CN100513971C - Heat radiation module and its heat pipe - Google Patents
Heat radiation module and its heat pipe Download PDFInfo
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- CN100513971C CN100513971C CNB2005100229562A CN200510022956A CN100513971C CN 100513971 C CN100513971 C CN 100513971C CN B2005100229562 A CNB2005100229562 A CN B2005100229562A CN 200510022956 A CN200510022956 A CN 200510022956A CN 100513971 C CN100513971 C CN 100513971C
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Abstract
The heat elimination module includes heat pipe and at least one heat elimination fin. Being setup outside heat pipe, heat elimination fins are connected to main body of heat pipe. Heat pipe includes main body of heat pipe, upper cover, first and second capillary structures and working fluid. Main body of heat pipe possesses a base, and a sidewall setup around the base. An enclosed space is formed when the upper cover is combined with main body of heat pipe. Upper cover is penetrated by a hollow tube with one end being extended inside heat pipe. First capillary structure is setup on inner surface of base of main body of heat pipe, and second capillary structure is connected to body of hollow tube. Being contacted to first capillary structure, second capillary structure makes working fluid condensed on upper cover possible along hollow tube to enter to second capillary structure and flow to first capillary structure.
Description
Technical field
The present invention relates to a kind of radiating module, particularly relate to radiating module with high-effect heat pipe.
Background technology
Along with development of technology, the number of transistors on the electronic component unit are is more and more, the increase of caloric value when causing its work.On the other hand, the operating frequency of electronic component is also more and more higher, and the heat (switch loss) that ON/OFF (on/off) conversion is caused during transistor work also is the reason that the electronic component caloric value increases.If fail these heats of suitable processing, will cause the reduction of chip arithmetic speed, severe patient even have influence on life-span of chip.Be to strengthen the radiating effect of electronic component, existing way mostly is greatly to be sentenced radiator at thermal source thermal conductance is gone out, and dissipates heat in the environment with nature or forced convertion mode via the Fin sheet (fin) of radiator.
Because heat pipe (heat pipe) can be under very little sectional area and temperature difference, a large amount of heat is transmitted one section considerable distance, and do not need the additional power source supply to operate, provide under the consideration with the space utilization economy need not power, various heat pipe has been one of heat transfer element of widely using in the electronic radiation product.Please refer to Fig. 1, it is the generalized section of existing a kind of column type heat pipe.The heat pipe 10A of existing column type combines back formed one airtight hollow cavity by sealing of one end and the open heat pipe body 12 of its other end with a loam cake 14a.
The tank body that heat pipe body 12 is formed in one, and form by side wall portion 122 and 124 of bottoms.Be provided with capillary structure 16 (that is being on the inner surface of the inner surface of side wall portion 122 and bottom 124) on the inwall of heat pipe body 12, and after loam cake 14a and the 12 welding combinations of heat pipe body, insert working fluid W from water injection pipe 18 again, make heat pipe 10A inner filling that working fluid W be arranged.
When the heat pipe 10A of column type reality in use, be directly contact, in order to hot direct diversion thermal source with thermal source produced with the thermal source (not illustrating) that is positioned at heat pipe 10A below with bottom 124.The bottom 124 of column type heat pipe 10A is an evaporation ends, and side wall portion 122 then is a condensation end with loam cake 14a.Working fluid W at evaporation ends flashes to gaseous state because of heat absorption, and spontaneous current changes liquid working fluid W after disengaging latent heat (latent heat) in the condensation end place then into to condensation end under the influence of pressure reduction.Condensed working fluid W flows back to evaporation ends by the capillary force of capillary structure 16 again.So, a recirculation reaches the effect of heat radiation.
