l283l6〇 九、發明說明： 【發明所屬之技術領域】 本發明係關於―種液冷式散熱裝置，特別係撕—種用來冷卻電 子元件之液冷式散熱裝置。 【先前技術】 隨著電子產業之蓬勃迅速發展，大型積體電路技術不斷進步，電 腦内部電子元件之麵度越來越高，運行速度也越來越快，高頻高速 處理器之推出曰益加快，唯，高頻高速運行必將使得電子元件之發熱 量越來越大，如果熱量不及時散發出去，則將導致電子元件内縣度 越來越高，嚴重影響電子元件運行之穩定性，如今散熱問題已成爲影 響電腦運行性能之-個重要因素，也成爲高速處理器實際應用之麵。 現有之風冷絲錄置齡_賴足細高速奸元件之散熱 需要，爲此，液冷式散齡統逐漸被業界採用。現有水冷散熱系統均 由系歹J刀放δ又置之元件連接而成，如中國大陸專利第992丄㈣4 2號 接露之-種液冷式電腦散熱裝置，包括冷卻管路、多個散熱片及一散 熱板。由於該裝置中多個散熱片分別與多條冷卻管路連接，形成一較 長之迴路’佔用空間較大，不適應如今電腦朝小型化發展之趨勢，且 安裝拆卸極爲不便。 爲節省空間使整體散熱結構更加緊湊，業界人士又設計一種用來 冷卻電子元件之液冷式散熱裝置，如中國大陸專利第〇3223378.7號所 述’其包括一冷卻板、一散熱器及一泵組成之迴路及在該泵驅動下在 迴路中循環之冷卻液，該散熱器包括複數散熱片及穿設在散熱片中之 1283160 散熱管。該散熱裝置中，用一個散熱器取代前述多個散熱片設置，縮/ 短迴路之距離。但，泵與散熱器分離設置又增加整體散熱裝置所占之 空間。 因此，需要提供一種整體結構緊湊、散熱效果好之液冷式散熱裝 置。 【發明内容】 本發明目的在於提供一種整體結構緊湊、散熱效果好之液冷式散 熱裝置。 本發明液冷式散錄置包括-吸熱體、—冷龍、將該冷卻體與 該吸熱體連«-魏辦之-進水管及—料管及轉__冷卻液循 %流動之泵，該冷卻體包括—底座、—設置於該底座之散熱元件、一 設置於該賴元件之蓋體以及—設置於雜熱元件—侧、晴與底座 及蓋體密封舰之水箱本體，該底翻具有—第—冷卻流道，該蓋體 内形成有-第二冷卻流道’該水箱本體設有與辦水管連通之進水孔 以及與該進水管連通之出水孔，該進水孔與底座内第一冷卻流道連 通，該栗收容於該水箱本體内並將該水箱本體内部分隔成一上行通道 下行通道，該上行通道與底翻第-冷卻流道、蓋_第二冷卻 流it相互親，該下㈣道缝體之第二冷卻贿、出水孔相互連通。 本發明液冷式散熱裝置憎置於水箱本_之_水箱本體内部 分隔形成該上行通道_下行通道，該冷卻液既要織上行通道進入 該蓋體内，又要_下躲如紅魏缝喊絲健環，該冷 郃液完成-次循環需兩次經過該水箱本體内，有效利用水箱本體内空 1283160 間，使結構緊湊之液冷式散熱裝置利用有限空間加快冷卻液循環速· 度，從而提高該散熱裝置之散熱效率。 【實施方式】 請同時參閱第-圖至第二圖，本發明液冷式散熱裝置包括一冷卻 體1、一吸熱體2及將冷卻體1與吸熱體2連接爲一循環迴路之進水管 3與出水管4。 該冷卻體1包括一底座1〇、一設置在底座1〇之水箱體2〇、一與 水箱體20連接並一同設置在底座1〇之散熱元件3〇及一與底座1〇、水 箱體20連通之蓋體40。散熱元件30夾設在底座1〇與蓋體4〇之間並 與水箱本體20連接，散熱元件3〇包括一散熱器31、一裝設在散熱器 31 —侧之風扇32及位於散熱器31底部與頂部之兩換熱板33。風扇32 通過一風扇固定架扣設在該散熱器31 一側面。該換熱板33包括一平 板330及放置在平板330上之複數散熱鰭片332，該平板33〇上設有複 數圓孔334。 底座10與蓋體40上分別設有複數與上述圓孔334相對應之螺孔 14、44。底座10與蓋體40設有複數螺釘200，該螺釘200順次穿過底 座10上之螺孔14、平板330上之圓孔334及水箱本體20將換熱板33 與底座10固定在一起，結合處以密封圈1〇〇密封。同樣地，該螺釘200 順次穿過蓋體40上之螺孔44、平板330上之圓孔334及水箱本體20 將換熱板33與蓋體4〇固定在一起，結合處以密封圈1〇〇密封。兩換 熱板33分別與底座1〇、蓋體4〇 一同形成密封、與水箱本體20連通， 供冷卻液在其中循環流動。 1283160 該吸熱體2用來吸收發熱元件之熱量，吸熱體2内部設有供冷卻 液流動之腔室220，且設有與腔室220相連通之進液口 222、出液口 224。冷卻液自該進液口 222進入腔室220。 該底座10呈矩形槽狀，其包括呈正方形之第一結合部12及呈長 方形與第一結合部12連為一體之第一配合部ι6，該第一結合部以與 水箱體本體20底部通過密封圈100密封為一體，該第一配合部16與 設於其頂狀換熱板33通膽顚1Q()㈣，該底座1(^部形成有 引V冷卻液流動之第一冷卻流道16〇,該第一冷卻流道16〇設有一入液 口 162及一出液口 164。該換熱板33上之散熱鰭片332吸收流經該第 -冷卻流道160之冷卻液之熱量，並將該熱量經平板33()傳遞至散熱 器31散發出去。該底座1〇内設有第一插條11〇，該第一插條ιι〇引導 冷卻液沿該底座10内部周邊，即沿第一冷卻流道16〇流動。 該蓋體40具有與底座10相同之結構，包括第二結合部42及與第 二結合部42連為-體之第；合部46，該第二結合部42對應於該水 箱本體20之上端開口並通過密删1〇〇與其密封，該第二配合部牝 對應於該熱交換板33通聰删與其㈣為—體，該蓋體4〇内 部形成有-第二冷卻流道（圖未示），該熱交換板％之散熱鰭片332 收容於該帛二冷職道巾，以魏流_帛二冷卻流道之冷卻液之熱 «，並將熱量經平板33〇傳遞給散熱器&。該水箱本體2〇上 、下端四 角處設有供螺釘200穿入與該底座1()之第一結合部12及該蓋體4〇之 第二結合部42固定之孔洞27。 1283160 該水箱本體2〇係上、下開口之中空方盒狀，其上端開口對應該蓋·， 體4〇之第二結合部42並與其密封結合，該水箱本體2G下劇口對應“ “底座10之第一結合部^並與其密封結合 ，該水箱本體20具有前、 後、左、右四侧壁22，該四側壁22與底座1〇之第一結合部12、蓋體 40之第二結合部42共同界定出一容置室，以容納冷卻液；該水箱本體 20岫側壁之下部及上部分別設有一進水孔25及一出水孔沉；該水箱 本體20左侧壁與散熱器31貼設，右侧壁表面開設有一用來收容部分 泵23之圓形插槽24，該左、右侧壁之内表面設置有一對從上往下延伸馨 之苐二插條21〇。 該泵23由一本體230及一殼體232構成，該本體230設置於水箱 本體20内部，該本體230向上延伸出一上隔板234,其前侧突設一出水 口 235 ’該上隔板234與水箱本體2〇之左右侧壁22上之第二插條210 配合並固定其内；該殼體232包括收容於水箱本體20之插槽24内之 凸起部236,該殼體232通過螺釘固定於水箱本體2〇之側壁22上。該 上隔板234及泵23之本體230將上述容置室分隔出一上行通道5〇〇及 鲁 一下行通道600。 該上行通道500將該底座1〇之第一冷卻流道160與該蓋體4〇之 第二冷卻流道連通，使從該底座10之第一冷卻流道160中流出之冷卻 液經該水箱本體20之上行通道500進入該蓋體40之第二冷卻流道； 該下行通道600將蓋體40之第二冷卻流道與水箱本體20之出水孔％ 連通，使從蓋體40之第二冷卻流道流出之冷卻液經水箱本體2〇之下 11 1283160 行通道600由出水孔26排出。 該出水管4之一端與吸熱體2之出液口 224相連接，另一端則與. 水箱體20之進水孔25相連接。 該進水管3之-端和及熱體2之進液口 222相連接，另一端則與 水箱體20之出水孔26相連接。 該液冷式散熱裝置中吸熱體2通過進水管3、出水管4與水箱本體 2〇相連接，水箱本體20又分別與_ 1〇及與蓋體4〇連通，使得底座 10、水箱本體20、蓋體40及吸熱體2形成一閉合迴路。 _ 冷卻液工作時，吸無2之底舰合在軒元件（圖未示）上， 從電子元件表面吸熱並傳至腔室22〇内，吸熱後之冷卻液在泵Μ之驅 動下，通過進水管3經進水孔25順著水箱本體2〇之你· 22流入底座 10之第-結合部I2内。冷卻液在底座10内沿其周邊流動，即經進液 口 162進入第-冷卻流道16〇並沿第一配合部10之周邊流動，同時熱 蓋通過換熱板33傳至散熱器31進行第一次散熱。接著冷卻液在泵23 之作用下，經底座10之出液口 164流出，經水箱本體2〇之上行通道鲁 500進入蓋體40内並沿其周邊流動，通過換熱板33將熱量傳至散熱器 31進行第二次散熱，同時風扇24加強散熱。最後，低溫冷卻液由蓋體 40之第二冷卻流道流出進入水箱本體2〇之下行通道麵，並由下行通 道600流至水箱本體20之出水孔26,后經進水管3回流至吸熱體2内。 低溫冷卻液在吸熱體2内吸收熱量後，再次經出水管4流入水箱體2〇 内’如此反復循環，達到冷卻電子元件之目的。 12 1283160 本毛月液冷式政熱裝置中，設置於水箱本體内之泵將水箱本體内. 部分隔形成該上行通道與該下行通道，該转舰要_上行通道進· 入該蓋翻，又要經該下行通道回流至該吸熱體内完成整個循環，該 冷部液70成-個雜需兩她過該水箱本翻，有效细水箱本體内 空間’使結構緊湊之液冷式散熱裝置有限空間加快冷卻液循環速 度’從而提高該散熱裝置之散熱效率。 【圖式簡單說明】 第一圖係本發明液冷式散熱裝置之立體組合圖。 弟二圖係本發明液冷式散熱裂置之立體分解圖。 【主要元件符號說明】 冷卻體 1 吸熱體 2 進水管 3 出水管 4 底座 10 水箱本體 20 散熱元件 30 蓋體 40 泵 23 侧壁 22 插槽 24 進水孔 25 出水孔 26 孔洞 287 散熱器 31 換熱板 33 平板 330 散熱鰭片 332 圓孔 334 螺孔 14 - 44 螺針 200 密封圈 100 腔室 220 進液口 222 13 1283160 出液口 224 第一插條 110 下行通道 600 第一結合部 12 第一冷卻流道 160 出液口 164 殼體 232 下隔板 216 第二配合部 46 上隔板 234 上行通道 500 第二插條 210 第一配合部 16 進液口 162 出水口 235 凸起部 236 第二結合部 42BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid-cooling heat sink, and in particular to a liquid-cooled heat sink for cooling an electronic component. [Prior Art] With the rapid development of the electronics industry, large-scale integrated circuit technology continues to advance, the internality of electronic components in computers is getting higher and higher, and the running speed is getting faster and faster. Accelerate, only, high-frequency high-speed operation will make the heat of electronic components more and more large, if the heat is not released in time, it will lead to higher and higher counts in the electronic components, seriously affecting the stability of the operation of electronic components, Nowadays, the heat dissipation problem has become an important factor affecting the running performance of the computer, and it has become the practical application of high-speed processors. The existing air-cooled wire recording age _ depends on the heat dissipation of the fine-grained components. For this reason, the liquid-cooled aging system is gradually adopted by the industry. The existing water-cooling and heat-dissipating systems are all connected by the components of the J-knife δ and the arranging elements. For example, the Chinese patent No. 992丄(4) No. 4 2 is a liquid-cooled computer cooling device, including a cooling pipe and a plurality of heat dissipation devices. Sheet and a heat sink. Since a plurality of fins in the device are respectively connected to a plurality of cooling pipes, a long circuit is formed, which occupies a large space, which is not suitable for the trend of miniaturization of the computer today, and the installation and disassembly are extremely inconvenient. In order to save space and make the overall heat dissipation structure more compact, the industry has also designed a liquid-cooled heat sink for cooling electronic components, as described in Chinese Patent No. 3223378.7, which includes a cooling plate, a radiator and a pump. The circuit consists of a circuit and a coolant circulating in the circuit driven by the pump. The heat sink includes a plurality of heat sinks and a 1283160 heat pipe that is disposed in the heat sink. In the heat sink, a heat sink is used instead of the plurality of fins to