CN208507657U - Y-shaped liquid cooling radiator complete device suitable for cooling data machine room chip - Google Patents
Y-shaped liquid cooling radiator complete device suitable for cooling data machine room chip Download PDFInfo
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- CN208507657U CN208507657U CN201820864005.2U CN201820864005U CN208507657U CN 208507657 U CN208507657 U CN 208507657U CN 201820864005 U CN201820864005 U CN 201820864005U CN 208507657 U CN208507657 U CN 208507657U
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Abstract
本实用新型公开了一种适用于数据机房芯片冷却的Y型液冷散热器成套装置，包括换热器、分集器和Y型液冷散热器等。用于冷却芯片的冷却水通过分集器流向各个机柜中主机内的Y型液冷芯片散热器，在对芯片冷却的同时冷却水被加热，被加热的冷却水通过流道回到分集器，再进入换热器与冷水换热，进而降低冷却水温度，完成换热循环。所述Y型液冷散热器通过构造理论来确定各级流道的长度和直径，以获得最佳的尺寸设计比例。本实用新型中将该种Y型液冷散热器通过导热硅胶与主机内的散热芯片紧密连接，利用流动的冷却水持续带走芯片产生的热量，获得更好的散热效果，从源头上解决数据机房芯片发热量大、芯片易损坏的问题。
The utility model discloses a Y-shaped liquid-cooling radiator complete set suitable for cooling chips in a data computer room, comprising a heat exchanger, a divider, a Y-shaped liquid-cooling radiator and the like. The cooling water used to cool the chip flows to the Y-type liquid-cooled chip radiator in the host in each cabinet through the divider. The cooling water is heated while the chip is cooled, and the heated cooling water returns to the divider through the flow channel. Enter the heat exchanger and exchange heat with cold water, thereby reducing the temperature of the cooling water to complete the heat exchange cycle. The Y-type liquid cooling radiator determines the length and diameter of the flow channels of each stage through the construction theory to obtain the best size design ratio. In the utility model, this kind of Y-type liquid cooling radiator is closely connected with the heat dissipation chip in the host through the thermal conductive silica gel, and the heat generated by the chip is continuously taken away by the flowing cooling water, so as to obtain a better heat dissipation effect, and solve the data from the source. The chip in the computer room generates a lot of heat and the chip is easily damaged.
Description
Technical field
The utility model relates to arrive data center computer room chip cooling technique field, it particularly relates to be suitable for modem to a kind of
The Y type liquid cooling heat radiator complexes of room chip cooling technique.
Background technique
The heating power of the fast development of companion chip technology, chip is increasing, and the chip in computer is more and more
Ground needs external equipment to improve radiating efficiency.And the heat dissipation problem of chip is related to the stability of equipment operation, safety, heat dissipation
The bad degradation that will lead to computer performance, and product reliability of operation is influenced, it is serious also to will affect other portions of computer
The use of part and service life.
In view of the above-mentioned problems, people, which are dedicated to developing, to be the mode of computer chip high efficiency and heat radiation.Presently the most
Common chip cooling technology still based on air-cooled, i.e., installs a radiator additional on the surface of cooled chip, heat passes through
The cold wind that fin on radiator is forced to flowing is taken away, and what Chinese patent CN107507812A was used is exactly a kind of compact wind
Cold heat sink, but wind-cooling heat dissipating technology is there are low efficiency, operation noise is big, is limited many problems such as big by space, gradually will
Replaced other cooling heat dissipation technologys.It is well known that being there are also a kind of chip cooling technology with compared with high heat transfer efficiency
Liquid-cooled cools down heat dissipation technology, but due to current processing technology and installation question, coolant liquid leakage problems easily occurs.At present
In the intracavitary needle column matrix for processing a square or polygon of armpit, main function is exactly common one kind liquid cooling heat radiator
Increase the intracavitary heat exchange area of armpit to improve cooling effect.But it is not each that the defect of the radiator of the type, which is each needle column,
From independent structure, and needle column is short and small, sap cavity bottom is relatively thick, cause liquid cooling heat radiator built-in system drag losses compared with
Greatly, liquid smooth can not circulate, and increase system energy consumption.Therefore the structure is other than above-mentioned processing problems, and crucial there are also pass
Defect in terms of heat and flow theory.Meanwhile it is existing have much about liquid cooling radiator patent, mostly just for separate unit take
The heat dissipation problem of business device, but do not have also at present and Integrated design is carried out to it, it is not used to solve to own in entire data center computer room
The heat dissipation problem of server.