Yet, because the heat pipe 10A of column type is not provided with capillary structure usually at the inner surface place of loam cake 14a, make the working fluid that is condensed in loam cake 14a place to reflux, cause loam cake 14a place to become invalid condensation end, influence the change of working fluid quality in the heat pipe 10A, and then influence heat transfer efficiency and the overall thermal resistance of heat pipe 10A.Moreover, the working fluid that condenses at loam cake 14a place be accumulate to a certain amount of after, to be subjected to the influence of gravity and straight vertical be access to down drop to the evaporation ends place (promptly bottom 124 and on capillary structure 16 places), often cause the two phase change circulation of working fluid to have some setbacks, and make the evaporation performance instability of evaporation ends, make the temperature change in time of evaporation ends excessive, and then cause thermal resistance change in time excessive, make the evaporation performance instability of evaporation ends, reduce the heat-sinking capability and the stability of heat pipe 10A integral body.
If will make the inner surface of loam cake 14a also be provided with capillary structure, then need use the copper powder sintering or additionally place mode such as copper mesh, could form capillary structure in the inner surface place of loam cake 14a.Yet, if use the manufacture craft of copper powder sintering, not only increase material and manufacture craft cost, and it is quite difficult to control the shape of the capillary structure that desire generates.If use extra mode of placing copper mesh, then owing to the netted capillary structure that is positioned at loam cake 14a place is not to make simultaneously with the capillary structure 16 that is positioned on side wall portion 122 and the bottom 124, and because of the more weak material characteristic of the intensity of copper mesh own, so it is very poor in the connectivity and the contact strength of two capillary structure contact portions, make working fluid can't lean on capillary force to flow to side wall portion 122 smoothly, therefore cause the whole thermal conduction characteristic variation of heat pipe 10A from loam cake 14a.
Please refer to Figure 1B, it is the generalized section of existing another kind of column type heat pipe.In order to improve the shortcoming of the column type heat pipe 10A among Figure 1A, the column type heat pipe 10B of Figure 1B adopts the loam cake 14b that uses similar bell shape, can make the working fluid that is condensed in loam cake 14b flow to the capillary structure 16 that is arranged in sidewall 122 gradually along the loam cake 14b of arc.Yet, it is limited only to utilize the loam cake 14b of bell shape to do the effect of guiding, and the loam cake 14b of this similar bell shape makes and is installed in its outer water injection pipe 18 more to outer lug, cause the shared volume of integral heat pipe 10B to increase, and if the words of this column type heat pipe 10B desire and radiating fin and fan and usefulness, under limited spatial constraints,, certainly will can't reach good assembling with radiating fin and fan to the loam cake 14b and the water injection pipe 18 of outer lug.
Summary of the invention
Therefore, for addressing the above problem, the present invention proposes a kind of radiating module and heat pipe thereof, has the effect of the amplitude of fluctuation of effective reduction thermal resistance, makes the two-phase circulation smooth and easy, increases evaporation efficiency, and then promotes whole heat-sinking capability, and the heat radiation stability is increased.
According to purpose of the present invention, a kind of heat pipe is proposed, include a working fluid.This heat pipe comprises a heat pipe body, a loam cake, one first capillary structure and one second capillary structure.The heat pipe body has the side wall portion that a bottom and is located on the bottom, and loam cake then combines the back and forms an enclosure space with the heat pipe body, and loam cake run through by a hollow body, and an end of hollow body stretches into inside heat pipe.First capillary structure is arranged on the bottom interior surface and side wall portion inner surface of heat pipe body, and second capillary structure links to each other with hollow body, and second capillary structure contacts with first capillary structure, makes the working fluid that condenses in the loam cake place to enter second capillary structure and to flow to first capillary structure along hollow body.
As above-mentioned heat pipe, more comprise a retaining piece, and second capillary structure is arranged on the retaining piece.Retaining piece is sheathed on the end place of going deep into inside heat pipe of hollow body, and retaining piece and hollow body and first capillary structure or side wall portion contact.Moreover in retaining piece and first capillary structure or the contacted contact position of side wall portion, retaining piece has a bending, in order to increase the contact area and the contact strength of first capillary structure and second capillary structure.Retaining piece comprises that the tablet, of a flat has the tablet of radian or has other equivalent shape, and second capillary structure comprises a copper mesh formula capillary structure, powder sintered capillary structure or plough groove type capillary structure.
