WO2014134791A1 - Heat conducting gasket and application thereof - Google Patents

Heat conducting gasket and application thereof Download PDF

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Publication number
WO2014134791A1
WO2014134791A1 PCT/CN2013/072216 CN2013072216W WO2014134791A1 WO 2014134791 A1 WO2014134791 A1 WO 2014134791A1 CN 2013072216 W CN2013072216 W CN 2013072216W WO 2014134791 A1 WO2014134791 A1 WO 2014134791A1
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WIPO (PCT)
Prior art keywords
thermal
thermal pad
heat
gasket
heat conducting
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PCT/CN2013/072216
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French (fr)
Chinese (zh)
Inventor
吴晓宁
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北京中石伟业科技股份有限公司
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Application filed by 北京中石伟业科技股份有限公司 filed Critical 北京中石伟业科技股份有限公司
Priority to PCT/CN2013/072216 priority Critical patent/WO2014134791A1/en
Priority to DE112013006784.6T priority patent/DE112013006784B4/en
Publication of WO2014134791A1 publication Critical patent/WO2014134791A1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to thermally conductive materials, and more particularly to a thermally conductive gasket and its use. Background technique
  • the artificial graphite film is a high-purity, crystalline graphite film material produced at a high temperature of about 3000 ° C. It has excellent planar thermal conductivity (greater than 1000-1500 W/mK) and good thermal conductivity in the thickness direction ( 10W/mK or so). This thermal anisotropy has been widely used in applications where soaking of mobile phones, tablet computers, etc. is required.
  • artificial graphite film Compared with traditional thermal interface materials such as paste-like thermal grease and thermal phase change materials, artificial graphite film has outstanding characteristics such as high thermal conductivity, long life and easy production process.
  • the conventional artificial graphite film thermal pad is solid and has poor compressibility (only 5 ⁇ 10%). As an interface thermal pad, it can not fully pad the size of the thermal contact between the heating element and the heat sink. A gap, which greatly limits the widespread use of solid artificial graphite films in some high power or large contact areas.
  • a gap 103 exists between the heat generating body 101 and the heat sink 102.
  • the air in the gap is poor in thermal conductivity, and the interface thermal resistance is large, which seriously affects the heat transfer from the heat generating body 101 to the heat radiating body 102. Therefore, the solid artificial graphite film thermal conductive gasket 104 having high thermal conductivity is placed on the gap 103 between the heating element 101 and the heat sink 102, so that the heating element and the heat sink are in sufficient contact to improve heat transfer efficiency, as shown in FIG. Shown.
  • the conventional solid artificial graphite film itself has poor compressibility and does not sufficiently pad the slit 103, the heat transfer efficiency is affected. Summary of the invention
  • the object of the present invention is to provide a heat conductive gasket and an application thereof, which solve the disadvantages of low compression ratio and small compression deformation capability of the thermal pad.
  • the heat conductive gasket provided by the present invention is made of an artificial graphite film, and the heat conducting gasket has a foam-like cross section.
  • the thermal conductive gasket is a foamed artificial graphite obtained by heat-treating a polymer film.
  • Membrane a foamed artificial graphite obtained by heat-treating a polymer film.
  • the polymer film is selected from the group consisting of polyoxadiazole, polyimide, polyparaphenylene vinylene, polybenzimidazole, polybenzoxazole, polybenzobisoxazole, polythiazole, At least one of a film of polybenzothiazole, polybenzobisthiazole, and polyamide.
  • the thermal pad has a compression ratio of 30% to 80%.
  • the thermal pad has a compression ratio of 50% to 70%.
  • the surface thereof is smooth, and the cross section thereof is still foamy.
  • the compressed heat-conductive gasket has a compression ratio of 20% to 40%.
  • the invention also provides an application of the thermal pad, which is lining the gap of the thermal interface of the component and then compacting the thermal pad at the gap.
  • the thermal pad is lined between the surface of the heating element and the heat conducting interface of the surface of the heat dissipating body, and after being deformed by the extrusion in the thickness direction, the two sides of the thermal pad are respectively associated with the surface of the heating element The surface of the heat sink is in close contact.
  • the height of the gap of the thermal interface of the component is less than 0.2 mm.
