TWM600068U - Equipment assembly, cooling system, and equipment rack - Google Patents

Abstract

An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.

Description

Equipment components, cooling systems, and equipment racks

This disclosure generally relates to a cooling system for a computer system. More particularly, an aspect of the present disclosure relates to a cooling system having a shaped surface on a liquid cooling heat exchanger to increase heat exchange capacity.

Electronic components, such as servers, include a large number of electronic components powered by a public power source. Due to the operation of internal electronic devices (such as controllers, processors, and memory), the server generates a lot of heat. Overheating caused by inability to effectively remove heat may shut down or hinder the operation of such devices. Therefore, the current server is designed to rely on the air flow through the inside of the server to take away the heat generated by the electronic components. The server usually includes a variety of heat sinks, which are attached to electronic components (for example, processing units). The heat sink absorbs heat from the electronic components, thereby transferring heat away from these components. The heat of the radiator must be discharged from the server. A fan system is usually used to generate the airflow to discharge this heat.

Due to the improvement of high-efficiency systems, with the development of new generation electronic components, more and more heat needs to be removed. With the advent of more powerful components, the combination of conventional gas cooling and fan systems is no longer sufficient to sufficiently remove the heat generated by the newer generation of components. Due to the increased demand for cooling, the development of liquid cooling has been driven. Since liquid cooling has excellent thermal performance, liquid cooling is currently recognized as a method for quickly removing heat. At room temperature, the heat transfer coefficient of gas is only 0.024W/mK, while the heat transfer coefficient of coolant (such as water) is 0.58W/mK, which is 24 times the heat transfer coefficient of gas. Therefore, liquid cooling is more effective in transferring heat from a heat source to a radiator, and this allows heat to be removed from the main components without noise pollution.

In the rack-level liquid cooling system design, the cooling liquid source includes a closed-loop cooling system and an open-loop cooling system to promote heat exchange. The known closed-loop liquid cooling system uses heat exchange to cool hot water heated from a heat source. Then, heat is removed from the hot water in the closed-loop liquid cooling system via an open-loop system (for example, a fan wall). Figure 1 shows the cooling cycle of the closed-loop cooling system 10 in the prior art. The closed-loop cooling system 10 includes a heat source 20 and a heat exchanger 22. The liquid flow pipe 24 conveys the coolant liquid to the heat source 20. The heat generated by the heat source 20 is transferred to the coolant liquid. The liquid flow tube 26 transports the heated liquid away from the heat source 20. The heat exchanger 22 has a series of fins, and the returning coolant flows in the fins. The fins transfer heat from the heated liquid, thereby causing the colder liquid to be circulated to the liquid flow tube 24. An open-loop gas cooling system (such as a fan array 30) generates an airflow 32, which transports the heat absorbed by the heat sink of the heat exchanger 22 away.

The general closed-loop heat exchanger has a flat shape and is usually installed on the door panel of the equipment housing. This door panel also supports the fan array. This allows the fans of the fan array to blow air through the heat exchanger to transport away the heat absorbed by the liquid coolant flowing from the pipeline. The number of fins that can be included in the heat exchanger, and therefore the available cooling surface area, depends on the linear width of the heat exchanger.

FIG. 2A is a perspective view of a known rack housing 50 with the closed-loop cooling system 10 shown in FIG. FIG. 2B is an exploded view of the components in the rack housing 50 and the closed-loop cooling system 10. FIG. 2C is a top view of the rack housing 50 with the heat exchanger 22. The rack housing 50 includes a cabinet 52, and the cabinet 52 may include slots for accommodating heat-generating electronic components (for example, a server 54). The rack housing 50 has a rear door 56 that can be opened, as shown in FIG. 2A, so that electronic components can enter the rack housing 50. As shown in Figures 2B and 2C, in normal operation, the rear door 56 is closed. When the rear door 56 is in the closed position, the heat exchanger 22 circulates the coolant through the delivery pipe to remove the heat generated by the electronic components in the rack housing 50.

The heat exchanger 22 and the fan array 30 are installed on the rear door 56 together. When the rear door 56 is closed, the fan array 30 generates an air flow 32, which causes the air to pass through the server 54, as shown in FIG. 2B. The air system is heated by the server 54 (heat source 20 in Figure 1) and is guided through a series of cooling plates that circulate the coolant around the server 54 and flow to the heat exchanger 22. The heat is transferred to the coolant flowing out of the heat exchanger 22. The coolant flows from a cold liquid coolant connector 60, through the liquid flow tube 24, and flows through the inside of the cooling plate to the server 54. The heated coolant returning from the liquid flow pipe 26 is connected to a hot coolant connector 62 and thus to the heat sink of the heat exchanger 22. The air flow 32 generated by the fan array 30 transports the hot air absorbed by the fins of the heat exchanger 22 through the rear door 56.

