CN113613463B - General cold plate of airborne through liquid cooling module - Google Patents
General cold plate of airborne through liquid cooling module Download PDFInfo
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- CN113613463B CN113613463B CN202110877451.3A CN202110877451A CN113613463B CN 113613463 B CN113613463 B CN 113613463B CN 202110877451 A CN202110877451 A CN 202110877451A CN 113613463 B CN113613463 B CN 113613463B
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- 239000007788 liquid Substances 0.000 title claims abstract description 127
- 238000001816 cooling Methods 0.000 title claims abstract description 121
- 239000012530 fluid Substances 0.000 claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 239000000110 cooling liquid Substances 0.000 claims abstract description 7
- 238000012546 transfer Methods 0.000 claims description 13
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 210000001503 joint Anatomy 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000009833 condensation Methods 0.000 abstract description 5
- 230000005494 condensation Effects 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000009834 vaporization Methods 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000013461 design Methods 0.000 description 9
- 230000010354 integration Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a universal cold plate for an airborne through liquid cooling module, which can meet the heat dissipation requirement of the module, is convenient for arrangement of components and components of the module and flow resistance matching, and is realized by the following technical scheme: the U-shaped opening flow channels around the liquid cooling channels form fluid in the arched flow channels, heat exchange tubes which are fixed in the middle of the micro-channel cold plate and are arranged in parallel are surrounded inside the micro-channel cold plate, an LRM liquid cooling switching connector connected with an external liquid cooling source forms a secondary heat exchange liquid cooling passage which takes away heat through the fluid passing through the micro-channel cold plate flow channels, heat exchange is carried out on the heat exchange tubes which are parallel to the cooling cold flow direction and the cooling liquid flow channels connected with the heat exchange tubes, the heat exchange tubes evaporate instant vaporization liquid pressure vapor flow around the heat receiving end heat insulation exchange tube wall surfaces, flow towards a condensation end under the traction of pressure, a large amount of heat is released, the heat in the high heat area in the middle of the LRM module is rapidly diffused to the low-heat liquid cooling flow channel area, and the heat of the LRM module component is dissipated.
Description
Technical Field
The invention relates to an electronic device and an onboard small-sized liquid cooling device design technology, in particular to an onboard through liquid cooling module universal cold plate for an onboard environment device in avionic devices with a plurality of key tasks.
Background
With the increase of heat flux density of electronic devices, heat dissipation design of electronic components is increasingly important in the design of electronic devices, and may even become a key factor for further integration of devices. In the time of 90% -95% of the actual flight envelope, the electronic components should control the temperature to be below 90 ℃, and meanwhile, the module temperature uniformity is required to be good so as to reduce the thermal stress. In order to achieve the purpose, different means of an air cooling system and efficient heat dissipation measures are adopted at home and abroad, and liquid cooling is adopted at most. At present, electronic components develop to the directions of high efficiency, compactness and microminiaturization, the integration level is higher and higher, the heat flow density of the electronic components is also higher and higher, and the normal working requirements of some high-power components cannot be met in the traditional air cooling mode. In order to meet the maintenance requirements of electronic equipment, and improve the reliability and fault tolerance of increasingly complex and highly integrated electronic systems, the electronic equipment is convenient to expand and refit, development and maintenance cost is reduced, and most comprehensive electronic equipment adopts an LRM modularized design. The liquid cooling device of the integrated electronic equipment is a conduction type module liquid-adding cooling machine box, wherein the liquid cooling machine box is a basic carrier applied to liquid cooling technology, a cooling medium flows through a machine box cold plate channel, and heat of electronic devices arranged on the conduction module is taken away through heat conduction and forced convection. The module main body is used as a main part for bearing a circuit printed board and components and parts and is assembled by a cover plate and a box body in a structure mode. Because of the improvement of the