Perhaps, as above-mentioned heat pipe, its hollow body has a kink, and the end that stretches into inside heat pipe of hollow body contacts with first capillary structure or side wall portion.Second capillary structure is a powder sintered capillary structure, plough groove type capillary structure or netted capillary structure, and is arranged at the surface of hollow body and is connected with first capillary structure.Perhaps, second capillary structure is a netted capillary structure, and also the while contacts with the hollow body and first capillary structure to be separately set in inside heat pipe.
The material of first capillary structure and second capillary structure comprise be selected from group that plastics, metal, alloy, porous nonmetallic materials are formed one of them, the method for the first capillary structure setting is selected from sintering, sticks together, fills and deposits the group that formed one of them or its combination.Loam cake and heat pipe body are that the processing mode with argon welding, high frequency or plasma combines.Heat pipe body and/or loam cake comprise a high heat conducting material, for example are copper, silver, aluminium or its alloy or the like.Working fluid is one of inorganic compound, pure water, alcohols, ketone, liquid metal, refrigerant, organic compound or its mixture.
According to another object of the present invention, a kind of radiating module is proposed, comprise heat pipe and at least one radiating fin.Heat pipe comprises a heat pipe body, a loam cake, one first capillary structure and one second capillary structure.Radiating fin is arranged at outside the heat pipe and with heat pipe and is connected, the heat pipe body has the side wall portion that a bottom and is located on the bottom, loam cake then combines the back and forms an enclosure space with the heat pipe body, and loam cake run through by a hollow body, and an end of hollow body stretches into inside heat pipe.First capillary structure is arranged on the bottom interior surface and side wall portion inner surface of heat pipe body, and second capillary structure links to each other with hollow body, and second capillary structure contacts with first capillary structure, makes the working fluid that condenses in the loam cake place to enter second capillary structure and to flow to first capillary structure along hollow body.
Radiating fin is to make with aluminium extruded moulding, punching press or other processing mode, and radiating fin is horizontal interval distribution, perpendicular separation distribution, oblique distribution spaced apart, radial or other distribution mode.It is outer and be connected with heat pipe that radiating fin is arranged at heat pipe, and connected mode be selected from welding, chimeric, fix, stick together the group that formed one of them.For example, radiating fin and heat pipe be with heat edge mode carry out chimeric with and/or fix.In addition, have more a tin cream (soldering paste), a heat-conducting cream (grease) between radiating fin and the heat pipe, or a material that can serve as thermally-conductive interface.
As above-mentioned radiating module, heat pipe can or directly contact with a thermal source by a pedestal, is directly conducted to radiating fin in order to the heat that thermal source is dispersed.Pedestal is a solid metal block, and thermal source is the electronic component of a heating, as central processing unit, transistor, server, high-order drafting card, hard disk, power supply unit, running control system, electronic multimedia mechanism, radio communication base station or high-order game machine etc.Moreover above-mentioned radiating module is and a fan winding, in order to the heat loss more rapidly that promotes to be derived by radiating module.
For above and other objects of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Figure 1A is the generalized section of existing a kind of column type heat pipe;
Figure 1B is the generalized section of existing another kind of column type heat pipe;
Fig. 2 is the generalized section according to a kind of column type heat pipe of preferred embodiment of the present invention;
Fig. 3 is the generalized section according to the another kind of column type heat pipe of preferred embodiment of the present invention;
Fig. 4 is that the thermal resistance value of the two column type heat pipes of Figure 1A and Fig. 3 changes comparison diagram;
Fig. 5 A and Fig. 5 B are for being applied to the column type heat pipe of Fig. 3 in the schematic diagram of two radiating modules.