A general heat exchanger design, such as the heat exchanger 22, has a flat shape and is fixed to the rear door 56, as shown in Figures 2A-2C. Therefore, the heat exchanger 22 has a flat rectangular surface 70 that faces the server 54 in the rack housing. The heat transported away by the heat exchanger is proportional to the surface area of the flat rectangular surface 70, because the width of the flat rectangular surface 70 determines how many heat sinks can be installed, thereby determining the available area exposed to the airflow. However, the conventional heat exchanger design becomes insufficient to meet the cooling demand of the heat generated by the faster server.

Therefore, there is a need to improve the performance of the flat heat exchanger installed on the door. It is also necessary to increase the heat radiation surface area of the heat exchanger to improve heat exchange. It is also necessary to increase the size of the heat exchanger to improve the cooling capacity.

One disclosed example is an equipment assembly that includes a housing for accommodating a heat-generating electronic component. The housing includes an open end with a flat area. A closed-loop liquid cooling system includes a liquid coolant conduit near the heat-generating electronic components. This conduit allows a liquid coolant to circulate to extract heat from the heat-generating electronic components. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from the circulating liquid coolant in the heat exchanger. The heat exchanger includes a shaped front side facing the open end of the shell. The surface area of the forming front side is larger than the surface area of the flat area of the open end. A gas flow system pushes the surrounding air through the shaped surface of the heat exchanger.

In another disclosed embodiment of the example device assembly, the shaped front side is a curved shape. In another disclosed embodiment, the formed front side includes at least two parts, each of which has a flat exterior connected at an angle to each other. In another disclosed embodiment, the liquid coolant conduit system is coupled to a cooling plate. In another disclosed embodiment, the heat exchanger includes a first side and a second side, and the first side and the second side are separated by a plurality of fins extending from the forming front side. In another disclosed embodiment, the air flow system includes a plurality of fans, and the fans are close to a rear surface of the heat exchanger and opposite to the front side of the forming. In another disclosed embodiment, the housing includes a door, the door has a closed position that closes the open end, and the closed-loop liquid cooling system and the air flow system are installed on the door.

Another disclosed example is a cooling system for circulating a liquid coolant to remove heat generated by a heat-generating electronic component in an equipment rack. The equipment rack has an open end defined by a flat surface area. The cooling system includes a liquid coolant outlet for circulating a liquid coolant to extract heat from the heat-generating electronic components. A liquid coolant inlet is used to collect the liquid coolant. A heat exchanger fluidly coupled to the liquid coolant inlet and the liquid coolant outlet to extract heat from the circulating liquid coolant in the heat exchanger. The heat exchanger includes a shaped front side facing the open end of the shell. The surface area of the forming front side is larger than the surface area of the plane. An air flow system operable to push ambient air through the shaped front side of the heat exchanger.

In another disclosed embodiment of the exemplary cooling system, the shaped front side is a curved surface. In another disclosed embodiment, the formed front side includes at least two parts, each of which has a flat exterior connected at an angle to each other. In another disclosed embodiment, a liquid coolant conduit system is coupled to a cooling plate. In another disclosed embodiment, the heat exchanger includes a first side and a second side, and the first side and the second side are separated by a plurality of fins extending from the forming front side. In another disclosed embodiment, the air flow system includes a plurality of fans, and the fans are close to a rear surface of the heat exchanger and opposite to the front side of the forming. In another disclosed embodiment, the equipment rack includes a door having a closed position closing the open end, and the cooling system is installed on the door.

Another disclosed example is an equipment rack with a pair of side walls, a top plate and a bottom plate. The top plate and the bottom plate are attached to the pair of side walls to define an open end. The pair of side walls, the top plate and the bottom plate provide support for a heat-generating electronic component installed between the pair of side walls. A door is attached to one of the pair of side walls. The door has a curved shape and a curved inner surface. A fan wall is attached to this door. A heat exchanger includes an inlet fluid conduit and an outlet fluid conduit for fluidly circulating a coolant to a heating electronic component. The heat exchanger is located between the curved inner surface of the door and the fan wall.