set the distance between the shrinkage/short loop. However, the separate arrangement of the pump and the heat sink increases the space occupied by the overall heat sink. Therefore, it is desirable to provide a liquid-cooled heat sink having a compact overall structure and good heat dissipation. SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid-cooled heat sink having a compact overall structure and a good heat dissipation effect. The liquid-cooled scattering device of the present invention comprises: a heat absorbing body, a cold dragon, a cooling body connected to the heat absorbing body, a pump, a water pipe, a water pipe, a water pipe, and a __cooling liquid. The cooling body comprises a base, a heat dissipating component disposed on the base, a cover body disposed on the dwelling component, and a water tank body disposed on the side of the heat dissipating component, the sun and the base and the cover sealing ship, the bottom turn Having a first cooling passage having a second cooling flow passage formed therein, the water tank body is provided with a water inlet hole communicating with the water pipe and a water outlet hole communicating with the water inlet pipe, the water inlet hole and the base The first cooling passage is connected, the chest is received in the water tank body and the interior of the water tank body is divided into an upward passage downstream passage, and the upward passage and the bottom turn cooling cooling passage, the cover_second cooling flow are mutually pro The second cooling bribe and the water outlet hole of the lower (four) road body are connected to each other. The liquid cooling heat dissipating device of the present invention is disposed inside the water tank body to form the ascending channel_downstream channel, and the cooling liquid has to woven the ascending channel into the cap body, and the _ lower hiding like a red sew Shouting the silk ring, the cold sputum completion - the second cycle needs to pass through the water tank body twice, effectively utilizing the water tank body space 1283160, so that the compact liquid-cooled heat sink uses a limited space to speed up the coolant circulation speed Thereby improving the heat dissipation efficiency of the heat sink. [Embodiment] Please refer to the first to second figures. The liquid cooling heat dissipating device of the present invention comprises a cooling body 1, a heat absorbing body 2, and an inlet pipe 3 for connecting the cooling body 1 and the heat absorbing body 2 into a circulation circuit. With the outlet pipe 4. The cooling body 1 includes a base 1 , a water tank 2 设置 disposed on the base 1 , a heat dissipating component 3 连接 connected to the water tank 20 and disposed on the base 1 , and a base 1 and a water tank 20 . Connected cover 40. The heat dissipating component 30 is disposed between the base 1 〇 and the cover 4 并 and connected to the water tank body 20 , and the heat dissipating component 3 〇 includes a heat sink 31 , a fan 32 mounted on the side of the heat sink 31 , and the heat sink 31 . Two heat exchange plates 33 at the bottom and the top. The fan 32 is fastened to a side of the heat sink 31 via a fan holder. The heat exchange plate 33 includes a flat plate 330 and a plurality of heat radiating fins 