with a second coolant.
  • the external refrigerating device (2) is for cooling the second coolant and providing circulating power to the second coolant.
  • the second coolant carrying the heat flows into the external refrigerating device, and after being cooled by the external refrigerating device, the second cooling liquid that flows out of the low temperature flows out, and exchanges heat with the first cooling liquid encapsulated in the casing to dissipate the electronic components to be dissipated. Cool down.
  • the external refrigeration device may be a cold well, a cooling tower, or the like equipped with a power device.
  • body refers to the tangible entity that constitutes the component itself, for example, the body of the top plate refers to the panel itself that constitutes the top panel.
  • a separate power device (3) may be connected in the circuit formed by the housing and the external refrigeration device (2) for providing circulating power to the second coolant to increase the second coolant in the circuit.
  • the rate of circulation thereby increasing heat transfer efficiency.
  • a purification device (4), a flow rate monitoring device (16), and a pressure monitoring device (17) may be connected to the circuit formed by the housing and the external refrigeration device (2).
  • the power device (3) is configured to provide circulating power to the second coolant, so that the second coolant continuously circulates between the casing and the external refrigeration device (2), such as a circulation pump, Pressure pump, etc.
  • the purifying device (4) is used for purifying the second cooling liquid, removing mechanical impurities which may exist in the second cooling liquid or impurities such as microorganisms generated by the second cooling liquid, and preventing impurities in the second cooling liquid from causing damage to other equipment in the circuit.
  • the purification device (4) such as a filter membrane, a line filter, and the like.
  • a flow rate monitoring device (16) is used to monitor a second coolant flow rate, such as a flow meter or the like.
  • a pressure monitoring device is used to monitor the second coolant pressure, such as a hydraulic gauge or the like.
  • one housing can be connected to one or more external refrigeration devices.
  • an external refrigeration device may be cooled only for one housing, or may be cooled for multiple housings at the same time, and the plurality of housings may be connected in series or in parallel, in the following description of the present application,
  • the housing is connected to an external cooling device as an example for description.
  • the first coolant may be selected from at least one of a silicon mineral oil or a fluorinated liquid, for example, OptiCool 87252 UV manufactured by Liquid Cool Solution Co., Ltd., or Novec TM 649 manufactured by 3M Company.
  • the second cooling liquid may be selected from at least one of water or a composition formed of an additive and water.
  • the additive is a substance which is soluble in water or miscible with water, such as ethylene glycol, etc., and the composition of ethylene glycol and water has a condensation point of less than -20 ° C. Therefore, under the same conditions, the low condensation
  • the second coolant at the point can exchange more heat with the first coolant.
  • the addition of ethylene glycol to the water can effectively inhibit the growth of microorganisms in the water, thereby facilitating equipment maintenance and maintenance.
  • a composition in which a second cooling liquid is used as an additive and water is described in further detail as an example.
  • the immersion liquid cooling device of the embodiment has the working principle that: after the electronic component to be dissipated heats up, the first coolant overflowing around it absorbs the heat emitted by the electronic component to be dissipated, and passes through the first The coolant is conducted to the surface of the closed cavity, and then transmitted to the external refrigeration device through the second coolant flowing in the flow channel, thereby achieving continuous heat dissipation of the electronic component to be dissipated, and the external cooling device circulating in the second coolant The circulation power is provided for the second coolant.
  • the housing shown in Figure 1 is made of a thermally conductive material, such as a metal-made housing or a ceramic-made housing.
  • a thermally conductive material such as a metal-made housing or a ceramic-made housing.
  • the metal shell is convenient for the thickness of the shell, and the density is small.
  • the shell can maintain the physical structure stability without the destructive deformation such as chipping, which is convenient. Used and maintained in electronic equipment.
  • the structure of the housing can adopt any one of the following structures:
  • Structure 1 The top plate, the bottom plate and the shell body can be removed.
  • FIG. 4 is a schematic structural view of a housing provided by the present application.
  • the housing includes a hollow housing body (12), a bottom plate (13) sealingly coupled to the bottom end of the housing body (12), and a top plate (14) sealingly coupled to the top end of the housing body (12), the bottom plate (13) And the top plate (14) and the casing body (12) are detachably connected, so that the equipment veneer (81) is installed in the sealed casing, so that the inside of the casing forms a closed cavity (11).
  • a flow path (6) is opened in the body of the top plate (14).
  • the bottom plate (13) is a flat plate so that the casing is stably installed in the whole machine.
