CN204392759U

CN204392759U - The liquid-cooling heat radiator of electronic equipment

Info

Publication number: CN204392759U
Application number: CN201520108291.6U
Authority: CN
Inventors: 黄泰棋
Original assignee: Tai Chuan Science And Technology Co Ltd
Current assignee: Tai Chuan Science And Technology Co Ltd
Priority date: 2015-02-13
Filing date: 2015-02-13
Publication date: 2015-06-10
Anticipated expiration: 2025-02-13

Abstract

A kind of liquid-cooling heat radiator of electronic equipment, comprise: a heat-absorbing model, one infusion module and a heat exchange module, this infusion module has at least one feed tube and at least one drain pipe, described feed tube is connected this heat-absorbing model with the first end of drain pipe, described heat exchange module has a fin assembly and at least one radiator fan, and branched communicating pipe of running through these fin assembly two ends, wherein, the first end of described fin assembly is provided with a fluid reservoir, multiple first space is provided with in described fluid reservoir, the first end of described branched communicating pipe extends into described multiple first space, second end of described fin assembly is provided with multiple second space, second end of described branched communicating pipe extends into described multiple second space, described drain pipe and the second end of feed tube are connected one first pump and one second pump respectively, and this first pump is communicated with the first space of this fluid reservoir with the second pump.

Description

The liquid-cooling heat radiator of electronic equipment

Technical field

The utility model relates to a kind of liquid-cooling heat radiator being used in electronic equipment, particularly a kind of position of improveing pump and arranging, and the flow path of the cooling liquid of improved hot Switching Module, there is the liquid-cooling heat radiator of the effects such as reduced volume, simplified structure and heat radiation usefulness.

Background technology

When computer or the running of other electronic equipment, the heat that central processing unit (CPU), chip or other processing unit in its main frame produce must be got rid of fast, efficiently, the temperature range of advising when making main frame inside keep manufacturing, just can avoid described electronic component to burn or impaired.

The mode being extensively used to cool CPU, chip or other processing unit adopts ventilation type; That is arrange at the surface heat of CPU or other chip the heat that radiating fin produces to absorb CPU or chip contiguously, radiating fin then arranges fan, and the wind produced during fan running is blown over each radiating fin and takes away its heat absorbed; But along with the fast development of CPU and chip, its arithmetic speed is more and more fast, and the heat produced is also more and more high, and traditional air-cooling type radiating apparatus has been unable to cope with the cooling requirement of high-order computer or electronic equipment.

Another kind of cooling device is then liquid-cooling heat radiator, it is characterized in that utilizing pump to drive cooling liquid at a closed system Inner eycle, described closed system is also provided with heat exchanger, after absorbing the heat of the chip generations such as CPU, is got rid of by described heat by heat exchanger by cooling liquid.Aforesaid liquid-cooling heat radiator is found in the Patent Cases such as US 7971632, US 8245764, US 8274787, US 8356505, US 8240632.

Generally speaking, liquid-cooling heat radiator has higher cooling effectiveness compared with air-cooling type radiating apparatus; But liquid-cooling heat radiator contains more multicomponent, thus add the time manufacturing assembling, and volume after assembling is comparatively large, compared with the demand that can not meet terminal user; In addition, more the assembling of multicomponent also result in the latency of liquid cooled systems generation seepage; Again, bulky liquid-cooling heat radiator then makes pump drive the efficiency that circulates of cooling liquid lower, cannot improving heat radiation efficiency further under both having ready conditions.

In addition, the heat exchange module H of the existing heat abstractor of Fig. 1 display, have by the fin assembly H1 of multiple metal fins group structure, and branched communicating pipe H2 is run through this fin assembly H1 two ends, the first end of described fin assembly H1 is provided with the first space H3, the relative other end is provided with two second space H41 and H42, being provided with the inlet H5 for connecting feed tube (not shown) bottom this second space H41, bottom second space H42, being provided with the liquid outlet H6 for connecting drain pipe (not shown); After the cooling liquid absorbing heat enters second space H41 via inlet H5, cooling liquid flow to the first space H41 by the communicating pipe H2 partly extending to second space H42, another second space H42 is flow to by another part communicating pipe H2 again, to form the flow path (as shown in the bold arrow direction of Fig. 1) of " U " shape from the first space H41; Cooling liquid is in the process of this flow path, and by heat conduction to each fin, the fan (not shown) being located at fin assembly H1 is then dried and to be got rid of by heat.

Utility model content

The purpose of this utility model, is the liquid-cooling heat radiator providing a kind of improvement, with further reduced volume, extends the flow path of cooling liquid at heat exchange module, heat radiation usefulness.

Feature of the present utility model, comprising: a heat-absorbing model, an infusion module and a heat exchange module; Wherein, heat-absorbing model connects at least one feed tube of infusion module and the first end of at least one drain pipe, described drain pipe and the second end of feed tube are then connected after one first pump and one second pump respectively, again the first pump, the second pump are connected to the fluid reservoir being located at heat exchange module, use the integral heat dissipation device forming small size, designs simplification.

