EA014801B1 - Cooling device for electrical equipment - Google Patents

Abstract

The invention is aimed at intensification of heat-exchange convective component resulting in increasing power efficiency of heat-exchange device, reducing weight thereof and cost production. The cooling device comprises a fan with air outlet directed from the body, a vortex chamber (1) with an inlet (2, 3) providing air eddying in the chamber (1) connected to the air outlet from the fan's body and to an orifice (10, 11) at the end surface, a heat-conducting element (12) arranged in the inner cavity of the vortex chamber (1) and adapted for interconnection for cooling with electrical instrument's element disposed outside the vortex chamber (1).

Description

Technical field

The invention relates to instrumentation and electrical engineering, and in particular to a cooling device for electrical equipment, which can be used to cool blocks of various electronic devices, in particular for cooling central processing units of computers, laptops, video card processors and their elements, power supplies for electrical equipment, and also for cooling other electrical devices for various purposes, such as film projectors, television cameras, voltage stabilizers, transformers, various -forming, rectifiers and the like.

State of the art

In most known existing cooling systems for electrical equipment, electronic equipment, in particular computers, heat is removed from its sources in three stages.

The first stage is heat transfer by heat conduction from a heat source to a heat-conducting element. By a heat-conducting element is meant any high-tech device for transferring heat to an insignificant distance (heat pipes, water systems, metals with a high coefficient of thermal conductivity, etc.). The heat source in this case is thermally connected to the hot end of the heat-conducting element.

The second stage is heat transfer by means of heat-conducting elements from the heat source to the radiator. The radiator in this case is thermally connected to the cold end of the heat-conducting element.

The third stage is convection heat transfer from the radiator to the air. At this stage, both natural convection can be used to remove a small amount of heat, and forced, with significant thermal loads.

For example, a cooling device for computers is known, which provides for increasing the convective component of heat transfer by installing above a heat source, with which a heat-conducting base is connected, a cooling device with an axial fan, blowing a heat-conducting base and, accordingly, a heat source. On the sides of the fan on the opposite sides are two radiators with cooling fins, also blown by this fan. In this case, the radiators are paired with a heat-conducting base by heat pipes (I8 2006/0164808 A1, MPK N05K 7/20 (2006.01), 2006).

A device for cooling central computer processors is known, including two radiators with fins that are connected by heat pipes to the heat-conducting base of the cooling device coupled to a heat source. The heat-conducting base is built for cooling using the Peltier effect and its two parts are thermally connected to the two radiators. The axial fan in this known solution blows air along the fins of both radiators (I8 7331185 B2, IPC Р25В 21/02 (2006.01), 2008).

A cooling device for power electronic equipment is known, which involves the use of a diametrical fan, the air from the outlet of which is directionally blown along the fins of a radiator associated with a heat source (ΌΕ 3609037 A1, MPK N05K 5/02, 1986).

Thus, at the existing stage of development of this technical field, which, in particular, is illustrated by the described known constructions, cooling systems use mainly convection of heat by convection from the radiator to air.

However, the process of heat transfer by convection from the radiator to the air in known structures, albeit activated by blowing air through the heat exchange surface, is the least optimized from a heat engineering point of view and has the maximum thermal resistance in the cooling device. Instead of intensifying heat transfer, most manufacturers of cooling systems go along the path of increasing the standard sizes of radiators and fan speeds. It,. ultimately, leads to an increase in the weight of the heat exchanger, its cost, as well as to the appearance of an annoying user of acoustic noise.

SUMMARY OF THE INVENTION

The objective of the present invention is to intensify the convective component of heat transfer, which, ultimately, leads to an increase in energy efficiency of the entire heat exchange device, reducing its weight and cost.

The solution to this problem is provided by a cooling device for electrical equipment, comprising at least one fan with a directed air outlet from the housing, at least one vortex chamber with at least one inlet providing air swirling in the chamber, which is connected to the air outlet from the fan housing, and with an opening at least on one end for air outlet, at least one heat-conducting element located in the internal volume of the vortex chamber and made with the possibility of interaction action with at least one element of electrical equipment located outside the vortex chamber for cooling it.