  • a seal member (91) is provided at a joint of the case main body (12) with the detachably attached top plate (14) and the bottom plate (13) for preventing the inside of the closed cavity (11)
  • the first cooling liquid seeps out of the casing.
  • the sealing member (91) may be any one of parts for sealing, such as a sealing ring, a sealing strip or the like.
  • the device board (81) can be clamped between the shell body (12) and the bottom plate (13), that is, the top plate (14), the shell body (12), the device board (81) and the bottom plate (13) are sequentially stacked. .
  • the device board (81) can also be clamped between the top board (14) and the shell body (12), that is, the top board (14), the equipment board (81), the shell body (12) and the bottom board ( 13) Stack settings in sequence.
  • the bottom plate (13) and the main body (12) are fastened by fasteners such as screws or the like, or are fixedly connected by a snap.
  • Structure 2 The bottom plate and the shell body are detachable, and the top plate and the shell body are not detachable.
  • FIG. 4a is a schematic structural view of another housing provided by the present application, and the difference from FIG. 4 is that the top plate (14) is integrally formed with the main body (12), and only the bottom plate and the main body are detachable, thereby adding a closed cavity. (11) Sealability.
  • the device board (81) is clamped between the shell body (12) and the bottom plate (13), that is, the top plate (14), the shell body (12), the device veneer (81), and the bottom plate (13). ) Cascade settings in sequence.
  • the bottom plate (13) is integrally formed with the shell body (12), and only the top plate and the shell body are detachable, which increases the sealing property of the closed cavity (1).
  • the equipment board (81) is clamped between the top board (14) and the shell body (12), that is, the top board (14), the equipment board (81), the shell body (12) and the bottom board (13). ) Cascade settings in sequence.
  • At least one electronic component (7) to be dissipated is included in the sealed cavity (11) of the housing.
  • the electronic component to be dissipated includes a CPU, a memory or a network card, and the electronic component (7) to be cooled is mounted on a printed circuit board (PCB board) according to a preset position and connection manner to form a device board. (81).
  • the device board (81) is fixed in the closed cavity (11).
  • the electronic components to be dissipated in the electronic device may be the same or different, and the application is not limited. As shown in Figure 1, the electronic device includes two different electronic components.
  • a connector (8) is also mounted on the device board (81) for electrically connecting to the backplane (9) or other electronic components.
  • the number of connectors (8) on the device board (81) may be one or more.
  • the connector (8) may be disposed outside the housing or may be embedded in the housing body. For example, two connectors (8) are mounted on the device board (81) shown in Fig. 1, and the connector (8) is disposed outside the casing.
  • the backplane (9) is a circuit board that is used for electrical connection between the electronic components (7) to be dissipated and other electronic components, wherein the other electronic components are electronic components disposed outside the casing.
  • FIG. 2 is a schematic longitudinal sectional view of another submerged liquid cooling device provided by the present application.
  • the difference from FIG. 1 is that the right side connector of the device board (81) in the immersion liquid cooling apparatus shown in FIG. 2 is electrically connected to other electronic components.
  • the channel connecting the housing to the external cooling device (2) may pass through the backboard (9) according to service requirements, or may not pass through the backplane (9), which is not limited in the application.
  • connection path of the housing to the external refrigeration unit (2) passes through the backing plate (9).
  • the shape of the casing in the submerged liquid cooling apparatus may also vary.
  • the shape of the casing may be a rectangular parallelepiped structure as shown in FIG.
  • the shape of the housing matches the shape of the electronic component (7) to be dissipated. Since the device board (81) is provided with a plurality of different electronic components (2), the physical shapes of the electronic components are different, and the height difference is large. Therefore, the shape of the housing can follow the electronic components. The shape changes, as the shape of the housing changes as the height of the electronic component changes. On the one hand, the volume of the whole machine is reduced, and on the other hand, the volume of the cavity inside the casing is reduced, thereby reducing the amount of the first coolant, thereby reducing the cooling cost.
  • the top plate (14) may be a flat plate or a curved plate, which is adapted to the outer shape of the casing to form a closed cavity (11).
  • one housing may be provided for each electronic component to be cooled, or one housing may be provided for two or more electronic components to be cooled.
  • At least one flow channel (6) may be opened in each of the housing bodies, each of which is in communication with an external refrigeration device (2).
  • FIG. 5 is a cross-sectional top view of a flow channel top plate provided by the present application.
  • a linear flow path (6) is formed on the body of the top plate (14).
  • the flow path of the linear coolant (6) to the second coolant is small, and therefore, the flow rate of the second coolant is fast, the heat exchange efficiency is high, and the linear flow path is easy to open.