The main element symbol description:
10A, 10B, 20,30: heat pipe
12,22,32: the heat pipe body
122,222,322: side wall portion
124,224,324: the bottom
14a, 14b, 24,34: loam cake
16: capillary structure
18: water injection pipe
26a, 36a: first capillary structure
26b, 36b: second capillary structure
28,38: hollow body
281: kink
282,382: one ends
39: retaining piece
391: the contact position
50A, 50B: radiating module
52a, 52b: radiating fin
W: working fluid
The specific embodiment
Hereinafter with reference to correlative type, the embodiment according to radiating module of the present invention and heat pipe thereof is described.
Please refer to Fig. 2, it is the schematic diagram according to a kind of column type heat pipe of preferred embodiment of the present invention.In Fig. 2, column type heat pipe 20 comprises that a heat pipe body 22, a loam cake 24, one first capillary structure 26a, one second capillary structure 26b and a filling are in the working fluid W of heat pipe 20 inside.Heat pipe body 22 has the side wall portion 222 that a bottom 224 and is located on bottom 224, and side wall portion 222 is formed in one on heat pipe body 22 with bottom 224, perhaps, side wall portion 222 and bottom 224 also can be two elements that separate mutually, and form heat pipe body 22 after the two mutual combinations.
Be provided with the first capillary structure 26a (that is being on the inner surface of the inner surface of side wall portion 222 and bottom 224) on the inwall of heat pipe body 22, and the second capillary structure 26b links to each other with a hollow body 28, and the second capillary structure 26b contacts with the first capillary structure 26a.24 of loam cakes and heat pipe body 22 utilize as processing modes such as argon welding, high frequency or plasmas, with loam cake 24 and the 22 welding combinations of heat pipe body, make and form an enclosure space in conjunction with the back, and loam cake 24 is run through by a hollow body 28, make working fluid W to insert, make heat pipe 20 inner fillings that working fluid W be arranged from hollow body 28.
When heat pipe 20 reality of column type in use, be directly to contact, in order to the direct diversion thermal source of heat that thermal source produced with the thermal source that is positioned at heat pipe 20 belows (not illustrating) with bottom 224.The bottom 224 of column type heat pipe 20 is an evaporation ends, and side wall portion 222 then is a condensation end with loam cake 24.Working fluid W at evaporation ends flashes to gaseous state because of heat absorption, and spontaneous current changes liquid working fluid W after disengaging latent heat (latent heat) in the condensation end place then into to condensation end under the influence of pressure reduction.
Because the second capillary structure 26b links to each other with hollow body 28, and the second capillary structure 26b contacts with the first capillary structure 26a, make condensation in the working fluid W at loam cake 24 places, the direction of arrow shown in can be on Fig. 2 flows to and is positioned at the hollow body 28 lip-deep second capillary structure 26b, the capillary force that is provided by the first capillary structure 26a flows back into evaporation ends again, so circulation endlessly continues band from thermal source, to reach the effect of heat radiation with heat.Therefore, the working fluid W that is condensed in loam cake 24 places just can as existing, directly not drip drop down onto the evaporation ends place (promptly the bottom and on the capillary structure place), avoid existing working fluid two phase change circulation to have some setbacks, make the evaporation performance instability of evaporation ends, and make the temperature change in time of evaporation ends excessive, and then cause thermal resistance to change excessive shortcoming in time.The reflux type that is condensed in the working fluid W at loam cake 24 places of the present invention, flow to the second capillary structure 26b along loam cake 24, and, and can make the working fluid W smooth delivery of power that is positioned at the second capillary structure 26b place get back to evaporation ends to being positioned at the first capillary structure 26a on the side wall portion 222 owing to the second capillary structure 26b contacts with the first capillary structure 26a.Thus, can effectively reduce the amplitude of fluctuation of thermal resistance, the heat radiation stability be increased, and then promote heat dispersion.