The heat-conducting element can be made in the form of a heat pipe or in the form of a rod of heat-conducting material. Its outer surface can be made with a relief to increase the heat exchange surface area and to intensify the heat exchange process itself, in particular

- 1 014801 have fins.

As a rule, a heat-conducting element is installed longitudinally in the vortex chamber, at a distance from the axis of the vortex chamber, greater than the radius of the hole at the end of the vortex chamber for air exit.

It is possible that the cooling device contains four heat-conducting elements installed longitudinally in the vortex chamber, at a distance from the axis of the vortex chamber, greater than the radius of the hole at the end of the vortex chamber for air exit.

To ensure liquid cooling, the heat-conducting element can be made in the form of a tube with the possibility of passage of coolant through it.

Embodiments of the invention are possible when the vortex chamber is made with a tangential inlet, or when the vortex chamber is made with a spiral inlet.

Alternatively, the vortex chamber may be made of heat-conducting material. In this case, let’s assume that the vortex chamber is made with a set of heat-conducting elements that are thermally connected to the vortex chamber casing or are made integrally with it, which corresponds to the case where the vortex chamber casing is made with a base for contact with the electric equipment element for cooling it. In this case, it is also possible to carry out the body of the vortex chamber from the outside with relief elements to increase the heat transfer surface.

It is possible that when the cooling device comprises a heat-conducting base configured to interface with an element of electrical equipment to cool it. In this case, the heat-conducting element is connected outside the vortex chamber with a heat-conducting base.

Alternatively, the heat-conducting base may be located opposite the hole for the exit of air from the vortex chamber. In this case, the heat-conducting base can be made in the form of a heat-dissipating radiator and is located with a heat-dissipating surface opposite the opening of the vortex chamber for air outlet. In this case, a possible option is to perform a vortex chamber with a nozzle fixed externally, communicating with its internal volume through an opening at the end for air outlet, when the end of the nozzle is directed to a heat-conducting base.

The internal volume of the vortex chamber can be made in cross section cylindrical, elliptical or multifaceted.

An embodiment of the invention is possible when the cooling device contains two fans, and the vortex chamber body is made with two inlet openings arranged axisymmetrically, providing air swirling in the vortex chamber, each of the inlet openings being associated with an air outlet from the separate fan casing.

An embodiment of the invention is possible when the cooling device comprises two mirror-symmetric vortex chambers installed with mating bodies together with a unidirectional arrangement of entrances providing air swirling in the chamber connected to the air outlet from one fan casing.

An embodiment of the invention is possible when the cooling device comprises two pairs of mirror-symmetric vortex chambers installed in each pair with mating bodies between each other in the area of the inlets providing air swirling in the chamber, with their orientation in one direction, which are connected to the air inlets exit from the case of one fan.

Description of graphic materials illustrating the invention

In FIG. 1 and 2 are presented illustratively illustrating the principle of operation of the circuit cooling device for electrical equipment; views of the vortex chamber, respectively, from the side and from the side of the end;

in FIG. 3 and 4 schematically show the design of a vertical arrangement cooling device for cooling a processor and including a vortex chamber with two fans, which corresponds to the circuits shown in FIG. 1 and 2;

in FIG. 5 shows a layout of a standard computer system unit with a vertical layout cooling device installed therein for cooling a central processor;

in FIG. 6 and 7 show a vertical arrangement of a cooling device with finned heat-conducting elements thermally connected to a heat-conducting base coupled to a heat source and a cooled stream of air leaving the chamber;

in FIG. 8, 9 and 10 show a horizontal arrangement of the cooling device with the vortex chamber disposed with an axis parallel to the mounting plane, one diametrical fan and with a pipe directing air from the vortex chamber to a heat-conducting base;

in FIG. 11 shows a horizontal arrangement cooling device in which a vortex chamber is made of a heat-conducting material and is directly thermally connected to a heat source by means of a heat-conducting base;

in FIG. 12, 13 and 14 show an example of a low-profile arrangement of a cooling device with one vortex chamber with a tangential inlet connected to one centrifugal fan;

in FIG. 15 shows a similar design with a spiral entrance to the vortex chamber;

in FIG. 16 shows an example of a low-profile implementation of a cooling device that contains