Another feature of the present utility model improves heat exchange module, make cooling liquid by the path of fin assembly more roundabout and extension path length, the heat that cooling liquid is absorbed can conduct to fin assembly and improving heat radiation efficiency better.

Technological means of the present utility model, comprise: a heat-absorbing model, one infusion module and a heat exchange module, this infusion module has at least one feed tube and at least one drain pipe, described feed tube is connected this heat-absorbing model with the first end of drain pipe, second end of described drain pipe connects one first pump, second end of described feed tube connects one second pump, and this first pump, second pump is all connected at the fluid reservoir of this heat exchange module, described heat exchange module has a fin assembly and at least one radiator fan, and branched communicating pipe of running through these fin assembly two ends, the first end of this fin assembly arranges this fluid reservoir, it is characterized in that:

Multiple first space is provided with in described fluid reservoir, the first end of described branched communicating pipe extends into described multiple first space, second end of described fin assembly is provided with multiple second space, and second end of described branched communicating pipe extends into described multiple second space.

An embodiment of the present utility model is that the first pump and the second pump are located at a pump seat, and recycling pump seat is combined in the fluid reservoir of heat exchange module, thus makes the first pump, the second pump connection fluid reservoir, to reduce the volume of whole heat abstractor.

Accompanying drawing explanation

Fig. 1 is the heat exchange module structure showing existing liquid-cooling heat radiator, and cooling liquid is in the floor map of heat exchange module flow path;

Fig. 2 is the stereogram of the surface structure after the combination of display the utility model liquid-cooling heat radiator;

Fig. 3 is the stereogram showing the surface structure after the combination of the utility model liquid-cooling heat radiator from another angle;

Fig. 4 is the three-dimensional exploded view of the syntagmatic of the main element that display the utility model liquid-cooling heat radiator comprises; And

Fig. 5 is the overall structure after the combination of display the utility model liquid-cooling heat radiator, and the floor map in cooling liquid flowing path.

Wherein, description of reference numerals is as follows:

1 heat-absorbing model

11 liquid-accumulating containers

111 fixed mounts

112 inlets

113 liquid outlets

12 heat-conducting plates

2 infusion module

21 pump seats

22 drain pipes

23 feed tubes

24 first pumps

25 second pumps

3 heat exchange modules

31 fin assemblies

311 frameworks

312 fins

313 end plates

314 communicating pipes

315 first dividing plates

316 second partitions

32 fluid reservoirs

321 feed liquors connect hole

322 fluids connect hole

33 fans

4 objects

S1 first space

S2 second space

H heat exchange module

H1 fin assembly

H2 communicating pipe

H3 first space

H41, H42 second space

H5 inlet

H6 liquid outlet

Embodiment

Below coordinate graphic and component symbol to do more detailed description to execution mode of the present utility model, can implement according to this after studying this specification carefully to make those of ordinary skill in the art.

As shown in Fig. 2, Fig. 3 and Fig. 4, the liquid-cooling heat radiator of the electronic equipment that the utility model provides, comprising: heat-absorbing model 1, infusion module 2 and a heat exchange module 3; Wherein, heat-absorbing model 1 has a liquid-accumulating container 11, described liquid-accumulating container 11 forms by multiple sidewall the container that can hold appropriate cooling liquid, wherein a sidewall is with made by the metal guide hot plate 12 possessing high efficiency heat conduction character, and a sidewall in addition then arranges inlet 112 and a liquid outlet 113; Preferably, described inlet 112 is arranged on symmetrical position, to connect aforesaid infusion module 2 better with liquid outlet 113; Described heat-conducting plate 12 connects thermal source with being used for thermo-contact, such as CPU, chip etc., makes the heat of thermal source conduct to the cooling liquid in liquid-accumulating container 11 via heat-conducting plate 12.The side of liquid-accumulating container 11 is also provided with multiple fixed mount 111, and screw can be coordinated fixed mount 111 to be locked in the object 4 of thermal source periphery.

As shown in Figure 4, infusion module 2 of the present utility model comprises: a pump seat 21, at least one drain pipe 22 and at least one feed tube 23 are explain with a drain pipe 22 and a feed tube 23 in the application's illustrated embodiment; The inside of described pump seat 21 is provided with one first pump 24 and one second pump 25 (only show the outward appearance exposing pump seat in figure, do not show the entire infrastructure of the first pump 24, second pump 25); Described drain pipe 22 and feed tube 23 be hollow and the body at through two ends, and can according to reality need bent to suitable shape; The first end of described feed tube 23 connects the inlet 112 of liquid-accumulating container 11 with a joint, is connected to the second pump 25 after relative second end of feed tube 23 extends into pump seat 21; The first end of described drain pipe 22 connects the liquid outlet 113 of liquid-accumulating container 11, is connected to the first pump 24 after relative second end of drain pipe 22 extends into pump seat 21.