integration level, the heat consumption of a single module is increased to more than 100W, and the heat consumption of part of the modules can even reach 200W, so that the heat dissipation requirement of the system cannot be met by the conduction type module liquid-adding cooling machine box. Meanwhile, the integrated rack is provided with a plurality of modules with large heating value by adopting a centralized module installation mode, so that the heat dissipation problem is very remarkable. For the above requirements, the module must employ a feed-through liquid cooled heat sink. The through liquid cooling mode cooling liquid directly enters the module through the flow channel to take away heat, and compared with the conduction liquid cooling mode, the heat dissipation capacity is improved obviously. The feedthrough liquid cooling module needs to solve many problems in practical application:
the design is complex: the integration level of the module is higher and higher, the number of components is very large, and the cold plate is very difficult to design and the flow channel is very complex because the cold plate is in direct contact with the components. The pressure drop of micro-channels and the like is high in the through cold plate, so that the situation that the pump pressure in the circulation is insufficient, the flow rate cannot reach the design requirement or the flow resistance parameter is larger than the required value is easy to occur; flow resistance matching is difficult: the types of modules in the comprehensive rack are numerous, and the types and the layout of components of each type of module are different, so that the flow channels of each type of module are different. The number of the modules is large, so that the number of the branches of the liquid is large, and the pressure gradually decreases in the process of branching, for example, the poor flow resistance matching of the modules can cause the extremely small flow of some branches, so that the heat dissipation performance of the branch modules is affected.
Disclosure of Invention
The invention aims at solving the problems of difficult design and difficult flow resistance matching of the cold plate of the through liquid cooling module, and provides a universal cold plate which can meet the heat dissipation requirement of the module, is convenient for arrangement of components and components of the module and matching of flow resistance, and is simply applied to compounding of an arched flow channel and a heat exchange tube.
The invention solves the problems by adopting the following technical scheme: an on-board feedthrough liquid cooling module universal cold plate comprising: the through liquid cooling module box body 5 of the liquid cooling cold plate is integrated on the plug-in components, fix LRM liquid cooling adapter connector 1 on the 5 runner apron of through liquid cooling module box body, establish the microchannel cold plate 2 of liquid cooling runner in it, its characterized in that: two ends of a liquid cooling flow channel of the micro-channel cold plate 2 are communicated through an external fluid LRM liquid cooling transfer connector 1 to form an airtight loop of an internal fluid liquid cooling channel for flowing a liquid working medium in the micro-channel cold plate 2, and then the airtight loop is fed into a liquid cooling circulation system of airborne liquid cooling equipment through the LRM liquid cooling transfer connector 1; the heat is taken away by the flow of fluid in an arched flow channel formed by U-shaped opening flow channels around the liquid cooling channel, meanwhile, the heat is effectively dissipated, the heat exchange tube 3 which is fixed in the middle of the micro-channel cold plate 2 and is arranged in parallel is surrounded in the micro-channel cold plate 2, the LRM liquid cooling switching connector 1 connected with an external liquid cooling source penetrates through the fluid through the flow channels of the micro-channel cold plate 2, a secondary heat exchange liquid cooling channel for taking away the heat is formed, the heat of a component chip packaged on a printed circuit board is exchanged in parallel with the cooling liquid flow channel connected with the heat exchange tube 3, the heat is diffused to the liquid cooling flow channel metal surface area of the micro-channel cold plate 2, the heat exchange tube 3 evaporates the liquid pressure vapor flow which is instantaneously vaporized around the heat receiving end heat insulation exchange tube wall surface, flows to the condensation end under the traction of pressure, the vapor flow is condensed into liquid to release a large amount of heat after reaching the condensation end, the generated vapor flow returns to the evaporation receiving end through the air cooling frame by virtue of capillary force, primary cooling circulation is completed, the heat of the high heat in the middle of the LRM module is rapidly diffused to the low-heat flow channel, and the heat of the component chip is rapidly dissipated out of the liquid through the liquid cooling channel.