- 2 014801 two vortex chambers made mirror-symmetric, connected to one centrifugal fan;

in FIG. 17 shows an example of a low-profile implementation of a cooling device, which contains two pairs of mirror-symmetric swirl chambers connected to one centrifugal fan;

in FIG. 18 and 19 show a cooling device implemented for a liquid cooling system of an electric apparatus;

in FIG. 20 shows the layout of a standard computer system unit with a liquid cooling system implemented using the cooling device of FIG. 18 and 19.

Detailed Description of Embodiments

The principle of operation of the cooling device for electrical equipment according to the invention is illustrated in the diagrams shown in FIG. 1 and 2. In the example corresponding to these schemes (Figs. 3, 4), the cooling device for electrical equipment contains a vortex chamber 1 with two inlets 2, 3 arranged in such a way that air swirls in the internal volume 4 (Fig. 1) of the vortex chamber 1. By the indicated inputs 2, 3, the vortex chamber 1 is connected to the directed air outlets 5, 6 (Fig. 4) of air from the cases of two diametrical fans 7, 8 (Fig. 4; not shown in the diagrams in Figs. 1, 2, and 3) with impellers 9. At the ends of the vortex chamber 1, holes 10, 11 (Fig. 1, 3) are made for the exit air.

Four heat-conducting elements 12 are installed longitudinally in the internal volume of the vortex chamber, each of which is made with the outgoing section 13 (hot end) (Fig. 1, 3) for interaction (thermal connection) with one or more elements of the electrical equipment for their cooling, and in this particular case with the surface 14 of the processor 15 (Fig. 3). The heat-conducting elements 12 are located at a distance from the axis of the vortex chamber 1, greater than the radius of the holes 10, 11.

In accordance with patent claims, the vortex chamber 1 may contain only one inlet 2 or 3, one fan 7 or 8 and an opening at only one end (10 or 11), which will be shown in more detail in the examples below.

There can also be a different amount of heat-conducting elements 12, which is determined by the particular structural embodiment of the cooling device in relation to one or another type of block or module of electrical equipment or device, apparatus, computer as a whole.

Air is supplied tangentially to the inner surface of the vortex chamber 1 (a spiral approach is possible), and discharged through openings 10, 11. At the same time, the heat-conducting elements 12 located in the inner volume of the vortex chamber 1 are washed by the air pumped through the vortex chamber 1 .

The main ways to increase the convective component of heat transfer is to increase the air flow rate and its degree of turbolization. Both that, and another is easily reached in a vortex chamber.

The vortex (cyclone) chamber 1, as a heat exchange device, is characterized by a high rate of air rotation, the ability to obtain air velocities in the internal volume above the inlet velocity, and the possibility of creating a shock-separated flow (flow turbolization) by displacing the cooled elements from the chamber axis, which ultimately leads to a significant increase in thermal efficiency and, as a result, to a decrease in the size of the heat exchanger as a whole.

The high intensity of air rotation in the chamber leads to a decrease in the required volume of air pumped by the fan and reduces the size of convectively cooled elements, in this case, heat-conducting elements 12. Before leaving the vortex chamber 1, the same volume of air is washed several times by the heat-conducting elements 12 that at high air velocities and due to the creation of shock-separated flow during flow around heat-conducting elements 12 leads to a significant increase in the convective component of heat exchange, and therefore - to increase the energy efficiency of the entire heat exchange device.

The internal volume of the vortex chamber 1 in cross section may have a cylindrical or elliptical shape, or be multifaceted. The inner surface of the chamber itself can be both smooth and embossed. Outside, as a rule, the vortex chamber 1 has a similar shape, but there may be exceptions to this rule, depending on the technology of its manufacture or subject to external fins, as will be shown below, or a different form of cooling relief.