For the studies above there are the shortcomings that, which then discloses a kind of suitable for data center computer room chip cooling technique
Y type liquid cooling heat radiator complexes have better solved stable radiator, efficient cooling heat dissipation, processing technology and installation question.
Simultaneously as Y type liquid cooling heat radiator uses structural theory, the drag losses of system can be reduced to greatest extent, are dropped significantly
Low energy consumption.
Utility model content
Place in view of above-mentioned deficiencies of the prior art, the purpose of this utility model is that utility model one kind is suitable for data
The Y type liquid cooling heat radiator complexes of computer room chip cooling technique, utilize structural theory, it is intended to it is stable, high to better solve radiator
The problem of cooling heat dissipation of effect, processing technology and installation and cooling system high energy consumption.
The Y type liquid cooling heat radiator complexes that this kind is suitable for data center computer room chip cooling technique include heat exchanger (1), total adjusting
Valve (2), diversity device (3), first branch regulating valve (4-1), second branch regulating valve (4-2), third branch regulating valve (4-3),
4th branch regulating valve (4-4), the 5th branch regulating valve (4-5), rack (5), the first host (6-1), the second host (6-2),
Third host (6-3), the 4th host (6-4), the 5th host (6-5), Y type liquid cooling heat radiator (7), water pump (8).Each host
One Y type liquid cooling heat radiator (7) of interior corresponding installation, Y type liquid cooling heat radiator (7) pass through the heat radiation chip in heat conductive silica gel and host
Close connection.
To ensure that the device stable operation, the connection between each equipment are particularly important.Firstly, heat exchanger (1)
Cooling water mouth is connected with total feed water inlet of diversity device (3), and total regulating valve (2) are installed on the connection pipeline section, total to supply
Water pipe enters diversity device (3) and is dispersed away afterwards by each branch.Then, from diversity device (3) first feed water inlet of the lowermost,
One water return outlet starts, the external water supplying pipe in the first feed water inlet, be placed in rack (5) bottommost the first host (6-1) in Y
The water inlet of type liquid cooling heat radiator (7) is connected, and installs first branch regulating valve (4-1) on pipeline, Y type liquid cooling heat radiator
(7) water outlet passes through pipeline with the first water return outlet of diversity device (3) again and connect, and completes the circulation of a cooling branch.Second
The external water supplying pipe in feed water inlet, be placed in rack (5) bottommost the second host (6-2) in Y type liquid cooling heat radiator (7)
Water inlet is connected, and installs second branch regulating valve (4-2) on pipeline, the water outlet and diversity of Y type liquid cooling heat radiator (7)
Second water return outlet of device (3) is connected by pipeline again, completes the circulation of second cooling branch.The external water supply in third feed water inlet
Pipe, is connected with the water inlet of the Y type liquid cooling heat radiator (7) in the third host (6-3) for being placed in rack (5) bottommost, and
Third branch regulating valve (4-3) is installed on pipeline, the water outlet of Y type liquid cooling heat radiator (7) and the third of diversity device (3) are returned
The mouth of a river is connected by pipeline again, completes the circulation of the cooling branch of third.The 4th external water supplying pipe in feed water inlet, and is placed in rack
(5) water inlet of the Y type liquid cooling heat radiator (7) in the 4th host (6-4) of bottommost is connected, and the 4th is installed on pipeline
Branch regulating valve (4-4), the water outlet of Y type liquid cooling heat radiator (7) and the 4th water return outlet of diversity device (3) are connected by pipeline again
It connects, completes the circulation of the 4th cooling branch.The 5th external water supplying pipe in feed water inlet, and is placed in the 5th of rack (5) bottommost
The water inlet of Y type liquid cooling heat radiator (7) in host (6-5) is connected, and the 5th branch regulating valve (4- is installed on pipeline
5), the water outlet of Y type liquid cooling heat radiator (7) passes through pipeline with the 5th water return outlet of diversity device (3) again and connect, and completion the 5th is cold
But the circulation of branch.Then, be pooled on total return pipe of diversity device (3) there are five the cooling water return water of branch, diversity device
(3) total return pipe is connected with heat exchanger (1) cooling water water return outlet, is installing at heat exchanger (1) cooling water water return outlet
Water pump (8).Finally, the circulating chilled water loop for cooling down cooling water is supplied with the cold water of heat exchanger (1), water return outlet is connected,
Cooling water and cold water is made to form the form of counterflow heat exchange in heat exchanger (1), the low-temperature cooling water after completing heat exchange passes through again to be changed
The cooling water mouth of hot device (1) is supplied outward, completes the circulation of whole device.Wherein for being changed with cooling water in radiator
The cold water of heat can be the tap water under normal temperature state, can be the chilled water or other cold sources of refrigeration unit generation.
