CN113597202A - Cold drawing and electronic equipment - Google Patents

Cold drawing and electronic equipment Download PDF

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Publication number
CN113597202A
CN113597202A CN202110734194.8A CN202110734194A CN113597202A CN 113597202 A CN113597202 A CN 113597202A CN 202110734194 A CN202110734194 A CN 202110734194A CN 113597202 A CN113597202 A CN 113597202A
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China
Prior art keywords
channel
liquid
cooling
hole
cold plate
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Granted
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CN202110734194.8A
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Chinese (zh)
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CN113597202B (en
Inventor
田婷
曹士彧
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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Priority to CN202110734194.8A priority Critical patent/CN113597202B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The application discloses a cold plate, which comprises a first plate body, a liquid inlet hole and a liquid outlet hole; the first plate body is used for approaching or contacting a piece to be cooled; a first channel formed on a side adjacent to the first plate body, the first channel being for circulating a cooling liquid; the second channel is formed on one side, far away from the first plate body, of the first channel, the second channel is communicated with the first channel through at least one liquid supply hole, and cooling liquid flowing through the second channel supplies liquid to the first channel through the liquid supply hole; the first channel is provided with a first structure, and the first structure is used for enabling the pressure intensity of cooling liquid flowing through the first channel to be smaller than the pressure intensity of cooling liquid flowing through the second channel.

Description

Cold drawing and electronic equipment
Technical Field
The application relates to the technical field of machinery, in particular to a cold plate and electronic equipment.
Background
Electronic equipment generates heat during data operation, the operating performance of the electronic equipment is affected by high temperature, and the electronic equipment needs to be cooled in order to operate efficiently. The cold drawing is the radiating device of liquid cooling that is used for carrying out electronic equipment, is provided with many confession coolant liquid in the cold drawing and flows the passageway, on the heat conduction of the device that generates heat is to the cold drawing, the heat absorbs through the inside coolant liquid of cold drawing, along with the flow entering outer cold circulation system of coolant liquid, scatters outdoor. However, the heat dissipation capability of the conventional cold plate is limited, and the heat dissipation capability of the cold plate needs to be improved.
Disclosure of Invention
The embodiment of the application provides a cold plate and electronic equipment, which can cool a local area of a to-be-cooled part with high efficiency and pertinence.
A first aspect of the present application provides a cold plate, comprising a first plate body, a liquid inlet and a liquid outlet; the first plate body is used for approaching or contacting a piece to be cooled; a first channel formed on a side adjacent to the first plate body, the first channel being for circulating a cooling liquid; the second channel is formed on one side, far away from the first plate body, of the first channel, the second channel is communicated with the first channel through at least one liquid supply hole, and cooling liquid flowing through the second channel supplies liquid to the first channel through the liquid supply hole; wherein the first passage has a first configuration for causing a pressure of the cooling fluid flowing through the first passage to be less than a pressure of the cooling fluid flowing through the second passage.
In one embodiment, the liquid inlet hole is communicated with the first channel and the second channel and is used for supplying liquid to the first channel and the second channel; the liquid outlet hole is communicated with the first channel and used for discharging the cooling liquid in the first channel.
In one embodiment, the first structure is a heat sink.
In one embodiment, the cross-sectional area of the second channel decreases from the inlet side to the outlet side, so that the flow rate of the cooling liquid in the second channel is lower on the inlet side than on the outlet side.
In one embodiment, the liquid supply hole is provided in plurality, the second channel extends towards the liquid supply hole to form a tree-shaped channel, and the cross-sectional area of the tree-shaped channel is reduced in stages.
In an embodiment, the last stage channel corresponding to the second channel is used for communicating the previous stage channel and the liquid supply hole.
In an embodiment, a space is formed between the second channel and the first plate channel, and the space is a thermal insulation layer disposed between the second channel and the first channel.
In one embodiment, the member to be cooled has a first heat generation area and a second heat generation area, and the first heat generation area has a higher cooling demand than the second heat generation area; the liquid supply hole is formed in a position corresponding to the first heat generation area.
