TW201228570A - Liquid heat dissipation device - Google Patents

Liquid heat dissipation device Download PDF

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Publication number
TW201228570A
TW201228570A TW099144642A TW99144642A TW201228570A TW 201228570 A TW201228570 A TW 201228570A TW 099144642 A TW099144642 A TW 099144642A TW 99144642 A TW99144642 A TW 99144642A TW 201228570 A TW201228570 A TW 201228570A
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TW
Taiwan
Prior art keywords
liquid
cooling
inlet
heat
liquid inlet
Prior art date
Application number
TW099144642A
Other languages
Chinese (zh)
Inventor
Zeu-Chia Tan
Original Assignee
Hon Hai Prec Ind Co Ltd
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Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW099144642A priority Critical patent/TW201228570A/en
Priority to US13/036,045 priority patent/US20120152495A1/en
Publication of TW201228570A publication Critical patent/TW201228570A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0202—Header boxes having their inner space divided by partitions
    • F28F9/0204—Header boxes having their inner space divided by partitions for elongated header box, e.g. with transversal and longitudinal partitions
    • F28F9/0214—Header boxes having their inner space divided by partitions for elongated header box, e.g. with transversal and longitudinal partitions having only longitudinal partitions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A liquid cooling device includes at least one liquid cooling member and a container connecting with the at least one liquid cooling member. The at least one liquid cooling member defines a sealed receiving chamber for containing a working medium therein. The at least one liquid cooling member defines a liquid inlet and a liquid outlet communicating with the receiving chamber. The container defines a first channel and a second channel isolated from each other. The container includes an inlet conduit corresponding to the first channel provided for cool liquid entering the first channel, and an outlet conduit corresponding to the second channel provided for exit of heated liquid in the second channel. The liquid inlet is communicated with the liquid inlet channel, and the liquid outlet is communicated with the liquid outlet channel.

Description

201228570 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種液冷散熱裝置，特別涉及一種用於對發 熱電子元件散熱的液冷散熱裝置。 【先前技4奸】 [0002] 在電子裝置如機架式伺服器、記憶體和工作站中，其散 熱架構所佔空間、耗能和成本是考慮的重點。習知的電 子裝置的散熱架構多為風冷式，其一般包括貼設於發熱 電子元件上的一散熱器和結合於該散熱器上的一風扇， 用以將發熱電子元件的熱量散發出去。然，對於貨櫃式 資料中心（container data center)而言，因其進行 大量計算會產生大量熱量，在利用風冷的方式進行散熱 時，需要使用大量的散熱器和風扇才能及時地將熱量散 發出去，然，風扇數量的增多意味著其工作時所消耗的 總能量亦隨之劇增，不符合目前節能環保的理念。 【發明内容】 [0003] 鑒於此，有必要提供一種節能環保且所佔空間小的液冷 散熱裝置。 [0004] —種液冷散熱裝置，用於為至少一發熱電子元件散熱， 所述液冷散熱裝置包括至少一液冷頭和連接所述至少一 液冷頭的一箱體，所述液冷頭内形成有一封閉的容置空 間，所述液冷頭上設有一第一進液口和一第一出液口， 所述箱體包括互相隔離的一進液通道和一出液通道，所 述箱體於進液通道所在側設有用於供冷卻介質進入的進 液管，所述箱體於出液通道所在側設有供冷卻介質流出 099144642 表單編號 A0101 第 4 頁/共 15 頁 0992077137-0 201228570 [0005] =液管，所述第-進液，述進液通道相連通，所 ^ A液口與所述出液通道相連通。 =°Γ::Γ本案由於將風冷散熱裝置變更為液冷 成^置〜構較風冷散熱裝置簡單，體積更小，開發 =:::同平臺下重—擔， [0006] 【實施方式】 下面參照圖示結合實施例對本發明作進—步說明。 Q [0007] 圖1及圖2所示為本聲明一實施例的液冷散熱裝置刚。該 液冷散熱裝置1〇〇用於為一電子裝置，比如貨櫃式資料中 心内的複數發熱電子元件麟散熱1液冷散熱裝置1〇〇 包括1⑽及結合於該箱㈣底部的複數液冷頭ι〇。 