TWI486116B - Electronic device - Google Patents

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device having a heat sink.

With the continuous advancement of technology, the daily necessities of modern people are moving towards digitalization and informationization. For example, a mobile computing device, such as a notebook computer or a tablet computer, has the advantage of being convenient for the user to carry, so that the user can freely use it regardless of the occasion.

In addition, the general mobile computing device internally removes thermal energy generated by the mobile computing device by providing a heat sink fin set and a fan. However, since the performance of the mobile computing device is continuously increased, the thermal energy generated by the mobile computing device in the arithmetic processing process is also increased. In this regard, the rate of heat removal of the mobile computing device is generally increased by increasing the heat dissipation area of the heat sink fins and increasing the power of the fan.

However, under the trend of technology development, R&D personnel are working hard to make mobile computing devices continue to move toward high-performance and thin, light and small volumes. The above-mentioned heat dissipation means for increasing the heat dissipation area of the heat dissipation fins and increasing the power of the fan will result in an additional increase in the internal volume of the mobile computing device to accommodate larger heat dissipation fins and high power fans. As a result, the development of the thinning of the mobile computing device will be hindered.

The present invention is to provide an electronic device, in order to reduce the volume of the action The heat dissipation requirements of the computing device.

The electronic device disclosed in the present invention comprises a casing, a heat source and a heat sink. The heat source is located inside the enclosure. The heat sink is disposed within the outer casing and the heat sink is maintained at a distance from the heat source. The heat sink includes a casing containing a plurality of honeycomb-type compartments composed of a plurality of partitions. These honeycomb-type compartments are filled with a heat-dissipating material, and the heat sink absorbs the heat of the heat source through heat radiation.

According to the electronic device disclosed in the above invention, the honeycomb-type compartment is provided to enhance the overall strength of the heat sink or even the electronic device. In addition, heat is absorbed through the heat dissipation material inside the heat sink to improve the heat absorption efficiency of the heat sink. Moreover, since the heat sink does not need to be equipped with an exhaust fan, the heat sink can be used for thin electronic devices and can reduce noise.

The features, implementations, and utilities of the present invention are described in detail below with reference to the drawings.

Referring to FIG. 1 , FIG. 2A and FIG. 2B , FIG. 1 is a cross-sectional view showing the structure of an electronic device according to an embodiment of the present invention, and FIG. 2A is a bottom view showing the structure of the heat sink according to FIG. 1 . 2B is a perspective view of the heat sink according to Fig. 2A.

The electronic device 10 of the embodiment includes a housing 11, a heat source 12 and a heat sink 13. The electronic device 10 can be a tablet computer, a mobile phone or other electronic products.

A circuit board 14 is disposed in the outer casing 11, and the heat source 12 is disposed on the circuit board 14 and located in the outer casing 11. The heat source 12 described above may be an arithmetic processing chip of a tablet computer, a mobile phone or other electronic products.

The heat sink 13 is disposed within the outer casing 11 and the heat sink 13 is maintained at a distance from the heat source 12 without contact. The heat sink 13 of the electronic device 10 of the present invention can effectively absorb the heat generated by the heat source 12, so that the heat source such as various electronic components can operate normally.

The heat sink 13 includes a casing 131. The outer shape of the casing 131 may be a square or other cube, and the material of the casing 131 may be aluminum, copper or other suitable materials. The housing 131 includes a plurality of honeycomb-type compartments 134 composed of a plurality of partitions 133. The overall structural strength of the heat sink 13 can be increased by the arrangement of the honeycomb type compartment 134. Further, the honeycomb type compartment 134 of the present embodiment described above is entirely covered in the outer casing 11, but the features in which the honeycomb type compartment 134 is covered throughout the outer casing 11 are not intended to limit the present invention. For example, in other embodiments, the honeycomb compartment 134 may also be only a partial area within the outer casing 11, while other areas not provided with the honeycomb type compartment 134 are rectangular compartments formed by cross ribs. To replace the original honeycomb type compartment 134.

In addition, the material of the partition plate 133 may be aluminum, copper or other suitable materials, and the honeycomb type compartments 134 are filled with a heat dissipating material 132. The heat dissipating material 132 in each of the honeycomb compartments 134 may be a copper material, a phase change material, an air or copper material, a phase change material, and a combination of air. The heat dissipating material 132 comprises 15% to 30% by volume of a plurality of copper materials, 50% to 85% by volume of a phase change material, and 15% to 20% by volume of an air. The heat sink 13 preferably comprises a plurality of copper materials having a volume percentage of 15% to 20%, a phase change material of 64% to 67% by volume, and a volume percentage of air of 16% to 17%. Among them, the phase change material may be an alkane such as paraffin.