The Y type liquid cooling heat radiator complexes that this kind is suitable for data center computer room chip cooling technique can be used for main in a cabinet
The chip cooling of machine can be used for the chip cooling of host in more cabinets.Meanwhile cabinet can be and only serve a clothes
Business device, is also possible to serve multiple servers.
The cooling water of circulation is flow to the water inlet in Y type liquid cooling heat radiator (7) surrounding cavity outside wall surface by water inlet pipe, water inlet
Pipe is connected to center convergence point through surrounding cavity outside wall surface, enters from the inlet cooling water by the section and leads to center convergence point
Hollow duct, reach the cooling water of center convergence point by flow-guiding channel diverging flow around, the cooling water after heating by
The outflow of afterbody runner, comes together in the cavity of surrounding, eventually flows to Y type liquid cooling heat radiator (7) under the action of water pump (8)
Water outlet.About the size of Y type liquid cooling heat radiator (7), such as: the diameter of each runner, length, diameter, the height of entire radiator
Degree etc. is utmostly to enhance heat dissipation effect according to being designed with structural theory.Meanwhile by structural theory, Y type liquid cooling
The series of runner contained by radiator (7) should be second level and its more than, specific quantity is determined by the size of chip.
To avoid interface that drainage occurs, the disengaging pipeline section of Y type liquid cooling heat radiator (7) is both needed to stretch in each host
A distance out, and connectivity port is all made of the form of internal screw thread and branch water pipe is attached.Meanwhile Y type liquid-cooling heat radiation
Device (7) is minitype radiator, and each flow diameter is smaller, to avoid that electrostatic and drainage occur in host, need to be used high-strength
Degree, non electrically conductive material make Y type liquid cooling heat radiator (7) under the support of 3D printing technique.
Detailed description of the invention
Fig. 1 is a kind of total system figure of Y type liquid cooling heat radiator complexes suitable for data center computer room chip cooling technique.
Fig. 2 is the floor map of Y type liquid cooling heat radiator in the utility model.
Fig. 3 is the connection schematic diagram of Y type liquid cooling heat radiator in the 5th host 6-5 in the utility model.
Label title in figure: 1, heat exchanger；2, total regulating valve；3, diversity device；4-1, first branch regulating valve；4-2,
Two branch regulating valves；4-3, third branch regulating valve；4-4, the 4th branch regulating valve；4-5, the 5th branch regulating valve；5, rack；
6-1, the first host；6-2, the second host；6-3, third host；6-4, the 4th host；6-5, the 5th host；7, Y type liquid cooling dissipates
Hot device；8, water pump.
Specific embodiment
As shown in Figure 1, described in the utility model is a kind of Y type liquid cooling heat radiator suitable for data center computer room chip cooling technique
Complexes, it is characterised in that the device includes 1, heat exchanger；2, total regulating valve；3, diversity device；4-1, first branch regulating valve；
4-2, second branch regulating valve；4-3, third branch regulating valve；4-4, the 4th branch regulating valve；4-5, the 5th branch regulating valve；
5, rack；6-1, the first host；6-2, the second host；6-3, third host；6-4, the 4th host；6-5, the 5th host；7, Y type
Liquid cooling heat radiator；8, water pump.One Y type liquid cooling heat radiator 7 of corresponding installation in each host, Y type liquid cooling heat radiator 7 is by leading
Hot silica gel is closely connect with the heat radiation chip in host.This kind be suitable for data center computer room chip cooling technique Y type liquid cooling heat radiator at
Covering device can be used for the chip cooling of host in a cabinet, can be used for the chip cooling of host in more cabinets.Together
When, cabinet, which can be, only serves a server, is also possible to serve multiple servers.