The heat-conducting element 12 can be made in the form of a heat pipe, either in the form of a rod of heat-conducting material, or be any other highly efficient device for transferring heat over short distances.

The use of heat pipes in such devices is widely known.

The heat pipe is a sealed heat transfer device that operates on a closed evaporative-condensation circuit in thermal contact with an external source and

- 3 014801 by heat sink (hot and cold ends). Typically, the tubes themselves are made of copper, inside of which there are several milliliters of coolant (easily evaporating liquid: ammonia, water, alcohols, complex compositions, etc.) and a porous body, which is a thin twisted wire, wick or sintered ceramic porous material. The porous body is made so as to fit snugly against the walls of the tube and at the same time leave part of the inner space of the tube free for the movement of steam. Thermal energy is received from the source and expended on the evaporation of the coolant. Then it is transferred by steam to the other end of the heat pipe (heat sink zone, cold end), where condensation occurs. The condensate formed under the action of capillary forces (the porous structure of the porous body) returns to the evaporation zone.

If the heat-conducting elements 12 are solid rods, then virtually any heat-conducting structural materials: copper, aluminum or other metals with high thermal conductivity can be used for their manufacture. It is possible to use synthetic materials with high thermal conductivity.

Thus, shown in FIG. 3, 4, a cooling device for electrical equipment, which is characterized as a solution with a vertical layout, implements an effective cooling cycle when, as shown in FIG. 1, the heat generated by the processor 15 is transferred to the heat-conducting elements 12, and then dissipated in the internal volume of the vortex chamber 1, where the heat-conducting elements 12 are blown by intensively rotating air pumped by fans 7 and 8 and leave the internal volume of the vortex chamber 1 through openings 10, 11 .

If the vertical arrangement cooling device 16 made in this way is used to cool the central processor, as shown in FIG. 5, the heated air is dissipated through the internal space of the system unit 17 and then carried out by fans 18 and 19 installed in the computer system case or carried out through an additional duct installed on the outlet (not shown in FIG. 5).

Another vertical arrangement of the cooling device is shown in FIG. 6 and 7.

Here, the outer surface of each heat-conducting element 20 is ribbed 21 (FIG. 6) to increase the heat transfer area. The finned surface 21 is located in the inner volume of the vortex chamber 22. The vortex chamber 22 has one hole 23 (Fig. 6) for air outlet, located at the end from the side of the heat-conducting base 24.

The ends 25 of the heat-conducting elements 20 are thermally connected to the heat-conducting base 24, which is made in the form of a heat-dissipating radiator and is located by a heat-dissipating relief 26 in the form of a set of ribs opposite the opening 23 of the vortex chamber 20. The heat-conducting base 24 is coupled to the processor 27 to cool it.

This design allows for more intensive cooling due to the implementation of heat-conducting elements 20 with a set of transverse ribs 21, intensifying heat dissipation, as well as due to additional air blowing out of the vortex chamber 20 of the heat-conducting base 24, coupled with the processor 27. Its installation in the computer system unit similar to that described above.

In FIG. 8, 9 and 10 show a horizontal arrangement of the cooling device with the location of the vortex chamber 28 axis parallel to the mounting plane.

In this embodiment, the vortex chamber 28 has one tangential inlet 29 with which the output of the centrifugal fan casing 30 is coupled, located axially parallel to the axis of the vortex chamber 28, which is true for all examples presented in the application. The vortex chamber 28 has an opening 31 (Fig. 10) for air outlet at one end, where a curved pipe 32 connected to the opening 31 is installed.

The outer surface of each heat-conducting element 33 is made in relief in the form of a set of transverse ribs 34 (Fig. 8) for heat dissipation, which are also located in the internal volume of the vortex chamber 28. The ends 35 of the heat-conducting elements 33 are thermally connected to the heat-conducting base 36, which is made in the form a heat dissipating heat sink coupled to the processor 37 to cool it. While the end of the curved pipe 32 is directed to the heat-conducting base 36.