  • the thermal conductive gasket provided by the invention not only maintains the characteristics of high crystalline state, high thermal conductivity and long life of artificial graphite, but also has the advantages of high compressibility. Not only that, but it also has the same low thermal resistance as thermal grease and thermally conductive phase change materials, but there is no potential risk of aging, silicon migration, lifetime and shelf life of thermal grease and thermally conductive phase change materials. Interface materials have a very broad commercial application prospects.
  • the thermal conductive gasket is suitable for various irregular and complicated interstitial parts, covering the microscopic uneven surface so as to make the components fully contact and improve the heat conduction efficiency, and is particularly suitable for the space-constrained heat conduction requirement; and the assembly process is simple
  • the thickness of the gasket is controllable, which overcomes the shortcoming of the poor compressibility of the solid artificial graphite film, and successfully transforms the artificial graphite film into an ideal thermal pad.
  • FIG. 1 is a schematic structural view of a heat transfer interface gap between a heating element and a heat sink
  • FIG. 2 is a schematic structural view of a solid-state artificial graphite film thermal conductive gasket pad lining a thermal interface gap between a heating element and a heat sink;
  • FIG. 3 is a structural schematic view showing a foam-like artificial graphite thermal conductive gasket pad lining the gap of a heat-conducting interface of a heat generating body and a heat radiating body according to an embodiment of the present invention.
  • the invention adopts a polymer film as a raw material film, and obtains a foam-like artificial graphite film after high-temperature heat treatment, since the foam-like artificial graphite film is not rolled, is loose, and can satisfy the thermal conductive gasket. Requirements.
  • the specific process of the high temperature heat treatment may be: in an inert gas, at a temperature of 400 to 1200 ° C, for about 1 hour; at a temperature of 1200 to 3200 ° C, the insulation is about 1 After cooling to room temperature, a foamed artificial graphite film, that is, a thermal conductive gasket, is obtained.
  • a foamed artificial graphite film that is, a thermal conductive gasket
  • the polymer film which can be used in the present invention includes polyoxadiazole (POD for short), polyimide (PI), polyparaphenylene vinylene (PPV), polybenzimidazole (PBI), poly Benzooxazole (PBO), polybenzobisoxazole (PBBO), polythiazole (PT), polybenzothiazole (PBT), polybenzobisthiazole (PBBT), polyamide PA) preferably contains at least one of the above-mentioned heat resistant aromatic polymer films. These films can be obtained by a known method.
  • the compression ratio of the foamed artificial graphite film after the high temperature heat treatment is 30% to 80%.
  • the high compression ratio can improve the surface adaptability of the thermal conductive gasket. It is suitable for the surface of different components and is suitable for gaps of different shapes and heights.
  • the foamed artificial graphite film after the high temperature heat treatment may have a compression ratio of 50% to 70%.
  • the thermal pad is placed on the gap of the thermal interface of the component, and then the thermal pad at the gap is compacted.
  • the compression ratio of the compacted thermal pad is 20% to 40%.
  • the thermal pad is placed over the uneven surface to provide sufficient contact between the components to improve heat transfer efficiency.
  • FIG. 3 it is a structural schematic view of the foamed artificial graphite thermal conductive gasket of the embodiment of the present invention lining the thermal interface gap between the heating element and the heat dissipating body.
  • the thermal pad 105 provided by the present invention is padded between the surface of the heating element 101 and the heat conducting interface on the surface of the heat dissipating body 102, and is deformed by the thickness direction, and the two sides of the thermal pad 105 are respectively heated.
  • the surface of the body 101 and the surface of the heat sink 102 are brought into close contact.
  • the compacted thermal pad 101 has a smooth surface and is still foam-like in cross section.
  • the gap size of the thermal interface of the component is inconsistent, and the invention is particularly suitable for high liner A gap of less than 0.2 mm.
  • the thermal pad at the slit can be compacted by applying a certain pressure to the component. It can be seen that the thermal conductive gasket provided by the invention not only has a simple manufacturing process but also is convenient to use.