  • FIG. 6 is a top plan view of a cross section of a flow passage top plate provided by the present application. As shown in FIG. 6, two curved flow passages (6) are formed on the body of the top plate (14). The two flow passages (6) are connected in parallel to the same external refrigeration device (2) such that the second coolant in each flow passage (6) discharges the heat conducted by the first coolant to the outside of the electronic device, thereby Improve heat dissipation efficiency.
  • the plurality of flow channels can be connected to reduce the number of closed loops and facilitate the cooling of the second coolant.
  • the plurality of flow channels may be disconnected to form a plurality of closed loops for the second coolant circulation, that is, multiple paths are simultaneously
  • the liquid cooling device provides a second cooling liquid at a low temperature to improve heat dissipation efficiency.
  • the flow channel (6) in the present application is opened inside the casing body, that is, may be opened inside the body of at least one of the casing body (12), the top plate (14) or the bottom plate (13).
  • the flow channel (6) is opened in the body of the top plate (14), so that the first coolant heated by the heat is cooled at the top of the casing, and the first coolant after cooling and cooling is naturally lowered. Thereby, heat convection is formed inside the casing, thereby continuously dissipating heat to the electronic component (2).
  • FIG. 3 is a schematic longitudinal sectional view of another submerged liquid cooling device provided by the present application.
  • a flow path (6) is respectively opened in the body of the top plate (14) and the body of the casing body (12), and the two flow paths are connected, that is, two flow paths ( 6) Connecting in series with the same external refrigeration device (2) to form a closed loop for circulating the second cooling liquid, increasing the heat exchange area of the first coolant and the second coolant, thereby improving heat dissipation efficiency.
  • a flow channel (6) is respectively disposed in the body of the top plate (14) and the body of the shell body (12), the two flow channels are not connected, and are respectively connected in parallel with the refrigeration device (5) to form two cycles.
  • a closed circuit of the cooling liquid the first coolant heated by the heat is cooled at the top of the casing, and the first coolant after the cooling and cooling is naturally lowered, thereby forming a heat convection inside the casing, and the second cooling is performed at a low temperature.
  • the liquid further cools the descending first cooling liquid through a flow path disposed on the shell body (12), thereby speeding up the speed of the heat convection cycle, and on the other hand, cooling the first coolant more fully, thereby improving Heat dissipation efficiency of electronic components (2).
  • the shape of the flow path (6) may be a linear distribution, a curved distribution or a spiral distribution.
  • the curved profile refers to at least one bend of the flow channel (6), such as a serpentine distribution, a zigzag distribution, a U-shaped distribution, etc.
  • the spiral distribution refers to a spiral extension of the flow channel.
  • the linear distribution means that the flow path (6) is linear, that is, a straight line between the housing inlet (61) and the housing outlet (62). Shaped channel.
  • the different flow paths (6) can be divided into a main flow path and a main flow path.
  • the shunt channel is connected to the main flow channel, and the main flow channel includes a main flow channel for the liquid inlet and an optional main flow channel, and the shunt channel is a flow channel which is branched from the main flow path branch to the main flow channel of the liquid discharge, or is a liquid inlet channel.
  • FIG. 8 is a schematic diagram of a three-dimensional structure of a top plate capable of realizing a main channel and a bypass channel according to the present application.
  • the flow channel (6) includes a linear liquid inlet main channel (63) and a strip.
  • the linear outlet main flow channel (64) and the plurality of U-shaped shunt passages (65), the ports of the liquid inlet main flow path (63) and the ports of the liquid discharge main flow path (64) are respectively opened on the surface of the top plate (14), and the outside Connected, the second coolant flows into the top plate (14) by the liquid inlet main channel (63) disposed in the lower layer, passes through the branching channel (65), and then flows out through the top plate through the main flow channel (64) of the liquid outlet 14 disposed in the upper layer ( 14), cycle to the external cooling equipment (2).
  • the two ports of the flow passage (6) on the housing body are a housing inlet (61) and a housing outlet (62), respectively, for the second coolant inflow passage (6).
  • the outflow channel (6) such that the second coolant circulates between the flow channel (6) and the external refrigeration device (5).
  • the housing inlet port ( 61 ) is disposed adjacent to the housing outlet port ( 62 ) to facilitate communication between the flow channel ( 6 ) and the refrigeration device ( 5 ). Reduce the occupation of space.
  • a housing liquid inlet quick connector (611) is disposed on the housing inlet port (61).