332 placed on the flat plate 330. The flat plate 33 is provided with a plurality of circular holes 334. The base 10 and the cover 40 are respectively provided with a plurality of screw holes 14, 44 corresponding to the circular holes 334. The base 10 and the cover 40 are provided with a plurality of screws 200. The screws 200 sequentially pass through the screw holes 14 on the base 10, the circular holes 334 on the flat plate 330, and the water tank body 20 to fix the heat exchange plate 33 and the base 10 together. Sealed with a sealing ring 1〇〇. Similarly, the screw 200 sequentially passes through the screw hole 44 on the cover 40, the circular hole 334 on the flat plate 330, and the water tank body 20 to fix the heat exchange plate 33 and the cover body 4 together, and the joint is sealed by a ring. seal. The two heat exchange plates 33 are sealed together with the base 1 and the cover 4, respectively, and communicate with the water tank body 20 for circulating cooling liquid therein. 1283160 The heat absorbing body 2 is for absorbing the heat of the heat generating component. The heat absorbing body 2 is provided with a chamber 220 for the coolant to flow therein, and is provided with a liquid inlet 222 and a liquid outlet 224 which communicate with the chamber 220. Coolant enters chamber 220 from the inlet 222. The base 10 has a rectangular groove shape, and includes a first joint portion 12 having a square shape and a first engaging portion ι 6 having a rectangular shape and being integrated with the first joint portion 12, the first joint portion passing through the bottom of the water tank body 20 The sealing ring 100 is integrally sealed, and the first engaging portion 16 is connected to the top heat exchange plate 33 through the cholesteric 1Q () (4), and the base portion 1 is formed with a first cooling flow path through which the V coolant flows. 16〇, the first cooling flow passage 16 is provided with a liquid inlet 162 and a liquid outlet 164. The heat dissipation fins 332 on the heat exchange plate 33 absorb the heat of the coolant flowing through the first cooling passage 160. And transferring the heat to the heat sink 31 through the flat plate 33(). The base 1〇 is provided with a first insert 11〇, and the first insert ιι〇 guides the coolant along the inner periphery of the base 10, ie The cover body 40 has the same structure as the base 10, and includes a second joint portion 42 and a second body connected to the second joint portion 42. The joint portion 46, the second joint The portion 42 corresponds to the upper end of the water tank body 20 and is sealed by a tampering, and the second mating portion 牝 corresponds to the The exchange plate 33 is connected to the body (4), and the cover body 4 is internally formed with a second cooling flow path (not shown). The heat exchange plate % of the heat dissipation fins 332 are accommodated in the second cold service road. The towel, the heat of the coolant of the cooling flow _ 帛 冷却 cooling channel, and the heat is transmitted to the radiator & through the flat plate 33 。. The water tank body 2 is provided at the four corners of the upper and lower ends for the screw 200 to penetrate The first joint portion 12 of the base 1 () and the second joint portion 42 of the cover body 4 are fixed to the hole 27. 