  • a foamed artificial graphite film having a thickness of about 0.1 mm and a compression ratio of about 60% is selected and die-cut into a 10 mm wide and 40 mm long thermal conductive gasket, and then lining the power component printed board and the heat sink. Contact between surfaces. Without the thermal pad, when the printed board and the heat sink are in direct contact, the hot spot temperature of the printed board is 90 °C. After the foam-like artificial graphite film thermal pad is padded, the hot spot temperature drops to 54 °C. .
  • the heat sink may be selected from a fan fin heat sink for a computer chip, a fan fin heat sink without a fan, a metal die casting heat sink or a box for a power electronic device, and may be used in a mobile electronic device. Any of a metal structural member or a non-metallic structural member that functions as a heat sink.
  • a thermally conductive adhesive may be disposed on the surface of the thermal pad to bring the thermal pad into close contact with the surface of the component to prevent displacement of the thermal pad.
  • the thermally conductive adhesive is any one selected from the group consisting of a thermally conductive epoxy resin adhesive, an acrylic resin thermal epoxy resin adhesive, and a silicon thermal conductive adhesive.
  • the thermal conductive gasket provided by the present invention not only maintains the characteristics of high crystalline state, high thermal conductivity and long life of artificial graphite, but also has the advantages of high compressibility. Not only that, but it also has the same low thermal resistance as thermal grease and thermally conductive phase change materials, but there is no potential risk of aging, silicon migration, lifetime and shelf life of thermal grease and thermally conductive phase change materials. Interface materials have a very broad commercial application prospects.
  • the thermal conductive gasket is suitable for various irregular and complicated interstitial parts, covering the microscopic uneven surface so as to make the components fully contact and improve the heat conduction efficiency, and is particularly suitable for the space-constrained heat conduction requirement; and the assembly process is simple
  • the thickness of the gasket is controllable, which overcomes the shortcoming of the poor compressibility of the solid artificial graphite film, and successfully transforms the artificial graphite film into an ideal thermal pad.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Gasket Seals (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat conducting gasket. The heat conducting gasket (105) is an artificial graphite film which is obtained by performing heat treatment on a polymer film and which has a foam-shaped cross section. The heat conducting gasket keeps the characteristics of a high crystallized state, high heat conduction and long service life of artificial graphite, has the advantages of high compensation and low thermal resistance, is applied to various shimming positions with irregular and complicated interfaces, and covers microscopic uneven surfaces so as to sufficiently contact components and increase the heat conduction efficiency.

Description

导热垫片及其应用 技术领域  Thermal pad and its application
本发明涉及导热材料， 特别是涉及一种导热垫片及其应用。 背景技术  The present invention relates to thermally conductive materials, and more particularly to a thermally conductive gasket and its use. Background technique
人工石墨膜是一种在 3000°C左右高温下制成高纯度、 结晶态石墨膜材 料， 它具有十分优异的平面导热性能 （大于 1000~1500W/mK)， 其厚度方向 也有良好的导热性 （10W/mK左右）。 这种导热各向异性在手机、 平板电脑等 需要均热的场合下， 得到了广泛的应用。  The artificial graphite film is a high-purity, crystalline graphite film material produced at a high temperature of about 3000 ° C. It has excellent planar thermal conductivity (greater than 1000-1500 W/mK) and good thermal conductivity in the thickness direction ( 10W/mK or so). This thermal anisotropy has been widely used in applications where soaking of mobile phones, tablet computers, etc. is required.
人工石墨膜较之传统导热界面材料如膏状的导热硅脂、 导热相变材料 等， 具有导热率高、 寿命长、 生产工艺简便等突出特点。 但是， 常规的人工 石墨膜导热垫片是固态， 压缩性较差 （仅有 5~10% )， 作为界面导热垫片， 不能充分垫衬存在于发热体和散热体导热接触界面处的大小不一的缝隙， 这 大大限制了固态人工石墨膜在一些高功率或者接触面积较大的场合的广泛使 用。  Compared with traditional thermal interface materials such as paste-like thermal grease and thermal phase change materials, artificial graphite film has outstanding characteristics such as high thermal conductivity, long life and easy production process. However, the conventional artificial graphite film thermal pad is solid and has poor compressibility (only 5~10%). As an interface thermal pad, it can not fully pad the size of the thermal contact between the heating element and the heat sink. A gap, which greatly limits the widespread use of solid artificial graphite films in some high power or large contact areas.