The above summary is not intended to represent each embodiment or every aspect of the present disclosure. Rather, the foregoing summary only provides examples of some of the novel aspects and features described herein. The above features and advantages, as well as other features and advantages of the present disclosure will become apparent from the following detailed description of representative embodiments and methods for implementing the invention when considered in conjunction with the accompanying drawings and the scope of the attached patent application.

This creation can be implemented in many different forms. Representative embodiments are shown in the drawings and will be described in detail here. The present disclosure is an example or description of the principles of the present disclosure, and it is not inadvertently intended to limit the broad aspects of the present disclosure to the illustrated embodiments. In this regard, for example, elements and limitations that are disclosed in the abstract, summary, and detailed description but not explicitly mentioned in the scope of the patent application should not be implied, inferred, or otherwise individually or entirely Incorporated into the scope of patent application. For detailed description, unless otherwise stated, the singular includes the plural, and vice versa; the word "including" means "including but not limited to". In addition, for example, similar words such as "approximately", "almost", "substantially", "approximately", etc. can be used here to mean "at" and "near... ", or "in the vicinity of", or "within 3-5% of", or "within acceptable manufacturing tolerance", or any logical combination thereof.

The present disclosure relates to a closed-loop liquid cooling system with a heat exchanger having a shaped front side, such as a curved shape. The surface area of the front side surface facing the open end of an equipment rack is larger than the surface area of the flat surface facing the open end. More heat sinks with curved front sides can be provided to increase the cooling surface relative to the surface area of a flat plane, whereby the curved front side of the heat exchanger improves performance. With a relatively large number of heat sinks, this curved front side increases the inlet airflow and cooling surface. Compared with known planar heat exchangers that have a flat surface area facing the components in the equipment rack, the curved front side increases the available cooling surface by 20% to 30% with the use of heat sinks. Alternatively, a curved shape can be formed by a plurality of rectangular heat exchanger sections, and these rectangular heat exchanger sections are arranged at an angle to each other in a substantially circular shape to provide more heat sinks. In addition, alternatively, a support door on which a heat exchanger is installed may be shaped to provide a curved end for cooling.

Figure 3 is a perspective view of an example of an improved heat exchanger system 100. Figure 4A is a top view of an example of the improved heat exchanger system 100. The improved heat exchanger system 100 is installed in the rack housing 110. The frame housing 110 includes two side walls 112 and 114, and the two side walls 112 and 114 are joined by a top plate 116 and a bottom plate 118. The front wall 120 is joined to the side walls 112 and 114 to close the housing 110. A series of pillars 122 and cross members 124 are attached to the side walls 112 and 114. The pillar 122 and the cross member 124 may include multiple slots that allow the shelf to be attached between the side walls 112 and 114. For example, different racks, such as racks 126 and 128, can be supported by pillars 122 at different heights. In addition, the shelves may be arranged such that there are different heights between the shelves. The shelves, such as shelves 126 and 128, create different slots for installing heat-generating electronic components or devices (such as servers 130 and 132). Although only two shelves and two servers are shown for simplicity, it should be understood that any number of shelves and corresponding heat-generating electronic components can be installed in the rack housing 110.

The frame housing 110 has an open end opposite to the front wall 120. The rear door 140 is attached to the side wall 112 via a hinge, which allows the rear door 140 to swing between the open position shown in Figure 3 and the closed position shown in Figure 4A. The rear door 140 is opened to allow components to enter the rack housing 110 through the open end of the rack housing 110. The heat exchanger system 100 is installed on the rear door 140. In this example, the heat exchanger system 100 is a closed-loop liquid cooling system for cooling the electronic components or devices in the rack housing 110 (for example, the servers 130 and 132). Each heat-generating electronic component in the rack housing 110 has a liquid cooling duct, which allows the circulation of liquid coolant to extract heat from the heat-generating electronic components. In this example, the liquid coolant conduit is connected to a cooling plate, which circulates the liquid coolant to transport away the heat generated by the internal components of the heat-generating electronic components in the rack housing 110. For example, the cooling plate internally circulates the liquid coolant supplied by the heat exchanger system 100 to absorb heat generated by components (such as the processors in the servers 130 and 132).