In an embodiment, a flow stopping mechanism is connected to the second channel, and the flow stopping mechanism is used for blocking the flow of the cooling liquid in the second channel to the first channel.
A second aspect of the present application provides an electronic device, comprising: an electronic component and the cooling device of any one of the first aspect, the cooling device being configured to be in proximity to or in contact with a surface of the electronic component, the cooling device being configured to cool the electronic component.
The application provides a cold drawing and electronic equipment makes the coolant liquid in the second passageway flow to first passageway in confession liquid hole department through addding the second passageway to promote the coolant liquid that is located confession liquid hole circumference first passageway to being located the cooling effect of this regional part of waiting to cool off, realize high-effect and have and pertinently cool off and wait to cool off a local region.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:
in the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
FIG. 1 is a schematic cross-sectional view of a cold plate according to a first embodiment of the present application;
FIG. 2 is a schematic cross-sectional view of a cold plate according to a second embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of a cold plate according to a third embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of a cold plate according to a fourth embodiment of the present application;
FIG. 5 is a schematic front view of a cold plate according to a fifth embodiment of the present application;
fig. 6 is a schematic front view of a cold plate according to a sixth embodiment of the present application.
Wherein the reference numbers are as follows: 1. a first plate body; 2. a liquid inlet hole; 3. a liquid outlet hole; 4. a member to be cooled; 5. a first channel; 6. a second channel; 7. a liquid supply hole; 8. a first structure; 9. a second plate body.
Detailed Description
In order to make the objects, features and advantages of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Fig. 1 is a schematic cross-sectional view of a cold plate according to a first embodiment of the present application.
Referring to fig. 1, a first aspect of the present application provides a cold plate, which includes a first plate body 1, a liquid inlet hole 2, and a liquid outlet hole 3; the first plate body 1 is used for approaching or contacting the piece to be cooled 4; a first channel 5 formed on a side adjacent to the first plate body 1, the first channel 5 being for circulating a cooling liquid; the second channel 6 is formed on one side, away from the first plate body 1, of the first channel 5, the second channel 6 is communicated with the first channel 5 through at least one liquid supply hole 7, and cooling liquid flowing through the second channel 6 supplies liquid to the first channel 5 through the liquid supply hole 7; wherein the first channel 5 has a first structure 8, the first structure 8 being adapted such that the pressure of the cooling liquid flowing through the first channel 5 is lower than the pressure of the cooling liquid flowing through the second channel 6.
The application provides a cold plate is through addding second passageway 6, makes the coolant liquid in the second passageway 6 flow to first passageway 5 in confession liquid hole 7 department to promote the coolant liquid that is located the first passageway 5 of confession liquid hole 7 circumference to the cooling effect of treating cooling part 4 that is located this region, realize high-effect and have the effect of pertinence cooling treating cooling part 4 local area, need not to promote the whole flow of cold drawing and treat cooling part 4's whole area of contact. This application is compared in the scheme of cooling in order to carry out the part through promoting cold drawing whole cooling effect, and is less to coolant liquid inlet temperature and feed liquid pressure's requirement, has reduced the required energy consumption of cooling, has substantially improved cold drawing liquid cooling radiating efficiency. This application need not increase liquid flow by a wide margin, or reduces the inlet liquid temperature deliberately, greatly improves the radiating efficiency of cold drawing, reduces the device that generates heat and economizes on the temperature, effectively breaks the heat dissipation bottleneck of submergence liquid cooling system. And only influence the local layout design of the cold plate, and the design influence on the liquid cooling system is small.
Specifically, the arbitrary position at the cold drawing can be seted up in income liquid hole 2 and play liquid hole 3 of this application, it is relative with the position of going out liquid hole 3 usually to go into liquid hole 2, it is connected with the coolant liquid storage box to go into liquid hole 2 for with coolant liquid source incasement coolant liquid input cold drawing, coolant liquid flows through behind first passageway 5 and the second passageway 6, flows out from going out liquid hole 3, it can be connected to coolant liquid storage box or collection box to go out liquid hole 3, be used for receiving the coolant liquid that flows out from going out liquid hole 3.