1283160 The water tank body 2 has a hollow box shape with upper and lower openings, and the upper end opening corresponds to The second joint portion 42 of the cover body 4 is sealingly coupled thereto, and the lower mouth of the water tank body 2G corresponds to "the first joint portion of the base 10 and is sealingly coupled thereto. The water tank body 20 has front, rear and left sides. The right side wall 22, the four side walls 22 and the first joint portion 12 of the base 1 and the second joint portion 42 of the cover 40 together define an accommodating chamber for accommodating the cooling liquid; The lower part and the upper part are respectively provided with a water inlet hole 25 and a water outlet hole; the left side wall of the water tank body 20 and the heat dissipation The device 31 is attached, and a circular slot 24 for accommodating a portion of the pump 23 is formed on the surface of the right side wall. The inner surfaces of the left and right side walls are provided with a pair of two-side inserts 21 延伸 extending from the top to the bottom. The pump 23 is composed of a body 230 and a casing 232. The body 230 is disposed inside the water tank body 20. The body 230 extends upwardly from an upper partition 234, and a water outlet 235 is formed on the front side. 234 is engaged with and fixed to the second insert 210 on the left and right side walls 22 of the water tank body 2; the housing 232 includes a boss 236 received in the slot 24 of the water tank body 20, and the housing 232 passes The screw is fixed to the side wall 22 of the tank body 2 . The upper partition 234 and the body 230 of the pump 23 separate the receiving chamber from an up channel 5 and a down channel 600. The upstream channel 500 communicates the first cooling channel 160 of the base 1 with the second cooling channel of the cover 4, so that the coolant flowing out of the first cooling channel 160 of the base 10 passes through the water tank. The up channel 500 of the body 20 enters the second cooling channel of the cover 40; the down channel 600 communicates the second cooling channel of the cover 40 with the water outlet hole % of the water tank body 20, so as to be the second from the cover 40 The cooling liquid flowing out of the cooling passage is discharged from the water outlet hole 26 through the passage 600 of the tank 1 under the water tank body 2 . One end of the water outlet pipe 4 is connected to the liquid outlet port 224 of the heat absorbing body 2, and the other end is connected to the water inlet hole 25 of the water tank body 20. The end of the water inlet pipe 3 is connected to the liquid inlet port 222 of the hot body 2, and the other end is connected to the water outlet hole 26 of the water tank body 20. In the liquid-cooling heat dissipating device, the heat absorbing body 2 is connected to the water tank body 2 through the water inlet pipe 3 and the water outlet pipe 4, and the water tank body 20 is further connected with the _1 〇 and the cover body 4, respectively, so that the base 10 and the water tank body 20 are The cover 40 and the heat absorbing body 2 form a closed loop. _ When the coolant is working, the bottom ship that sucks 2 is combined with the Xuan component (not shown), absorbs heat from the surface of the electronic component and passes to the chamber 22〇. The coolant after the heat absorption is driven by the pump. The inlet pipe 3 flows into the first joint portion I2 of the base 10 through the water inlet hole 25 along the water tank body 2 . The coolant flows along the periphery thereof in the base 10, that is, enters the first cooling passage 16 through the liquid inlet 162 and flows along the periphery of the first fitting portion 10, and the heat cover is transmitted to the radiator 31 through the heat exchanger plate 33. The first heat dissipation. Then, under the action of the pump 23, the cooling liquid flows out through the liquid outlet 164 of the base 10, and the upward passage Lu 500 of the water tank body 2 enters the cover body 40 and flows along the periphery thereof, and the heat is transmitted to the heat exchanger plate 33 to the heat transfer plate 33. The heat sink 31 performs the second heat dissipation while the fan 24 enhances heat dissipation. Finally, the low-temperature cooling liquid flows out from the second cooling flow path of the cover body 40 into the lower passage surface of the water tank body 2, and flows from the descending passage 600 to the water outlet hole 26 of the water tank body 20, and then flows back to the heat absorbing body through the water inlet pipe 3. 2 inside. After the low-temperature coolant absorbs heat in the heat absorbing body 2, it flows again into the water tank body 2 through the water outlet pipe 4, and the cycle is repeated to achieve the purpose of cooling the electronic components. 12 1283160 In the Maoyue liquid-cooled political heating device, the pump disposed in the water tank body partially partitions the upstream passage and the downward passage, and the reverse ship enters the cover and enters the cover. In addition, the downstream passage is returned to the heat absorbing body to complete the entire cycle, and the cold liquid 70 is turned into a miscellaneous demand. The water is turned over by the water tank, and the space inside the effective water tank body makes the compact liquid cooling device. The limited space accelerates the coolant circulation speed' to increase the heat dissipation efficiency of the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a three-dimensional combination diagram of the liquid-cooled heat sink of the present invention. The second drawing is a perspective exploded view of the liquid-cooled heat-dissipating crack of the present invention. [Main component symbol description] Cooling body 1 Heat absorbing body 2 Inlet pipe 3 Outlet pipe 4 Base 10 Water tank body 20 Heat dissipating component 30 Cover 40 Pump 23 Side wall 22 Slot 24 Inlet hole 25 Outlet hole 26 Hole 287 Radiator 31 Hot plate 33 Plate 330 Heat sink fin 332 Round hole 334 Screw hole 14 - 44 Screw pin 200 Seal ring 100 Chamber 220 Inlet port 222 13 1283160 Outlet port 224 First insert 110 Down channel 600 First joint 12 a cooling channel 160 outlet port 164 housing 232 lower partition 216 second mating portion 46 upper partition 234 up channel 500 second insert 210 first mating portion 16 inlet port 162 water outlet 235 raised portion 236 Two joints 42
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