The material of the first capillary structure 26a and the second capillary structure 26b comprise be selected from group that plastics, metal, alloy, porous nonmetallic materials are formed one of them, the method that the first capillary structure 26a is provided with is selected from sintering, sticks together, fills and deposits the group that formed one of them or its combination.Heat pipe body 22 and/or loam cake 24 comprise a high heat conducting material, for example are copper, silver, aluminium or its alloy or the like.Working fluid W is one of inorganic compound, pure water, alcohols, ketone, liquid metal, refrigerant, organic compound or its mixture.
At this, what need pay special attention to is, Fig. 2 is for being example with hollow body 28 with kink 281, yet the present invention is not limited thereto, and please refer to Fig. 3, and it is the generalized section according to the another kind of column type heat pipe of preferred embodiment of the present invention.In Fig. 3, column type heat pipe 30 comprises that a heat pipe body 32, a loam cake 34, one first capillary structure 36a, one second capillary structure 36b and a filling are in the working fluid W of heat pipe 30 inside.Heat pipe body 32 has the side wall portion 322 that a bottom 324 and is located on bottom 324, and side wall portion 322 is formed in one on heat pipe body 32 with bottom 324, perhaps, side wall portion 322 and bottom 324 also can be two elements that separate mutually, and are that two mutual combination backs form heat pipe body 32.
Similar to the heat pipe 20 of Fig. 2, be provided with the first capillary structure 36a (that is to say on the inner surface of the inner surface of side wall portion 322 and bottom 324) on the inwall of heat pipe body 32, and the second capillary structure 36b links to each other with a hollow body 38, and the second capillary structure 36b contacts with the first capillary structure 36a.34 of loam cakes and heat pipe body 32 utilize as processing modes such as argon welding, high frequency or plasmas, with loam cake 34 and the 32 welding combinations of heat pipe body, make and form an enclosure space in conjunction with the back, and loam cake 34 is run through by a hollow body 38, make working fluid W to insert, make heat pipe 30 inner fillings that working fluid W be arranged from hollow body 38.Different is with the heat pipe 20 of Fig. 2, and heat pipe 30 more comprises a retaining piece 39, and the second capillary structure 36b is arranged on the retaining piece 39, and the tablet or that retaining piece 39 can be a flat has the tablet of radian.
Retaining piece 39 is sheathed on an end 382 places of going deep into heat pipe 30 inside of hollow body 38, and retaining piece 39 and hollow body 38 and the first capillary structure 36a or side wall portion 322 contact.When heat pipe 30 reality of column type in use, directly contact with bottom 324, in order to the direct diversion thermal source of heat that thermal source produced with the thermal source that is positioned at heat pipe 30 belows (not illustrating).The bottom 324 of column type heat pipe 30 is an evaporation ends, and side wall portion 322 then is a condensation end with loam cake 34.Working fluid W at evaporation ends flashes to gaseous state because of heat absorption, and spontaneous current changes liquid working fluid W into then to condensation end after latent heat (latent heat) is disengaged at the condensation end place under the influence of pressure reduction.
The second capillary structure 36b, it for example is a copper mesh formula capillary structure, powder sintered capillary structure or plough groove type capillary structure, and because the second capillary structure 36b is arranged on the retaining piece 39, and contact with the hollow body 38 and the first capillary structure 36a, make condensation in the working fluid W at loam cake 34 places, the direction of arrow shown in can be on Fig. 3 is through hollow body 38 and flow to the second capillary structure 36b that is positioned on the retaining piece 39, the capillary force that is provided by the first coupled capillary structure 36a flows back into evaporation ends again, so circulation endlessly continues band from thermal source, to reach the effect of heat radiation with heat.In addition, in retaining piece 39 and the first capillary structure 36a or side wall portion 322 contacted contact positions 391, retaining piece 39 preferably can have a bending, and still be covered with the second capillary structure 36b on it, thus, can increase by contact area and the contact strength of the first capillary structure 36a and the second capillary structure 36b, make the conveying effect of working fluid W more smooth.Other implementation method has identical technical characterictic with Fig. 2, does not repeat them here.