該複數液冷頭10用於分別與複數發熱電子元件（圖未示 )接觸以分別吸收該複數發熱電子元件產生的熱量。於 本實施例中，該冷卻介質為水。可以理解4，該冷卻介 質亦可為其他的液體。 〇 w [0008] 母一液冷頭10包括—蓋板η、一散熟器12和—底座U。 該蓋板11與該底座丨3配合，形成一密封的容置空間Η， 該散熱器12收容於該容置空間14内。 [0009] 該蓋板11為一矩形板體，其上設有貫穿該蓋板U的一第 -進液口 111和-第—出液口112。於本實施例中，該第 -進液口111和第-出液口112均呈方形且位於該蓋板U 長度方向上的相對兩端。 [0010] 該底座13大致呈頂側間口的長方體形，該底座與該蓋 099144642 表單編號A0101 第5頁/共15頁 0992077137-0 201228570 板11配合形成一内空的長方體。該底座13包括一與該蓋 板11相對的矩形基板131，該基板131與該蓋板11平行且 其長寬與該蓋板11的長寬大致相當。該基板131可由銅、 鋁等導熱性能良好的材料製成，用於與發熱電子元件接 觸，以吸收該發熱電子元件產生的熱量，並將熱量傳導 至容置於該容置空間14内的散熱器12。 [0011] [0012] [0013] 099144642 該散熱器12位於該容置空間η内且固定至該底座13的基 板131上。該散熱器12由複數相互平行的散熱鰭片121堆 疊而成，相鄰的兩散熱鰭片121間形成有流體通道122。 該複數散熱鰭片121沿該基板131的寬度方向堆疊，且該 散熱鰭片121的長度較該基板131的長度略小，該散熱鰭 片121的高度較該液冷頭1〇的高度略小。該流體通道122 的延伸方向與該基板131的長度方向大致平行。 凊同時參閱圖3，該箱體2〇設於該複數液冷頭1〇之上且與 該複數液冷頭10的蓋板Π相連。該箱體2〇包括大致呈中 空的長方體狀的一本體21及分別自該本體21的兩端向外 凸伸的-進液管22及-出液管23，該進液管22和該出液 官23分別位於該本體的兩側，該本體21包括一底板、 一頂板25及連接於該頂板25與底板24之間的側壁26。 該箱體2G内部設有-分隔板27，於本實施财，該分隔 板27為-縱長的板體’且該分隔板27的高度與該頂板 和底板24之間的距離相當，且該分隔板27的長度與該本 體21的長度相當。該分隔板將該本體21分隔成均等的兩 4刀’-部分與該進液管22連通且與該進液管22共同形 成大致呈L形的進液通道28，另一部分與該出液管23連 表單編號A0101 第6頁/共頁 0992077137-0 201228570 通且與該出液管23共同形成另一大致呈L形的出液通道29 〇 [0014] 該底板24於對應該進液通道28的一側設有分別與該液冷 頭10的第一進液口 111相對應的第二進液口241，該底板 24於對應該出液通道29的一側設有分別與該液冷頭10的 第一出液口 112相對應的第二出液口 242。於本實施例中 ，該第二進液口 241和第二出液口 242均呈方形，且該第 二進液口 241和第二出液口 242的尺寸分別與所述液冷頭 10的第一進液口 111和第二進液口 241相當。該箱體20固 設於該液冷頭10的蓋板11上，且該第一進液口 111與該第 二進液口 241對齊，該第一出液口 11 2與該第二出液口 262對齊。 [0015] 該液冷散熱裝置100於使用時，該箱體20的進液管22與一 泵（圖未示）相連，用於向該箱體20的進液通道28内注 入冷卻介質，比如水；該出液管23處與另一泵（圖未示 )相連，用於將該箱體20的出液通道29内的冷卻介質抽 出。 [0016] 該液冷散熱裝置100工作時，發熱電子元件工作時產生的 熱量被相應的液冷頭10的基板131吸收，進而傳導至該散 熱器12上。冷卻介質從該進液管22進入該進液通道28， 並藉由該底板24上的複數第二進液口 241和該複數蓋板11 上的第一進液口 111分別進入到各液冷頭10的容置空間14 内，進而使該散熱器12浸入在該冷卻介質中。該冷卻介 質流經該散熱器12的複數散熱鰭片121間的流體通道122 時，與該複數散熱鰭片121進行熱交換以吸收該複數散熱 099144642 表單編號A0101 第7頁/共15頁 0992077137-0 201228570 鰭片121上的熱量，在與該出液管23連通的另一泵的作用 下，進行熱交換後的冷卻介質分別從該複數液冷頭1〇的 第一出液口 112流出並彙集到該出液通道29中，進而被泵 抽出並排至外界。藉此，藉由循環往復的冷卻介質不斷 地與液冷頭10内的散熱器12進行熱交換，從而達到同時 對該複數發熱電子元件進行散熱的目的。 [0017] [0018] 本實施例中，該箱體20上的第二進液口 241和第二出液口 242的數量與該發熱電子元件的數量對應；可以理解地， 本發明中的液冷散熱裝置100可在箱體2〇上預留多餘的第 二進液口 2 41和第二出液σ 2 4 2，以備於在發熱電子元件 數量增加時，對該液冷散熱裝置1〇〇進行擴展，此時，可 通過增設新的液冷頭1〇即可對增加的發熱電子元件進行 散熱，實現該液冷散熱裝置100的模組化。同時，該冷卻 介質並不限定於水’亦可為其他的液體；該液冷頭1〇的 形狀和數量並不限定，可根據其需要散熱的發熱電子元 件的形狀和數量進行調整；該分隔板27亦可為其他的形 狀，如曲面或斜面等；該箱體2(j亦可位於該液冷頭1〇的 蓋板11之上且與該蓋板丨丨間隔設置，此時，該第一進液 口 111與該第二進液口 241可藉由一管道（圖未示）連接 «亥第出液口 112與该第二出液口 242亦可藉由一管道 (圖未示）連接。 另’在具體使用時，該電子裝置可設置於江、河、湖、 海的堤岸上，此時，可抽取„的水料冷卻液體使 用後的熱水可排纽、河、湖、海裏錢其他回收利用 ，藉此可使能源迴圈利用，節能環保。 099144642 表單編號A0102 第8頁/共15頁 0992077137-0 201228570 [0019] 又，本發明的液冷散熱裝置體積小，結構較風冷散熱裝 置簡單，開發成本小，可減少不同平臺下重新設計開發 的成本負擔，有效節省設計成本。 [0020] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 0 [0021] 圖1是本發明一較佳實施例的液冷散熱裝置的立體組裝圖 〇 [0022] 圖2是圖1所示液冷散熱裝置的倒置的立體分解圖。 [0023] 圖3是圖1所示液冷散熱裝置的水準刮視圖及流場示意圖 【主要元件符號說明】 [0024] 液冷散熱裝置：100 [0025] 液冷頭：10 [0026] 蓋板：11 [0027] 第一進液口 ： 111 [0028] 第一出液口 ： 11 2 [0029] 散熱器：12 [0030] 散熱鰭片：121 [0031] 流體通道：122 0992077137-0 099144642 表單編號A0101 第9頁/共15頁 201228570 [0032]底座：13 [0033] 基板：131 [0034] 容置空間：14 [0035] 箱體：20 [0036] 本體：21 [0037] 進液管：22 [0038] 出液管：2 3 [0039] 底板：24 [0040] 第二進液口 ： 241 [0041] 第二出液口 ： 242 [0042] 頂板：25 [0043] 側壁：26 [0044] 分隔板：27 [0045] 進液通道：28 [0046] 出液通道：2 9 0992077137-0 099144642 表單編號A0101 第10頁/共15頁201228570 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a liquid cooling heat sink, and more particularly to a liquid cooling heat sink for dissipating heat from an electronic component. [Previous technology] [0002] In electronic devices such as rack servers, memory and workstations, the space, energy consumption and cost of the thermal architecture are the focus of consideration. The heat dissipation structure of the conventional electronic device is mostly air-cooled, and generally includes a heat sink attached to the heat-generating electronic component and a fan coupled to the heat sink for dissipating heat of the heat-generating electronic component. However, for the container data center, a large amount of heat is generated due to a large amount of calculations. When using air-cooled cooling, a large number of radiators and fans are needed to dissipate heat in time. However, the increase in the number of fans means that the total energy consumed during their work has also increased dramatically, which does not meet the current concept of energy conservation and environmental protection. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide a liquid-cooling heat sink that is energy-saving and environmentally friendly and that occupies a small space. [0004] a liquid cooling device for dissipating heat from at least one heat-generating electronic component, the liquid-cooling heat sink comprising at least one liquid cooling head and a tank connecting the at least one liquid cooling head, the liquid cooling a closed accommodating space is formed in the head, the liquid cooling head is provided with a first liquid inlet and a first liquid outlet, and the tank comprises a liquid inlet channel and a liquid outlet channel which are separated from each other. The tank body is provided with a liquid inlet pipe for entering the cooling medium on the side of the liquid inlet passage, and the tank body is provided on the side of the liquid outlet passage for the cooling medium to flow out 099144642. Form No. A0101 Page 4 / Total 15 Page 0992077137-0 201228570 [0005] = liquid pipe, the first liquid inlet, the inlet liquid passage is connected, and the liquid inlet is connected to the liquid outlet passage. =°Γ::ΓIn this case, the air-cooling heat-dissipating device was changed to liquid-cooled into a liquid-cooled heat-dissipating device, and the volume was smaller. Development=:::The same platform was heavy-duty, [0006] Modes The following is a description of the present invention with reference to the accompanying drawings. Q [0007] FIGS. 1 and 2 show a liquid cooling heat sink according to an embodiment of the present invention. The liquid cooling heat dissipating device 1 is used for an electronic device, such as a plurality of heat-generating electronic components in a container type data center, which comprises a 1 (10) and a plurality of liquid cooling heads coupled to the bottom of the box (4). 〇〇. The plurality of liquid cooling heads 10 are for respectively contacting a plurality of heat-generating electronic components (not shown) to respectively absorb heat generated by the plurality of heat-generating electronic components. In this embodiment, the cooling medium is water. It can be understood that 4, the cooling medium can also be other liquids. 