举例来说， 如图 1所示， 发热体 101与散热体 102之间存在缝隙 103。 缝隙中的空气导热性很差， 界面热阻较大， 严重影响发热体 101 的热量向散 热体 102传递。 因此， 将具有高导热性的固态人工石墨膜导热垫片 104垫衬 于发热体 101与散热体 102之间的缝隙 103处， 从而使发热体与散热体充分 接触而提高热传导效率， 如图 2 所示。 但是， 由于常规固态人工石墨膜本身 的压缩性差， 并不能充分垫衬缝隙 103， 导热效率受影响。 发明内容  For example, as shown in FIG. 1, a gap 103 exists between the heat generating body 101 and the heat sink 102. The air in the gap is poor in thermal conductivity, and the interface thermal resistance is large, which seriously affects the heat transfer from the heat generating body 101 to the heat radiating body 102. Therefore, the solid artificial graphite film thermal conductive gasket 104 having high thermal conductivity is placed on the gap 103 between the heating element 101 and the heat sink 102, so that the heating element and the heat sink are in sufficient contact to improve heat transfer efficiency, as shown in FIG. Shown. However, since the conventional solid artificial graphite film itself has poor compressibility and does not sufficiently pad the slit 103, the heat transfer efficiency is affected. Summary of the invention
有鉴于此， 本发明的目的在于提出一种导热垫片及其应用， 解决导热垫 片压缩率低、 压缩形变能力小的弊端。  In view of the above, the object of the present invention is to provide a heat conductive gasket and an application thereof, which solve the disadvantages of low compression ratio and small compression deformation capability of the thermal pad.
基于上述目的， 本发明提供的导热垫片， 由人工石墨膜制成， 所述导热 垫片的横截面呈泡棉状。  Based on the above object, the heat conductive gasket provided by the present invention is made of an artificial graphite film, and the heat conducting gasket has a foam-like cross section.
可选地， 所述导热垫片为将高分子膜经热处理后得到的泡绵状人工石墨 膜。 Optionally, the thermal conductive gasket is a foamed artificial graphite obtained by heat-treating a polymer film. Membrane.
较佳地， 所述高分子膜选自聚噁二唑、 聚酰亚胺、 聚对亚苯基亚乙烯、 聚苯并咪唑、 聚苯并噁唑、 聚苯并双噁唑、 聚噻唑、 聚苯并噻唑、 聚苯并双 噻唑和聚酰胺的膜中的至少一种。  Preferably, the polymer film is selected from the group consisting of polyoxadiazole, polyimide, polyparaphenylene vinylene, polybenzimidazole, polybenzoxazole, polybenzobisoxazole, polythiazole, At least one of a film of polybenzothiazole, polybenzobisthiazole, and polyamide.
可选地， 所述导热垫片的压缩率为 30%~80%。  Optionally, the thermal pad has a compression ratio of 30% to 80%.
优选地， 所述导热垫片的压缩率为 50%~70%。  Preferably, the thermal pad has a compression ratio of 50% to 70%.
可选地， 所述导热垫片受厚度方向的挤压后， 其表面光滑， 而且其横截 面仍呈泡棉状。  Optionally, after the heat conducting gasket is pressed by the thickness direction, the surface thereof is smooth, and the cross section thereof is still foamy.
较佳地， 所述受挤压后的导热垫片的压缩率为 20%~40%。  Preferably, the compressed heat-conductive gasket has a compression ratio of 20% to 40%.
本发明还提供了一种所述导热垫片的应用， 将所述导热垫片垫衬于元器 件导热界面的缝隙处， 然后压实缝隙处的导热垫片。  The invention also provides an application of the thermal pad, which is lining the gap of the thermal interface of the component and then compacting the thermal pad at the gap.
可选地， 将所述导热垫片垫衬于发热体表面和散热体表面的导热界面之 间， 受厚度方向的挤压发生形变后， 所述导热垫片的两个侧面分别与发热体 表面、 散热体表面实现紧密地接触。  Optionally, the thermal pad is lined between the surface of the heating element and the heat conducting interface of the surface of the heat dissipating body, and after being deformed by the extrusion in the thickness direction, the two sides of the thermal pad are respectively associated with the surface of the heating element The surface of the heat sink is in close contact.