Therefore, the working fluid W that is condensed in loam cake 34 places just can as existing, directly not drip drop down onto the evaporation ends place (promptly the bottom and on the capillary structure place), avoid existing working fluid two phase change circulation to have some setbacks, make the evaporation performance instability of evaporation ends, and make the temperature change in time of evaporation ends excessive, and then cause thermal resistance to change excessive shortcoming in time.The reflux type that is condensed in the working fluid W at loam cake 34 places of the present invention, be to flow to the second capillary structure 36b with hollow body 38 along loam cake 34, and utilize the second capillary structure 36b to contact, and can make the working fluid W smooth delivery of power that is positioned at the second capillary structure 36b place get back to evaporation ends to being positioned at the first capillary structure 36a on the side wall portion 322 with the first capillary structure 36a.
Please refer to Fig. 4, it is the thermal resistance value variation comparison diagram of the two column type heat pipes of Figure 1A and Fig. 3.The thermal resistance value of the heat pipe 30 of Fig. 3 (being the present invention) is along with the change of time, though still also produce periodic lifting, yet compare with the heat pipe 10A (being prior art) of Figure 1A, this thermal resistance value change in time obviously reduces, thermal resistance value of the present invention only between 0.100 (℃/W) and 0.102 (℃/W) between change, its variable quantity only be 0.002 (℃/W), yet existing thermal resistance value but 0.093 (℃/W) and 0.105 (℃/W) between acutely change, its variable quantity up to 0.012 (℃/W).Therefore, this result can prove that the present invention has effective effect of the amplitude of fluctuation that reduces thermal resistance really completely, and when effectively being reduced in the heat pipe heat radiation running, the amplitude of fluctuation of the temperature (Tcase) of its heat pipe body 32 and thermal source phase-contact surface (being the evaporation ends place), the temperature difference that makes maximum and minimum of a value makes two-phase (gas phase and liquid phase) circulation smooth and easy in 0.2 ℃, can increase evaporation efficiency, and then promote whole heat-sinking capability, the heat radiation stability is increased.
In addition, please be simultaneously with reference to Fig. 5 A and Fig. 5 B, it is for being applied to the column type heat pipe of Fig. 3 in the schematic diagram of two radiating modules.Radiating module 50A, 50B can be applicable on the thermal source (not illustrating), and heat pipe 30 directly contacts with thermal source or be positioned at heat pipe below and be positioned at the outside pedestal (not illustrating) of thermal source top and contact with thermal source by one.Thermal source is the electronic component of a heating, for example is central processing unit, transistor, server, high-order drafting card, hard disk, power supply unit, running control system, electronic multimedia mechanism, radio communication base station, or the high-order game machine etc.In addition, radiating module 50A, 50B more can with a fan winding, in order to the heat loss more rapidly that promotes to be derived by radiating module 50A, 50B.
In Fig. 5 A, radiating module 50A comprises a heat pipe 30 and at least one radiating fin 52a.Heat pipe 30 can have identical technical characterictic with the heat pipe 30 of Fig. 3, does not repeat them here.Radiating fin 52a makes with aluminium extruded moulding, punching press or other processing mode, and radiating fin 52a to be arranged at heat pipe 30 outer and link to each other with heat pipe 30.The connected mode of radiating fin 52a and heat pipe 30 be selected from welding, chimeric, fix, stick together the group that formed one of them.For example, radiating fin and heat pipe be with heat edge mode carry out chimeric with and/or fix.In addition, more be coated with a tin cream (soldering paste), a heat-conducting cream (grease) between radiating fin 52a and the heat pipe 30, or a material that can serve as thermally-conductive interface.
A plurality of radiating fin 52a radially distribute and link to each other outside heat pipe 30 and with heat pipe 30, and heat pipe 30 is sheathed between a plurality of radiating fin 52a.Perhaps, shown in Fig. 5 B, a plurality of radiating fin 52b are sheathed on outside the heat pipe 30 in the mode that the horizontal interval distributes, and parallel to each other between a plurality of radiating fin 52b.Only for giving an example, the present invention is not restricted to this to the distribution mode of right radiating fin 52a or 52b, and the arrangement mode of radiating fin 52a, 52b also can be that perpendicular separation distributes, oblique spaced apart or other distribution mode.