The first plate body 1 can be made of metal with good heat conductivity, and when the cold plate is integrally fixed on the surface of the to-be-cooled part 4, one of the surfaces of the first plate body 1 is close to or in contact with the to-be-cooled part 4, so that heat emitted by the to-be-cooled part 4 and heat exchange of cooling liquid in the first channel 5 are realized, and the purpose of cooling the to-be-cooled part 4 is realized.
First passageway 5 is enclosed by the plate body and another surface of first plate body 1 and closes and forms, and first passageway 5 can with go into liquid hole 2 and go out liquid hole 3 intercommunication to absorb and take away the heat of treating that cooling part 4 gived off, according to the way of enclosing of plate body, first passageway 5 can form into the passageway that one or more confession cooling liquid circulate. When the first channel 5 is a plurality of channels, the first channel 5 may be a plurality of channels separated by a plate and not communicated with each other, or may be a plurality of channels separated by a plate and communicated with each other. Further, according to the arrangement of the plate body, the plurality of first channels 5 may be the same-shaped first channels 5, or different-shaped first channels 5. The shape of the first channel 5 may be regular or irregular, and the cut-off surfaces of different first channels 5 may be the same or different.
The second channel 6 is formed on one side of the first channel 5 far away from the first plate body 1, the second channel 6 can be formed on one side surface of the first channel 5 far away from the first plate body 1, for example, the first channel 5 and the second channel 6 are separated by the second plate body 9, the first surface of the second plate body 9 is used for enclosing with the first plate body 1 to form the first channel 5, the second surface of the second plate body 9 is used for enclosing with other plate bodies to form the second channel 6, and in this case, the liquid injection hole can be opened on the second plate body 9.
FIG. 2 is a schematic cross-sectional view of a cold plate according to a second embodiment of the present application
Referring to fig. 2, in another case, the second passage 6 may be formed independently, for example, the second passage 6 may be formed by an infusion tube, one end of which is connected to the coolant storage tank and the other end of which is directly connected to the liquid injection hole; the second channel 6 can also be another cold plate, the liquid inlet 2 of the other cold plate is connected with a cooling liquid storage box, and the liquid outlet 3 is directly connected to the liquid inlet. Through the two-channel design of first passageway 5 and second passageway 6, can be to waiting the heat flux density distribution of cooling piece 4, the liquid hole is annotated in the design, and the coolant liquid is not restricted to and flows through first passageway 5 flow direction from the income liquid hole 2 of cold drawing and goes out liquid hole 3 to can realize fixing a position input coolant liquid or set up it to nearest coolant liquid route of flowing through to appointed high heat density position, in order to reach the high-efficient refrigerated purpose in location.
Annotate the liquid hole and be used for communicateing first passageway 5 and second passageway 6, annotate the liquid hole and can set up on being used for enclosing and close arbitrary plate that forms first passageway 5, specifically, annotate the position of seting up the position of liquid hole and according to treating that cooling member 4 needs strengthen the position of cooling effect, according to treating that cooling member 4 is last need strengthen the position quantity of cooling effect, annotate the quantity in liquid hole and also can correspond to one or more. Through the design of annotating the liquid hole, can realize the fixed point and supply liquid in a flexible way high-efficiently to shorten partial coolant liquid and flow to the distance of waiting the cooling point, greatly strengthen the radiating efficiency of cold drawing, break the heat dissipation bottleneck of cold drawing.
Wherein the first channel 5 further has a first structure 8 therein, the first structure 8 being adapted to cause a pressure in the first channel 5 to be lower than a pressure in the second channel 6, thereby causing the cooling liquid to flow from the second channel 6 to the first channel 5. Specifically, the first structure 8 may be a flow guide plate disposed in the circumferential direction of the liquid injection hole, so that the cooling liquid in the second passage 6 flows to the first passage 5 in a unidirectional manner. Correspondingly, a second structure may be further disposed in the second channel 6, and the second structure is configured to increase the flow rate of the cooling liquid in the second channel 6 so as to increase the pressure of the cooling liquid flowing through the second channel 6 to be greater than the pressure of the cooling liquid flowing through the first channel 5.