The rear door 140 has a flat inner surface 142, and the flat inner surface 142 supports a heat exchanger 150 and a fan wall 152 of the heat exchange system 100. The heat exchange system 100 includes a heat exchanger 150 that is fluidly connected to the liquid coolant conduit of the heat-generating electronic components in the rack housing 110. The fan wall 152 includes a plurality of fans, and these fans provide air flow from the front wall 120 of the rack housing 110 and pass through the heat exchanger 150.

Figure 4B is a perspective view of an example heat exchanger 150. The heat exchanger 150 has a shaped front side, such as a curved front side 154. When the rear door 140 is in the closed position, the shaped front side generally faces the electronic components in the rack housing 110. When the rear door 140 is in the closed position (Figure 4A), the curved front side 154 is located at a certain distance from the electronic components. A curved rear side 156 is in contact with the fan wall 152 (Figure 4A). The two sides of the heat exchanger 150 are joined to the front side 154 and the rear side 156. The fins 158 separate the sides of the heat exchanger 150. The fins 158 are hollow and have ducts for flowing the returning heated coolant. The curved shape of the front side 154 and the rear side 156 allows relatively more heat sinks 158 to be provided. Compared with the conventional linear design, additional cooling fins can provide more cooling surface area. The heat exchanger 150 is fluidly connected to an outlet fluid connector 160 and an inlet fluid connector 162. The pump (not shown) circulates the coolant between the heat exchanger 150 and the heat-generating electronic components in the rack housing 110.

The heat exchanger 150 extracts heat from the circulating liquid coolant in the heat exchanger 150. Therefore, the coolant circulates from the outlet fluid connector 160 through the internal cooling plate of the heat-generating electronic components in the rack housing 110 (FIG. 4A). The coolant transports the heat generated by the electronic components in the rack housing 110 away. The heated coolant is returned to the heat exchanger 150 through the inlet fluid connector 162. When the coolant circulates through the fins 158 of the heat exchanger 150, the airflow system, such as the fan wall 152, moves the surrounding air through the shaped front side 154 of the heat exchanger 150 to remove the coolant in the fins 158 The heat is transported away and reduces the temperature of the coolant. Then, the cooled liquid coolant circulates back through the outlet fluid connector 160.

The disclosed concept is to use different shapes of heat exchanger 150 to improve the performance of the heat exchanger 150 by allowing more fins and therefore more cooling surface area to be provided. The rear end of the rack housing 110 has a plane shape defined by the side walls 112 and 114 and the top plate 116 and the bottom plate 118. In this example, the planar shape is a flat rectangular plane, and the flat rectangular plane has a surface area, which is represented by the plane 400 in FIG. 4A. The flat plane 400 is approximately the surface area of a conventional heat exchanger (for example, the heat exchanger 22 shown in FIG. 2), which faces the heat-generating electronic components in the rack housing 110. In contrast, the surface area of the exemplary heat exchanger 150 with the curved front side 154 is represented by the plane 410 in FIG. 5. If the front side 154 is flattened, the plane 410 represents the surface area of the curved front side 154. Due to the curvature of the front side 154, the surface area of the plane 410 is greater than the surface area of the plane 400, and therefore allows relatively more heat sinks to be provided.

The heat exchanger 150 includes a curved front side 154. Compared with the flat surface (represented by the plane 400) in the conventional heat exchanger 22 shown in FIG. 2C, the curved front side 154 has a larger surface area (represented by the plane 410). In this example, the curved front side 154 provides more radiating fins than a heat radiating fin that forms a flat surface in a general design, and the cooling surface area is increased by 20%-30% by the additional radiating fin. The increased surface area of the additional fins of the heat exchanger 150 helps to transfer more heat from the circulating coolant to the outside of the heat exchanger 150. The heat dissipation solution of the heat exchanger with fins forming the curved front side 154, compared to the conventional design such as the heat exchanger 22 in Figure 2C, can provide cooling to allow heat generation in the rack housing 110 The system maximum energy consumption of electronic components increases by 20%.

Figure 5 shows a top view of an alternative version of the equipment rack housing 110 of Figure 3 with a heat exchanger system 510. The same parts in Figure 5 and Figure 3 are labeled with the same reference numerals. The heat exchanger system 510 is installed on the inner surface 142 of the rear door 140. The heat exchanger system 510 provides liquid coolant through the fluid outlet fluid connector 160 (FIG. 3) to cool the heat-generating electronic components in the equipment rack housing 110. The heated coolant is circulated back to the heat exchanger system 510 via the fluid inlet fluid connector 162.