〇 w [0008] The mother-liquid cold head 10 includes a cover η, a disperser 12 and a base U. The cover 11 cooperates with the base 丨 3 to form a sealed accommodating space Η. The heat sink 12 is received in the accommodating space 14 . The cover plate 11 is a rectangular plate body having a first liquid inlet port 111 and a first liquid outlet port 112 extending through the cover plate U. In the present embodiment, the first liquid inlet port 111 and the first liquid outlet port 112 are both square and located at opposite ends of the cover plate U in the longitudinal direction. [0010] The base 13 is substantially in the shape of a rectangular parallelepiped of the top side, and the base cooperates with the cover 099144642 Form No. A0101 Page 5 of 15 0992077137-0 201228570 The plate 11 forms an inner hollow cuboid. The base 13 includes a rectangular substrate 131 opposite to the cover plate 11, the base plate 131 being parallel to the cover plate 11 and having a length and width substantially equivalent to the length and width of the cover plate 11. The substrate 131 may be made of a material having good thermal conductivity such as copper or aluminum for contacting the heat-generating electronic component to absorb heat generated by the heat-generating electronic component and conducting heat to the heat dissipating in the accommodating space 14. 12 [0013] [0013] The heat sink 12 is located in the accommodating space η and is fixed to the base plate 131 of the base 13. The heat sink 12 is formed by stacking a plurality of heat radiating fins 121 parallel to each other, and a fluid passage 122 is formed between the adjacent heat radiating fins 121. The plurality of heat dissipation fins 121 are stacked along the width direction of the substrate 131, and the length of the heat dissipation fins 121 is slightly smaller than the length of the substrate 131. The height of the heat dissipation fins 121 is slightly smaller than the height of the liquid cooling head 1〇. . The extending direction of the fluid passage 122 is substantially parallel to the longitudinal direction of the substrate 131. Referring to Figure 3, the casing 2 is disposed above the plurality of liquid cooling heads 1 and is connected to the cover Π of the plurality of liquid cooling heads 10. The casing 2 includes a body 21 having a substantially hollow rectangular parallelepiped shape, and an inlet pipe 22 and a liquid outlet pipe 23 projecting outwardly from opposite ends of the body 21, the inlet pipe 22 and the outlet pipe 22 The liquid chambers 23 are respectively located at two sides of the body. The body 21 includes a bottom plate, a top plate 25 and side walls 26 connected between the top plate 25 and the bottom plate 24. The partition 2G is internally provided with a partition plate 27 which, in the present embodiment, is a longitudinally long plate body and the height of the partition plate 27 is equivalent to the distance between the top plate and the bottom plate 24. And the length of the partitioning plate 27 is equivalent to the length