This design also allows for intensive cooling due to the implementation of heat-conducting elements 33 with a set of transverse ribs 34, intensifying heat transfer and also due to additional blowing coming out of the vortex chamber 28 through the curved pipe 32 of the heat-conducting base 36.

However, due to the location of the vortex chamber 28 and the diametrical fan case 30 with the axes parallel to the mounting plane, such a cooling device has a lower height in comparison with the options described above, which allows for more compact use of the internal volume of the computer system unit or the case of another electric device.

In FIG. 11 shows a horizontal arrangement cooling device in which the vortex chamber 38 is made of heat-conducting material and is directly thermally connected to a heat source - processor 39.

- 4 014801

The vortex chamber 38 has one tangential input 40, with which the output of the centrifugal fan housing 41 is connected. The axes of the vortex chamber 38 and the housing 41 of the centrifugal fan are parallel to the mounting plane.

The vortex chamber 38 has an opening 42 for air outlet at one end, but it is possible to make such holes on both ends of the vortex chamber 38.

The vortex chamber 38 is made with a set of heat-conducting elements 43 located inside its volume in the form of needles, which are rigidly connected (thermally connected) to the body of the vortex chamber 38 or are made with it in one piece also of heat-conducting material. Outside, the vortex chamber 38 has relief elements in the form of ribs 44 to increase the heat exchange surface area.

In this constructive embodiment of the invention, heat is transferred from the source through the heat-conducting body of the vortex chamber 38 and dissipated in its internal volume through the heat-conducting elements 43 by a rotating air stream, and also by relief elements in the form of ribs 44 on the outer surface of the vortex chamber 38.

This solution is distinguished by a large compactness and the absence of active heat-conducting elements, such as heat pipes, in comparison with the ones described above.

The following are examples of low-profile configurations of a cooling device made in accordance with the present invention, which, in particular, can be used for computer graphics cards, central processing units and laptop video cards, film projectors, or in other narrow unit layouts of other electrical equipment.

In FIG. 12, 13 and 14 show an example of a structural implementation of a cooling device located on a video card with the location of the vortex chamber 45 with an axis perpendicular to the mounting plane. Similarly located centrifugal fan housing 46. The vortex chamber 45 has one tangential input 47, with which the output of the centrifugal fan housing 46 is coupled.

The outer surface of each heat-conducting element 48 is made in relief in the form of a set of transverse ribs 49 (Fig. 12) to increase the heat transfer surface, which are located in the internal volume of the vortex chamber 45. The ends 50 of the heat-conducting elements 48 are thermally connected to the heat-conducting base 51, which is made in the form heat dissipating radiator and is coupled to a heat source 52 (video card processor; FIG. 12).

The hole 53 (Fig. 12) for air outlet is located on one end of the vortex chamber 45 and is oriented to the heat-conducting base 51.

This design also allows for intensive cooling during installation in a narrow volume, which, in particular, corresponds to the constructive implementation of most of the currently used video cards.

As shown in FIG. 12, 13 and 14 of the example, the vortex chamber 45 is made with a tangential inlet 47, which is connected to the air outlet from the housing 46 of the centrifugal pump, that is, the inlet 47 to the vortex chamber is located tangentially.

In the construction shown in FIG. 15 and implemented generally similarly, a spiral inlet 54 into the vortex chamber 55 is used, that is, the inlet 54 is arranged in a spiral to the side surface of the vortex chamber 55. In this case, the air swirling in the fan outlet device (snail) 56 enters the vortex chamber 55 , as a result of the lack of a direct connecting section, continues the curvilinear movement in a spiral.

In FIG. 16 shows an example of a low-profile implementation of a cooling device, which contains two mirror-symmetric swirl chambers 57, 58 installed with mating housings with a unidirectional arrangement of inputs 59, 60, providing air swirl in the chamber and connected to the air outlet 61 from the housing 62 of one fan.

The internal volumes of the vortex chambers 57, 58 are elliptical in cross section. Four heat-conducting elements 63 are mounted longitudinally in pairs in the internal volumes of the vortex chambers 57 and 58.

This design solution has a smaller footprint compared to cylindrical chambers and increased flow turbolization in the volume of the vortex chamber (57 and 58).