可选地， 所述元器件导热界面的缝隙的高度小于 0.2mm。  Optionally, the height of the gap of the thermal interface of the component is less than 0.2 mm.
从上面所述可以看出， 本发明提供的导热垫片， 既保持了人工石墨高结 晶态、 高导热、 长寿命的特点， 同时具备高压缩性的优点。 不但如此， 它还 具有与导热硅脂和导热相变材料同样低的热阻性能， 但是没有导热硅脂和导 热相变材料的老化、 硅迁移、 寿命和储存期等潜在风险， 将其作为导热界面 材料， 具有十分广阔的商业应用前景。  It can be seen from the above that the thermal conductive gasket provided by the invention not only maintains the characteristics of high crystalline state, high thermal conductivity and long life of artificial graphite, but also has the advantages of high compressibility. Not only that, but it also has the same low thermal resistance as thermal grease and thermally conductive phase change materials, but there is no potential risk of aging, silicon migration, lifetime and shelf life of thermal grease and thermally conductive phase change materials. Interface materials have a very broad commercial application prospects.
所述导热垫片适用于各种界面不规则且复杂的填隙部位， 覆盖住微观不 平整的表面从而使元器件充分接触而提高热传导效率， 特别适合空间受限的 热传导需求； 且装配过程简单， 垫片厚度可控， 克服了固态人工石墨膜压缩 性差的缺点， 成功地将人工石墨膜转变为一种理想的导热垫片。 附图说明  The thermal conductive gasket is suitable for various irregular and complicated interstitial parts, covering the microscopic uneven surface so as to make the components fully contact and improve the heat conduction efficiency, and is particularly suitable for the space-constrained heat conduction requirement; and the assembly process is simple The thickness of the gasket is controllable, which overcomes the shortcoming of the poor compressibility of the solid artificial graphite film, and successfully transforms the artificial graphite film into an ideal thermal pad. DRAWINGS
图 1为发热体和散热体的导热界面缝隙处的结构示意图；  1 is a schematic structural view of a heat transfer interface gap between a heating element and a heat sink;
图 2 为将固态人工石墨膜导热垫片垫衬于发热体和散热体的导热界面缝 隙处的结构示意图；  2 is a schematic structural view of a solid-state artificial graphite film thermal conductive gasket pad lining a thermal interface gap between a heating element and a heat sink;
图 3 为将本发明实施例泡绵状人工石墨导热垫片垫衬于发热体和散热体 的导热界面缝隙处的结构示意图。 具体实施方式 3 is a structural schematic view showing a foam-like artificial graphite thermal conductive gasket pad lining the gap of a heat-conducting interface of a heat generating body and a heat radiating body according to an embodiment of the present invention. detailed description
为使本发明的目的、 技术方案和优点更加清楚明白， 以下结合具体实施 例， 并参照附图， 对本发明进一步详细说明。  In order to make the objects, the technical solutions and the advantages of the present invention more comprehensible, the present invention will be further described in detail below with reference to the accompanying drawings.
本发明以高分子膜为原料膜， 对其进行高温热处理后得到泡绵状人工石 墨膜， 由于所述泡绵状的人工石墨膜未经轧制处理， 呈疏松状， 可以满足导 热垫片的使用要求。  The invention adopts a polymer film as a raw material film, and obtains a foam-like artificial graphite film after high-temperature heat treatment, since the foam-like artificial graphite film is not rolled, is loose, and can satisfy the thermal conductive gasket. Requirements.
在本发明的一个实施例中， 高温热处理的具体过程可以是： 在惰性气体 中， 在 400~1200°C的温度下， 保温约 1小时； 在 1200~3200°C温度下， 保温 约 1 个小时， 冷却到室温后得到泡绵状人工石墨膜， 即导热垫片。 需要说明 的是， 高温热处理的目的是对高分子膜进行碳化， 使其呈泡绵状， 因此热处 理温度并无限定， 也可以采用其他的高温热处理步骤对高分子膜进行碳化。  In one embodiment of the present invention, the specific process of the high temperature heat treatment may be: in an inert gas, at a temperature of 400 to 1200 ° C, for about 1 hour; at a temperature of 1200 to 3200 ° C, the insulation is about 1 After cooling to room temperature, a foamed artificial graphite film, that is, a thermal conductive gasket, is obtained. It should be noted that the purpose of the high-temperature heat treatment is to carbonize the polymer film to form a foam, so that the heat treatment temperature is not limited, and other high-temperature heat treatment steps may be used to carbonize the polymer film.