of the body 21. The partition plate divides the body 21 into equal two-blade '- portions communicating with the liquid inlet tube 22 and cooperating with the liquid inlet tube 22 to form a substantially L-shaped inlet passage 28, the other portion and the liquid discharge The tube 23 is connected with the form number A0101, page 6 / total page 0992077137-0 201228570 and forms another substantially L-shaped liquid outlet channel 29 with the liquid outlet tube 23 00 [0014] the bottom plate 24 corresponds to the liquid inlet channel A side of the 28 is provided with a second liquid inlet 241 corresponding to the first liquid inlet 111 of the liquid cooling head 10, and the bottom plate 24 is respectively provided on the side corresponding to the liquid outlet passage 29 with the liquid cooling The first liquid outlet 112 of the head 10 corresponds to the second liquid outlet 242. In the embodiment, the second liquid inlet 241 and the second liquid outlet 242 are square, and the sizes of the second liquid inlet 241 and the second liquid outlet 242 are respectively different from the liquid cooling head 10 The first liquid inlet 111 and the second liquid inlet 241 are equivalent. The casing 20 is fixed on the cover 11 of the liquid cooling head 10, and the first liquid inlet 111 is aligned with the second liquid inlet 241, and the first liquid outlet 11 2 and the second liquid outlet Port 262 is aligned. [0015] When the liquid cooling device 100 is in use, the liquid inlet pipe 22 of the casing 20 is connected to a pump (not shown) for injecting a cooling medium into the liquid inlet passage 28 of the casing 20, such as Water; the outlet pipe 23 is connected to another pump (not shown) for extracting the cooling medium in the outlet passage 29 of the casing 20. [0016] When the liquid cooling device 100 is in operation, heat generated when the heat generating electronic component operates is absorbed by the substrate 131 of the corresponding liquid cooling head 10, and is then conducted to the heat sink 12. The cooling medium enters the liquid inlet passage 28 from the liquid inlet pipe 22, and enters each liquid cooling through the plurality of second liquid inlet ports 241 on the bottom plate 24 and the first liquid inlet port 111 on the plurality of cover plates 11, respectively. The heat sink 12 is immersed in the cooling medium in the accommodating space 14 of the head 10. When the cooling medium flows through the fluid passage 122 between the plurality of heat dissipation fins 121 of the heat sink 12, heat exchange with the plurality of heat dissipation fins 121 to absorb the plurality of heat dissipation 099144642 Form No. A0101 Page 7 / Total 15 Page 0992077137- 0 201228570 The heat on the fins 121 flows out of the first liquid outlet 112 of the plurality of liquid cold heads 1 by the heat exchanged by the other pump connected to the liquid discharge pipe 23, respectively. It is collected into the liquid outlet passage 29, and is pumped out and discharged to the outside. Thereby, heat exchange with the heat sink 12 in the liquid cooling head 10 is continuously performed by the circulating reciprocating cooling medium, thereby achieving the purpose