Compared with the current conventional design scheme, the invention has the following advantages:
according to the invention, two ends of a liquid cooling runner of the micro-channel cold plate 2 are communicated through the external fluid LRM liquid cooling transfer connector 1, so that an internal fluid liquid cooling runner of liquid working medium flowing in the micro-channel cold plate 2 is formed, the runner of the micro-channel cold plate 2 for taking heat away by the flow of fluid in an arched runner formed by the liquid cooling runner is narrower, and the pressure resistance is strong. The pressure resistance can reach more than 4 Mpa. The arched flow channel formed by the liquid cooling channels is used for effectively penetrating through the flow channel of the cold plate, and the heat conduction is used for effectively forming a fluid flow route for effectively dissipating heat. The invention has the following characteristics.
The heat dissipation capability is strong. The invention adopts the heat exchange tube 3 parallel to the cooling cold flow direction to exchange heat with the cooling liquid flow channel connected with the heat exchange tube, and diffuses the heat of the packaged component chip on the printed circuit board to the liquid cooling flow channel metal surface area of the micro-channel cold plate 2, so that the flow passing through each module is consistent, the flow resistance is consistent, and the conditions of flow preemption, short circuit and other flow non-uniformity can not occur. The heat dissipation capacity of the single cold plate can reach 150W through the composite application of liquid cooling and heat exchange tubes. The welded heat exchange tube 3 occupies only a very small space in the cold plate area, and a very large part of space is left for distributing components and parts, so that different types of modules can be adapted. Flow distribution may be further facilitated. And the processing quality is easy to control, so that the problem of uneven manufacturing level of the process of each manufacturer can be avoided.
The heat-conducting coefficient of the heat-exchanging tube adopted by the invention is about 10000W/mK and about 500 times of that of aluminum alloy, when the heat-exchanging tube begins to be heated, liquid around the tube wall is instantaneously vaporized to generate vapor, at the moment, the pressure of the part is increased, and vapor flows to a condensing end (a flow passage section) under the traction of the pressure. The vapor stream is condensed into liquid after reaching the condensing end, and simultaneously, a large amount of heat is released, and finally, the vapor stream returns to the heating end by capillary force to complete a cycle. The heat of the high-heat area in the middle of the module is rapidly diffused to the low-heat liquid cooling flow passage area by utilizing the working principle of the heat exchange tube, and the heat of components is rapidly taken away through the liquid working medium. The through type cold plate has the advantages of small temperature gradient, uniform heat distribution, capability of taking away larger concentrated heat load, and capability of meeting the requirements of miniaturization, light weight and heat dissipation of a liquid cooling system. The universal cold plate is used as an independent component, and any problem can be conveniently replaced.
Drawings
FIG. 1 is a schematic diagram of a generic cold plate configuration for an on-board feedthrough liquid cooling module of the present invention;
FIG. 2 is a cross-sectional view of FIG. 1;
FIG. 3 is an exploded schematic view of FIG. 1 in use with a feedthrough liquid cooling module;
in the figure: the LRM liquid cooling transfer connector, the micro-channel cold plate, the heat exchange tube, the module printed plate and the through liquid cooling module box body are 1, 2, 4.
The present invention will be described in detail with reference to the accompanying drawings.