The heat exchanger system 510 includes a heat exchanger 520 and a liquid coolant pipe. The liquid coolant pipe circulates the coolant to cool the heat-generating electronic components in the equipment rack housing 110. The air flow system (e.g., fan wall 522) passes the ambient air through the heat exchanger 520 to transport the heat in the coolant away. The fan wall 522 includes a plurality of fans that provide air flow through the heat exchanger 520 from the front wall 120 of the equipment rack housing 110. The heat exchanger 520 includes three parts 530, 532, and 534. The fan wall 522 is located between the three components 530, 532 and 534 and the rear door 140. The central part 530 has a flat outer part 540 facing the electronic parts of the equipment rack housing 110. Both of the other two parts 532 and 534 are attached to the end of the central part 530 and inclined. Both other parts 532 and 534 have similar flat outer portions 542 and 544.

Since the parts 532 and 534 are both inclined with respect to the central part 530, the combined surface area of the outer parts 540, 542, and 544 is larger than that of the conventional heat exchanger (for example, the heat exchanger 22 in Figure 2). As described herein, the conventional heat exchanger has a surface area facing the components in the equipment rack, and this surface area is defined by a flat plane having an open rear end shape of the equipment rack housing 110. In this example, a plane 550 defines the area of this flat plane. The number of fins used in the conventional heat exchanger is limited by the width of the plane 550. The total surface area of the outer parts 540, 542, and 544 is relatively large, as shown by the planes 560, 562, and 564. As explained herein, the larger surface area of the outer portions 542 and 544 of the angled components allows more fins to be provided, and therefore, increases the cooling capacity of the heat exchanger system 510 with a larger cooling surface area. Of course, other components can be attached at an angle to each other to further increase the surface area by providing more heat sinks in contact with the external airflow.

Figure 6 is a top view of another exemplary equipment rack assembly 600 with an improved heat exchanger and shaped doors. As explained here, the rack assembly 600 is based on a curved rack door that supports a curved heat exchanger on a curved inner surface of the door. The rack assembly 600 has a closed-loop liquid heat exchanger system 608 and a rack housing 610.

The frame housing 610 includes two side walls 612 and 614, and the two side walls are joined by a top plate 616 and a bottom plate. A front wall 620 joins the side walls 612 and 614 to close the housing 610. As explained here, the inside of the side walls 612 and 614 may support the struts and cross members to have multiple grooves to allow a shelf to be attached between the side walls 612 and 614. Heat-generating electronic components, such as servers, can be placed on the shelf between the side walls 612 and 614.

The rack housing 610 has a rear door 630 that allows the heat-generating electronic components in the rack housing 610 to enter. The rear door 630 is attached to the side wall 612 via a hinge, which allows the rear door 630 to swing between an open position and a closed position. The rear door 630 has a curved plate 632. The inner surface 634 of the curved plate 632 supports the heat exchanger system 608.

The heat exchanger system 608 is a closed-loop liquid cooling system, and the closed-loop liquid cooling system cools the heat-generating electronic components (such as a server) in the rack housing 610. A series of delivery pipes circulate the liquid coolant to transport away the heat generated by the heat-generating electronic components. The heat exchanger system 608 includes a heat exchanger 640 and a liquid coolant conduit. The liquid coolant conduit system circulates the coolant through the components in the rack housing 610. An air flow system, such as a fan wall 642, includes a plurality of fans. The fans provide air flow from the front wall 620 of the equipment rack housing 610 and pass the air flow through the heat exchanger 640, as shown by arrow 644. The fan wall 642 has an opposite curved plate 648, and the curved plate 648 is adjacent to the heat exchanger 640.

The heat exchanger 640 is generally semicircular. The heat exchanger 640 has an inner curved surface 652 in contact with the curved plate 648 of the fan wall 642. The opposite curved surface 654 contacts the inner surface 634 of the fan rear door 630. The heat exchanger 640 is fluidly connected to the outlet fluid connector 660 and the inlet fluid connector 662. The pump (not shown) circulates the coolant between the heat exchanger 640 and the electronic heating components in the equipment rack housing 610.