of simultaneously dissipating heat from the plurality of heat-generating electronic components. [0018] In the embodiment, the number of the second liquid inlet 241 and the second liquid outlet 242 on the casing 20 corresponds to the number of the heat-generating electronic components; it is understood that the liquid in the invention The cold heat dissipating device 100 can reserve an excess second liquid inlet port 2 41 and a second liquid outlet σ 2 4 2 on the casing 2〇, so as to prepare the liquid cooling heat dissipating device 1 when the number of heat-generating electronic components increases. 〇〇Expanding, at this time, the additional heat-dissipating electronic component can be dissipated by adding a new liquid-cooling head 1 to realize modularization of the liquid-cooling heat sink 100. Meanwhile, the cooling medium is not limited to water 'may be other liquids; the shape and number of the liquid cooling heads 1并不 are not limited, and may be adjusted according to the shape and number of heat-generating electronic components that require heat dissipation; The partition plate 27 can also be in other shapes, such as a curved surface or a beveled surface; the box body 2 (j can also be located above and spaced apart from the cover plate 11 of the liquid cooling head 1〇, at this time, The first liquid inlet port 111 and the second liquid inlet port 241 can be connected by a pipe (not shown), and the second liquid outlet port 242 and the second liquid outlet port 242 can also be connected by a pipe. In addition, the electronic device can be installed on the banks of rivers, rivers, lakes and seas. In this case, the hot water after the use of water cooling liquid can be drained, river, The lake and the sea can be recycled for other purposes, so that the energy can be recycled, energy saving and environmental protection. 099144642 Form No. A0102 Page 8 of 15 0992077137-0 201228570 [0019] Further, the liquid cooling device of the present invention is small in size. The structure is simpler than the air-cooling heat sink, and the development cost is small, which can reduce the difference. In view of the above, the present invention complies with the requirements of the invention patent, and patents are filed according to law. However, the above description is only a preferred embodiment of the present invention. The equivalent modifications or variations made by those skilled in the art of the present invention should be included in the scope of the following patent application. [Simplified illustration] 0 [0021] FIG. 1 is a comparison of the present invention. 3 is an exploded perspective view of the liquid cooling heat sink shown in FIG. 1. [0023] FIG. 3 is a level of the liquid cooling heat sink shown in FIG. Scratch view and flow field diagram [Main component symbol description] [0024] Liquid cooling heat sink: 100 [0025] Liquid cooling head: 10 [0026] Cover: 11 [0027] First inlet: 111 [0028] A liquid outlet: 11 2 [0029] Heat sink: 12 [0030] Heat sink fin: 121 [0031] Fluid channel: 122 0992077137-0 099144642 Form number A0101 Page 9 of 15 201228570 [0032] Base: 13 [0033] Substrate: 131 [0034] accommodating space: 14 [ 0035] Enclosure: 20 [0036] Body: 21 [0037] Inlet: 22 [0038] Discharge tube: 2 3 [0039] Base plate: 24 [0040] Second inlet: 241 [0041] Second Outlet: 242 [0042] Top plate: 25 [0043] Side wall: 26 [0044] Partition: 27 [0045] Inlet channel: 28 [0046] Outlet channel: 2 9 0992077137-0 099144642 Form number A0101 10 pages / 15 pages