To ensure that the device stable operation, the connection between each equipment are particularly important.To be placed in a rack
For five hosts, firstly, the cooling water mouth of heat exchanger 1 is connected with total feed water inlet of diversity device 3, and in the connecting tube
Total regulating valve 2 is installed, total water supplying pipe is dispersed away after entering diversity device 3 by each branch in section.Then, most from diversity device 3
First feed water inlet of lower end, the first water return outlet start, the external water supplying pipe in the first feed water inlet, and are placed in the of 5 bottommost of rack
The water inlet of Y type liquid cooling heat radiator 7 in one host 6-1 is connected, and the first branch regulating valve 4-1, Y type are installed on pipeline
The water outlet of liquid cooling heat radiator 7 passes through pipeline with the first water return outlet of diversity device 3 again and connect, and completes following for a cooling branch
Ring.The external water supplying pipe in second feed water inlet, with the Y type liquid cooling heat radiator 7 in the second host 6-2 for being placed in 5 bottommost of rack
Water inlet is connected, and the water outlet and diversity device 3 of second branch regulating valve 4-2, Y type liquid cooling heat radiator 7 are installed on pipeline
The second water return outlet again by pipeline connect, complete the circulation of second cooling branch.The external water supplying pipe in third feed water inlet, with peace
The water inlet for the Y type liquid cooling heat radiator 7 being placed in the third host 6-3 of 5 bottommost of rack is connected, and is installed on pipeline
The water outlet of three branch regulating valve 4-3, Y type liquid cooling heat radiators 7 passes through pipeline with the third water return outlet of diversity device 3 again and connect, complete
At the circulation of the cooling branch of third.The 4th external water supplying pipe in feed water inlet, with the 4th host 6-4 for being placed in 5 bottommost of rack
The water inlet of interior Y type liquid cooling heat radiator 7 is connected, and the 4th branch regulating valve 4-4, Y type liquid-cooling heat radiation is installed on pipeline
The water outlet of device 7 passes through pipeline with the 4th water return outlet of diversity device 3 again and connect, and completes the circulation of the 4th cooling branch.5th
The external water supplying pipe in feed water inlet, be placed in 5 bottommost of rack the 5th host 6-5 in Y type liquid cooling heat radiator 7 water inlet phase
Connection, and install on pipeline the 5th branch regulating valve 4-5, Y type liquid cooling heat radiator 7 water outlet and the 5th time of diversity device 3
The mouth of a river is connected by pipeline again, completes the circulation of the 5th cooling branch.Then, collect there are five the cooling water return water of branch
Onto total return pipe of diversity device 3, total return pipe of diversity device 3 is connected with 1 cooling water water return outlet of heat exchanger, close to heat exchange
Water pump 8 is installed at 1 cooling water water return outlet of device.Finally, the cold water of circulating chilled water loop and heat exchanger 1 for cooling down cooling water
It is connected for, water return outlet, cooling water and cold water is made to form the form of counterflow heat exchange in heat exchanger 1, it is low after completing heat exchange
The cooling water mouth that warm cooling water passes through heat exchanger 1 again is supplied outward, completes the circulation of whole device.Wherein in radiator
For can be the tap water under normal temperature state with the cold water that cooling water exchanges heat, the chilled water of refrigeration unit generation can be, or
It is other cold sources.
The cooling water of circulation is flow to the water inlet in 7 surrounding cavity outside wall surface of Y type liquid cooling heat radiator, water inlet pipe by water inlet pipe
It is connected to center convergence point through surrounding cavity outside wall surface, cooling water is entered from the inlet by this section and leads to center convergence point
Hollow duct, the cooling water for reaching center convergence point pass through flow-guiding channel diverging flow around, and the cooling water after heating is by most
The outflow of rear stage runner, comes together in the cavity of surrounding, the water outlet of Y type liquid cooling heat radiator 7 is eventually flowed under the action of water pump 8
Mouthful.
About the size of Y type liquid cooling heat radiator 7, such as: the diameter of each runner, length, diameter, height of entire radiator etc.
Deng with structural theory being using best proportion, utmostly to enhance heat dissipation effect according to being designed.It is dissipated about Y type liquid cooling
The Series Problems of runner contained by hot device 7, by structural theory should be second level and its more than, specific quantity by the size of chip Lai really
It is fixed.At the same time, to avoid interface that drainage occurs, the disengaging pipeline section of Y type liquid cooling heat radiator 7 is both needed in each host
A distance is stretched out, and connectivity port is all made of the form of internal screw thread and branch water pipe is attached.It is apparent from Y type liquid-cooling heat radiation
Device 7 is minitype radiator, and each flow diameter is smaller, to avoid that electrostatic and drainage occur in host, is then needed using high-strength
Degree, non electrically conductive material make Y type liquid cooling heat radiator 7 under the support of 3D printing technique.