Therefore, the coolant flows from the outlet fluid connector 660 and circulates through the delivery pipe network, which supplies the coolant to the internal cooling plates in the heat-generating electronic components in the rack housing 610. The coolant transfers the heat generated by the heat-generating electronic components in the rack housing 610 away. The heated coolant is returned to the heat exchanger 640 through the inlet fluid connector 662. When the coolant circulates through the fins of the heat exchanger 640 between the curved surfaces 652 and 654, the air flow generated by the fan wall 642 passes through the curved surface 652 of the heat exchanger 640 from the front plate 646 to remove the The heat of the coolant is transported away, thereby reducing the temperature of the coolant. The cooled liquid coolant is circulated back through the outlet fluid connector 660.

The curved plate 632 of the rear door creates additional space for the heat exchanger 640. Therefore, the fan in the fan wall 642 pushes the gas through the heat exchanger 640 instead of pulling the gas through the heat exchanger as in the example system in Figures 3-5. Due to the curved shape of the rear door 630, the curved rear door shape allows the size of the heat exchanger 640 to be increased to fill the increased space between the rack housing 610 and the rack rear door 630. Therefore, as the size of the heat exchanger 640 increases, this concept will improve the performance of the heat exchanger 640, and therefore the number of heat sinks that can be provided also increases.

The terms used herein are only used for the purpose of describing specific embodiments, and are not intended to limit the creation. As used herein, unless the content clearly indicates otherwise, the terms "a" and "the" in the singular form also include the plural form. In addition, with regard to the use of the terms "including", "including", "with", "having", "有" or their variants in the detailed description and/or the scope of the patent application, these terms are intended to include similar The term "includes".

Unless otherwise defined, all words (including technical or scientific terms) used herein have the same meaning as commonly understood by those with ordinary knowledge in the technical field to which this creation belongs. In addition, words such as those defined in commonly used dictionaries should be interpreted as having meaning consistent with their meaning in the relevant technical content, and will not be interpreted as ideal or excessively superficial meaning unless clearly defined here.

Although various embodiments of the present creation have been described above, it should be understood that they are presented only as examples and not limitations. Without departing from the spirit or scope of the creation, various changes can be made to the disclosed embodiments according to the disclosure herein. Therefore, the breadth and scope of this creation should not be limited by any of the above-mentioned embodiments. On the contrary, the scope of this creation should be defined according to the following patent scope and its equivalents.

Although this creation has been illustrated and described with reference to one or more embodiments, those with ordinary knowledge in the art will be able to think of equivalent changes and modifications after reading and understanding this specification and drawings. In addition, although a particular feature of this creation may be disclosed with respect to only one of several embodiments, this feature can be combined with one or more other features of other embodiments, and this is relevant to any given or specific application. Expecting and beneficial.

To sum up, although this creation has been disclosed as above in an embodiment, it is not intended to limit this creation. Those with ordinary knowledge in the technical field to which this creation belongs can make various changes and modifications without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation shall be subject to the scope of the attached patent application.

10: Closed loop cooling system 20: Heat source 22: Heat exchanger 24, 26: Liquid flow tube 30: Fan array 32: Airflow 50: rack shell 52: Cabinet 54: server 56: Backdoor 60: Cold liquid coolant connector 62: hot coolant connector 70: Flat rectangular surface 100: heat exchanger system 110: Rack shell 112, 114: sidewall 116: top plate 118: bottom plate 120: front wall 122: Pillar 124: Cross member 126, 128: Shelf 130,132: server 140: Backdoor 142: inner surface 150: heat exchanger 152: Fan Wall 154: front 156: back 158: Heat sink 160: Outlet fluid connector 162: Inlet fluid connector 400,410: plane 510: Heat Exchanger System 520: heat exchanger 522: Fan Wall 530,532,534: parts 540,542,544: external 550,560,562,564: plane 600: rack components 608: heat exchanger system 610: rack shell 612,614: sidewall 616: top plate 620: front wall 630: back door 632: Bent Plate 634: inner surface 640: heat exchanger 642: Fan Wall 644: Arrow 646: front panel 648: Bent Plate 652,654: curved surface 660: Outlet fluid connector 662: Inlet fluid connector

The present disclosure will be better understood with reference to the description of the following exemplary embodiments and the accompanying drawings, in which: Figure 1 is a block diagram of a prior art closed-loop cooling system; Figure 2A is a perspective view of a known heat exchanger system on a rack shell; Figure 2B is an exploded view of the components of the known heat exchanger system in Figure 2A; Figure 2C is a top view of the known heat exchanger in Figure 2A installed on the door of the rack housing; Figure 3 is a perspective view of an example of an improved heat exchanger installed in a rack according to some aspects of the present disclosure; Figure 4A is a top view of the exemplary improved heat exchanger in Figure 3 according to some aspects of the present disclosure; Figure 4B is a perspective view of the exemplary improved heat exchanger in Figure 3A; Figure 5 is a top view of another example of an improved heat exchanger according to some aspects of the present disclosure; and Figure 6 is a top view of another exemplary equipment rack assembly with an improved heat exchanger and shaped doors in accordance with some aspects of the present disclosure.