In FIG. 17 shows an example of a low-profile implementation of a cooling device, which contains two pairs of mirror-symmetric vortex chambers 64 made of heat-conducting material installed in each pair with mating housings in the area of the inputs 65 providing air swirling in the chamber, with their orientation in one direction, which are connected by inlets 65 to the air outlet 66 from the housing 67 of one centrifugal fan.

In this case, four heat-conducting elements 68 are installed in the internal volume of a separate vortex chamber 64, and a design feature is an increase in the heat exchange surface by means of thermal connection of the edges 69 of the heat-conducting elements 68 with the surfaces of the heat-conducting vortex chambers 64.

This design solution may be appropriate for the use of air flowing from the four holes 70 of the vortex chambers 64, for directing to additional heat sources,

- 5 014801 located in the volume of the cooled device (capacitors, memory blocks, etc.).

In FIG. 18 and 19 show a cooling device implemented for a liquid (water) cooling system of an electrical apparatus, in particular a computer system unit.

In this embodiment of the invention, the cooling device comprises a vortex chamber 71 with two inlets 72, 73 arranged in such a way that air swirls in the inner volume 74 (Fig. 18) of the vortex chamber 71. The vortex chamber 71 is connected with directional inputs 72, 73 air outlets 75, 76 of air from the housings 77, 78 of two diametrical fans. At the ends of the vortex chamber 71, openings 79, 80 (FIG. 18) are made for air outlet, which are equipped with outward straight short guide tubes (clamps) 81, 82 (FIG. 19), which can also be located in the inner volume of the chamber. The presence or absence of outlet pipes (clamps) 81 and 82, as well as their location, internal, external or combined, is determined by the specific structural embodiment of the cooling device in relation to one or another type of block or module of electrical equipment or device, apparatus, computer as a whole, which is typical for all the designs described above.

In the inner volume of the vortex chamber 71, a heat-conducting element 83 is longitudinally installed in the form of a tube curved by a spiral. The heat-conducting element 83 has a fin in the inner volume of the vortex chamber 71 (shown in broken lines along the heat-conducting element) along the heat-conducting element 83.

In FIG. 20 shows the layout of a standard computer system unit with a liquid cooling system.

The heat-conducting element 83 at its ends is connected to a closed liquid cooling system, including a pump 84 for pumping liquid and elements 85, 86 that require cooling.

The cooling device (71, 77, 78) made in accordance with the invention is located outside the housing 87, but can also be included in the volume of the housing 87. The pump 84, which can be made as a single unit with an expansion tank (not shown in the diagram) for liquid, pumps the liquid cooled by the cooling device (71, 77, 78) through the piping system to the elements 85, 86 requiring cooling. Passing through them, the liquid heats up and then goes through a system of pipelines for cooling to a cooling device (71, 77, 78).

In all the described embodiments of the cooling device for electrical equipment in accordance with the present invention, it can be manufactured according to the traditional technologies in instrumentation and electrical engineering for the manufacture of devices and parts from the materials used for them and the complexity for the specialist in the field of instrumentation, this aspect, taking into account the examples presented, does not represents.

In addition, in all the described embodiments, the use of centrifugal (radial) and diametrical fans is shown. However, it is also possible to use axial fans, that is, fans that supply air in the direction of the axis of rotation of the blades. It is possible to use multi-stage fans or several fans working on one or more swirl chambers. It is possible to use diagonal fans.

From a fundamental point of view, one can allow the option when one or more fans are made as stand-alone units and connected to one or more vortex chambers by air ducts, while vortex chambers are located directly on the blocks with heat sources.

As noted above, the heat-conducting element can be made in the form of a heat pipe, in the form of a rod of heat-conducting material, or in the form of a set of needles located inside the heat chamber. However, other embodiments are possible, for example in the form of a plate. The main condition that the heat-conducting elements must satisfy is that they are a highly efficient device for transferring heat over short distances. Their outer surface may have a ribbing or other specific shape that intensifies the heat transfer process, for example, a square cross section.