In one embodiment, the liquid inlet hole 2 is communicated with the first channel 5 and the second channel 6 and is used for supplying liquid to the first channel 5 and the second channel 6; the liquid outlet hole 3 communicates with the first channel 5 for discharging the cooling liquid in the first channel 5.
According to the specific communication structure design of the first channel 5 and the second channel 6, the liquid inlet hole 2 can be only communicated with the first channel 5, can also be only communicated with the second channel 6, and can also be simultaneously communicated with the first channel 5 and the second channel 6.
Referring to fig. 1, when the first channel 5 and the second channel 6 are communicated at a side close to the inlet hole 2, the inlet hole 2 may be communicated with only the first channel 5, only the second channel 6, or both the first channel 5 and the second channel 6, so that the cooling liquid can enter the first channel 5 and the second channel 6 through the inlet hole 2.
Fig. 3 is a schematic cross-sectional view of a cold plate according to a third embodiment of the present application.
Referring to fig. 3, in the case where the first passage 5 and the second passage 6 are not communicated on the side close to the inlet port 2, the inlet port 2 may be communicated only with the second passage 6 to allow the coolant in the second passage 6 to enter the first passage 5 through the inlet port. The inlet 2 may also communicate with both the first channel 5 and the second channel 6.
In a similar way, according to the specific communicating structure design of the first channel 5 and the second channel 6, the liquid outlet hole 3 of the present application can be communicated with only the first channel 5, also can be communicated with only the second channel 6, and also can be communicated with the first channel 5 and the second channel 6 simultaneously.
When first passageway 5 and second passageway 6 are being close to under the condition that goes out liquid hole 3 one side not communicate, go out liquid hole 3 can only with first passageway 5 intercommunication for the coolant liquid in the first passageway 5 of discharge, so that the coolant liquid in the second passageway 6 can just discharge in flowing into first passageway 5 through annotating the liquid hole, has improved the utilization ratio of the coolant liquid in second passageway 6. The liquid outlet holes 3 can also be simultaneously communicated with the first channel 5 and the second channel 6 so as to guarantee the flow rate of the cooling liquid.
Fig. 4 is a schematic cross-sectional view of a cold plate according to a fourth embodiment of the present application.
Referring to fig. 4, when the second channel 6 is cut off by the second structure in the second channel 6, the second plate 9 may further have a communication hole, and the liquid outlet hole 3 may be communicated with only the second channel 6, so that the flow direction of the cooling liquid is: the liquid inlet hole 2 → the second channel 6 → the liquid inlet hole → the first channel 5 → the communication hole → the second channel 6 → the liquid outlet hole 3.
In one possible embodiment, the first structures 8 are heat dissipating fins. Further, the fin structure form includes any one or a combination of more than one of the chip type, the string type, the welding chip type and the rolled chip type. The radiating fins can increase the radiating area of the cold plate, improve the heat exchange efficiency and further improve the radiating effect, and meanwhile have certain turbulence and flow blocking effects so as to achieve the purpose that the pressure of the cooling liquid flowing through the first channel 5 is smaller than the pressure of the cooling liquid flowing through the second channel 6. Correspondingly, the second structure may be a baffle for the purpose of making the pressure of the cooling liquid flowing through the second channel 6 higher than the pressure of the cooling liquid flowing through the first channel 5.
Fig. 5 is a schematic front view of a cold plate according to a fifth embodiment of the present application.
Referring to fig. 5, in an alternative embodiment, the cross-sectional area of the second passage 6 decreases from the side of the inlet 2 to the side of the feed hole 7, so that the flow rate of the coolant in the second passage 6 is lower on the side of the inlet 2 than on the side of the feed hole 7.
Specifically, according to the design requirement of the liquid injection hole, the plate may enclose the second channel 6 with various shapes, and the shape of the second channel 6 may further include, but is not limited to, a tapered channel, a straight tube channel, a bent tube channel, a tree channel, a channel with the same shape as the first plate, and the like.
Fig. 6 is a schematic front view of a cold plate according to a sixth embodiment of the present application.
Referring to fig. 6, in an embodiment, the liquid supply hole 7 is provided in plurality, the second channel 6 extends towards the liquid supply hole 7 to form a tree-shaped channel, and the cross-sectional area of the tree-shaped channel is reduced in steps.