能用于本发明的高分子膜包括聚噁二唑 （简称 POD) , 聚酰亚胺 （简称 PI), 聚对亚苯基亚乙烯 （简称 PPV), 聚苯并咪唑 （简称 PBI), 聚苯并噁唑 (简称 PBO), 聚苯并双噁唑 (简称 PBBO), 聚噻唑 （简称 PT) , 聚苯并噻唑 (简称 PBT), 聚苯并双噻唑 （简称 PBBT) , 聚酰胺 （简称 PA), 优选含有 上述至少一种的耐热芳香族高分子膜。 这些膜可以通过公知的方法制得。  The polymer film which can be used in the present invention includes polyoxadiazole (POD for short), polyimide (PI), polyparaphenylene vinylene (PPV), polybenzimidazole (PBI), poly Benzooxazole (PBO), polybenzobisoxazole (PBBO), polythiazole (PT), polybenzothiazole (PBT), polybenzobisthiazole (PBBT), polyamide PA) preferably contains at least one of the above-mentioned heat resistant aromatic polymer films. These films can be obtained by a known method.
所述经高温热处理后的泡绵状人工石墨膜的压缩率为 30%~80%。 高压缩 率可以提高导热垫片的表面适应性， 适用于不同元器件的表面， 适用于不同 形状、 不同高度的缝隙。  The compression ratio of the foamed artificial graphite film after the high temperature heat treatment is 30% to 80%. The high compression ratio can improve the surface adaptability of the thermal conductive gasket. It is suitable for the surface of different components and is suitable for gaps of different shapes and heights.
优选地， 所述经高温热处理后的泡绵状人工石墨膜的压缩率也可以为 50%~70%。  Preferably, the foamed artificial graphite film after the high temperature heat treatment may have a compression ratio of 50% to 70%.
将所述导热垫片垫衬于元器件导热界面的缝隙处， 然后压实缝隙处的导 热垫片， 所述压实后的导热垫片的压缩率为 20%~40%。 使导热垫片覆盖住微 观不平整的表面， 从而使元器件充分接触而提高热传导效率。  The thermal pad is placed on the gap of the thermal interface of the component, and then the thermal pad at the gap is compacted. The compression ratio of the compacted thermal pad is 20% to 40%. The thermal pad is placed over the uneven surface to provide sufficient contact between the components to improve heat transfer efficiency.
参考图 3， 其为将本发明实施例泡绵状人工石墨导热垫片垫衬于发热体 和散热体的导热界面缝隙处的结构示意图。 将本发明提供的导热垫片 105 垫 衬于发热体 101表面和散热体 102表面的导热界面之间， 受厚度方向的挤压 发生形变后， 所述导热垫片 105 的两个侧面分别与发热体 101表面、 散热体 102 表面实现紧密地接触。 所述压实后的导热垫片 101 的表面光滑， 而且其 横截面仍呈泡棉状。  Referring to Fig. 3, it is a structural schematic view of the foamed artificial graphite thermal conductive gasket of the embodiment of the present invention lining the thermal interface gap between the heating element and the heat dissipating body. The thermal pad 105 provided by the present invention is padded between the surface of the heating element 101 and the heat conducting interface on the surface of the heat dissipating body 102, and is deformed by the thickness direction, and the two sides of the thermal pad 105 are respectively heated. The surface of the body 101 and the surface of the heat sink 102 are brought into close contact. The compacted thermal pad 101 has a smooth surface and is still foam-like in cross section.
较佳地， 元器件导热界面的缝隙大小不一致， 本发明特别适用于垫衬高 度小于 0.2mm的缝隙。 Preferably, the gap size of the thermal interface of the component is inconsistent, and the invention is particularly suitable for high liner A gap of less than 0.2 mm.