The phase change material of this embodiment can be converted from a solid state to a liquid state by absorbing heat. Moreover, in the process in which the phase change material is converted from a solid state to a liquid state by absorbing heat, the temperature can be maintained at a certain value without rising. Since the phase change material is converted from a solid state to a liquid state, the volume increases, and the air has excellent compressibility and can serve as an expansion space for the phase change material. Therefore, the purpose of the heat dissipating material 132 containing air is to increase the volume of the phase change material due to the phase change, so as to avoid the problem that the space in the casing 131 is insufficient to accommodate the heat dissipating material 132 due to the increase of the volume change material. .

Further, the housing 131 of the heat sink 13 has a surface 1311 facing the heat source 12. Surface 1311 defines a central region 1312 and an outer annular region 1313 that surrounds central region 1312.

Also, the central portion 1312, the surface 1311, and the heat sink 13 of the present embodiment have overlapping geometric midpoints M. The area of the central zone 1312 is 10% to 50% of the area of the surface 1311. Among them, it is preferable that the area of the central portion 1312 is 10% of the area of the surface 1311. And the area outside the central area 1312 can be scaled down beyond the area of the surface 1311. An orthographic projection range A of heat source 12 on surface 1311 is located in central region 1312. The heat sink 13 absorbs heat of the heat source 12 by heat radiation.

Continuing to refer to FIGS. 2A and 2B, in the present embodiment, a portion of the honeycomb compartment 134 is filled with a copper material 1321 (such as the internally slanted honeycomb type compartment 134 shown in FIG. 2B), or Fill the phase change material with air (as shown in Figure 2B, the internal honeycomb compartment 134 is blank). Further, these honeycomb type compartments 134 filled with the copper material 1321 are arranged from the central portion 1312 toward the outer ring region 1313. As such, the copper material 1321 can extend substantially from the central region 1312 toward the outer ring region 1313. In addition, in the present embodiment, the honeycomb type compartment 134 adjacent to the side 1314 of the housing 131 can also be filled. Filled with copper 1321. In this way, heat can be quickly transmitted to the central portion 1312 of the heat sink 13 and the outer ring region 1313 via the copper material 1321, so that the overall heat sink 13 can be uniformly heated to enhance the heat absorbing effect.

It should be noted that the position of the copper material 1321 of the present embodiment is not used to limit the present invention. Those skilled in the art can adjust the filling position of the copper material 1321 according to actual needs.

Further, in the present embodiment, the honeycomb type compartment 134 overlapping the orthographic projection range A of the heat source 12 is filled with the full phase change material, so that the heat sink 13 can have a better heat absorbing efficiency.

By filling the copper material 1321 and filling the phase change material in place by the above embodiment, when the heat source 12 transmits heat to the central region 1312 of the heat sink 13 through the heat radiation, the phase change material at the central portion 1312 will absorb heat first. The phase change is performed, and the phase change material simultaneously transfers heat to the entire outer ring region 1313 via the copper material 1321. In this way, the corners of the heat sink 13 can be uniformly heated, so that the phase change materials in the interior of the heat sink 13 can uniformly absorb heat to perform phase change to improve the heat absorption efficiency of the heat sink 13. Moreover, the heat sink 13 of the present embodiment does not need to be equipped with an exhaust fan, and thus can be applied to a thinned electronic device.

In addition, since the heat dissipating material 132 in the heat sink 13 contains a phase change material, and the phase change material undergoes a phase change in the endothermic phase, the temperature of the phase change material does not increase. Therefore, as long as the appropriate phase change material is selected, for example, a phase change material having a phase transition temperature of about 37 degrees is selected, the temperature of the heat sink 13 can be maintained at a comfortable temperature of 37 degrees for a long time during the heat absorption process. . As such, when the user holds the electronic device 10 for a long time, the electronic device 10 will not be caused by the heat absorption of the heat sink 13 The temperature of the shell 11 is constantly rising and there is a problem of being hot.

In addition, in this embodiment or other embodiments, a plurality of sets of heat dissipation fins (not shown) may be disposed on the surface of the heat sink 13 to further improve the heat absorption efficiency of the heat sink 13.

Please refer to FIG. 3, which is a bottom view of the structure of the heat sink according to another embodiment of the present invention.

This embodiment is similar to the embodiment of FIGS. 2A and 2B, and therefore the same portions will not be described again. The difference between this embodiment and the embodiments of FIGS. 2A and 2B is that an orthographic projection range A of the heat source 12 of the present embodiment on the surface 1311 is located in the outer ring region 1313.