Claims (1)

201228570 七、申請專利範圍. 1 . 一種液冷散熱裝置’用於為至少一發熱電子元件散熱’所 述液冷散熱裝置包括至少一液冷頭和連接所述至少一液冷 頭的一箱體，所述液冷頭内形成有一封閉的容置空間’其 中：所述液冷頭上設有—第一進液口和一第一出液口，所 述箱體包括互相隔離的一進液通道和一出液通道，所述箱 體於進液通道所在側設有用於供冷卻介質進入的進液管， 所述箱體於出液通道所在侧設有供冷卻介質流出的出液官 ，所述第一進液口與所述進液通道杻連通，所述第一出液 口與所述出液通道相連通。 2 .如申請專利範圍第1項所述的液冷散熱裝置，其中所述液 冷頭内設有一散熱器’所述散熱器收容於所述容置空間内 〇 3 .如申請專利範圍第2項所述的液冷散熱裝置，其中所述散 熱器由複數散熱鰭片堆疊而成，相鄰的兩散熱鰭片間形成 〇 有流體通道，所述流體通道的延伸方向華科於所述第一進 液口和第一出液口所在的連線。 4.如申請專利範圍第3項所述的液讀熱裝置，其中所述液 冷頭包括-基板和與所述基板相對的一蓋板所述散熱錯 片組固設於所述基板上，所述第一谁你 廷夜〇和第一出液口設 於所述蓋板的兩端。 5 .如申請專利範圍第1項所述的液冷散熱 、 „ ’、、、裝置，其中所述箱 體包括一中空的本體’所述進液管、Φ、 f 液管設於該本體上 ，該本體内設有一分隔板’所述分 , 板將所述箱體劃分為 相互隔離的所述進液通道和所述出液通、胃 099144642 表單編號A0101 第11頁/共15頁 0992077137-0 201228570 6 .如申請專利範圍第5項所述的液冷散熱裝置，其中所述進 液管、出液管分別自該本體的進液通道所在侧和出液通道 所在側向外凸伸形成，所述進液通道和出液通道均·呈L形 〇 7. 如申請專利範圍第5項所述的液冷散熱裝置，其中所述箱 體於對應所述進液通道的一側設有與所述液冷頭的第一進 液口相對應的一第二進液口，所述箱體於對應所述出液通 道的一側設有與所述液冷頭的第一出液口相對應的一第二 出液口。 8. 如申請專利範圍第7項所述的液冷散熱裝置，其中所述箱 體與所述水冷頭間隔設置，且所述第一進液口與所述第二 進液口藉由管道連接，所述第一出液口與所述第二出液口 藉由管道連接。 9 . 一種液冷散熱裝置，用於為複數發熱電子元件散熱，所述 液冷散熱裝置包括複數液冷頭和連接所述複數液冷頭的一 箱體，每一液冷頭内形成有一封閉的容置空間，每一液冷 頭上設有一第一進液口和一第一出液口，所述箱體包括互 相隔離的一進液通道和一出液通道，所述箱體於進液通道 所在側設有用於供冷卻介質進入的進液管，所述箱體於出 液通道所在側設有供冷卻介質流出的出液管，所述每一液 冷頭上的第一進液口與所述進液通道相連通，所述每一液 冷頭上的第一出液口與所述出液通道相連通。 10 .如申請專利範圍第9項所述的液冷散熱裝置，其中所述箱 體包括一中空的本體，所述進液管、出液管設於該本體上 ，該本體内設有一分隔板，所述分隔板將所述箱體劃分為 相互隔離的所述進液通道和所述出液通道。 099144642 表單編號A0101 第12頁/共15頁 0992077137-0201228570 VII. Patent application scope. 1. A liquid cooling heat dissipating device 'for dissipating heat for at least one heat-generating electronic component'. The liquid cooling heat dissipating device comprises at least one liquid cooling head and a box connecting the at least one liquid cooling head a closed accommodating space is formed in the liquid cooling head, wherein: the liquid cooling head is provided with a first liquid inlet and a first liquid outlet, and the tank includes a liquid inlet channel which is isolated from each other. And a liquid outlet channel, the tank is provided with a liquid inlet pipe for the inlet of the cooling medium on the side of the liquid inlet passage, and the tank body is provided with a liquid discharge officer for discharging the cooling medium on the side of the liquid outlet passage. The first liquid inlet is in communication with the liquid inlet passage, and the first liquid outlet is in communication with the liquid outlet. 2. The liquid-cooling heat dissipating device according to claim 1, wherein the liquid cooling head is provided with a heat sink, wherein the heat sink is housed in the accommodating space 〇3. The liquid-cooling heat dissipating device of the present invention, wherein the heat sink is formed by stacking a plurality of heat-dissipating fins, and a fluid passage is formed between two adjacent heat-dissipating fins, and the extending direction of the fluid channel is in the first The connection between the inlet port and the first outlet port. 4. The liquid heat reading device according to claim 3, wherein the liquid cooling head comprises a substrate and a cover opposite to the substrate, wherein the heat dissipation chip group is fixed on the substrate, The first person who is in the night and the first liquid outlet are provided at both ends of the cover. 