需要说明的是， 可以通过对元器件施加一定的压力， 使缝隙处的导热垫 片被压实。 可见， 本发明提供的导热垫片不但制造工艺简单， 而且使用方 便。  It should be noted that the thermal pad at the slit can be compacted by applying a certain pressure to the component. It can be seen that the thermal conductive gasket provided by the invention not only has a simple manufacturing process but also is convenient to use.
具体地， 选用厚度约 0.1mm、 压缩率约 60%的泡绵状人工石墨膜， 将其 模切为 10mm 宽、 40mm长的导热垫片， 然后垫衬在功率组件印制板和散热 体的接触表面之间。 未加导热垫片， 印制板和散热体直接接触时， 印制板的 热点最高温度为 90 °C ; 垫衬所述泡绵状人工石墨膜导热垫片后， 热点温度降 为 54°C。  Specifically, a foamed artificial graphite film having a thickness of about 0.1 mm and a compression ratio of about 60% is selected and die-cut into a 10 mm wide and 40 mm long thermal conductive gasket, and then lining the power component printed board and the heat sink. Contact between surfaces. Without the thermal pad, when the printed board and the heat sink are in direct contact, the hot spot temperature of the printed board is 90 °C. After the foam-like artificial graphite film thermal pad is padded, the hot spot temperature drops to 54 °C. .
其中， 所述散热体可以选自用于计算机芯片的带风扇鳍状散热器、 不带 风扇鳍状散热器、 用于功率电子设备的金属压铸散热腔或箱体、 用于移动电 子设备中可充当散热器的金属结构件、 非金属结构件中的任意一种。  The heat sink may be selected from a fan fin heat sink for a computer chip, a fan fin heat sink without a fan, a metal die casting heat sink or a box for a power electronic device, and may be used in a mobile electronic device. Any of a metal structural member or a non-metallic structural member that functions as a heat sink.
在本发明的又一个实施例中， 还可以在所述导热垫片的表面设置导热粘 接剂， 使导热垫片与元器件的表面紧密接触， 防止导热垫片的移位。  In still another embodiment of the present invention, a thermally conductive adhesive may be disposed on the surface of the thermal pad to bring the thermal pad into close contact with the surface of the component to prevent displacement of the thermal pad.
可选地， 所述导热粘接剂为选自导热环氧树脂粘接剂、 丙烯酸系树脂导 热环氧树脂粘接剂和硅系导热粘接剂中的任意一种。  Alternatively, the thermally conductive adhesive is any one selected from the group consisting of a thermally conductive epoxy resin adhesive, an acrylic resin thermal epoxy resin adhesive, and a silicon thermal conductive adhesive.
如上所述， 本发明提供的导热垫片， 既保持了人工石墨高结晶态、 高导 热、 长寿命的特点， 同时具备高压缩性的优点。 不但如此， 它还具有与导热 硅脂和导热相变材料同样低的热阻性能， 但是没有导热硅脂和导热相变材料 的老化、 硅迁移、 寿命和储存期等潜在风险， 将其作为导热界面材料， 具有 十分广阔的商业应用前景。  As described above, the thermal conductive gasket provided by the present invention not only maintains the characteristics of high crystalline state, high thermal conductivity and long life of artificial graphite, but also has the advantages of high compressibility. Not only that, but it also has the same low thermal resistance as thermal grease and thermally conductive phase change materials, but there is no potential risk of aging, silicon migration, lifetime and shelf life of thermal grease and thermally conductive phase change materials. Interface materials have a very broad commercial application prospects.
所述导热垫片适用于各种界面不规则且复杂的填隙部位， 覆盖住微观不 平整的表面从而使元器件充分接触而提高热传导效率， 特别适合空间受限的 热传导需求； 且装配过程简单， 垫片厚度可控， 克服了固态人工石墨膜压缩 性差的缺点， 成功地将人工石墨膜转变为一种理想的导热垫片。  The thermal conductive gasket is suitable for various irregular and complicated interstitial parts, covering the microscopic uneven surface so as to make the components fully contact and improve the heat conduction efficiency, and is particularly suitable for the space-constrained heat conduction requirement; and the assembly process is simple The thickness of the gasket is controllable, which overcomes the shortcoming of the poor compressibility of the solid artificial graphite film, and successfully transforms the artificial graphite film into an ideal thermal pad.