Therefore, when the heat source 12 transmits heat to one of the outer ring regions 1313 of the heat sink 13 through heat radiation, the phase change material at one of the ring regions 1313 will absorb heat first to undergo phase change, and the phase change material simultaneously Heat is rapidly transferred to the central zone 1312 and other portions of the outer ring zone 1313 via the copper material 1321. In this way, the regions and corners of the heat sink 13 can be uniformly heated, so that the phase change materials in the interior of the heat sink 13 can uniformly absorb heat to perform phase change to improve the heat absorption efficiency of the heat sink 13.

The electronic device according to the above embodiment is provided with a honeycomb type compartment to enhance the overall strength of the heat sink or even the electronic device. In addition, since the heat dissipating material contains 15% to 30% by volume of copper, 50% to 85% by volume of phase change material, and 15% to 20% by volume of air, heat can be quickly transferred through the copper. Spread to all parts of the radiator. Thereby, the phase change material in the interior of the heat sink can uniformly absorb heat to perform phase change to improve the heat absorption efficiency of the heat sink. In addition, since the heat dissipating material contains a phase change material, the heat sink is in the process of absorbing heat, The temperature of the heat sink can be maintained at a comfortable grip temperature for a long time. Moreover, since the heat sink of the embodiment does not need to be equipped with an exhaust fan, the heat sink of the embodiment can be advantageously used for a thinned electronic device and can reduce noise generation.

While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.

10‧‧‧Electronic devices

11‧‧‧Shell

12‧‧‧heat source

13‧‧‧ radiator

13a‧‧‧heatsink

131‧‧‧Shell

1311‧‧‧ surface

1312‧‧‧Central District

1313‧‧‧Outer Ring Area

1314‧‧‧ side

132‧‧‧ Heat-dissipating materials

1321‧‧‧ Copper

133‧‧‧Baffle

134‧‧‧Hive-type compartment

14‧‧‧ boards

1 is a cross-sectional view showing the structure of an electronic device according to an embodiment of the present invention.

Fig. 2A is a bottom view showing the structure of the heat sink according to Fig. 1.

Figure 2B is a perspective view of the heat sink according to Figure 2A.

Figure 3 is a structural underside view of a heat sink according to another embodiment of the present invention.

10‧‧‧Electronic devices

11‧‧‧Shell

12‧‧‧heat source

13‧‧‧ radiator

131‧‧‧Shell

1311‧‧‧ surface

132‧‧‧ Heat-dissipating materials

14‧‧‧ boards

Claims (9)

An electronic device comprising: a housing; a heat source located in the housing; and a heat sink disposed in the housing, the heat sink maintaining a distance from the heat source, the heat sink including a housing, the housing The utility model comprises a plurality of honeycomb type compartments composed of a plurality of partitions, wherein the honeycomb type compartments are filled with a heat dissipating material, and the heat sink absorbs heat of the heat source by heat radiation; wherein the heat dissipating material comprises 15% to 30 % by volume of a copper, 50% to 67% by volume of a phase change material, and 15% to 20% by volume of an air. The electronic device of claim 1, wherein the heat sink has a surface facing the heat source, the surface defining a central zone and an outer ring zone, the outer ring zone surrounding the central zone, the geometric midpoint of the central zone and the The geometric midpoints of the surface overlap, and the area of the central zone is 10% to 50% of the area of the surface, and the orthographic projection range of the heat source on the surface is located in the central zone. The electronic device of claim 2, wherein a portion of the honeycomb-type compartments are filled with the copper material, and the honeycomb-type compartments filled with the copper material are aligned from the central region toward the outer ring region. The electronic device of claim 1, wherein the heat sink has a surface facing the heat source, the surface defining a central zone and an outer ring zone, the outer ring zone surrounding the central zone, the geometric midpoint of the central zone and the The geometric midpoints of the surface overlap, and the area of the central zone is 10% to 50% of the area of the surface, and the heat source is in the table. The orthographic projection range on the surface is located in the outer loop region. The electronic device of claim 4, wherein a portion of the honeycomb-type compartments are filled with the copper material, and the honeycomb-type compartments filled with the copper material are aligned from the central region toward the outer ring region. The electronic device of claim 1, wherein the honeycomb-type compartments overlapping the orthographic projection range of the heat source are filled with the phase change material. The electronic device of claim 1, wherein the honeycomb-type compartments adjacent to a side of the housing are filled with the copper material. The electronic device of claim 1, wherein the composition of the phase change material is an alkane. The electronic device of claim 1, wherein the housing and the spacer are made of aluminum.