Claims (7)
1. a kind of Y type liquid cooling heat radiator complexes suitable for data center computer room chip cooling technique, it is characterised in that: including heat exchanger
(1), total regulating valve (2), diversity device (3), first branch regulating valve (4-1), second branch regulating valve (4-2), third branch tune
Save valve (4-3), the 4th branch regulating valve (4-4), the 5th branch regulating valve (4-5), rack (5), the first host (6-1), second
Host (6-2), third host (6-3), the 4th host (6-4), the 5th host (6-5), Y type liquid cooling heat radiator (7), water pump (8)；
One Y type liquid cooling heat radiator (7) of corresponding installation in each host, Y type liquid cooling heat radiator (7) pass through in heat conductive silica gel and host
Heat radiation chip closely connect.
2. a kind of Y type liquid cooling heat radiator complexes suitable for data center computer room chip cooling technique according to claim 1, one
It is connected with each other between each equipment in a cabinet, it is characterised in that: the cooling water mouth of heat exchanger (1) and diversity device (3)
Total feed water inlet is connected, and total regulating valve (2) are installed on the connection pipeline section, and total water supplying pipe enters diversity device (3) afterwards by each
A branch disperses away；Since diversity device (3) first feed water inlet of the lowermost, the first water return outlet, the external confession in the first feed water inlet
Water pipe is connected with the water inlet of the Y type liquid cooling heat radiator (7) in the first host (6-1) for being placed in rack (5) bottommost,
And first branch regulating valve (4-1) is installed on pipeline, first time of the water outlet of Y type liquid cooling heat radiator (7) and diversity device (3)
The mouth of a river is connected by pipeline again, completes the circulation of a cooling branch；The external water supplying pipe in second feed water inlet, and is placed in rack
(5) water inlet of the Y type liquid cooling heat radiator (7) in the second host (6-2) of bottommost is connected, and second is installed on pipeline
Branch regulating valve (4-2), the water outlet of Y type liquid cooling heat radiator (7) and second water return outlet of diversity device (3) are connected by pipeline again
It connects, completes the circulation of second cooling branch；The external water supplying pipe in third feed water inlet, with the third for being placed in rack (5) bottommost
The water inlet of Y type liquid cooling heat radiator (7) in host (6-3) is connected, and third branch regulating valve (4- is installed on pipeline
3), the water outlet of Y type liquid cooling heat radiator (7) passes through pipeline with the third water return outlet of diversity device (3) again and connect, and it is cold to complete third
But the circulation of branch；The 4th external water supplying pipe in feed water inlet, be placed in rack (5) bottommost the 4th host (6-4) in Y type
The water inlet of liquid cooling heat radiator (7) is connected, and the 4th branch regulating valve (4-4), Y type liquid cooling heat radiator are installed on pipeline
(7) water outlet passes through pipeline with the 4th water return outlet of diversity device (3) again and connect, and completes the circulation of the 4th cooling branch；The
The external water supplying pipe in five feed water inlets, be placed in rack (5) bottommost the 5th host (6-5) in Y type liquid cooling heat radiator (7)
Water inlet is connected, and the 5th branch regulating valve (4-5), the water outlet and diversity of Y type liquid cooling heat radiator (7) are installed on pipeline
5th water return outlet of device (3) is connected by pipeline again, completes the circulation of the 5th cooling branch；There are five branch cooling water
Return water is pooled on total return pipe of diversity device (3), total return pipe and heat exchanger (1) the cooling water water return outlet phase of diversity device (3)
Connection is installing water pump (8) at heat exchanger (1) cooling water water return outlet；For cool down the circulating chilled water loop of cooling water with
The cold water of heat exchanger (1) supplies, water return outlet is connected, and cooling water and cold water is made to form the shape of counterflow heat exchange in heat exchanger (1)
Formula, the cooling water mouth that the low-temperature cooling water after completing heat exchange passes through heat exchanger (1) again are supplied outward, complete whole device
Circulation.
3. a kind of Y type liquid cooling heat radiator complexes suitable for data center computer room chip cooling technique according to claim 1,
Be characterized in that: the Y type liquid cooling heat radiator complexes that this kind is suitable for data center computer room chip cooling technique are suitable for main in a cabinet
The chip cooling of host in the chip cooling of machine and more cabinets.