The present disclosure is in a form that can be easily modified and replaced. Some representative embodiments have been shown in the drawings by way of example, and will be described in detail here. However, it should be understood that this creation is not limited to the specific form disclosed. On the contrary, this disclosure will include all modifications, equivalents, and alternatives that fall within the spirit and scope of the creation as defined by the scope of the appended application.

100: heat exchanger system

110: Rack shell

112, 114: sidewall

116: top plate

118: bottom plate

120: front wall

122: Pillar

124: Cross member

126, 128: Shelf

140: Backdoor

142: inner surface

150: heat exchanger

152: Fan Wall

154: front

158: Heat sink

160: Outlet fluid connector

162: Inlet fluid connector

Claims (10)

A device component including: A housing for accommodating a heat-generating electronic component, the housing including an open end with a flat area; A closed-loop liquid cooling system, including: A liquid coolant conduit near the heat-generating electronic component, allowing a liquid coolant to circulate to extract heat from the heat-generating electronic component; A heat exchanger fluidly coupled to the liquid coolant conduit to extract heat from the circulating liquid coolant in the heat exchanger, wherein the heat exchanger includes the opening facing the housing A forming front side of the end, the surface area of the forming front side is greater than the surface area of the flat area of the open end; and An air flow system operable to push ambient air through the shaped front side of the heat exchanger. According to the device assembly described in claim 1, wherein the front forming side is a curved shape, and the front forming side includes at least two parts, each part having a flat exterior connected at an angle to each other. The equipment assembly described in claim 1, wherein the liquid coolant pipe system is coupled to a cooling plate, the heat exchanger includes a first side and a second side, the first side and the second side The side system is separated by a plurality of cooling fins extending from the forming front side. According to the equipment assembly described in claim 1, wherein the air flow system includes a plurality of fans, and the fans are close to a rear surface of the heat exchanger and opposite to the front side of the forming. According to the device assembly described in claim 1, wherein the housing includes a door, the door has a closed position closing the open end, and the closed-loop liquid cooling system and the air flow system are installed on the door. A cooling system for circulating a liquid coolant to remove heat generated by a heat-generating electronic component in an equipment rack, the equipment rack having an open end defined by a flat surface area, the The cooling system includes: A liquid coolant outlet for circulating the liquid coolant to extract heat from the heat-generating electronic component; A liquid coolant inlet for collecting the liquid coolant; A heat exchanger fluidly coupled to the liquid coolant inlet and the liquid coolant outlet to extract heat from the circulating liquid coolant in the heat exchanger, wherein the heat exchanger includes A forming front side facing the open end of the shell, the surface area of the forming front side is greater than the surface area of the plane; and An air flow system operable to push ambient air through the shaped front side of the heat exchanger. The cooling system according to claim 6, wherein the forming front side is a curved surface, and the forming front side includes at least two parts, each part having a flat exterior connected at an angle to each other. The cooling system described in claim 6, wherein a liquid coolant pipe system is coupled to a cooling plate, the heat exchanger includes a first side and a second side, the first side and the second side The side system is separated by a plurality of cooling fins extending from the forming front side. According to the cooling system described in claim 6, wherein the airflow system includes a plurality of fans, the fans are close to a rear surface of the heat exchanger and opposite to the front side of the forming, the equipment rack includes a door, the The door has a closed position for closing the open end, wherein the cooling system is installed on the door. An equipment rack including: A pair of side walls; A top plate and a bottom plate attached to the pair of side walls to define an open end, the pair of side walls, the top plate and the bottom plate provide support for a heat-generating electronic component installed between the pair of side walls; A door is attached to one of the pair of side walls, the door having a curved shape and a curved inner surface; A fan wall is attached to the door; A heat exchanger including an inlet fluid duct and an outlet fluid duct for fluidly circulating a coolant to a heat-generating electronic component, the heat exchanger being located between the curved inner surface of the door and the fan wall .

Images