From the above, radiating module of the present invention and heat pipe thereof, because its second capillary structure 26b, 36b link to each other with hollow body 28,38, and the second capillary structure 26b, 36b contact with the first capillary structure 26a, 36a, make condensation in the working fluid W at loam cake 24,34 places, can flow through along loam cake 24,34 places hollow body 28,38 and the second capillary structure 26b, 36b, and and then can be transported to smoothly and be positioned at the first capillary structure 26a, the 36a on the side wall portion 222,322 and get back to evaporation ends.Thus, having solved the existing working fluid that is condensed in the loam cake place directly drips and drops down onto the problem at evaporation ends place.Therefore, radiating module of the present invention and heat pipe thereof have the effect of the amplitude of fluctuation of effective reduction thermal resistance, make the two-phase circulation smooth and easy, increase evaporation efficiency, and then promote whole heat-sinking capability, and the heat radiation stability is increased.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be included in the appended claim its equivalent modifications of carrying out or change.
Claims (20)
1, a kind of heat pipe includes a working fluid, and this heat pipe comprises:
One heat pipe body has the side wall portion that a bottom and is located on this bottom;
One loam cake is to combine the back to form an enclosure space with this heat pipe body, and this loam cake run through by a hollow body, and an end of this hollow body stretches into this inside heat pipe;
One first capillary structure is arranged on this bottom interior surface and this side wall portion inner surface of this heat pipe body; And
One second capillary structure, link to each other with this hollow body but do not fit with loam cake, and this second capillary structure contacts with this first capillary structure, makes this working fluid that condenses at this loam cake place to enter this second capillary structure and to flow to this first capillary structure along this hollow body.
2, heat pipe as claimed in claim 1, wherein this hollow body has a kink, and this end that stretches into this inside heat pipe of this hollow body contacts with this first capillary structure or this side wall portion.
3, heat pipe as claimed in claim 2, wherein this second capillary structure is arranged at the surface of this hollow body and is connected with this first capillary structure.
4, heat pipe as claimed in claim 1, wherein this second capillary structure is a kind of in powder sintered capillary structure, plough groove type capillary structure, copper mesh formula capillary structure and the netted capillary structure.
5, heat pipe as claimed in claim 1, wherein this second capillary structure is to be separately set in this inside heat pipe, and contacts with this hollow body and this first capillary structure simultaneously.
6, heat pipe as claimed in claim 1 more comprises a retaining piece, and it is sheathed on an end place that stretches into inside heat pipe of hollow body, and this second capillary structure is arranged on this retaining piece.
7, heat pipe as claimed in claim 6, wherein this retaining piece contacts with this hollow body and this first capillary structure, or this retaining piece contacts with this hollow body and this side wall portion.
8, heat pipe as claimed in claim 6, wherein this retaining piece and this first capillary structure or with the contacted contact position of this side wall portion, this retaining piece has bending, in order to increase the contact area and the contact strength of this first capillary structure and this second capillary structure.
9, heat pipe as claimed in claim 6, wherein this retaining piece is the tablet that the tablet or of a flat has radian.
10, heat pipe as claimed in claim 1, wherein this is one-body molded in this heat pipe body for this bottom and this side wall portion, and perhaps this bottom is two elements that separate mutually with this side wall portion, and this bottom and this side wall portion combination back and form this heat pipe body.