Under the condition that the liquid feed holes 7 are multiple, the cooling liquid in the second channel 6 needs to flow to different liquid injection holes, based on the situation, the tree-shaped channel can be formed according to the position of the liquid injection hole, so that the cooling liquid in the second channel 6 can flow to the liquid injection hole in a targeted mode, each stage of the tree-shaped channel can form different cross-sectional areas, specifically, the cross-sectional area of the channel at the previous stage can be larger than that of the channel at the next stage, namely, the cross-sectional area of the tree-shaped channel close to the liquid injection hole 2 is larger than that of the tree-shaped channel close to the liquid injection hole, and the flow speed is faster as the cooling liquid approaches the liquid injection hole. It should be added that the cross-sectional area in this application refers to a cross-section perpendicular to the flow direction of the coolant.
In an embodiment, the last stage passage corresponding to the second passage 6 is used to communicate the upper stage passage with the feed hole 7. Furthermore, the starting end of the second channel 6 is communicated with the liquid inlet 2, and the tail end of the second channel can be communicated with the liquid inlet, namely the tail end of the second channel 6 is not communicated with the liquid outlet 3. The cooling liquid in the second channel 6 can completely enter the first channel 5 through the liquid injection hole, and the use efficiency of the cooling liquid in the second channel 6 is improved.
In an embodiment, a space is formed between the second channel 6 and the channel of the first plate 1, and the space is a heat insulation layer arranged between the second channel 6 and the first channel 5.
The second plate used for isolating the first channel 5 from the second channel 6 is selected as a heat insulation layer, the heat insulation layer can prevent the cooling liquid in the second channel 6 from exchanging heat with the cooling liquid in the first channel 5 in advance before entering the first channel 5 through the liquid injection hole, and the cooling liquid in the second channel 6 is ensured to cool the cooling parts around the liquid injection hole in a targeted manner.
In one embodiment, the member to be cooled 4 has a first heat generation area and a second heat generation area, the first heat generation area having a higher cooling demand than the second heat generation area; the liquid supply hole 7 is opened at a position corresponding to the first heat generation region.
The member to be cooled 4 may be industrial equipment, electronic equipment, components in electronic equipment, etc. as required, and the cooling member 4 is exemplified as a chip in the electronic equipment in the present application. The chip is connected with a plurality of functional modules, and the heat of the position of the chip functional module is greater than that of the position of the non-functional module of the chip, so that the position of the chip functional module needs to be subjected to targeted cooling. In this example, the first heat-generating region is the position of the chip functional module, and the second heat-generating region is the heat of the position of the chip non-functional module. The liquid supply hole 7 is formed in the heat insulation layer of the first channel 5 and the second channel 6 and is located right above or in front of the position where the chip function module is located, so that the cooling liquid in the second channel 6 can cool the position where the chip function module is located.
In an embodiment, a flow stopping mechanism is connected to the second channel 6, and the flow stopping mechanism is used for blocking the cooling liquid in the second channel 6 from flowing to the first channel 5.
According to electronic equipment's working requirement, functional module's on the chip service behavior also can not be different, promptly to different working requirements, the condition of different functional module work, promptly under the mode of working a bit, functional module does not carry out work a bit, these functional module have the demand that needs the pertinence cooling, under this condition, this application can seal the notes liquid hole that corresponds with the functional module that does not need the cooling through the mechanism that ends, so that the coolant liquid in the second passageway 6 can only cool down the functional module that needs the cooling and handle. Specifically, the flow stopping mechanism is a closed partition plate capable of being electrically controlled.
A second aspect of the present application provides an electronic device, comprising: an electronic component and the cooling device of any one of the first to third aspects, the cooling device being adapted to be brought into proximity with or into contact with a surface of the electronic component, the cooling device being adapted to cool the electronic component.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A cold plate comprises a first plate body, a liquid inlet and a liquid outlet;
the first plate body is used for approaching or contacting a piece to be cooled;
a first channel formed on a side adjacent to the first plate body, the first channel being for circulating a cooling liquid;
the second channel is formed on one side, far away from the first plate body, of the first channel, the second channel is communicated with the first channel through at least one liquid supply hole, and cooling liquid flowing through the second channel supplies liquid to the first channel through the liquid supply hole;
wherein the first passage has a first configuration for causing a pressure of the cooling fluid flowing through the first passage to be less than a pressure of the cooling fluid flowing through the second passage.