5. The liquid cooling heat dissipation according to claim 1, wherein the housing comprises a hollow body, and the liquid inlet tube, the Φ, and the f liquid tube are disposed on the body. The body is provided with a partitioning plate', and the plate divides the casing into the liquid inlet passages and the liquid outlets and the stomach 99144642 which are isolated from each other. Form No. A0101 Page 11 / 15 pages 0992077137 The liquid-cooling heat dissipating device according to claim 5, wherein the liquid inlet pipe and the liquid outlet pipe are respectively protruded outward from the side of the liquid inlet passage of the main body and the side of the liquid outlet passage. The liquid-cooling heat dissipating device according to claim 5, wherein the tank body is disposed on a side corresponding to the liquid inlet passage. a second liquid inlet corresponding to the first liquid inlet of the liquid cooling head, wherein the tank is provided with a first liquid discharge with the liquid cooling head on a side corresponding to the liquid outlet passage a second liquid outlet corresponding to the mouth. 8. Liquid cooling as described in claim 7 The device, wherein the tank is spaced apart from the water-cooling head, and the first liquid inlet and the second liquid inlet are connected by a pipe, the first liquid outlet and the second liquid outlet The port is connected by a pipe. 9. A liquid cooling heat dissipating device for dissipating heat for a plurality of heat-generating electronic components, the liquid cooling heat dissipating device comprising a plurality of liquid cooling heads and a box connecting the plurality of liquid cooling heads, each liquid A closed accommodating space is formed in the cold head, and each liquid cooling head is provided with a first liquid inlet and a first liquid outlet, and the tank includes a liquid inlet channel and a liquid outlet channel which are separated from each other. The tank body is provided with a liquid inlet pipe for the inlet of the cooling medium on the side of the liquid inlet passage, and the tank body is provided with a liquid outlet pipe for the cooling medium to flow out on the side of the liquid outlet passage, and the liquid cooling head on each liquid cooling head The first liquid inlet is in communication with the liquid inlet passage, and the first liquid outlet on each liquid cooling head is in communication with the liquid outlet passage. 10. The liquid cooling according to claim 9 a heat sink, wherein the case comprises a hollow body, the liquid inlet tube The liquid discharge pipe is disposed on the body, and the body is provided with a partition plate, and the partition plate divides the tank into the liquid inlet passage and the liquid outlet passage which are separated from each other. 099144642 Form No. A0101 12 pages / 15 pages 0992077137-0
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