11, a kind of radiating module comprises:
One heat pipe includes a working fluid and this heat pipe comprises:
One heat pipe body has the side wall portion that a bottom and is located on this bottom;
One loam cake combines the back and forms an enclosure space with this heat pipe body, and this loam cake run through by a hollow body, and an end of this hollow body stretches into this inside heat pipe;
One first capillary structure is arranged on this bottom interior surface and this side wall portion inner surface of this heat pipe body; And
One second capillary structure, link to each other with this hollow body but do not fit with loam cake, and this second capillary structure contacts with this first capillary structure, makes this working fluid that condenses in this loam cake place to enter this second capillary structure and to flow to this first capillary structure along this hollow body; And
At least one radiating fin is arranged at this heat pipe and is connected outward and with this heat pipe.
12, radiating module as claimed in claim 11, wherein this hollow body has a kink, and this end that stretches into this inside heat pipe of this hollow body contacts with this first capillary structure or this side wall portion.
13, radiating module as claimed in claim 11, wherein this second capillary structure is arranged at the surface of this hollow body and is connected with this first capillary structure.
14, radiating module as claimed in claim 11, wherein this second capillary structure is a kind of in powder sintered capillary structure, plough groove type capillary structure, copper mesh formula capillary structure and the netted capillary structure.
15, radiating module as claimed in claim 11, wherein this second capillary structure is separately set in this inside heat pipe, and contacts with this hollow body and this first capillary structure simultaneously.
16, radiating module as claimed in claim 11 more comprises a retaining piece, and it is sheathed on an end place that stretches into inside heat pipe of hollow body, and this second capillary structure is arranged on this retaining piece.
17, radiating module as claimed in claim 16, wherein this retaining piece contacts with this hollow body and this first capillary structure, or this retaining piece contacts with this hollow body and this side wall portion.
18, radiating module as claimed in claim 16, wherein this retaining piece and this first capillary structure or with the contacted contact position of this side wall portion, this retaining piece has bending, in order to increase the contact area and the contact strength of this first capillary structure and this second capillary structure.
19, radiating module as claimed in claim 16, wherein this retaining piece is the tablet that the tablet or of a flat has radian.
20, radiating module as claimed in claim 11, wherein this bottom and this side wall portion are formed in one in this heat pipe body, and perhaps this bottom is two elements that separate mutually with this side wall portion, and forms this heat pipe body after this bottom and the combination of this side wall portion.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100229562A CN100513971C (en) | 2005-12-19 | 2005-12-19 | Heat radiation module and its heat pipe |
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|---|---|---|---|
| CNB2005100229562A CN100513971C (en) | 2005-12-19 | 2005-12-19 | Heat radiation module and its heat pipe |
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| CN100513971C true CN100513971C (en) | 2009-07-15 |
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| CN102289266A (en) * | 2010-06-17 | 2011-12-21 | 鸿富锦精密工业（深圳）有限公司 | Server and server system |
| CN102581586B (en) * | 2011-12-31 | 2015-02-18 | 东莞市瑞为电器配件有限公司 | Method for manufacturing and heat-radiation column |
| CN103586576A (en) * | 2013-10-12 | 2014-02-19 | 苏州嘉德鲁机电科技有限公司 | Manufacturing method of fully-enclosed phase-change radiator |
| CN107614997B (en) * | 2015-04-23 | 2019-08-23 | Wga水环球公司 | Condenser-reboiler pipe |
| CN106714509B (en) * | 2015-11-17 | 2019-06-07 | 奇鋐科技股份有限公司 | Radiator |
| CN105403087A (en) * | 2015-12-25 | 2016-03-16 | 江苏宏力光电科技股份有限公司 | Thermal column structure |
| CN107148192B (en) * | 2016-03-01 | 2020-01-31 | 讯凯国际股份有限公司 | Heat pipe module and heat radiating device using same |
| CN110021570B (en) * | 2019-04-10 | 2022-06-14 | 嘉龙(平潭)科技有限公司 | Three-dimensional phase change remote heat dissipation module |
| CN110749221A (en) * | 2019-09-03 | 2020-02-04 | 中国人民解放军陆军工程大学 | Rapid heat dissipation system of closed space heat source equipment based on flat heat pipe |
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2005
- 2005-12-19 CN CNB2005100229562A patent/CN100513971C/en active Active
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