  • the quick connector is used alone, the liquid outflow in the pipeline can be stopped, and after the two quick connectors are docked, The pipeline forms a passage, and the liquid can flow in the formed passage. After the two docked quick joints are separated, the pipeline can be immediately sealed to stop the outflow of the liquid in the pipeline.
  • a housing outlet quick connector (621) is disposed at the housing outlet port (62), and a quick connector for discharging the housing is provided on the cooling liquid inlet (51).
  • 621) A matched refrigerant inlet quick connector (511), on which a refrigerant outlet quick connector (521) matching the housing inlet quick connector (611) is disposed.
  • the housing liquid inlet quick connector (611) is in fixed communication with the corresponding refrigerant outlet quick connector (521), and the refrigeration liquid inlet quick connector (511) is in fixed communication with the corresponding housing outlet quick connector (621).
  • the flow passage (6) communicates with the cooling liquid outlet (52) through the housing inlet (61), and the housing outlet (62) communicates with the cooling inlet (51) to make the flow passage (6) and the cooling
  • the device (5) forms a closed loop.
  • the second coolant flows into the flow channel (6) from one end of the electronic component (7) to be dissipated, and flows out from one end of the electronic component (7) to be cooled.
  • the flow channel (6) causes the second cooling liquid at a low temperature to first contact the high temperature casing to exchange heat with the heat sink, thereby improving the heat dissipation efficiency of the electronic component to be dissipated.
  • the liquid cooling device encapsulates the electronic component to be dissipated into a metal sealed casing filled with the first cooling liquid, and is provided with external cooling on the body of the sealed casing.
  • a flow passage connected to the device, the flow channel is filled with a second coolant for circulating between the sealed casing body and the external cooling device, and the heat generated by the electronic component during operation is directly transmitted to the first coolant, the first cooling
  • the liquid then transfers the heat to the second cooling liquid through the sealed casing of the metal to complete the heat exchange between the electronic component and the outside, and the first coolant directly in contact with the electronic component in the sealed casing is used in a small amount, and each The sealed housings are independent of each other, facilitating the maintenance of electronic components and improving maintenance efficiency.
  • the second coolant circulating between the closed chamber and the external cooling device can use inexpensive water or other inexpensive cooling medium, it is solved that the full immersion or node liquid cooling requires a large amount of expensive coolant. , reducing the cost of the liquid cooling system. Moreover, the heat dissipation efficiency of the liquid cooling system is improved by the design of the position and number of the flow path.
  • FIG. 9 is a schematic structural diagram of a liquid-cooled blade server provided by the present application.
  • the blade server includes four blade servers, and each blade server is separately installed in one shell, 4
  • the housings share an external refrigeration unit to form a set of submerged coolant units.
  • multiple blade servers are connected by a backplane (9).
  • the structure of the immersion cooling device is the same as that described in FIGS. 1 to 8 and will not be described again.
  • the rack server group includes four rack servers (C). Wherein, each rack server is installed in one housing, and four housings share an external cooling device to form the above-mentioned submerged liquid cooling device. In this mode, only between the housing and the external refrigerating device Set power equipment and purification equipment without setting up flow rate monitoring equipment or pressure monitoring equipment.
  • the structure of the immersion cooling device is the same as that described in FIG. 1 to FIG. 8 and will not be described herein.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Cette invention concerne un appareil de refroidissement par liquide de type immergé, un serveur de type lame et un serveur de type châssis. L'appareil de refroidissement par liquide comprend un boîtier et un dispositif de refroidissement externe, une cavité fermée étant agencée dans le boîtier. Des composants électroniques à refroidir sont installés dans la cavité fermée qui est remplie d'un premier liquide de refroidissement. Au moins un canal est agencé dans le corps du boîtier, et le canal et le dispositif de refroidissement externe forment une boucle qui est remplie d'un second liquide de refroidissement. Le dispositif de refroidissement externe est utilisé pour refroidir le second liquide de refroidissement et fournit une puissance de circulation pour le second liquide de refroidissement. Le second liquide de refroidissement évacue la chaleur des composants électroniques à refroidir conduite par le premier liquide de refroidissement à travers la cavité fermée à l'extérieur du boîtier, de façon à refroidir les composants électroniques à refroidir. L'invention permet de résoudre les problèmes de faible efficacité de rayonnement thermique et de coût de production élevé ou de coût de fonctionnement élevé d'un système de refroidissement par liquide, ainsi que la difficulté d'entretien des composants électroniques.
PCT/CN2018/076744 2017-07-17 2018-02-13 Appareil de refroidissement par liquide de type immergé, serveur de type lame et serveur de type châssis WO2019015321A1 (fr)

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