所属领域的普通技术人员应当理解： 以上所述仅为本发明的具体实施例 而已， 并不用于限制本发明， 凡在本发明的精神和原则之内， 所做的任何修 改、 等同替换、 改进等， 均应包含在本发明的保护范围之内。  It should be understood by those skilled in the art that the above description is only the embodiment of the present invention, and is not intended to limit the invention, and any modifications, equivalents, and improvements made within the spirit and principles of the present invention. And so on, should be included in the scope of protection of the present invention.

Claims

权 利 要 求 书 Claim
1. 一种导热垫片， 由人工石墨膜制成， 其特征在于， 所述导热垫片的横 截面呈泡绵状。 A thermally conductive gasket made of an artificial graphite film, characterized in that the heat conducting gasket has a foam cross section.
2. 根据权利要求 1所述的导热垫片， 其特征在于， 所述导热垫片为将高 分子膜经热处理后得到的泡绵状人工石墨膜。  The thermal pad according to claim 1, wherein the thermal pad is a foamed artificial graphite film obtained by heat-treating a high molecular film.
3. 根据权利要求 2所述的导热垫片， 其特征在于， 所述高分子膜选自聚 噁二唑、 聚酰亚胺、 聚对亚苯基亚乙烯、 聚苯并咪唑、 聚苯并噁唑、 聚苯并 双噁唑、 聚噻唑、 聚苯并噻唑、 聚苯并双噻唑和聚酰胺的膜中的至少一种。  The thermal pad according to claim 2, wherein the polymer film is selected from the group consisting of polyoxadiazole, polyimide, polyparaphenylene vinylene, polybenzimidazole, and polybenzoene. At least one of a film of oxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, and polyamide.
4. 根据权利要求 3所述的导热垫片， 其特征在于， 所述导热垫片的压缩 率为 30%~80%。  The thermal pad according to claim 3, wherein the thermal pad has a compression ratio of 30% to 80%.
5. 根据权利要求 4所述的导热垫片， 其特征在于， 所述导热垫片的压缩 率为 50%~70%。  The thermal pad according to claim 4, wherein the thermal pad has a compression ratio of 50% to 70%.
6. 根据权利要求 1~5 中任意一项所述的导热垫片， 其特征在于， 所述导 热垫片受厚度方向的挤压后， 其表面光滑， 而且其横截面仍呈泡棉状。  The thermal conductive gasket according to any one of claims 1 to 5, wherein the heat conducting gasket is pressed by the thickness direction, the surface thereof is smooth, and the cross section thereof is still foamy.
7. 根据权利要求 6所述的导热垫片， 其特征在于， 所述受挤压后的导热 垫片的压缩率为 20%~40%。  The thermal pad according to claim 6, wherein the compressed thermal pad has a compression ratio of 20% to 40%.
8. 一种根据权利要求 1~7 中任意一项所述的导热垫片的应用， 其特征在 于， 所述导热垫片垫衬于元器件导热界面的缝隙处， 然后压实缝隙处的导热 垫片。  The application of the thermal conductive gasket according to any one of claims 1 to 7, wherein the thermal conductive gasket is lined at a gap of a heat conducting interface of the component, and then the heat conduction at the slit is compacted. Gasket.
9. 根据权利要求 8所述的导热垫片的应用， 其特征在于， 将所述导热垫 片垫衬于发热体表面和散热体表面的导热界面之间， 受厚度方向的挤压发生 形变后， 所述导热垫片的两个侧面分别与发热体表面、 散热体表面实现紧密 地接触。  9. The application of the thermal pad according to claim 8, wherein the thermal pad is placed between the surface of the heating element and the heat conducting surface of the surface of the heat sink, and is deformed by the extrusion in the thickness direction. The two sides of the thermal pad are in intimate contact with the surface of the heating element and the surface of the heat dissipating body, respectively.
10. 根据权利要求 8 所述的导热垫片的应用， 其特征在于， 所述元器件 导热界面的缝隙的高度小于 0.2mm。  10. The use of a thermally conductive gasket according to claim 8, wherein the height of the gap of the thermally conductive interface of the component is less than 0.2 mm.
PCT/CN2013/072216 2013-03-06 2013-03-06 Heat conducting gasket and application thereof WO2014134791A1 (en)

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