4. a kind of Y type liquid cooling heat radiator complexes suitable for data center computer room chip cooling technique according to claim 2,
Be characterized in that: the cold water in radiator for exchanging heat with cooling water can be the tap water under normal temperature state, can be refrigeration
The chilled water or other cold sources that unit generates.
5. a kind of Y type liquid cooling heat radiator complexes suitable for data center computer room chip cooling technique according to claim 1,
Be characterized in that: the cooling water of circulation is flow to the water inlet in Y type liquid cooling heat radiator (7) surrounding cavity outside wall surface by water inlet pipe, into
Water pipe is connected to center convergence point through surrounding cavity outside wall surface, enters from the inlet cooling water by the section and leads to center convergence
The hollow duct of point, the cooling water for reaching center convergence point pass through flow-guiding channel diverging flow around, the cooling water after heating
It is flowed out, is come together in the cavity of surrounding by afterbody runner, eventually flow to Y type liquid cooling heat radiator under the action of water pump (8)
(7) water outlet.
6. a kind of Y type liquid cooling heat radiator complexes suitable for data center computer room chip cooling technique according to claim 1,
It is characterized in that: the size of Y type liquid cooling heat radiator (7), such as: the diameter of each runner, length, diameter, height of entire radiator etc.
Deng with structural theory being utmostly to enhance heat dissipation effect according to being designed；Meanwhile by structural theory, Y type liquid-cooling heat radiation
The series of runner contained by device (7) should be second level and its more than, specific quantity is determined by the size of chip.
7. a kind of Y type liquid cooling heat radiator complexes suitable for data center computer room chip cooling technique according to claim 1,
Be characterized in that: to avoid interface that drainage occurs, the disengaging pipeline section of Y type liquid cooling heat radiator (7) is both needed in each host
A distance is stretched out, and connectivity port is all made of the form of internal screw thread and branch water pipe is attached；Meanwhile Y type liquid cooling dissipates
Hot device (7) is minitype radiator, and each flow diameter is smaller, need to be using height to avoid that electrostatic and drainage occur in host
Intensity, non electrically conductive material make Y type liquid cooling heat radiator (7) under the support of 3D printing technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820864005.2U CN208507657U (en) | 2018-05-31 | 2018-05-31 | Y-shaped liquid cooling radiator complete device suitable for cooling data machine room chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820864005.2U CN208507657U (en) | 2018-05-31 | 2018-05-31 | Y-shaped liquid cooling radiator complete device suitable for cooling data machine room chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208507657U true CN208507657U (en) | 2019-02-15 |
Family
ID=65287924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820864005.2U Expired - Fee Related CN208507657U (en) | 2018-05-31 | 2018-05-31 | Y-shaped liquid cooling radiator complete device suitable for cooling data machine room chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN208507657U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598055A (en) * | 2018-05-31 | 2018-09-28 | 南京工业大学 | Y-shaped liquid cooling radiator and complete device suitable for cooling data machine room chip |
| CN111542203A (en) * | 2020-04-29 | 2020-08-14 | 南京工业大学 | A T-pipe chip radiator based on impingement cooling and a complete set of devices |
| CN113309603A (en) * | 2021-05-14 | 2021-08-27 | 中国汽车工程研究院股份有限公司 | Method for rapidly and accurately increasing pressure drop performance of heat radiator with reduced size |
-
2018
- 2018-05-31 CN CN201820864005.2U patent/CN208507657U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598055A (en) * | 2018-05-31 | 2018-09-28 | 南京工业大学 | Y-shaped liquid cooling radiator and complete device suitable for cooling data machine room chip |
| CN108598055B (en) * | 2018-05-31 | 2023-11-10 | 南京工业大学 | Y-type liquid cooling radiator suitable for cooling data computer lab chip and complete sets |
| CN111542203A (en) * | 2020-04-29 | 2020-08-14 | 南京工业大学 | A T-pipe chip radiator based on impingement cooling and a complete set of devices |
| CN111542203B (en) * | 2020-04-29 | 2023-02-03 | 南京工业大学 | T-shaped pipeline chip radiator based on impingement cooling and complete device |
| CN113309603A (en) * | 2021-05-14 | 2021-08-27 | 中国汽车工程研究院股份有限公司 | Method for rapidly and accurately increasing pressure drop performance of heat radiator with reduced size |
| CN113309603B (en) * | 2021-05-14 | 2022-06-03 | 中国汽车工程研究院股份有限公司 | A method to rapidly and accurately increase the pressure drop performance of a heat sink of reduced size |
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Granted publication date: 20190215 |