Thus, the presented embodiments of the invention are not exhaustive. Other specific constructive embodiments of the invention are also possible, which will correspond to the scope of patent claims claimed for all cases of protection and fair for all the above examples of the invention.

Claims (21)

CLAIM 1. A cooling device for electrical equipment, comprising at least one fan with a directed air outlet from the housing, at least one vortex chamber with at least one inlet providing air swirling in the chamber, which is connected to the air outlet from the fan housing, and the hole at least one end for the exit of air, at least one heat-conducting element located in the inner volume of the vortex chamber and made with the possibility of interaction with at least one ra sleeping position - 6 014801 shotguns of the vortex chamber by an element of electrical equipment for its cooling. 2. The device according to claim 1, characterized in that the heat-conducting element is made in the form of a heat pipe. 3. The device according to claim 1, characterized in that the heat-conducting element is made in the form of a rod of heat-conducting material. 4. The device according to claims 1, 2 or 3, characterized in that the outer surface of the heat-conducting element is made with a relief for heat dissipation. 5. The device according to claims 1, 2 or 3, characterized in that the outer surface of the heat-conducting element is made with ribbing. 6. The device according to claims 1, 2 or 3, characterized in that the heat-conducting element is installed in the vortex chamber longitudinally at a distance from the axis of the vortex chamber, greater than the radius of the hole at the end of the vortex chamber for air exit. 7. The device according to claims 1, 2 or 3, characterized in that it contains four heat-conducting elements installed in the vortex chamber longitudinally at a distance from the axis of the vortex chamber, greater than the radius of the hole at the end of the vortex chamber for air exit. 8. The device according to claim 1, characterized in that the heat-conducting element is made in the form of a tube to provide liquid cooling. 9. The device according to claim 1, characterized in that the vortex chamber is made with a tangential entrance. 10. The device according to claim 1, characterized in that the vortex chamber is made with a spiral inlet. 11. The device according to claim 1, characterized in that the vortex chamber is made of heat-conducting material. 12. The device according to claim 11, characterized in that the vortex chamber is made with a set of heat-conducting elements thermally connected to the housing of the vortex chamber or made with it in one piece, while the housing of the vortex chamber is made with a base for contact with an element of electrical equipment for cooling . 13. The device according to claim 11 or 12, characterized in that the body of the vortex chamber is made externally with relief elements to increase the heat transfer surface. 14. The device according to claim 1, characterized in that it contains a heat-conducting base, made with the possibility of interfacing with an element of electrical equipment to cool it, and the heat-conducting element is connected outside the vortex chamber with a heat-conducting base. 15. The device according to 14, characterized in that the heat-conducting base is located opposite the hole for the exit of air from the vortex chamber. 16. The device according to p. 15, characterized in that the heat-conducting base is made in the form of a heat-dissipating radiator and is located heat-dissipating surface opposite the hole of the vortex chamber for air outlet. 17. The device according to p. 14 or 16, characterized in that the vortex chamber is made with a pipe secured externally, communicating with its internal volume through an opening at the end for air outlet, the heat-conducting base is made in the form of a heat-dissipating radiator, and the end of the pipe is directed to the heat-conducting base . 18. The device according to claim 1, characterized in that the internal volume of the vortex chamber is made in cross section cylindrical, or elliptical, or multifaceted. 19. The device according to claim 1, characterized in that it contains two fans, and the vortex chamber body is made with two axially symmetric inlet openings providing air swirling in the chamber, each of the inlet openings being associated with an air outlet from the separate fan casing. 20. The device according to claim 1, characterized in that it contains two vortex chambers made by mirror-symmetric, installed with mating housings with each other with a unidirectional arrangement of entrances, providing air swirl in the chamber, connected to the air outlet from the housing of one fan. 21. The device according to claim 1, characterized in that it contains two pairs of vortex chambers made by mirror-symmetric, installed in each pair with interfacing the housings with each other in the area of the inputs providing air swirling in the chamber, with their orientation in one direction, which are connected entrances with an air exit from the case of one fan.