Detailed Description
Referring to fig. 1-3, in the embodiments described below, an on-board feedthrough liquid cooling module universal cold plate comprises: the through liquid cooling module box body 5 of the liquid cooling plate is integrated on the plug-in, the LRM liquid cooling adapter connector 1 is fixed on the runner cover plate of the through liquid cooling module box body 5, and the micro-channel cold plate 2 of the liquid cooling runner is arranged in the LRM liquid cooling adapter connector. Two ends of a liquid cooling flow channel of the micro-channel cold plate 2 are communicated through an external fluid LRM liquid cooling transfer connector 1 to form an internal fluid liquid cooling channel closed loop in which a liquid working medium flows in the micro-channel cold plate 2, and then the internal fluid liquid cooling channel closed loop is fed into a liquid cooling circulation system of an airborne liquid cooling device through the LRM liquid cooling transfer connector 1; the heat is taken away by the flow of fluid in an arched flow channel formed by U-shaped opening flow channels around the liquid cooling channel, meanwhile, the heat is effectively dissipated, the heat exchange tube 3 which is fixed in the middle of the micro-channel cold plate 2 and is arranged in parallel is surrounded in the micro-channel cold plate 2, the LRM liquid cooling switching connector 1 connected with an external liquid cooling source penetrates through the fluid through the flow channels of the micro-channel cold plate 2, a secondary heat exchange liquid cooling channel for taking away the heat is formed, the heat of a component chip packaged on a printed circuit board is exchanged in parallel with the cooling liquid flow channel connected with the heat exchange tube 3, the heat is diffused to the liquid cooling flow channel metal surface area of the micro-channel cold plate 2, the heat exchange tube 3 evaporates the liquid pressure vapor flow which is instantaneously vaporized around the heat receiving end heat insulation exchange tube wall surface, flows to the condensation end under the traction of pressure, the vapor flow is condensed into liquid to release a large amount of heat after reaching the condensation end, the generated vapor flow returns to the evaporation receiving end through the air cooling frame by virtue of capillary force, primary cooling circulation is completed, the heat of the high heat in the middle of the LRM module is rapidly diffused to the low-heat flow channel, and the heat of the component chip is rapidly dissipated out of the liquid through the liquid cooling channel.
See fig. 2. The micro-channel cold plate 2 mainly occupies a peripheral flow channel and at least 2 heat exchange tube areas, and most areas are reserved for component arrangement.
See fig. 3. Install in the module printed board 4 of feed-through liquid cooling module box body 5, arranged very many components and parts that generate heat on the module printed board 4, microchannel cold plate 2 is as the subassembly by upper and lower pressure to feed-through liquid cooling module box body 5 on, feed-through liquid cooling module box body 5 is as the hardware support of microchannel cold plate 2, assembles complete machine and carries the feed-through liquid cooling module, and the liquid cooling is carried out through liquid working medium.
The heat conduction coefficient of the heat exchange tube is about 10000W/mK and is about 500 times of that of aluminum alloy, when the components around the heat exchange tube generate heat, the heat of the components can be very fast transmitted to the vicinity of the arched flow passage through the heat exchange tube with high heat conduction, and the heat is transmitted to the liquid working medium.
The LRM liquid cooling transfer connector 1 is used as a converging and diverging pivot of the whole heat dissipation system, is positioned at two ends of a broadside notch of the micro-channel cold plate 2, is in butt joint communication with a fluid inlet and a fluid outlet of an arched liquid cooling channel of the micro-channel cold plate 2, fluid enters the arched liquid cooling channel, and the outflow fluid uniformly enters through the fluid inlet of the LRM liquid cooling transfer connector 1 and flows out through the fluid outlet). Under the external heat load condition of 150w, the temperature difference between the inlet and the outlet of the cooling liquid is 5 ℃.
Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. The scope of the invention is not limited to the specific embodiments described. Any technical solution obtained by carrying out the same or equivalent substitution of technical elements in the specific technical solution described or technical solution which can be obtained by a person skilled in the art without creative work on the basis of the specific technical solution described shall be considered as falling within the protection scope of the present invention.