Referring again to Fig. 4 and Fig. 5, heat exchange module 3 of the present utility model comprises: a fin assembly 31, branched run through described fin assembly 31 communicating pipe 314, be located at the fan 33 of described fin assembly 31 with at least one; Showing fin assembly 31 of the present utility model in figure is formed by multiple fin arranged in parallel group of structure, suitable space is maintained between fin and fin, pass through for air-flow, the periphery of fin assembly 31 arranges framework 311 so that fin assembly 31 is mounted to electronic equipment, the first end of framework 311 arranges a fluid reservoir 32, separate with an end plate 313 between fluid reservoir 32 and fin assembly 31, the internal chamber of fluid reservoir 32 then separates out multiple first space S 1 with multiple first dividing plate 315.Second end of framework 311 separates out at least two second space S2 with at least one second partition 316.The embodiment icon of the application shows has branched communicating pipe 314 of running through fin assembly 31, and described branched communicating pipe 314 runs through described fin assembly 31 two ends perpendicular to each fin of fin assembly 31; That is the length direction of communicating pipe 314 is haply perpendicular to the central axis direction of fan 33, make one end of each communicating pipe 314 pass this end plate 313, then extend into this first space S 1, and the other end extends into this second space S2.Aforesaid liquid-accumulating container 11, drain pipe 22, feed tube 23, fluid reservoir 32, each communicating pipe 314, first pump 24 and the second pump 25 in be then filled into cooling liquid.Structure after aforementioned each block combiner as shown in Figure 2 and Figure 3.

Use of the present utility model and function mode are:

Heat sink 1 is installed on the thermal source such as CPU, chip place, heat-conducting plate 12 is contacted with the heat source thermo such as CPU, chip, the heat of thermal source conducts to the cooling liquid in liquid-accumulating container 11 via heat-conducting plate 12, when startup first pump 24, when second pump 25 operates with fan 33, cooling liquid sucks by the first pump 24, wherein one first space S 1 of fluid reservoir 32 is entered via drain pipe 22 and the first pump 24, as shown in Figure 5, enter the cooling liquid of wherein one first space S 1 then by entering corresponding second space S2 after corresponding communicating pipe 314, cooling liquid flow to another the first space S 1 via another communicating pipe 314 again, so make cooling liquid via communicating pipe 314 circuitous flow between the first space S 1 and second space S2, finally get back to last first space S 1, by the second pump 25, cooling liquid aspirated again and get back to liquid storage container 11 by feed tube 23 and repeat aforesaid process and form the closed circulatory system.When the cooling liquid absorbing heat by each communicating pipe 314 time, heat can be conducted to each fin 312 of fin assembly 31, now, the fan 33 in running by wind to each fin to take away heat, reach high efficiency cooling effect.

Shown in bold arrow as shown in Figure 5, of the present utility modelly to be characterised in that, after cooling liquid to enter the first space S 1 of fluid reservoir 32 rightmost side via drain pipe 22, cooling fluid is known from experience from fin assembly 31 first end should the second space S2 flowing to the second end communicating pipe 314 of the first space S 1, again from this second space S2 by flowing to another first space S 1 of first end other branched communicating pipe 314, and then from this first space S 1 by flowing to another second space S2 of the second end other branched communicating pipe 314, again from this second space S2 by flowing to the first space S 1 of the leftmost side other branched communicating pipe 314, then by the second pump 25, cooling liquid suction is flow to liquid storage container 11 via feed tube 23, that is, the circuitous path of the flow path of cooling liquid in fin assembly 31 haply in " W " shape, so extend the time of cooling liquid by each fin, make each fin have the heat of enough time absorption contained by cooling liquid, thus improve cooling heat dissipation efficiency.

The foregoing is only to explain preferred embodiment of the present utility model, not attempt tool is to do any pro forma restriction to the utility model.Therefore, all to have under identical invention spirit do relevant any modification of the present utility model or change, all must be included in the category of the utility model intention protection.

Claims

1. the liquid-cooling heat radiator of an electronic equipment, comprise: a heat-absorbing model, one infusion module and a heat exchange module, this infusion module has at least one feed tube and at least one drain pipe, described feed tube is connected this heat-absorbing model with the first end of drain pipe, described heat exchange module has a fin assembly and at least one radiator fan, and branched communicating pipe of running through these fin assembly two ends, it is characterized in that, the first end of described fin assembly is provided with a fluid reservoir, multiple first space is provided with in described fluid reservoir, the first end of described branched communicating pipe extends into described multiple first space, second end of described fin assembly is provided with multiple second space, second end of described branched communicating pipe extends into described multiple second space, described drain pipe and the second end of feed tube are connected one first pump and one second pump respectively, and this first pump is communicated with the first space of this fluid reservoir with the second pump.

2. the liquid-cooling heat radiator of electronic equipment as claimed in claim 1, it is characterized in that, a pump seat is located at by described first pump and the second pump, and described pump seat and this fluid reservoir are connected and fixed.