2. The cold plate of claim 1,
the liquid inlet hole is communicated with the first channel and the second channel and used for supplying liquid to the first channel and the second channel;
the liquid outlet hole is communicated with the first channel and used for discharging the cooling liquid in the first channel.
3. The cold plate of claim 1, said first structure being a heat sink fin.
4. The cold plate of claim 1, wherein the cross-sectional area of the second channel decreases from the port side to the port side such that the flow rate of the cooling fluid in the second channel is lower on the port side than on the port side.
5. The cold plate of claim 1, wherein the fluid feed hole is a plurality of fluid feed holes, the second channel extends in a direction towards the fluid feed hole to form a tree-shaped channel, and the cross-sectional area of the tree-shaped channel decreases in stages.
6. The cold plate of claim 5, wherein a last stage channel corresponding to the second channel is used to communicate a previous stage channel with the liquid supply hole.
7. The cold plate of claim 1, wherein a space is formed between the second channel and the first plate body channel, the space being a thermally insulating layer disposed between the second channel and the first channel.
8. The cold plate of claim 1, the member to be cooled having a first heat generating region and a second heat generating region, the first heat generating region having a higher cooling demand than the second heat generating region;
the liquid supply hole is formed in a position corresponding to the first heat generation area.
9. The cold plate of claim 1, wherein a flow stop mechanism is coupled to the second channel for blocking the flow of cooling fluid in the second channel to the first channel.
10. An electronic device, comprising: an electronic component and a cooling device as claimed in any one of claims 1-9, said cooling device being adapted to be brought into close proximity or into contact with a surface of said electronic component, said cooling device being adapted to cool said electronic component.
CN202110734194.8A 2021-06-30 2021-06-30 Cold plate and electronic equipment Active CN113597202B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230189484A1 (en) * 2021-12-15 2023-06-15 Baidu Usa Llc Hybrid system for servers

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108759533A (en) * 2018-05-29 2018-11-06 电子科技大学 A kind of microchannel cold plates, radiator and device based on 3D bulk prints
CN111479442A (en) * 2020-03-25 2020-07-31 中航光电科技股份有限公司 Array micro-jet and micro-channel composite cold plate
CN211630683U (en) * 2020-01-15 2020-10-02 苏州汇川联合动力系统有限公司 Heat abstractor and electric automobile controller
CN111918520A (en) * 2019-05-08 2020-11-10 华为技术有限公司 Heat sink and heat radiator
CN112822913A (en) * 2020-12-30 2021-05-18 西安交通大学 Penetrating ultrathin liquid cooling plate integrated with low-flow-resistance manifold network
CN213519929U (en) * 2020-07-17 2021-06-22 辽宁海澜沣沅新材科技发展有限公司 Novel cooling plate and device using same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108759533A (en) * 2018-05-29 2018-11-06 电子科技大学 A kind of microchannel cold plates, radiator and device based on 3D bulk prints
CN111918520A (en) * 2019-05-08 2020-11-10 华为技术有限公司 Heat sink and heat radiator
CN211630683U (en) * 2020-01-15 2020-10-02 苏州汇川联合动力系统有限公司 Heat abstractor and electric automobile controller
CN111479442A (en) * 2020-03-25 2020-07-31 中航光电科技股份有限公司 Array micro-jet and micro-channel composite cold plate
CN213519929U (en) * 2020-07-17 2021-06-22 辽宁海澜沣沅新材科技发展有限公司 Novel cooling plate and device using same
CN112822913A (en) * 2020-12-30 2021-05-18 西安交通大学 Penetrating ultrathin liquid cooling plate integrated with low-flow-resistance manifold network

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230189484A1 (en) * 2021-12-15 2023-06-15 Baidu Usa Llc Hybrid system for servers

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