Claims (5)
1. An on-board feedthrough liquid cooling module universal cold plate comprising: the through liquid cooling module box body (5) of the liquid cooling cold plate is integrated on the plug-in components, fix LRM liquid cooling adapter connector (1) on the runner apron of through liquid cooling module box body (5), establish microchannel cold plate (2) of liquid cooling runner in it, its characterized in that: two ends of a liquid cooling runner of the micro-channel cold plate (2) are communicated through an external fluid LRM liquid cooling transfer connector (1) to form an internal fluid liquid cooling channel closed loop in which a liquid working medium flows in the micro-channel cold plate (2), and then the internal fluid liquid cooling channel closed loop is fed into a liquid cooling circulation system of airborne liquid cooling equipment through the LRM liquid cooling transfer connector (1); the heat is taken away by the flow of fluid in an arched flow channel formed by U-shaped opening flow channels around the liquid cooling channel, and meanwhile, the heat is effectively dissipated by the flow of the fluid in the arched flow channel, the arc diversion and bend route is effectively dissipated, the heat exchange tubes (3) which are fixed in the middle of the micro-channel cold plate (2) and are arranged in parallel are enclosed in the micro-channel cold plate (2), the LRM liquid cooling switching connector (1) connected with an external liquid cooling source is used for penetrating the fluid through the flow channel of the micro-channel cold plate (2) to form a secondary heat exchange liquid cooling channel for taking away the heat, the heat exchange is carried out by the cooling liquid flow channel connected with the heat exchange tubes (3) in parallel, and the heat of the component chips is encapsulated on the printed circuit board, the vapor flows are condensed into liquid to release a large amount of heat after reaching the condensing end along a direct-flow channel cavity heat transfer path, the generated vapor flows pass through an air cooling rack by capillary force to return to the evaporation heat-receiving end to complete one-time cooling circulation, the heat of a high-heat area in the middle of an LRM module is rapidly diffused to a low-heat liquid cooling flow passage area, and the heat of an LRM module component is rapidly dissipated through a conduction liquid working medium;
the LRM liquid cooling transfer connector (1) is used as a converging and diverging pivot of the whole heat dissipation system, is positioned at two ends of a broadside notch of the micro-channel cold plate (2), is in butt joint communication with a fluid inlet and a fluid outlet of an arched liquid cooling channel of the micro-channel cold plate (2), and fluid enters the arched liquid cooling channel, and the external fluid firstly enters through the fluid inlet of the LRM liquid cooling transfer connector (1) and flows out through the fluid outlet.
2. The on-board feedthrough cooling module universal cold plate of claim 1, wherein: the occupied area of the micro-channel cold plate (2) is a peripheral flow channel and at least 2 heat exchange tube areas, and most areas are reserved for component arrangement.
3. The on-board feedthrough cooling module universal cold plate of claim 1, wherein: a plurality of heating components are arranged on a module printed board (4) arranged on the through liquid cooling module box body (5), and the micro-channel cold board (2) is used as a component to be pressed onto the through liquid cooling module box body (5) from top to bottom.
4. The on-board feedthrough cooling module universal cold plate of claim 1, wherein: the through liquid cooling module box body (5) is used as a hardware support of the micro-channel cold plate (2), a complete airborne through liquid cooling module is assembled, and liquid cooling is carried out through a liquid working medium.
5. The on-board feedthrough cooling module universal cold plate of claim 1, wherein: the heat conduction coefficient of the heat exchange tube (3) is 10000W/mK and is 500 times of that of aluminum alloy, when the components around the heat exchange tube (3) generate heat, the heat of the components passes through the heat exchange tube (3) with high heat conduction very fast, the heat is conducted to the vicinity of the arched flow passage, and the heat is transferred to the liquid working medium.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110877451.3A CN113613463B (en) | 2021-07-31 | 2021-07-31 | General cold plate of airborne through liquid cooling module |
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| CN202110877451.3A CN113613463B (en) | 2021-07-31 | 2021-07-31 | General cold plate of airborne through liquid cooling module |
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| CN113613463A CN113613463A (en) | 2021-11-05 |
| CN113613463B true CN113613463B (en) | 2023-09-26 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114667035B (en) * | 2022-03-02 | 2023-05-26 | 中国电子科技集团公司第二十九研究所 | A simulated fluid flow device with adjustable flow resistance |
| CN115017639B (en) * | 2022-05-17 | 2023-10-10 | 江苏大学 | A cold plate flow channel topology design method for uneven heat distribution |
| CN118443097B (en) * | 2024-04-30 | 2025-11-11 | 中国电子科技集团公司第三十研究所 | Flow distribution testing method for liquid cooling machine box |
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